CN210986584U - PCB board convenient to installation cut straightly formula device - Google Patents
PCB board convenient to installation cut straightly formula device Download PDFInfo
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- CN210986584U CN210986584U CN201921828306.0U CN201921828306U CN210986584U CN 210986584 U CN210986584 U CN 210986584U CN 201921828306 U CN201921828306 U CN 201921828306U CN 210986584 U CN210986584 U CN 210986584U
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- heat dissipation
- conductive layer
- pcb board
- embedding hole
- conducting layer
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Abstract
The utility model is suitable for the technical field of PCB boards, and provides a PCB board convenient for installing an in-line device, which comprises a conductive layer, an insulating layer, a first device, a first pin, a second device and a second pin, wherein the conductive layer is provided with a first embedding hole and a second embedding hole, the first device is embedded in the first embedding hole, the first device is connected with the conductive layer through a plurality of first pins, the second device is embedded in the second embedding hole, and the first device and the second device are embedded and fixed in the conductive layer by arranging the conductive layer which is provided with the first embedding hole and the second embedding hole for installing the first device and the second device, thereby effectively resisting vibration, reducing the swinging space of the devices, avoiding the situation that the devices fall off because of vibration, fall and the like, and simultaneously effectively reducing the board loading height under the situation that the heat dissipation of the devices is not influenced, the volume is reduced, and the space utilization rate is increased.
Description
Technical Field
The utility model belongs to the technical field of the PCB board, especially, relate to a PCB board convenient to installation cut straightly formula device.
Background
The PCB is a printed circuit board, also called a printed circuit board, which is a provider of electrical connection of electronic components, the design of the PCB is mainly a layout design, and the adoption of the circuit board has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate.
Under general conditions, the direct-insert type device on the PCB adopts veneering type installation, suspended type installation and the like, the conventional installation mode is that the device is fixed by welding pins of the device and gluing, the manual gluing process flow is complex, the consistency is not guaranteed well, equipment and maintenance cost can be increased by using a machine, and the falling phenomenon can also occur when the machine experiences vibration and falls.
SUMMERY OF THE UTILITY MODEL
The utility model provides a PCB board convenient to installation cut straightly formula device aims at solving the problem that the phenomenon of droing appears easily when experiencing vibration and falling.
The utility model is realized in such a way that the PCB board which is convenient for installing the direct-insert type device comprises a conducting layer, an insulating layer, a first device, a first pin, a second device and a second pin;
the conductive layer is provided with a first embedding hole and a second embedding hole, the first device is embedded in the first embedding hole, the first device is connected with the conductive layer through a plurality of first pins, the second device is embedded in the second embedding hole, the second device is connected with the conductive layer through a plurality of second pins, and the insulating layer covers the upper surface of the conductive layer.
Preferably, a plurality of first heat dissipation channels are formed in the conductive layer, a plurality of first heat dissipation holes are formed in the bottom of the conductive layer, and the first heat dissipation channels are communicated with the first embedding holes and the first heat dissipation holes.
Preferably, a plurality of second heat dissipation channels are formed in the conductive layer, a plurality of second heat dissipation holes are formed in the bottom of the conductive layer, and the second heat dissipation channels are communicated with the second embedding holes and the second heat dissipation holes.
Preferably, two reinforcing plates parallel to each other are fixed to the lower surface of the conductive layer, and a heat dissipation pad is fixed to the lower surface of each reinforcing plate.
Preferably, the lower surface of conducting layer is fixed with a plurality of diaphragm, the both ends of diaphragm respectively fixed connection two the reinforcing plate.
Preferably, a plurality of mounting holes are formed in the edge of the conductive layer.
Preferably, the heat dissipation pad is made of a graphene material.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a PCB board convenient to installation cut straightly formula device, offer the conducting layer that is used for installing the first embedding hole and the second embedding hole of first device and second device through the setting, first device and second device embedding are fixed in the conducting layer, thereby can resist vibration effectively, reduce the wobbling space of device, avoid appearing because the vibration, fall etc. and lead to the condition that the device drops, can be simultaneously under the radiating condition of not influencing the device effectual reduction board carries the height, reduce the volume, increase space utilization.
