CN210986812U - Heat radiation structure of formation partial volume power - Google Patents
Heat radiation structure of formation partial volume power Download PDFInfo
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- CN210986812U CN210986812U CN201921783197.5U CN201921783197U CN210986812U CN 210986812 U CN210986812 U CN 210986812U CN 201921783197 U CN201921783197 U CN 201921783197U CN 210986812 U CN210986812 U CN 210986812U
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- circuit board
- vertical beam
- heat dissipation
- partial volume
- heat radiation
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Abstract
The utility model discloses a heat radiation structure of formation partial volume power, the heat radiation structure of formation partial volume power is including setting up deep bead and the setting on circuit board mounting plate and being in diversion fan on the deep bead, install the circuit board on the circuit board mounting plate, the deep bead corresponds diversion fan has the ventilation hole, the heat radiation structure of formation partial volume power is still including setting up the radiator on the circuit board, the radiator is formed with the face in the through-type wind channel in ventilation hole, the radiator contact in switch tube on the circuit board. The heat dissipation structure of the formation and grading power supply aims to solve the technical problem that a heat dissipation device of the formation and grading power supply in the prior art is poor in heat dissipation effect.
Description
Technical Field
The utility model relates to a power heat radiation structure technical field especially relates to a heat radiation structure of formation partial volume power.
Background
At present, in the existing component-capacitance power supply, a large-current and high-power device is often required; but the problem of large current brings the hidden trouble of overhigh temperature to the printed circuit; generally, a printed circuit board needs to operate in an environment below 100 ℃ to continuously operate for a long time, and electronic components are also under the same condition; however, because of the characteristics of the chemical composition capacitive power supply, the power supply device cannot reduce the current, power and efficiency, however, the heat dissipation effect of the heat dissipation device of the chemical composition capacitive power supply in the prior art is often poor.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Based on this, the utility model provides a change heat radiation structure of partial volume power, this change heat radiation structure of partial volume power aims at solving the poor technical problem of radiating effect of the heat abstractor of partial volume power among the prior art.
(II) technical scheme
In order to solve the technical problem, the utility model provides a heat radiation structure of formation partial volume power, wherein, the heat radiation structure of formation partial volume power is in including setting up deep bead and the setting on circuit board mounting plate the guiding fan on the deep bead, install the circuit board on the circuit board mounting plate, the deep bead corresponds guiding fan has the ventilation hole, the heat radiation structure of formation partial volume power is still including setting up the radiator on the circuit board, the radiator is formed with the face in the through-type wind channel in ventilation hole, the radiator contact in switch tube on the circuit board.
Preferably, the number of the heat sinks is at least 3 at intervals along the direction of the ventilation holes.
Preferably, the guide fan has two sets symmetrically arranged with respect to a central axis of the circuit board, and the heat sink is correspondingly provided with two sets.
Preferably, each group of guide fans comprises at least two guide fans which are arranged at intervals up and down.
Preferably, the heat sink includes a first vertical beam, a second vertical beam and a cross beam, wherein the first vertical beam and the second vertical beam are connected to the circuit board and are spaced apart from each other, and the through-type air duct is located between the first vertical beam and the second vertical beam.
Preferably, the surfaces of the first vertical beam and the second vertical beam in the through-type air duct respectively have a plurality of radiating fins arranged at intervals.
Preferably, the circuit board mounting base plate is connected with a front cover of the housing, and the front cover of the housing and the wind shield are arranged at intervals and have meshes facing the guide fan.
(III) advantageous effects
The utility model discloses compare with prior art, the beneficial effects of the utility model include:
because the utility model provides an among the heat radiation structure of formation partial volume power, have the water conservancy diversion fan just the radiator is formed with the face to the through-type wind channel in ventilation hole, so at power during operation, the fan can begin work, with wind guide towards the radiator flow to walk to the back level through the through-type wind channel, simultaneously, the switch tube generates heat and can conduct the heat energy that produces to the radiator on, utilize the wind in through-type wind channel to take away the heat, thereby can reach large tracts of land heat dissipation efficiency, good radiating effect can make formation partial volume power realize high power density's structure.
Other advantageous effects of the present invention will be described in the following detailed description.
Drawings
The features and advantages of the invention will be more clearly understood by reference to the accompanying drawings, which are schematic and should not be understood as imposing any limitation on the invention, in which:
fig. 1 is a perspective view of a heat dissipation structure of a chemical capacitive power supply according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a heat sink according to an embodiment of the present invention;
fig. 3 is a front view of the heat dissipation structure of the chemical capacitive power supply according to the embodiment of the present invention.
Description of reference numerals:
1. the circuit board comprises a circuit board mounting base plate, 2, wind shields, 3, a guide fan, 4, a circuit board, 5, a radiator, 6, a shell front cover, 51, a first vertical beam, 52, a second vertical beam, 53, a cross beam, 54, radiating fins, 61 and meshes.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention can be embodied in many different forms other than those specifically described herein, and it will be apparent to those skilled in the art that similar modifications can be made without departing from the spirit and scope of the invention, and it is therefore not to be limited to the specific embodiments disclosed below.
