CN210986350U

CN210986350U - Mould structure with controllable wire position wire bullet ripples

Info

Publication number: CN210986350U
Application number: CN202020142057.6U
Authority: CN
Inventors: 大原祐子
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-01-22
Filing date: 2020-01-22
Publication date: 2020-07-10
Anticipated expiration: 2030-01-22

Abstract

A mold structure with wire elastic wave capable of controlling wire position includes: the first die is provided with a pressing surface, the center of the pressing surface is provided with a positioning lug, the pressing surface is convexly provided with a pressing wavy part, the pressing wavy part is provided with two parallel wire protection grooves, and the wire protection grooves are positioned at two sides of the positioning lug; and a second mold having a forming surface with a positioning groove corresponding to the positioning protrusion, the forming surface having a forming wavy portion, the forming wavy portion having two wire positioning grooves corresponding to the wire protection grooves, the wire positioning grooves being located at two sides of the positioning groove. In the hot pressing process of wire elastic wave, the structure arrangement of the positioning bump and the positioning groove effectively solves the problems that when the wire is heated and pressurized in a mould in the process of manufacturing a loudspeaker vibrating plate (also called elastic wave), the shrinkage stress of the cloth material receiving heat is further balanced, and the wire is prevented from dislocation or deforming, loosening and damaging due to heating.

Description

Mould structure with controllable wire position wire bullet ripples

Technical Field

The present invention relates to a mold structure for a wire damper, and more particularly to a mold structure for a wire damper with a controllable wire position.

Background

The general loudspeaker comprises a bass unit, a middle-tone unit and a treble unit. These three units are responsible for different frequencies; most loudspeakers operate on the same principle. As with a typical moving coil speaker, when current flows through the wires to the voice coil, an electromagnetic field is generated. This forces the moving coil to move within the gap due to the electromagnetic field being at right angles to the magnetic field of the permanent magnet on the horn; the mechanical force generated by the movement makes the paper disc attached with the voice coil generate vertical and up-and-down vibration, so that air is vibrated, audio is emitted and transmitted to human ears, the purpose of restoring sound for human listening is achieved, and the conversion of electric energy into sound energy is realized.

However, because the damper (damper) in the speaker is connected to the voice coil, and the damper mainly functions to suspend the voice coil and the drum paper, the structure is mostly a plurality of concentric circles, and the cross section is wavy, the damper can support the voice coil and the drum paper, so the quality of the damper can directly affect the amplitude of the drum paper, and the tone quality of the speaker is affected.

In addition, the conventional wire damper includes a body and a plurality of wires, wherein at least one of the wires is fixedly connected to the body, one end of the wire is connected to the voice coil, and the other end of the wire is connected to the input terminal. The traditional formed wire elastic wave mainly uses cotton cloth as a basic material, the cotton cloth is soaked in liquid synthetic resin, the synthetic resin is absorbed in fibers of the cotton cloth, and the cotton cloth absorbing the synthetic resin is heated, pressurized and cut off through a plurality of forming dies after being dried and hardened, so that the wire elastic wave with annular ripples on the surface is formed.

However, when the mold is heated and pressed, the outer circumferential surface of the hot press forming surface and the hot press forming surface of the mold also hot press the lead wire; this process causes damage to the wire, which is mostly twisted or braided from a plurality of metal wires; since no other protection structure or reserved space is arranged on the outer ring surface of the hot-pressing forming surface, the damage to the two adjacent end parts of the wire is particularly serious; moreover, the die is not provided with a structure for clamping two ends of the lead so as to prevent dislocation caused by forming shrinkage of the cloth and the lead during hot press forming.

Therefore, when the wire damper vibrates for a long time, the wire may be deformed as a whole due to damage and misalignment of the wire during the forming process, and even the wire may be broken.

Therefore, the inventors of the present invention have observed the above-mentioned deficiency and have conducted the present invention.

SUMMERY OF THE UTILITY MODEL

The main objective of the present invention is to provide a mold structure with a wire spring for controlling the position of the wire, which is set by a specific structure in the mold, so as to effectively solve the problem of wire shrinkage stress caused by heat absorption in the process of heating and pressurizing the mold in the speaker vibrating reed (also referred to herein as spring), and prevent the wire from being dislocated or deformed loose and damaged due to heat.