Drawings
Fig. 1 is a schematic view of an overall structure of a PCB board convenient for mounting a direct-insert device according to the present invention;
fig. 2 is a cross-sectional view of a conductive layer of the present invention;
fig. 3 is a bottom view of the conductive layer of the present invention.
In the figure: 1-conducting layer, 2-insulating layer, 3-first embedding hole, 4-second embedding hole, 5-first device, 6-first pin, 7-first heat dissipation channel, 8-first heat dissipation hole, 9-second device, 10-second pin, 11-second heat dissipation channel, 12-second heat dissipation hole, 13-reinforcing plate, 14-transverse plate, 15-heat dissipation pad and 16-mounting hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1-3, the present invention provides a technical solution: a PCB board convenient for installing an in-line device comprises a conducting layer 1, an insulating layer 2, a first device 5, a first pin 6, a second device 9 and a second pin 10.
The conducting layer 1 is provided with a first embedding hole 3 and a second embedding hole 4, a first device 5 is embedded in the first embedding hole 3, the first device 5 is connected with the conducting layer 1 through a plurality of first pins 6, a second device 9 is embedded in the second embedding hole 4, the second device 9 is connected with the conducting layer 1 through a plurality of second pins 10, and the insulating layer 2 covers the upper surface of the conducting layer 1.
In the embodiment, the conducting layer 1 and the insulating layer 2 are mutually attached and fixed, the first device 5 and the second device 9 are both direct-insertion type devices, the first device 5 and the second device 9 are respectively electrified with the conducting layer 1 through the first pin 6 and the second pin 10, the insulating layer 2 is made of acrylic circuit board three-proofing paint, acrylic acid is single-component and low-viscosity resin, the operation is simple, the paint is suitable for various processes such as brushing, spraying, dip-coating, curtain coating and the like, the curing speed is high, the paint has good adhesive force to various circuit boards, the paint has outstanding moisture resistance and good salt mist resistance, and in addition, the paint does not contain oily components, so the paint has the mildew resistance.
Furthermore, a plurality of first heat dissipation channels 7 are formed inside the conductive layer 1, a plurality of first heat dissipation holes 8 are formed at the bottom of the conductive layer 1, and the first heat dissipation channels 7 are communicated with the first embedding holes 3 and the first heat dissipation holes 8.
In this embodiment, the first device 5 generates heat during operation, and the first heat dissipation channel 7 can guide the heat generated by the first device 5 into the first heat dissipation hole 8 and then dissipate the heat, so that efficient heat dissipation can be provided for the first device 5, and the operation of the first device 5 is more stable.
Further, a plurality of second heat dissipation channels 11 are formed inside the conductive layer 1, a plurality of second heat dissipation holes 12 are formed at the bottom of the conductive layer 1, and the second heat dissipation channels 11 are communicated with the second insertion holes 4 and the second heat dissipation holes 12.
In this embodiment, the second device 9 generates heat during operation, and the second heat dissipation channel 11 can guide the heat generated by the second device 9 into the second heat dissipation hole 12 and then dissipate the heat, so that efficient heat dissipation can be provided for the second device 9, and the second device 9 can operate more stably.
Further, two reinforcing plates 13 parallel to each other are fixed to the lower surface of the conductive layer 1, and a heat dissipation pad 15 is fixed to the lower surface of the reinforcing plate 13.
In this embodiment, the reinforcing plate 13 is made of steel sheets, and two reinforcing plates 13 are used for reinforcing the conductive layer 1, so as to increase the structural strength of the conductive layer 1, so that the reinforcing plate 13 has stronger shock resistance and longer service life, and the heat dissipation pad 15 is used for dissipating heat on the reinforcing plate 13, thereby further improving the heat dissipation effect.
Furthermore, a plurality of transverse plates 14 are fixed on the lower surface of the conductive layer 1, and two reinforcing plates 13 are respectively fixedly connected to two ends of the transverse plates 14.
In this embodiment, transverse plate 14 is also made of steel sheet, three transverse plates 14 are provided and fixed at two ends and a middle portion of reinforcing plate 13, and transverse plate 14 and reinforcing plate 13 are integrally formed, and transverse plate 14 and reinforcing plate 13 work together to reinforce conductive layer 1.