Referring to fig. 1 to 3, the utility model discloses a heat radiation structure of formation partial volume power, wherein, the heat radiation structure of formation partial volume power is including setting up deep bead 2 and the guiding fan 3 of setting on deep bead 2 on circuit board mounting plate 1, installs circuit board 4 on the circuit board mounting plate 1, and deep bead 2 corresponds guiding fan 3 and has the ventilation hole, and the heat radiation structure of formation partial volume power is still including setting up radiator 5 on circuit board 4, and radiator 5 is formed with the through-type wind channel in the face of the ventilation hole.
More specifically, the heat sink 5 includes a first vertical beam 51, a second vertical beam 52 connected to the circuit board 4 at intervals, and a cross beam 53 connected between the first vertical beam 51 and the second vertical beam 52, the through-type air duct is located between the first vertical beam 51 and the second vertical beam 52, and is flatly attached to the switching tube elements by the first vertical beam 51 and the second vertical beam 52, and a heat conduction layer is provided between each of the switching tubes and each of the first vertical beam 51 and the second vertical beam 52.
According to the preferred embodiment of the present invention, the number of the heat sinks 5 is at least 3 along the direction interval of the ventilation holes. The guide fans 3 are provided with two groups which are symmetrically arranged relative to the central axis of the circuit board 4, and the radiators 5 are correspondingly provided with two groups. Each group of guiding fans 3 comprises at least two guiding fans 3 which are arranged up and down at intervals. For example, the left two guiding fans 3, the right two guiding fans 3, the left side has 3 radiators 5, the right side has 3 radiators 5, and the respective through type air ducts of the radiators 5 on each side extend along the same direction.
In addition, the surfaces of the first vertical beam 51 and the second vertical beam 52 in the through-type air duct respectively have a plurality of heat dissipation fins 54 arranged at intervals, so as to increase the heat dissipation area and enhance the heat dissipation effect.
Of course, the circuit board mounting base plate 1 is connected with a housing front cover 6, and the housing front cover 6 is spaced apart from the wind shield 2 and has a mesh 61 facing the guide fan 3. Specifically, the fan guides external wind to enter through the mesh 61, and forms a heat dissipation airflow sequentially through the vent holes and the through-type air passage.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations fall within the scope defined by the appended claims.
Claims (7)
1. The utility model provides a heat radiation structure of formation partial volume power, its characterized in that, the heat radiation structure of formation partial volume power is in including setting up deep bead and the setting on circuit board mounting plate diversion fan on the deep bead, circuit board mounting plate is last to install the circuit board, the deep bead corresponds diversion fan has the ventilation hole, the heat radiation structure of formation partial volume power is still including setting up the radiator on the circuit board, the radiator is formed with the face through-type wind channel in ventilation hole, the radiator contact in switch tube on the circuit board.
2. The heat dissipation structure of a chemical capacitive power source according to claim 1, wherein the heat sink is provided at intervals of at least 3 along an orientation of the vent hole.
3. The heat dissipation structure of a component-capacitor power supply according to claim 1 or 2, wherein the guiding fan has two sets symmetrically disposed with respect to a central axis of the circuit board, and the heat sinks are correspondingly disposed in the two sets.
4. The heat dissipation structure of a component-capacitor power supply according to claim 1 or 2, wherein each set of the guiding fans comprises at least two guiding fans arranged at intervals up and down.
5. The heat dissipation structure for the component capacitive power supply according to claim 1 or 2, wherein the heat sink comprises a first vertical beam, a second vertical beam and a cross beam, the first vertical beam and the second vertical beam are connected to the circuit board and spaced from each other, the cross beam is connected between the first vertical beam and the second vertical beam, and the through-type air duct is located between the first vertical beam and the second vertical beam.
6. The heat dissipation structure of the chemical capacitive power supply according to claim 5, wherein the surfaces of the first vertical beam and the second vertical beam in the through-type air duct respectively have a plurality of heat dissipation fins arranged at intervals.
7. The heat dissipation structure of a component-capacitor power supply according to claim 1 or 2, wherein a front cover of the housing is connected to the circuit board mounting base plate, and the front cover of the housing is spaced from the wind shield and has a mesh facing the flow-guiding fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921783197.5U CN210986812U (en) | 2019-10-23 | 2019-10-23 | Heat radiation structure of formation partial volume power |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921783197.5U CN210986812U (en) | 2019-10-23 | 2019-10-23 | Heat radiation structure of formation partial volume power |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210986812U true CN210986812U (en) | 2020-07-10 |
Family
ID=71423213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921783197.5U Active CN210986812U (en) | 2019-10-23 | 2019-10-23 | Heat radiation structure of formation partial volume power |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210986812U (en) |
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2019
- 2019-10-23 CN CN201921783197.5U patent/CN210986812U/en active Active
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