CN210982532U

CN210982532U - Chip test seat capable of quickly radiating

Info

Publication number: CN210982532U
Application number: CN201921680457.6U
Authority: CN
Inventors: 杨晓华; 石光普; 史先映
Original assignee: Suzhou Yingshimi Semiconductor Technology Co ltd
Current assignee: Suzhou Yingshimi Semiconductor Technology Co ltd
Priority date: 2019-10-09
Filing date: 2019-10-09
Publication date: 2020-07-10
Anticipated expiration: 2029-10-09

Abstract

The utility model provides a chip testing seat capable of rapidly radiating, which comprises a base, a base cover and a guide mechanism, wherein the guide mechanism is detachably arranged above the base and is positioned in a base cover through groove of the base cover; the guide mechanism comprises a first heat dissipation groove and a second heat dissipation groove which are used for dissipating heat. The utility model discloses a reform transform current change-over plate, produce the guiding mechanism who has first radiating groove and second radiating groove, this guiding mechanism detachable and pedestal connection, can be convenient replace according to test environment, not only can effectually distribute away the heat of chip, and the holistic weight reduction of test seat, reduced the influence to spring in the test seat, elasticity punching press needle in the use, increased the life of spring and elasticity punching press needle.

Description

Chip test seat capable of quickly radiating

Technical Field

The utility model relates to a chip test equipment field especially relates to chip test seat that can dispel the heat fast.

Background

The existing burn-in test sockets typically include a base cover and a base that mate with each other, and a transfer plate having a guide function. In the use process of the existing aging test base, a high-temperature test can be carried out in the process of testing a chip, so that a conversion plate in the common aging test base does not need to be considered in the aspect of heat dissipation. However, when the aging test socket is applied to a normal temperature test, the chip needs to dissipate heat, but the existing aging test socket does not have a special design for heat dissipation in design, so that the heat dissipation problem needs to be solved in the normal temperature test.

Disclosure of Invention

In order to solve the problem, the utility model provides a can quick radiating chip test seat.

The main contents of the utility model include:

the chip testing seat capable of rapidly dissipating heat comprises a base and a base cover which are matched with each other, wherein the base is of a frame structure with an upper opening and a lower opening; a guide mechanism is detachably mounted above the base, a base cover through groove is formed in the center of the base cover, and the guide mechanism is located in the base cover through groove; the guide mechanism comprises two first side walls arranged oppositely and two second side walls arranged oppositely; the first side wall comprises a plurality of first guide surfaces and an extruder avoidance groove; the second side wall comprises a plurality of second guide surfaces and a plurality of first heat dissipation grooves; the first heat dissipation groove and the second guide surface are arranged at intervals; and a second heat dissipation groove is formed at the joint of the first side wall and the second side wall.

Preferably, the number of the second guide surfaces is two, the number of the first heat dissipation grooves is one, the first heat dissipation grooves are located between the two second guide surfaces, and the width of the first heat dissipation grooves is greater than or equal to one half of the width of the second side wall.

Preferably, the bottom downwardly extending of first spigot surface and second spigot surface has the installation department, the mounting hole has been seted up to the upper end of base correspondingly, the installation department inlays in the mounting hole.

Preferably, the first side wall and/or the second side wall further include a plurality of mounting buckles, and the guide mechanism is mounted on the base through the mounting buckles.

Preferably, the first guide surface and the second guide surface are arranged to be inclined inward from top to bottom.

The beneficial effects of the utility model reside in that: the utility model provides a can quick radiating chip test seat, through reforming transform current change-over plate, produce the guiding mechanism who has first radiating groove and second radiating groove, this guiding mechanism detachable and pedestal connection, can be convenient replace according to test environment, not only can effectually distribute away the heat of chip, and the holistic weight of test seat alleviates, has reduced the influence to test seat inner spring, elasticity punching press needle in the use, has increased the life of spring and elasticity punching press needle.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the overall structure of the base cover with the base cover removed;

FIG. 3 is a schematic structural view of a guide mechanism;

reference numerals: 1. a chip; 10. a base; 20. a base cap; 200. a base cover through slot; 30. a guide mechanism; 31. a first side wall; 310. a first guide surface; 312. the squeezer avoids the groove; 32. a second side wall; 320. a second guide surface;

321. a first heat sink; 322. a second heat sink; 330. an installation part; 340. mounting a buckle; 40. and (4) an extruder.

