CN219076398U - High-heat-dissipation injection molding die frame capable of avoiding die deformation - Google Patents
High-heat-dissipation injection molding die frame capable of avoiding die deformation Download PDFInfo
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- CN219076398U CN219076398U CN202320070904.6U CN202320070904U CN219076398U CN 219076398 U CN219076398 U CN 219076398U CN 202320070904 U CN202320070904 U CN 202320070904U CN 219076398 U CN219076398 U CN 219076398U
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Abstract
The utility model discloses a high-heat-dissipation injection molding die frame capable of avoiding die deformation, which comprises a lower die frame, wherein an upper die frame is arranged above the lower die frame, mounting plates are uniformly and fixedly connected to the outer walls of the left side and the right side of the lower die frame, the mounting plates are used for mounting and fixing the lower die frame so as to ensure the use stability of the lower die frame, a lower die is fixedly arranged at the center of the upper surface of the lower die frame, an upper die cavity is arranged at the center of the bottom surface of the upper die frame above the lower die frame, a water pump is arranged at the right side of a temperature control sub-box, and a user can control the water temperature inside the temperature control sub-box through a temperature control component at the same time so as to ensure that the cooling water inside the temperature control sub-box tends to be at room temperature when being injected into a water outlet pipe and a cooling pipe, thereby avoiding the situation that the upper die frame is damaged due to heat dissipation or cooling too fast under the influence of thermal expansion and contraction.
Description
Technical Field
The utility model relates to the application field of mold technology, in particular to a high-heat-dissipation injection molding frame capable of avoiding mold deformation.
Background
At present, the Chinese patent application publication No. CN216267259U discloses a high-heat-dissipation injection molding die carrier for avoiding die deformation, which is provided with: the existing injection molding die carrier has certain defects when in use, the heat dissipation performance is poor, the temperature difference between the inside and the outside of the die is large, the die is easy to deform, and the stripping is troublesome and is not easy to treat, so that the cooling box structure can be used for carrying out water cooling and heat dissipation on the die in the die processing process, the temperature difference between the inside and the outside of the die is not excessive, the die is prevented from deforming, the inferior product rate is reduced, the vibration motor on the surface of the mounting box structure can vibrate and demold the molding die, and then the stripping structure is matched for carrying out rapid stripping, so that the injection molding die carrier is convenient and simple to use and convenient to operate;
however, the above device still has the following disadvantages:
(1) the heat dissipation treatment is carried out by using a water cooling heat dissipation mode, but in order to take the defect of water cooling heat dissipation into consideration, the temperature of water in the water cooling box cannot be well controlled, and when the temperature of the water in the water cooling box is too low, the mold frame is directly subjected to heat dissipation, so that extra load is caused on the mold frame, the mold frame is damaged to a certain extent, and the service life of the mold frame is further reduced;
(2) in the water cooling process, the device cannot reasonably recover the used cooling water, so that the utilization efficiency of water resources is low;
in view of the above, the present utility model provides a high heat dissipation injection molding frame that avoids the deformation of the mold.
Disclosure of Invention
In order to solve the technical problems, the technical scheme solves the corresponding technical problems in the background art by providing the high-heat-dissipation injection molding die carrier capable of avoiding the deformation of the die.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a high heat dissipation nature injection mold frame of avoiding mould deformation, includes the die carrier down, the top of die carrier down is provided with the die carrier down, the even fixedly connected with mounting panel of left and right sides outer wall of die carrier down, this mounting panel is used for installing fixed die carrier down to guarantee the stability that die carrier used down, the upper surface center fixed mounting of die carrier down has the lower mould, the top of lower mould is located the bottom surface center of die carrier down and has seted up the die cavity, the left and right sides outer wall fixedly connected with installation ear of die carrier this installation ear is used for installing drive assembly, in order to guarantee to move down the die carrier and carry out the compound die, the injection hole has been seted up to the top of die cavity down, the injection hole is located the upper surface of die carrier down, and it supplies the injecting glue to use, the inside of die carrier and the upper surface of die carrier are provided with accuse warm water cooling mechanism jointly;
the temperature control water cooling mechanism comprises: the water tank, accuse temperature subassembly, accuse temperature divides case, collection tank, water pump, outlet pipe, drain pipe, vacuum wall chamber, heat-conducting plate, cooling tube, go up the upper surface left side fixed mounting of die carrier has the water tank, just the temperature subassembly is installed to the top of water tank, and this accuse temperature subassembly can be used to heat and control the inside cooling water's of water tank temperature, the inside of water tank is provided with accuse temperature respectively and divides case, and should accuse temperature divides case can be used to deposit cooling water, and the collection tank can be used to retrieve the water after the cooling uses, the right side of accuse temperature divides case to be provided with the water pump, the outlet pipe is installed to the right side of water pump, the vacuum wall chamber has been seted up to the inside that the outlet pipe lower extreme was located the die carrier, and this vacuum wall chamber is relative vacuum state, can be used to the heat conduction of separation injection mold in-process, the lower extreme of outlet pipe extends to the inside of vacuum wall chamber, one side laminating that the vacuum wall intracavity is close to the upper die cavity installs the heat-conducting plate, and this heat-conducting plate can be the copper material, can be used to the heat of conducting upper die cavity, the heat of heat-conducting plate laminating one side of inner wall is kept away from the upper side of die cavity, the heat-conducting plate is equipped with the cooling tube, the cooling end is installed with the cooling tube down end mutually.