In order to achieve the above object, the present invention provides a mold structure with wire spring wave at controllable wire position, which comprises: the first die is provided with a pressing surface, the center of the pressing surface is provided with a positioning lug, the pressing surface is convexly provided with a pressing wavy part, the pressing wavy part is provided with two parallel lead protection grooves, and the lead protection grooves are positioned on two sides of the positioning lug; and the second mould is provided with a forming surface, the forming surface is concavely provided with a positioning groove corresponding to the positioning lug, the forming surface is provided with a forming wavy part, the forming wavy part is provided with two lead positioning grooves corresponding to the lead protecting grooves, and the lead positioning grooves are positioned at two sides of the positioning groove.

Preferably, the pressing wavy portion and the forming wavy portion have a circular area at the center thereof.

Preferably, the positioning protrusion is located at the center of the circular area of the pressing wavy portion, and the positioning groove is located at the center of the circular area of the forming wavy portion.

Preferably, the positioning protrusion is in the shape of a long arc, and the positioning groove is in the shape of a long concave arc groove corresponding to the positioning protrusion.

Preferably, the pressing wavy portion and the forming wavy portion are in the shape of a circular block.

Preferably, a central convex column is disposed at the middle position of the positioning groove, and a limiting insertion hole is concavely disposed on the positioning projection corresponding to the central convex column.

Preferably, the pressing wavy portion and the forming wavy portion are formed in one of a rectangular region shape, a polygonal region shape and an elliptical region shape.

Preferably, when the first mold is pressed on the second mold, the wire protection groove and the positioning groove form two wire limiting channels.

Preferably, the two wire limiting channels are in a continuous wave shape, and the wires are linear at the circular area.

The utility model provides a mould structure with wire position controllable wire spring wave, which is mainly characterized in that the structural characteristics of the positioning lug of the first mould and the positioning groove of the second mould are utilized in the hot-press forming process step of the spring wave, thereby effectively solving the problems of dislocation or loose deformation caused by heating when the mould is heated and pressurized in the process of the prior art; additionally, the utility model discloses a mould structure more can reach the utility of whole line.

Drawings

Fig. 1 is an exploded perspective view of a preferred embodiment of the present invention.

Fig. 2 is a perspective view of a second mold according to a preferred embodiment of the present invention.

Fig. 3 is a perspective view of a first mold according to a preferred embodiment of the present invention.

Fig. 4 is a schematic diagram illustrating the operation of the thermoforming process according to a preferred embodiment of the present invention.

Fig. 5 is a cross-sectional view of a mold for a thermoforming process according to a preferred embodiment of the present invention.

Fig. 6 is a schematic diagram of a lead positioning process of the thermoforming process according to a preferred embodiment of the present invention.

Fig. 7 is a perspective view of the wire damper according to the first embodiment of the present invention.

Wherein the reference numerals are as follows:

100 mould structure with wire position controllable wire elastic wave

10 first mold

11 pressing and jointing surface

111 press-fit wave part

12 positioning lug

121 limit jack

13 wire protection groove

20 second die

21 forming surface

211 wave-shaped part

22 positioning groove

221 central convex column

23 wire locating slot

30 wire limiting channel

200 base material

201 preform region

202 central line outgoing region

203 lead outlet position

300 horn vibrating reed

301 conducting wire

Detailed Description

Referring to fig. 1 and 2 in conjunction with fig. 3, an exploded perspective view, a perspective view of a second mold 20 and a perspective view of a first mold 10 according to a preferred embodiment of the present invention are shown, which disclose a mold structure 100 capable of controlling wire bouncing waves at a wire position, the mold structure 100 comprising:

a first mold 10 having a pressing surface 11, a positioning bump 12 at the center of the pressing surface 11, a pressing wavy portion 111 protruding from the pressing surface 11, the pressing wavy portion 111 being in a circular block shape, two parallel wire protection grooves 13 being formed on the pressing wavy portion 111, the wire protection grooves 13 being located at two sides of the positioning bump 12; in the present embodiment, the center of the pressing wavy portion 111 has a circular area, and the positioning bump 12 is located at the center of the circular area of the pressing wavy portion 111, and the positioning bump 12 is in the shape of a long arc.

A second mold 20 having a forming surface 21, the forming surface 21 having a positioning groove 22 corresponding to the positioning protrusion 12, the forming surface 21 having a forming wavy portion 211, the forming wavy portion 211 being in a circular block shape, the forming wavy portion 211 having two wire positioning grooves 23 corresponding to the wire protection grooves 13, the wire positioning grooves 23 being located at two sides of the positioning groove 22.

