CN210986562U

CN210986562U - High-frequency mixed pressing plate

Info

Publication number: CN210986562U
Application number: CN201921543054.7U
Authority: CN
Inventors: 黄国祥; 卢小东
Original assignee: SICHUAN SHENBEI CIRCUIT TECHNOLOGY CO LTD
Current assignee: SICHUAN SHENBEI CIRCUIT TECHNOLOGY CO LTD
Priority date: 2019-09-17
Filing date: 2019-09-17
Publication date: 2020-07-10
Anticipated expiration: 2029-09-17

Abstract

The utility model discloses a high frequency mixes clamp plate in circuit board equipment technical field, including mixing clamp plate, high frequency chip and fixing device, the lateral wall of mixing clamp plate installs the wiring foot through the tinning, the inside of mixing clamp plate is opened there is concave groove, the inside of concave groove is opened there are a plurality of through-holes, the inside of through-hole is installed the sheetmetal, the sheetmetal with mixing clamp plate connects, high frequency chip installs in the concave groove, the top of high frequency chip is installed a plurality of metal feet, the metal foot with the position of through-hole corresponds, and the metal foot with the through-hole uses in coordination; this high frequency mixes setting of clamp plate, structural design is reasonable, through installing the sheetmetal in mixing clamp plate bottom through-hole, installs the heat-resisting ring at the inside wall in concave groove, and the fastness of being connected between can effectual improvement high frequency chip and the mixing clamp plate is used in the cooperation of heat-resisting ring and sheetmetal to the use of improvement circuit board is stable.

Description

High-frequency mixed pressing plate

Technical Field

The utility model relates to a circuit board equipment technical field specifically is a high frequency mixes clamp plate.

Background

In the process of PCB design, if a layer needs to use high-frequency signals, the design usually adopts the mixed pressing of the whole layer of polytetrafluoroethylene high-frequency material and the common epoxy resin material. The existing mixed pressing plate has a serious problem that the stability of connection of a high-frequency chip and the mixed pressing plate is poor when the mixed pressing plate is used, and the high-frequency chip falls off the mixed pressing plate due to vibration of a machine body, so that the use of a circuit board is influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high frequency mixing board to the mixing board that proposes in solving above-mentioned background art is relatively poor with the stability that mixing board is connected of high frequency chip when using, because the vibrations of organism can cause high frequency chip to drop mixing board, and influences the problem of the use of circuit board.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high frequency mixes clamp plate, includes mixed clamp plate, high frequency chip and fixing device, the wiring foot is installed through the tinning to the lateral wall of mixed clamp plate, the inside of mixed clamp plate is opened there is concave groove, the inside of concave groove is opened there are a plurality of through-holes, the internally mounted of through-hole has the sheetmetal, the sheetmetal with mixed clamp plate connects, high frequency chip install in the concave groove, a plurality of metal feet are installed at the top of high frequency chip, the metal foot with the position of through-hole is corresponding, and the metal foot with the through-hole cooperatees and uses, fixing device install in the bottom of mixed clamp plate, fixing device includes two fixing bases and dead lever, the both ends of dead lever with the fixing base is connected, the dead lever with the bottom contact of high frequency chip.

Preferably, the inner side wall of the concave groove is inlaid with a heat-resistant ring, and the high-frequency chip is inlaid in the concave groove through the heat-resistant ring.

Preferably, the number of the through holes and the number of the metal pins are five, and the five through holes and the five metal pins are distributed annularly.

Preferably, the left side wall and the right side wall of the mixed pressing plate are respectively provided with three wiring pins.

Preferably, through holes are formed in the two fixing seats, and two ends of the fixing rod are inserted into the through holes in the fixing seats respectively.

Compared with the prior art, the beneficial effects of the utility model are that: this high frequency mixes setting of clamp plate, structural design is reasonable, through installing the sheetmetal in mixing clamp plate bottom through-hole, installs the heat-resisting ring at the inside wall in concave groove, and the fastness of being connected between can effectual improvement high frequency chip and the mixing clamp plate is used in the cooperation of heat-resisting ring and sheetmetal to the use of improvement circuit board is stable.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the backside structure of the present invention;

fig. 3 is the schematic view of the internal sectional structure of the mixing plate of the present invention.

In the figure: the composite board comprises a composite board 100, a wiring pin 110, a concave groove 120, a heat-resistant ring 121, a through hole 130, a metal sheet 131, a high-frequency chip 200, a metal pin 210, a fixing device 300, a fixing seat 310 and a fixing rod 320.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model provides a high frequency mixes clamp plate for improve the fastness of being connected between high frequency chip and the mixed clamp plate, thereby improve the use stability of circuit board, please refer to fig. 1-3, including mixed clamp plate 100, high frequency chip 200 and fixing device 300.

Referring to fig. 1-3 again, the outer side wall of the hybrid board 100 is provided with a wiring pin 110 by tin plating, the hybrid board 100 is provided with a concave groove 120 inside, the concave groove 120 is provided with a plurality of through holes 130 inside, the through holes 130 are provided with metal sheets 131 inside, the metal sheets 131 are connected with the hybrid board 100, the hybrid board 100 is used for mounting the high-frequency chip 200 and the fixing device 300, the wiring pin 110 is used for communicating with an external circuit, the concave groove 120 is used for mounting the high-frequency chip 200, and the through holes 130 are used for inserting the metal pins 210.