Preferably, the water pump is fixedly arranged on the upper surface of the upper die frame, and the left side and the right side of the water pump are respectively provided with an input end and an output end.
Preferably, the left input end of the water pump is communicated with the inside of the temperature control sub-tank, and the lower end of the water outlet pipe extends to the inside of the upper die frame.
Preferably, the positions of the lower die and the upper die cavity correspond to each other, and the lower die and the upper die cavity are in clearance fit.
Preferably, the cooling pipes are of a tubular structure, and the cooling pipes are uniformly distributed on the surface of the heat conducting plate in a bent mode.
Preferably, the lower end of the cooling pipe is communicated with a drain pipe, and the upper end of the drain pipe extends to the outside of the upper die frame and is communicated with the inside of the recovery tank.
Compared with the prior art, the utility model has the beneficial effects that:
(1) According to the high-heat-dissipation injection molding die carrier avoiding die deformation, a user can control the water temperature in the temperature control sub-box by starting the water pump and simultaneously utilizing the temperature control assembly to ensure that the cooling water in the temperature control sub-box can tend to the room temperature when being injected into the water outlet pipe and the cooling pipe, so that the situation that the upper die carrier is damaged due to heat dissipation or too fast cooling caused by too low cooling water temperature and under the influence of thermal expansion and cold contraction is avoided;
(2) According to the high-heat-dissipation injection molding die frame capable of avoiding the deformation of the die, heat generated in the injection molding process along with the inner wall of the upper die cavity is conducted to the cooling pipe by the heat conducting plate, water circulation can be continuously carried out in the cooling pipe under the action of the water pump, and the circulated water can be led into the recovery box under the action of the water pump so as to be reused later, and the utilization efficiency of the water is improved;
(3) This avoid high heat dissipation nature of mould deformation die carrier of moulding plastics, user's usable mounting panel will go down die carrier fixed mounting to waiting to use the place to guarantee the stability of die carrier use down, and then guarantee the stability of going up die carrier and die carrier compound die in-process down, with the quality of assurance mould after moulding plastics.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic rear perspective view of the present utility model;
FIG. 3 is a schematic bottom perspective view of the present utility model;
FIG. 4 is a schematic view of a partial top perspective view of a temperature-controlled sub-tank and a recovery tank in the present utility model;
FIG. 5 is a schematic view of the internal structure of the upper mold cavity of the present utility model.
The reference numerals in the figures are:
1. a lower die frame; 11. a die carrier is arranged; 12. a mounting plate; 13. a lower die; 14. an upper die cavity; 15. a mounting ear; 16. injection molding holes;
2. a temperature-controlled water cooling mechanism; 21. a water tank; 22. a temperature control assembly; 23. temperature control and box separation; 24. a recovery box; 25. a water pump; 26. a water outlet pipe; 27. a drain pipe; 28. a vacuum wall cavity; 29. a heat conductive plate; 210. and (5) cooling the tube.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1
Referring to fig. 1 to 5, a high heat dissipation injection molding frame for avoiding mold deformation comprises a lower frame 1, wherein an upper frame 11 is arranged above the lower frame 1, the outer walls of the left side and the right side of the lower frame 1 are uniformly and fixedly connected with mounting plates 12, the mounting plates 12 are used for mounting and fixing the lower frame 1 so as to ensure the stability of the use of the lower frame 1, a lower mold 13 is fixedly arranged at the center of the upper surface of the lower frame 1, an upper mold cavity 14 is arranged at the center of the bottom surface of the upper frame 11 above the lower mold 13, the positions of the lower mold 13 and the upper mold cavity 14 are mutually corresponding, the lower mold 13 and the upper mold cavity 14 are in clearance fit, mounting lugs 15 are fixedly connected to the outer walls of the left side and the right side of the upper mold frame 11 and are used for mounting driving components so as to ensure that the upper mold 11 moves downwards for mold assembly, injection holes 16 are formed above the upper mold cavity 14, the injection holes 16 are formed in the upper surface of the upper mold frame 11 and are used for glue injection, and a temperature control water cooling mechanism 2 is jointly arranged inside the upper mold cavity 14 and the upper surface of the upper mold cavity 11;