As shown in fig. 2, 3 and 4, in the present embodiment, the center of the wavy portion 211 has a circular area, the positioning groove 22 is located at the center of the circular area of the wavy portion 211, the positioning groove 22 is in the shape of a long concave arc groove corresponding to the positioning protrusion 12, a central convex pillar 221 is disposed at the middle of the positioning groove 22, and a position-limiting insertion hole 121 is disposed at the position of the positioning protrusion 12 corresponding to the central convex pillar 221.

It should be further noted that, as shown in fig. 4 and 5, when the first mold 10 is pressed on the second mold 20, the wire protection groove 13 and the positioning groove 22 form two wire limiting channels 30, and the wire limiting channels 30 are continuously wavy, and the wire limiting channels 30 are linear at the circular area.

In addition, the present invention provides a substrate 200 disposed between the first mold 10 and the second mold 20 during the hot pressing process, the substrate 200 has at least one pre-forming region 201, the substrate 200 is provided with at least two parallel wires 301, the wires 301 are located in the pre-forming region 201, and the pre-forming region 201 is formed into a circular block corresponding to the pressing wavy portion 111 and the forming wavy portion 211; in the present embodiment, the base material 200 is a strip-shaped cloth, and the preforming region 201 has a central line-outgoing region 202, the central line-outgoing region 202 has two wire-outgoing positions 203, and the wire-outgoing positions 203 are positions of the wire-limiting channels 30.

For a further understanding of the nature of the structures, uses of the techniques and intended utilities of the present disclosure, reference will now be made to the manner of usage and it is believed that the present disclosure will be more fully understood and appreciated from the following description:

please refer to fig. 4 and 5 with reference to fig. 6 and 7, which are a schematic diagram of an operation, a cross-sectional view of a mold, a schematic diagram of a lead positioning, and a perspective diagram of a lead spring wave of a thermoforming process according to a preferred embodiment of the present invention; during the hot press forming process, the first mold 10 is pressed on the second mold 20, and the substrate 200 is hot pressed, so that a substrate 200 located between the first mold 10 and the second mold 20, the wire protection groove 13 and the positioning groove 22 form two wire limiting channels 30, and the pre-forming region 201 has a central wire outlet region 202 therein, the central wire outlet region 202 has two wire outlet positions 203, and the wire outlet position 203 is the position of the wire limiting channel 30.

In addition, referring to fig. 6, when the first mold 10 is pressed on the second mold 20, the positioning protrusion 12 presses the substrate 200 against the positioning groove 22, and limits the bottom-pressed portion of the substrate 200 from shrinking, so that the wires 301 on the substrate 200 are adjusted to the two wire outlet positions 203 on the substrate 200; in the present embodiment, when the preformed region 201 can deform and shrink suddenly, the positioning bump 12 presses the substrate 200 against the positioning groove 22, and the conductive wire 301 is located in the conductive wire limiting channel 30; furthermore, since the middle position of the positioning groove 22 is provided with a central convex column 221, and the positioning bump 12 is concavely provided with a limit insertion hole 121 corresponding to the central convex column 221; more specifically, in the process, the central protrusion 221 is inserted into the position-limiting insertion hole 121, and at this time, the substrate 200 is stably limited and positioned, and then the positioning protrusion 12 is matched to press the substrate 200 to abut against the positioning groove 22, so as to limit the pressed portion of the substrate 200, and the substrate 200 corresponds to the long-strip concave arc groove-shaped structure of the positioning groove 22, and is therefore recessed and heated, and bears the pressing and shrinking stress and is pulled.

Thus, as shown in fig. 6, it can be clearly seen that the present invention can effectively balance the shrinkage stress of the substrate 200 between the pressing wavy portion 111 and the forming wavy portion 211, and the shrinkage stress of the positioning protrusion 12 pressing the substrate 200 against the positioning groove 22; therefore, the lead wire 301 can be stably positioned in the lead wire limiting channel 30; more particularly, the present invention can effectively solve the problem that the conductive wire 301 is dislocated or deformed and loosened due to heating when the mold is heated and pressurized in the prior art; in addition, this creation more can reach whole line effect.

In addition, the present invention can effectively solve the problem that the wire 301 is dislocated or deformed, loose or damaged due to heating when the mold is heated and pressurized during the process of manufacturing the speaker vibrating reed (also referred to as spring wave). To be more specific, when the speaker device uses the speaker vibrating reed 300 manufactured by the present invention, it can solve the problems mentioned in the prior art, and achieve the effects of improving the yield, reducing the cost of waste materials, preventing the conductive wires 301 from loosening, improving the stability of the speaker sound quality, and outputting the high quality sound quality.

