CN210986812U - A heat dissipation structure of a component power supply - Google Patents

Abstract

The utility model discloses a heat dissipation structure converted into a capacitive power supply. The heat dissipation structure of a converted capacitive power supply comprises a wind shield plate arranged on a circuit board mounting bottom plate and a guide fan arranged on the wind shield plate. A circuit board is installed on the circuit board mounting bottom plate, and the wind shield has ventilation holes corresponding to the diversion fan. The radiator is formed with a through-type air duct facing the ventilation hole, and the heat sink is in contact with the switch tube on the circuit board. The heat dissipation structure of the component power supply aims to solve the technical problem of poor heat dissipation effect of the heat dissipation device of the component power supply in the prior art.

Description

A heat dissipation structure of a component power supply

technical field

The utility model relates to the technical field of power supply heat dissipation structures, in particular to a heat dissipation structure of a component power supply.

Background technique

At present, in the existing capacitive power supply, high-current and high-power devices are often required; however, the problem of high current brings the hidden danger of excessive temperature to the printed circuit; generally speaking, the printed circuit board needs to work at 100 It can only work continuously for a long time in the environment below degrees Celsius, and the electronic components are also under the same conditions; but because of the characteristics of the capacitive power supply, the power supply device cannot reduce the current, power and efficiency. However, the heat dissipation of the capacitive power supply in the prior art The cooling effect of the device is often poor.

Utility model content

(1) Technical problems to be solved

Based on this, the present invention proposes a heat dissipation structure of a component capacitor power supply, which aims to solve the technical problem of poor heat dissipation effect of the heat dissipation device of the component capacitor power supply in the prior art.

(2) Technical solutions

In order to solve the above-mentioned technical problems, the present invention proposes a heat dissipation structure that is converted into a capacitive power supply, wherein the heat dissipation structure of the converted capacitive power supply includes a wind shield arranged on the circuit board mounting bottom plate and a wind shield arranged on the shield. A diversion fan on the wind board, a circuit board is installed on the circuit board mounting bottom plate, the wind shield has ventilation holes corresponding to the diversion fan, and the heat dissipation structure formed into a capacity power supply also includes a circuit board disposed on the circuit board. The heat sink is formed with a through-type air duct facing the ventilation hole, and the heat sink is in contact with the switch tube on the circuit board.

Preferably, at least three radiators are arranged at intervals along the direction of the ventilation holes.

Preferably, the guide fans have two groups symmetrically arranged with respect to the central axis of the circuit board, and the radiators are correspondingly arranged in two groups.

Preferably, each group of guide fans includes at least two guide fans arranged at intervals up and down.

Preferably, the heat sink includes a first vertical beam, a second vertical beam and a cross beam connected between the first vertical beam and the second vertical beam, which are connected to the circuit board and are spaced apart from each other. The air duct is located between the first vertical beam and the second vertical beam.

Preferably, each surface of the first vertical beam and the second vertical beam located in the through-type air duct has a plurality of heat dissipation fins arranged at intervals.

Preferably, the circuit board mounting bottom plate is connected with a housing front cover, and the housing front cover is spaced from the wind deflector and has a mesh hole facing the guide fan.

(3) Beneficial effects

Compared with the prior art, the beneficial effects of the present utility model include:

Since the heat dissipation structure of the component power supply provided by the present invention has a diversion fan and the radiator is formed with a through-type air duct facing the ventilation hole, when the power supply is working, the fan will start to work, and The wind guide flows towards the radiator, and goes to the rear stage through the through-type air duct. At the same time, the heat generated by the switch tube will conduct the generated heat energy to the radiator, and the wind of the through-type air duct will be used to take away the heat, so that a large area can be achieved. Heat dissipation effect, good heat dissipation effect can make the component power supply achieve high power density structure.

Other beneficial effects of the present invention will be described in the following specific embodiments.

Description of drawings

The features and advantages of the present invention will be more clearly understood by reference to the accompanying drawings, which are schematic and should not be construed to limit the present invention in any way, in which:

FIG. 1 is a perspective view of a heat dissipation structure of a component-capacitor power supply according to an embodiment of the present invention;

2 is a schematic diagram of a radiator according to an embodiment of the present invention;

FIG. 3 is a front view of a heat dissipation structure of a chemically-constituted power supply according to an embodiment of the present invention.