the temperature-controlled water cooling mechanism 2 includes: the water tank 21, the temperature control component 22, the temperature control sub-tank 23, the recovery tank 24, the water pump 25, the water outlet pipe 26, the water outlet pipe 27, the vacuum wall cavity 28, the heat conducting plate 29 and the cooling pipe 210, the water tank 21 is fixedly arranged on the left side of the upper surface of the upper die frame 11, the temperature control component 22 is arranged above the water tank 21, the temperature control component 22 can be used for heating and controlling the temperature of cooling water in the water tank 21, the temperature control sub-tank 23 and the recovery tank 24 are respectively arranged in the water tank 21, the temperature control sub-tank 23 can be used for storing the cooling water, the recovery tank 24 can be used for recovering the water after cooling, the water pump 25 is arranged on the right side of the temperature control sub-tank 23, the water pump 25 is fixedly arranged on the upper surface of the upper die frame 11, the left side and the right side of the water pump 25 are respectively provided with an input end and an output end, the water outlet pipe 26 is arranged on the right side of the water pump 25, the left side input end of the water pump 25 is mutually communicated with the inside of the temperature control sub-tank 23, the lower end of the water outlet pipe 26 extends to the inside of the upper die frame 11, the vacuum wall cavity 28 is arranged in the upper die frame 11 at the lower end of the water outlet pipe 26, the vacuum wall cavity 28 is in a relative vacuum state and can be used for blocking heat conduction in the injection molding process, so that heat is reduced to be transmitted to the upper die frame 11, the use safety of the upper die frame 11 is ensured, scalding caused when workers use the upper die frame 11 is avoided, the safety of the workers is ensured, the lower end of the water outlet pipe 26 extends to the inside of the vacuum wall cavity 28, a heat conducting plate 29 is attached to one side of the inner wall of the vacuum wall cavity 28 close to the upper die cavity 14, the heat conducting plate 29 can be made of copper materials and can be used for conducting heat of the inner wall of the upper die cavity 14, thereby better assisting the heat dissipation condition of the upper die cavity 14 in the injection molding receiving process, a cooling pipe 210 is attached to one side surface of the heat conducting plate 29 away from the upper die cavity 14, the upper end of the cooling tube 210 is communicated with the lower end of the water outlet tube 26, the water outlet tube 27 is installed at the lower end of the cooling tube 210, the cooling tube 210 is of a tubular structure, the cooling tube 210 is uniformly distributed on the surface of the heat conducting plate 29 in a bent mode, the lower end of the cooling tube 210 is communicated with the water outlet tube 27, and the upper end of the water outlet tube 27 extends to the outside of the upper die frame 11 and is communicated with the inside of the recovery box 24.
The complete working principle of the utility model is as follows:
firstly, a user can fixedly install the lower die carrier 1 to a place to be used by utilizing the mounting plate 12 so as to ensure the stability of the lower die carrier 1 in the use process, and further ensure the stability of the upper die carrier 11 and the lower die carrier 1 in the die clamping process so as to ensure the quality of the injection molded die, and when the upper die carrier 11 is downward close to the upper surface of the lower die carrier 1, the lower die 13 and the upper die cavity 14 are mutually matched and a certain gap is reserved for the injection molding of the die;
after the injection molding hole 16 is formed in the injection molding mold, the user can start the water pump 25 and control the water temperature inside the temperature control sub-tank 23 by using the temperature control component 22, so that the cooling water inside the temperature control sub-tank 23 can be enabled to reach the room temperature when being injected into the water outlet pipe 26 and the cooling pipe 210, the situation that the upper mold frame 11 is subjected to load caused by the fact that the cooling water temperature is too low and the influence of expansion and contraction is caused, the situation that the upper mold frame 11 is damaged due to heat dissipation or too fast cooling is reduced to the greatest extent is avoided, the cooling water inside the temperature control sub-tank 23 is sent to the inside of the cooling pipe 210 through the water pump 25, the cooling pipe 210 is mutually attached to the heat conducting plate 29 by using the water pump 25, the heat conducting plate 29 is mutually attached to one side surface of the upper mold cavity 14, the heat conducting plate 29 is made of copper, the heat of the inner wall of the upper mold cavity 14 can be conducted, the situation that the upper mold cavity 14 is subjected to the injection molding process is better avoided, the heat generated in the injection molding process is conducted to the cooling pipe 210 by the heat conducting plate 29, the cooling pipe 210 is conducted with the inner wall of the upper mold cavity 14, the cooling water is continuously circulated under the action of the water pump 25, the water can be recycled inside the cooling pipe 210, and the cooling water can be effectively recycled through the cooling pipe 24, and the cooling water can be recycled inside the upper mold cavity 11.