Furthermore, a plurality of mounting holes 16 are formed on the edge of the conductive layer 1.
In this embodiment, the mounting hole 16 is used for installing the PCB board of the present invention, the mounting hole 16 is provided with four and is respectively located at four corners of the PCB board.
Further, the heat dissipation pad 15 is made of graphene.
In this embodiment, the heat dissipation area of the horizontal plate 14 can be increased by the graphene material, so that the heat dissipation effect is improved.
The utility model discloses a theory of operation and use flow: the utility model discloses install the back well, conducting layer 1 is fixed with 2 laminating each other of insulating layer, first device 5 and second device 9 are respectively through first pin 6 and second pin 10 and 1 circular telegrams of conducting layer, first device 5 can produce the heat when moving, first heat dissipation channel 7 can channel into first louvre 8 with the heat that first device 5 produced, then the effluvium, second device 9 can produce the heat when moving, second heat dissipation channel 11 can channel into second louvre 12 with the heat that second device 9 produced, then the effluvium, two gusset plates 13 and diaphragm 14 can consolidate conducting layer 1 jointly, thereby increase the structural strength of conducting layer 1, make gusset plate 13 shock resistance stronger, long service life, heat pad 15 can dispel the heat on gusset plate 13, thereby further promote the radiating effect. The utility model discloses a PCB board can resist vibration effectively, reduces the wobbling space of device, avoids appearing because the vibration, fall etc. and lead to the condition that the device drops, can be simultaneously under the radiating condition of device effectual reduction board carry the height, reduce the volume, increase space utilization, in addition, this scheme of use need not beat and glue the processing, can practice thrift the cost of fixed glue and the outward appearance is more pleasing to the eye clean and tidy.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. The utility model provides a PCB board convenient to installation cut straightly formula device which characterized in that: the device comprises a conductive layer, an insulating layer, a first device, a first pin, a second device and a second pin;
the conductive layer is provided with a first embedding hole and a second embedding hole, the first device is embedded in the first embedding hole, the first device is connected with the conductive layer through a plurality of first pins, the second device is embedded in the second embedding hole, the second device is connected with the conductive layer through a plurality of second pins, and the insulating layer covers the upper surface of the conductive layer.
2. A PCB board for facilitating the mounting of in-line devices according to claim 1, wherein: a plurality of first heat dissipation channels are formed in the conducting layer, a plurality of first heat dissipation holes are formed in the bottom of the conducting layer, and the first heat dissipation channels are communicated with the first embedding holes and the first heat dissipation holes.
3. A PCB board for facilitating the mounting of in-line devices according to claim 1, wherein: a plurality of second heat dissipation channels are formed in the conducting layer, a plurality of second heat dissipation holes are formed in the bottom of the conducting layer, and the second heat dissipation channels are communicated with the second embedding holes and the second heat dissipation holes.
4. A PCB board for facilitating the mounting of in-line devices according to claim 1, wherein: two reinforcing plates which are parallel to each other are fixed on the lower surface of the conducting layer, and a heat dissipation pad is fixed on the lower surface of each reinforcing plate.
5. A PCB board for facilitating the mounting of in-line devices according to claim 4, wherein: the lower surface of conducting layer is fixed with a plurality of diaphragms, the both ends of diaphragm are two fixed connection respectively the gusset plate.
6. A PCB board for facilitating the mounting of in-line devices according to claim 1, wherein: a plurality of mounting holes are formed in the edge of the conducting layer.
7. A PCB board for facilitating the mounting of in-line devices according to claim 4, wherein: the heat dissipation pad is made of graphene materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921828306.0U CN210986584U (en) | 2019-10-28 | 2019-10-28 | PCB board convenient to installation cut straightly formula device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921828306.0U CN210986584U (en) | 2019-10-28 | 2019-10-28 | PCB board convenient to installation cut straightly formula device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210986584U true CN210986584U (en) | 2020-07-10 |
Family
ID=71415864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921828306.0U Active CN210986584U (en) | 2019-10-28 | 2019-10-28 | PCB board convenient to installation cut straightly formula device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210986584U (en) |
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2019
- 2019-10-28 CN CN201921828306.0U patent/CN210986584U/en active Active
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