CN210986683U

CN210986683U - High-power amplifier integrated board structure

Info

Publication number: CN210986683U
Application number: CN201922066436.1U
Authority: CN
Inventors: 岳博; 赵雪; 姜子雯
Original assignee: Heilongjiang University of Science and Technology
Current assignee: Heilongjiang University of Science and Technology
Priority date: 2019-11-26
Filing date: 2019-11-26
Publication date: 2020-07-10
Anticipated expiration: 2029-11-26

Abstract

The utility model discloses a high-power amplifier integrated board structure, which belongs to the field of circuit boards, and comprises a shell, wherein two pairs of support columns are fixedly connected on the inner wall of the shell, a driving circuit board is placed on the support columns, a fixing bolt is connected between the driving circuit board and each support column, the fixing bolt is clamped with the support columns, a plurality of electronic elements are arranged on the driving circuit board, a plurality of evenly distributed pins are connected on the electronic elements, the pins are welded on the driving circuit board, each electronic element is provided with a pair of protection strips matched with the pins, the lower ends of the protection strips are fixedly connected with a protective layer, a pair of elastic bands are connected between the pair of protection strips, fixing nails are connected between the two ends of the protection strips and the driving circuit board, a sealing cover is clamped at the upper end of the shell, and a locking screw matched with, the electronic elements on the circuit board are easy to protect and the electronic elements are prevented from falling off.

Description

High-power amplifier integrated board structure

Technical Field

The utility model relates to a circuit board field, more specifically say, relate to a high-power amplifier intergral template structure.

Background

The circuit board is widely used in a power circuit, a plurality of electrical elements are usually welded on the circuit board, pins of the electrical elements are mostly installed on the circuit board in a spot welding connection mode, and the electronic elements are fixed on the circuit board by welding the plurality of pins of the electronic elements on the circuit board.

The circuit board is in the transportation installation, and the condition of collision appears in the difficult emergence, and the circuit board that is located the casing produces slightly to rock, will influence the welded junction between electronic component and this circuit board, and the condition that the solder joint probably drops causes circuit board contact failure scheduling condition.

SUMMERY OF THE UTILITY MODEL

1. Technical problem to be solved

To the problem that exists among the prior art, the utility model aims to provide a high-power amplifier intergral template structure, it is through setting up the solder joint on a pair of protection strip cover circuit board on the circuit board to directly set up at a pair of protection strip and bring fixed electronic component with the elasticity, make electronic component compressed tightly on the circuit board, make electronic component fixed, electronic component's pin is compressed tightly by the protective layer cladding on the protection strip, the solder joint that makes the pin is protected fixedly, easily protect the electronic component on the circuit board, prevent that electronic component from droing.

2. Technical scheme

In order to solve the above problems, the utility model adopts the following technical proposal.

A high-power amplifier integrated board structure comprises a shell, wherein two pairs of supporting columns are fixedly connected to the inner wall of the shell, a driving circuit board is placed on each supporting column, a fixing bolt is connected between each driving circuit board and each supporting column, each fixing bolt is clamped with each supporting column, a plurality of electronic elements are arranged on each driving circuit board, a plurality of uniformly distributed pins are connected onto each electronic element, the pins are welded onto the driving circuit boards, a pair of protection strips matched with the pins are arranged on each electronic element, a protection layer is fixedly connected to the lower ends of the protection strips, a pair of elastic bands are connected between the protection strips, fixing nails are connected between the two ends of the protection strips and the driving circuit board, a sealing cover is clamped at the upper end of the shell, and locking screws matched with the fixing bolts are in threaded connection on the sealing cover, the fixing bolt is provided with a threaded hole matched with the locking screw, so that electronic elements on the circuit board are protected easily, and the electronic elements are prevented from falling off.

Furthermore, a plurality of uniformly distributed heat dissipation holes are drilled in the side wall of the shell, and the filter screen matched with the heat dissipation holes is fixedly connected to the inner wall of the shell, so that heat dissipation of the circuit board is facilitated.

Furthermore, the lower end of the sealing cover is fixedly connected with a sealing ring matched with the shell, so that the sealing performance of the opening of the device is easily improved.

Furthermore, the protective layer is made of a silica gel material, and the insulating layer is paved on the protective strip, so that the protective layer can coat and compress the welding spot, and the welding spot is easily protected.

Furthermore, the driving circuit board is fixedly connected with an analysis port, and the shell is provided with a wiring hole matched with the wiring port in a chiseled mode, so that wiring of the device is facilitated.

3. Advantageous effects

Compared with the prior art, the utility model has the advantages of:

(1) the scheme is easy to protect the electronic elements on the circuit board and prevent the electronic elements from falling off.

(2) A plurality of radiating holes are uniformly distributed in the side wall of the shell, and a filter screen matched with the radiating holes is fixedly connected to the inner wall of the shell, so that the circuit board is convenient to radiate.

(3) The lower end of the sealing cover is fixedly connected with a sealing ring matched with the shell, so that the sealing performance of the opening of the device is easily improved.

(4) The protective layer is made of silica gel materials, and the insulating layer is laid on the protective strip, so that the protective layer can cover and compress the welding spot, and the welding spot is easy to protect.

(5) Fixedly connected with wiring port on the drive circuit board, it has the wiring hole with wiring port assorted to open the chisel on the casing, makes things convenient for the wiring of device.

Drawings

FIG. 1 is an exploded view of the present invention;

fig. 2 is a perspective view of the present invention;

FIG. 3 is a perspective view of the sealing cover of the present invention;

FIG. 4 is a schematic view of the structure at A in FIG. 3;

FIG. 5 is a cross-sectional view of the fixing bolt of the present invention;

fig. 6 is a partial sectional view of the protection bar of the present invention.