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a avoid high heat dissipation nature injection mold frame of mould deformation, includes die carrier (1), its characterized in that: an upper die frame (11) is arranged above the lower die frame (1), mounting plates (12) are uniformly and fixedly connected to the outer walls of the left side and the right side of the lower die frame (1), a lower die (13) is fixedly arranged in the center of the upper surface of the lower die frame (1), an upper die cavity (14) is formed in the center of the bottom surface of the upper die frame (11) above the lower die (13), mounting lugs (15) are fixedly connected to the outer walls of the left side and the right side of the upper die frame (11), injection holes (16) are formed in the upper side of the upper die cavity (14), and the injection holes (16) are formed in the upper surface of the upper die frame (11), and a water-cooling control mechanism (2) is arranged in the upper die cavity (14) and the upper surface of the upper die frame (11) together;
the temperature-controlled water cooling mechanism (2) comprises: the water tank (21), accuse temperature subassembly (22), accuse temperature divides case (23), collection box (24), water pump (25), outlet pipe (26), drain pipe (27), vacuum wall chamber (28), heat conduction board (29), cooling tube (210), the inside of upper surface left side fixed mounting of going up die carrier (11) has water tank (21), just accuse temperature subassembly (22) are installed to the top of water tank (21), the inside of water tank (21) is provided with accuse temperature respectively and divides case (23), collection box (24), accuse temperature divides case (23) right side to be provided with water pump (25), outlet pipe (26) are installed on the right side of water pump (25), vacuum wall chamber (28) have been seted up to the inside of outlet pipe (26) lower extreme in die carrier (11), the inside that the lower extreme of outlet pipe (26) extends to vacuum wall chamber (28), heat conduction board (29) are installed to one side that the inner wall of vacuum wall chamber (28) is close to last die cavity (14), one side surface laminating (210) of keeping away from upper die cavity (14), cooling tube (210) are equipped with cooling tube (210), cooling end (26) are installed each other to the cooling tube (210), cooling end (26) are linked together.
2. The high heat dissipation injection mold frame for avoiding mold deformation according to claim 1, wherein: the water pump (25) is fixedly arranged on the upper surface of the upper die frame (11), and the left side and the right side of the water pump (25) are respectively provided with an input end and an output end.
3. The high heat dissipation injection mold frame for avoiding mold deformation according to claim 1, wherein: the left input end of the water pump (25) is communicated with the inside of the temperature control sub-tank (23), and the lower end of the water outlet pipe (26) extends to the inside of the upper die frame (11).
4. The high heat dissipation injection mold frame for avoiding mold deformation according to claim 1, wherein: the lower die (13) and the upper die cavity (14) are mutually corresponding in position, and the lower die (13) and the upper die cavity (14) are in clearance fit.
5. The high heat dissipation injection mold frame for avoiding mold deformation according to claim 1, wherein: the cooling pipes (210) are of tubular structures, and the cooling pipes (210) are uniformly distributed on the surface of the heat conducting plate (29) in a bending mode.
6. The high heat dissipation injection mold frame for avoiding mold deformation according to claim 1, wherein: the lower end of the cooling pipe (210) is communicated with the drain pipe (27), and the upper end of the drain pipe (27) extends to the outside of the upper die frame (11) and is communicated with the inside of the recovery tank (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320070904.6U CN219076398U (en) | 2023-01-10 | 2023-01-10 | High-heat-dissipation injection molding die frame capable of avoiding die deformation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320070904.6U CN219076398U (en) | 2023-01-10 | 2023-01-10 | High-heat-dissipation injection molding die frame capable of avoiding die deformation |
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| CN219076398U true CN219076398U (en) | 2023-05-26 |
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| CN202320070904.6U Active CN219076398U (en) | 2023-01-10 | 2023-01-10 | High-heat-dissipation injection molding die frame capable of avoiding die deformation |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116901338A (en) * | 2023-06-13 | 2023-10-20 | 江苏锦汇高分子科技有限公司 | Auxiliary radiator of compressor rubber mat forming die |
| CN116901338B (en) * | 2023-06-13 | 2024-05-14 | 江苏锦汇高分子科技有限公司 | Auxiliary radiator of compressor rubber mat forming die |
-
2023
- 2023-01-10 CN CN202320070904.6U patent/CN219076398U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116901338A (en) * | 2023-06-13 | 2023-10-20 | 江苏锦汇高分子科技有限公司 | Auxiliary radiator of compressor rubber mat forming die |
| CN116901338B (en) * | 2023-06-13 | 2024-05-14 | 江苏锦汇高分子科技有限公司 | Auxiliary radiator of compressor rubber mat forming die |
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