Description of reference numbers:

1. Circuit board mounting bottom plate, 2. Wind deflector, 3. Diversion fan, 4. Circuit board, 5. Heat sink, 6. Front cover of housing, 51, First vertical beam, 52, Second vertical beam, 53 , beam, 54, cooling fins, 61, mesh.

Detailed ways

In order to make the above objects, features and advantages of the present utility model more clearly understood, the specific embodiments of the present utility model are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present utility model can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without violating the connotation of the present utility model. Therefore, the present utility model is not limited by the specific implementation disclosed below. .

Referring to FIGS. 1 to 3 , the present invention discloses a heat dissipation structure of a component power supply, wherein the heat dissipation structure of a component power supply includes a wind shield 2 arranged on the circuit board mounting base 1 and a wind shield The diversion fan 3 on the board 2, the circuit board 4 is installed on the circuit board installation bottom plate 1, the wind shield 2 has ventilation holes corresponding to the diversion fan 3, and the heat dissipation structure of the component power supply also includes a heat dissipation structure arranged on the circuit board 4. The radiator 5, the radiator 5 is formed with a through-type air duct facing the ventilation holes.

More specifically, the heat sink 5 includes a first vertical beam 51, a second vertical beam 52 and a cross beam 53 connected between the first vertical beam 51 and the second vertical beam 52, which are connected to the circuit board 4 and are spaced apart from each other. The air duct is located between the first vertical beam 51 and the second vertical beam 52, and is flatly attached to the switch tube element by the first vertical beam 51 and the second vertical beam 52. There is a heat conduction layer between each switch tube.

According to the preferred embodiment of the present invention, at least three radiators 5 are arranged at intervals along the direction of the ventilation holes. The guide fans 3 have two groups arranged symmetrically with respect to the central axis of the circuit board 4 , and the radiators 5 are correspondingly arranged in two groups. Each group of guide fans 3 includes at least two guide fans 3 arranged at intervals up and down. For example, there are two guide fans 3 on the left, two guide fans 3 on the right, three radiators 5 on the left, and three radiators 5 on the right.

In addition, the surfaces of the first vertical beam 51 and the second vertical beam 52 respectively located in the through-type air duct have a plurality of heat dissipation fins 54 arranged at intervals to increase the heat dissipation area and enhance the heat dissipation effect.

Of course, the circuit board mounting base plate 1 is connected with a housing front cover 6 . The housing front cover 6 is spaced apart from the wind shield 2 and has a mesh hole 61 facing the guide fan 3 . Specifically, the fan guides the outside wind to enter through the mesh hole 61 , and to form a cooling airflow through the ventilation hole and the through-type air duct in sequence.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention.

Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope of the present invention. within the scope of the appended claims.

Claims (7)

1. A heat dissipation structure converted into a capacitive power supply, characterized in that the heat dissipation structure converted into a capacitive power supply comprises a wind shield arranged on a circuit board mounting base plate and a guide fan arranged on the wind shield , a circuit board is installed on the circuit board mounting bottom plate, the windshield has ventilation holes corresponding to the guide fan, and the heat dissipation structure of the component power supply also includes a radiator arranged on the circuit board, the The radiator is formed with a through-type air duct facing the ventilation hole, and the radiator is in contact with the switch tube on the circuit board. 2 . The heat dissipation structure of a component power supply according to claim 1 , wherein at least three radiators are arranged at intervals along the direction of the ventilation holes. 3 . 3. The heat dissipation structure of claim 1 or 2, wherein the guide fan has two groups symmetrically arranged with respect to the central axis of the circuit board, and the radiator corresponds to There are two sets of settings. 4 . The heat dissipation structure of claim 1 or 2 , wherein each group of guide fans includes at least two guide fans arranged at intervals up and down. 5 . 5 . The heat dissipation structure of claim 1 or 2 , wherein the heat sink comprises a first vertical beam, a second vertical beam spaced apart from each other and connected to the circuit board. 5 . The cross beam between the first vertical beam and the second vertical beam, and the through-type air duct is located between the first vertical beam and the second vertical beam. 6 . The heat dissipation structure of claim 5 , wherein the surfaces of the first vertical beam and the second vertical beam respectively located in the through-type air duct have a plurality of heat dissipation fins arranged at intervals. 7 . piece. 7 . The heat dissipation structure of the component power supply according to claim 1 or 2 , wherein the circuit board mounting bottom plate is connected with a housing front cover, and the housing front cover is spaced from the wind deflector and has 7 . Face the mesh of the guide fan.

Images