The reference numbers in the figures illustrate:

the device comprises a shell 1, a supporting column 101, a driving circuit board 2, a wiring port 201, an electronic component 3, a pin 301, a fixing bolt 4, a sealing cover 5, a protection strip 6, a protection layer 601, an elastic band 7, a fixing nail 8, a locking screw 9 and a filter screen 10.

Detailed Description

The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention based on the embodiments of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like are to be understood in a broad sense, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected with each other or indirectly through an intermediate medium, or they may be connected with each other through the inside of two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1:

please refer to fig. 1-4, a high-power amplifier integrated board structure, which comprises a housing 1, a plurality of uniformly distributed heat dissipation holes are cut on the side wall of the housing 1, a filter screen 10 matched with the heat dissipation holes is fixedly connected to the inner wall of the housing 1, thereby facilitating the heat dissipation of a circuit board, two pairs of support pillars 101 are fixedly connected to the inner wall of the housing 1, a driving circuit board 2 is placed on the support pillars 101, a fixing bolt 4 is connected between the driving circuit board 2 and each support pillar 101, the fixing bolt 4 is connected with the support pillars 101 in a clamping manner, a sealing cover 5 is connected to the upper end of the housing 1 in a clamping manner, a locking screw 9 matched with the fixing bolt 4 is screwed on the sealing cover 5, a threaded hole matched with the locking screw 9 is cut on the fixing bolt 4, a sealing ring matched with the housing 1 is fixedly.

Referring to fig. 3-6, a wiring port 201 is fixedly connected to a driving circuit board 2, a wiring hole matched with the wiring port 201 is formed in a shell 1, and the wiring of the device is facilitated, a plurality of electronic components 3 are arranged on the driving circuit board 2, a plurality of uniformly distributed pins 301 are connected to the electronic components 3, the pins 301 are welded to the driving circuit board 2, a pair of protection strips 6 matched with the pins 301 are arranged on each electronic component 3, a protection layer 601 is fixedly connected to the lower ends of the protection strips 6, the protection layer 601 is made of a silica gel material, an insulation layer is laid on the protection strips 6, so that the protection layer 601 can cover and compress welding spots, the welding spots are easily protected, a pair of elastic bands 7 is connected between the pair of protection strips 6, and fixing nails 8 are connected between the two ends of the protection strips 6 and the.

When the driving circuit board 2 is installed, the driving circuit board 2 is placed on a support pillar 101 in a shell 1, then a plurality of fixing bolts 4 penetrate through the driving circuit board 2 and are clamped with the support pillar 101 to realize the fixing of the driving circuit board 2, then a protection strip 6 is installed on the driving circuit board 2, the protection strip 6 is fixed on the driving circuit board 2 by using a pair of locking screws 9, and the protection strip 6 covers pins 301 on an electronic element 3, at the moment, the protection layer 601 compresses the pins 301 to ensure that the pins 301 are not easy to fall off from welding points, the electronic element 3 is compressed on the driving circuit board 2 by the tightening action of an elastic cord 7 between the pair of protection strips 6 to ensure that the electronic element 3 is fixed on the driving circuit board 2, the electronic element 3 is not easy to loosen, the pins 301 are not easy to break, finally, a sealing cover 5 is clamped into the shell 1, and then the locking screws 9 are in threaded connection with the, the sealing cover 5 is fixed with the shell 1, and then the installation can be completed.

The above description is only the preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by replacing or changing the technical solution and the improvement concept of the present invention with equivalents and modifications within the technical scope of the present invention.

Claims

1. The utility model provides a high-power amplifier intergral template structure, includes casing (1), its characterized in that: the improved structure of the electronic component is characterized in that two pairs of support columns (101) are fixedly connected to the inner wall of the shell (1), a driving circuit board (2) is placed on the support columns (101), fixing bolts (4) are connected between the driving circuit board (2) and each support column (101), the fixing bolts (4) are connected with the support columns (101) in a clamping mode, a plurality of electronic components (3) are arranged on the driving circuit board (2), a plurality of uniformly distributed pins (301) are connected onto the electronic components (3), the pins (301) are welded onto the driving circuit board (2), each electronic component (3) is provided with a pair of protection strips (6) matched with the pins (301), a protection layer (601) is fixedly connected to the lower ends of the protection strips (6), a pair of elastic bands (7) is connected between the protection strips (6), and fixing nails (8) are connected between the two ends of the protection strips (6) and the driving circuit board (2), the upper end joint of casing (1) has sealed lid (5), threaded connection has locking screw (9) with gim peg (4) assorted on sealed lid (5), open chisel on gim peg (4) have with locking screw (9) assorted screw hole.

2. The high-power amplifier integrated board structure according to claim 1, wherein: the side wall of the shell (1) is provided with a plurality of uniformly distributed heat dissipation holes, and the inner wall of the shell (1) is fixedly connected with a filter screen (10) matched with the heat dissipation holes.

3. The high-power amplifier integrated board structure according to claim 1, wherein: the lower end of the sealing cover (5) is fixedly connected with a sealing ring matched with the shell (1).

4. The high-power amplifier integrated board structure according to claim 1, wherein: the protective layer (601) is made of a silica gel material, and an insulating layer is paved on the protective strip (6).

5. The high-power amplifier integrated board structure according to claim 1, wherein: the driving circuit board (2) is fixedly connected with a wiring port (201), and a wiring hole matched with the wiring port (201) is formed in the shell (1) in a chiseled mode.