Detailed Description

The technical solution protected by the present invention will be specifically described below with reference to the accompanying drawings.

Please refer to fig. 1-2. The utility model provides a can quick radiating chip test seat, including mutually supporting base 10 and base lid 20, both connect fixedly through the buckle mode be connected with squeezer 40 on the base lid 20, along with base lid 20 towards base 10 downstream to can open squeezer 40, in order to put into chip 1, and use squeezer 40 to fix chip 1, test afterwards.

In one embodiment, the base 10 is a frame structure with an upper opening and a lower opening; a guide mechanism 30 is detachably mounted above the base 10, specifically, the guide mechanism 30 is disposed on the inner side of the upper end surface of the base 10, a base cover through groove 200 is formed in the center of the base cover 20, the guide mechanism 30 is located in the base cover through groove 200, that is, the base cover 20 surrounds the outer side of the guide mechanism 30, and the base cover 20 is connected with the base 10 in a snap-fit manner.

In one embodiment, the guiding mechanism 30 includes two first side walls 31 and two second side walls 32; the first side wall 31 comprises a plurality of first guide surfaces 310 and squeezer avoiding grooves 311; the second side wall 32 comprises a plurality of second guide surfaces 320 and a plurality of first heat dissipation grooves 321; the first guide surface 310 and the second guide surface 320 are both inclined surfaces, specifically, inclined from top to bottom toward the inside, so as to guide the chip 1 when being put in; in this embodiment, the number of the second guide surfaces 320 is two, the number of the first heat dissipation grooves 321 is one, the first heat dissipation grooves 321 are located between the two second guide surfaces 320, and the width of the first heat dissipation grooves 321 is greater than or equal to one half of the width of the second side wall 320, that is, the heat dissipation area is increased as much as possible on the premise that the second side wall 320 satisfies the guide function.

In addition, a second heat dissipation groove 322 is formed at the connection position of the first side wall 31 and the second side wall 32, in this embodiment, the number of the second heat dissipation grooves 322 is 4, the second heat dissipation grooves are located at four opposite corners of the guide mechanism, and a structure for avoiding the return spring is further designed on the outer side of the second heat dissipation groove 322.

In one embodiment, the guide mechanism 30 is mounted on the upper end surface of the base 10, specifically, a mounting portion 330 extends downward from the bottom of the first guide surface 311 and the second guide surface 321, a mounting hole (not shown) is correspondingly opened on the upper end surface of the base 10, and the mounting portion 330 is inserted into the mounting hole.

In addition, the first side wall 31 and/or the second side wall 32 further include a plurality of mounting buckles 340, and the guiding mechanism 30 is mounted on the base 10 through the mounting buckles 340, in this embodiment, the mounting buckles 340 are only disposed on the first side wall, so as to reduce the occupation of the area of the first heat dissipation groove 321 on the second side wall 32.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims

1. The chip test seat capable of dissipating heat quickly is characterized by comprising a base and a base cover which are matched with each other, wherein the base is of a frame structure with an upper opening and a lower opening; a guide mechanism is detachably mounted above the base, a base cover through groove is formed in the center of the base cover, and the guide mechanism is located in the base cover through groove; the guide mechanism comprises two first side walls arranged oppositely and two second side walls arranged oppositely; the first side wall comprises a plurality of first guide surfaces and an extruder avoidance groove; the second side wall comprises a plurality of second guide surfaces and a plurality of first heat dissipation grooves; the first heat dissipation groove and the second guide surface are arranged at intervals; and a second heat dissipation groove is formed at the joint of the first side wall and the second side wall.

2. The socket according to claim 1, wherein the number of the second guiding surfaces is two, the number of the first heat dissipation grooves is one, the first heat dissipation groove is located between the two second guiding surfaces, and the width of the first heat dissipation groove is greater than or equal to one-half of the width of the second side wall.

3. The chip testing socket capable of dissipating heat rapidly according to claim 1, wherein a mounting portion extends downward from the bottom of the first guide surface and the bottom of the second guide surface, a mounting hole is correspondingly formed in the upper end surface of the base, and the mounting portion is inserted into the mounting hole.

4. The chip test socket capable of dissipating heat rapidly according to claim 1 or 3, wherein the first side wall and/or the second side wall further comprises a plurality of mounting clips, and the guide mechanism is mounted on the base through the mounting clips.

5. The quick heat dissipation chip test socket according to claim 1, wherein the first guide surface and the second guide surface are inclined inward from top to bottom.