Referring to fig. 1 and 3 again, the high frequency chip 200 is installed in the concave groove 120, a plurality of metal pins 210 are installed on the top of the high frequency chip 200, the metal pins 210 correspond to the positions of the through holes 130, the metal pins 210 are used in cooperation with the through holes 130, the high frequency chip 200 is used for generating high frequency signals, and the metal pins 210 are used for connecting the high frequency chip 200 with circuits in the voltage mixing and pressing plate 100.

Referring to fig. 2-3 again, the fixing device 300 is installed at the bottom of the hybrid board 100, the fixing device 300 includes two fixing bases 310 and a fixing rod 320, two ends of the fixing rod 320 are connected to the fixing bases 310, the fixing rod 320 contacts with the bottom of the high-frequency chip 200, and the high-frequency chip 300 is used for fixing the high-frequency chip 200, so as to improve the stability of the connection between the high-frequency chip 200 and the hybrid board 100.

Referring to fig. 2 again, in order to prevent the high frequency chip 200 from separating from the hybrid board 100, a heat-resistant ring 121 is embedded in the inner sidewall of the concave groove 120, the high frequency chip 200 is embedded in the concave groove 120 through the heat-resistant ring 121, and the heat-resistant ring 121 is used to increase the friction force between the high frequency chip 200 and the hybrid board 100.

Referring to fig. 2-3, in order to improve the connection stability between the high-frequency chip 200 and the hybrid board 100, the number of the through holes 130 and the number of the metal pins 210 are five, the five through holes 130 and the five metal pins 210 are distributed in a ring shape, and the through holes 130 and the metal pins 210 are used in cooperation with each other to improve the firmness between the high-frequency chip 200 and the hybrid board 100.

Referring to fig. 1 again, in order to facilitate connection with an external power device, three connection pins 110 are respectively installed on the right side wall and the left side wall of the hybrid board 100, and the connection pins 110 are used for being firmly connected with an external power.

Referring to fig. 2-3, in order to facilitate the detachment and installation of the fixing device 300, through holes are formed in the two fixing bases 310, two ends of the fixing rod 320 are respectively inserted into the through holes in the fixing bases 310, and the fixing rod 320 is used for supporting the high-frequency chip 200 and preventing the high-frequency chip 200 from falling off the mixing plate 100.

The number of the through holes 130, the metal sheets 131, the metal pins 210, and the wiring pins 110 is not limited to the specific number described in the embodiment, and those skilled in the art can increase or decrease the number as required on the premise that the device can complete the function of fixing the high-frequency chip.

The working principle is as follows: the wiring pin 110 outside the mixed pressing plate 100 is communicated with external power supply equipment, the external power supply equipment supplies power to the mixed pressing plate 100 through the wiring pin 110, electric energy is transmitted to the metal sheet 131 through the circuit inside the mixed pressing plate 100, the metal sheet 131 is transmitted to the high-frequency chip 200 through the metal pin 210, the high-frequency chip 200 is normally used after being electrified, the fixing rod 320 in the fixing rod 300 extrudes the high-frequency chip 200, the metal pin 210 is firmly clamped into the through hole 130 to be in contact with the metal sheet 131, and the use stability of the high-frequency chip 200 is kept.

While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the description of such combinations is not exhaustive in the present specification only for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims

1. A high-frequency mixed compression plate is characterized in that: the high-frequency chip module comprises a mixed pressing plate (100), a high-frequency chip (200) and a fixing device (300), wherein a wiring pin (110) is installed on the outer side wall of the mixed pressing plate (100) through tin plating, a concave groove (120) is formed in the mixed pressing plate (100), a plurality of through holes (130) are formed in the concave groove (120), a metal sheet (131) is installed in the through holes (130), the metal sheet (131) is connected with the mixed pressing plate (100), the high-frequency chip (200) is installed in the concave groove (120), a plurality of metal pins (210) are installed at the top of the high-frequency chip (200), the metal pins (210) correspond to the through holes (130) in position, the metal pins (210) are matched with the through holes (130) for use, the fixing device (300) is installed at the bottom of the mixed pressing plate (100), and the fixing device (300) comprises two fixing seats (310) and a fixing rod (320), two ends of the fixing rod (320) are connected with the fixing seat (310), and the fixing rod (320) is in contact with the bottom of the high-frequency chip (200).

2. The high-frequency hybrid board according to claim 1, wherein: a heat-resistant ring (121) is inlaid in the inner side wall of the concave groove (120), and the high-frequency chip (200) is inlaid in the concave groove (120) through the heat-resistant ring (121).

3. The high-frequency hybrid board according to claim 1, wherein: the number of the through holes (130) and the number of the metal feet (210) are five, and the five through holes (130) and the five metal feet (210) are distributed annularly.

4. The high-frequency hybrid board according to claim 1, wherein: the right side wall and the left side wall of the mixed pressing plate (100) are respectively provided with three wiring pins (110).

5. The high-frequency hybrid board according to claim 1, wherein: through holes are formed in the two fixing seats (310), and two ends of the fixing rod (320) are inserted into the through holes in the fixing seats (310) respectively.