It should be noted that the pressing wavy portion 111 and the forming wavy portion 211 are selected from one of rectangular area shape, polygonal area shape and elliptical area shape; more specifically, the present invention can manufacture the non-wafer-shaped horn vibrating reed 300, and further can manufacture the horn vibrating reed 300 having a rectangular region shape, a polygonal region shape or an elliptical region shape according to the pressing wavy portion 111 and the forming wavy portion 211 of the different-shaped blocks.

The features of the present invention and the expected effects achieved by the same are stated as follows:

the utility model discloses a mould structure 100 with steerable wire position wire bullet ripples, its mainly in the thermoforming process step of loudspeaker trembler 300 through the positioning lug 12 of this first mould 10 and the positioning groove 22's of this second mould 20 structural feature to in making this creation can effectively solve in prior art in the process wire 301 when the mould heats, pressurizes, and then takes place the dislocation or because of being heated the loose problem of deformation.

Therefore, the utility model discloses have following implementation efficiency and technical efficiency:

one of the problems of the present invention is to effectively solve the problem that the wire 301 is dislocated or deformed, loose and damaged due to heating when the wire 301 is heated and pressurized in the mold during the process of manufacturing the horn vibrating reed 300 (also referred to as spring wave).

Secondly, the utility model discloses protect the structure of wire 301 in thermoforming's processing procedure, simultaneously, more can reach and prevent that wire 301 misplaces to and reach whole line, firm the utility of wire 301 and this loudspeaker trembler 300 (also known here as play ripples) outside inter combination.

Third, the utility model discloses can reach the efficiency that improves the yield, reduces the waste material cost, prevents that wire 301 from taking place the fibre pine and taking off, improving loudspeaker tone quality's stability and high quality tone quality output.

Fourthly, the utility model discloses can provide the stability of processing in loudspeaker trembler 300's hot pressing process to and promote the machining precision and improve machining efficiency's efficiency.

To sum up, the utility model discloses have its splendid progress practicality in like product, look over the technical data about this type of structure at home and abroad simultaneously, also do not discover to have the same structure to exist earlier in the literature, so, the utility model discloses the reality has possessed novel patent essential, and the belonged law proposes the application.

In the above, only the preferred and feasible embodiments of the present invention are shown and described, and all the modifications of the equivalent structure to which the present invention is applied in the specification and the claims of the present invention should be interpreted as being included in the scope of the present invention.

Claims

1. A kind of mould structure with wire position controllable wire damper, characterized by that, it includes:

the first die is provided with a pressing surface, the center of the pressing surface is provided with a positioning lug, the pressing surface is convexly provided with a pressing wavy part, the pressing wavy part is provided with two parallel lead protection grooves, and the lead protection grooves are positioned on two sides of the positioning lug; and

and the second mold is provided with a forming surface, the forming surface is concavely provided with a positioning groove corresponding to the positioning convex block, the forming surface is provided with a forming wavy part, the forming wavy part is provided with two lead positioning grooves corresponding to the lead protecting grooves, and the lead positioning grooves are positioned at two sides of the positioning groove.

2. The die structure of claim 1, wherein the press wave portion and the forming wave portion have a circular area at the center thereof.

3. The die structure of claim 2, wherein the positioning protrusion is located at the center of the circular area of the press-fit wavy portion, and the positioning groove is located at the center of the circular area of the forming wavy portion.

4. The die structure for wire bouncing wave with controllable wire position of claim 3, wherein the positioning bump has an elongated circular arc shape, and the positioning groove has an elongated concave arc groove shape corresponding to the positioning bump.

5. The die structure of claim 1, wherein the press wave and the form wave are in the shape of a circular block.

6. The mold structure of claim 1, wherein the positioning groove has a central protrusion at the middle thereof, and the positioning protrusion has a positioning hole corresponding to the central protrusion.

7. The die structure of claim 1, wherein the press wave and the form wave are formed in one of a rectangular area, a polygonal area, and an elliptical area.

8. The mold structure of claim 2, wherein the wire position-controllable wire spring is formed by the wire protection groove and the positioning groove to form two wire position-limiting channels when the first mold is pressed against the second mold.

9. The die structure for wire bouncing wave with controllable wire position according to claim 8, wherein the two wire limiting channels are continuously wavy, and the wire limiting channels are linear at the circular area.