CN210971131U

CN210971131U - Tool for transporting semiconductor devices

Info

Publication number: CN210971131U
Application number: CN201921021592.XU
Authority: CN
Inventors: 王迪杏; 蒋伟; 王宁; 张阳; 秦文兵; 王金裕; 苗全; 盛路阳; 王伟; 顾育琪
Original assignee: Wuxi Diyuante Technology Co ltd
Current assignee: Wuxi Diyuante Technology Co ltd
Priority date: 2019-07-03
Filing date: 2019-07-03
Publication date: 2020-07-10
Anticipated expiration: 2029-07-03

Abstract

The utility model discloses a tool for transmitting semiconductor equipment, which comprises an equipment placing plate, wherein the top of the equipment placing plate is provided with an equipment placing groove, two ends of two sides of the equipment placing plate are respectively provided with a lifting mechanism, a plurality of moving mechanisms are arranged between two adjacent lifting mechanisms at equal intervals, each moving mechanism comprises a hidden groove, a rotating shaft is arranged in each hidden groove, an inner shaft of the rotating shaft is fixedly connected with the hidden groove, and a first limit groove is arranged at the inner side of the hidden groove below the rotating shaft, the universal wheel can be prevented from falling down, the operation is simple, and the movement is convenient.

Description

Tool for transporting semiconductor devices

Technical Field

The utility model relates to a transmission's instrument, in particular to instrument for transmitting semiconductor device belongs to transmission equipment technical field.

Background

The semiconductor is a material with electric conductivity between a conductor and an insulator at normal temperature, and has wide application in the fields of radio, television, information processing and the like, for example, a diode is a device made of the semiconductor, most of electronic products such as computers, mobile phones or digital recorders nowadays have close relationship with the semiconductor, and with the application of the semiconductor material, the volume of core components of some mechanical equipment is gradually reduced, and the equipment is not clumsy as before.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is overcome prior art's defect, a tool for transmitting semiconductor device is provided, through set up lifting mechanism around placing the board at equipment, place the board lifting back with equipment through lifting mechanism, emit moving mechanism, can be used to remove, moving mechanism alternates between two spacing grooves through the gag lever post, it is spacing fixed with the universal wheel, push device places the board and can remove equipment, insert a spacing inslot with the gag lever post after the universal wheel is packed up, can prevent that the universal wheel from falling down, and easy operation, it is convenient to remove.

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model discloses an instrument for transmitting semiconductor device, place the board including equipment, the top excavation that the board was placed to equipment is equipped with the equipment standing groove, the both ends that the board both sides were placed to equipment all are equipped with lifting mechanism, adjacent two the equidistance is equipped with a plurality of moving mechanism between the lifting mechanism, moving mechanism is including hiding the groove, the inside of hiding the groove is equipped with the pivot, interior axle and the hidden groove fixed connection of pivot, the inboard excavation that hidden groove position in pivot below is equipped with the spacing groove No. one.

As a preferred technical scheme of the utility model, lifting mechanism includes the backup pad, board fixed connection is placed with equipment to the backup pad, the equal threaded connection in middle part of backup pad has the threaded rod, the bottom of threaded rod is rotated and is connected with the support callus on the sole.

As a preferred technical scheme of the utility model, the outer axle fixedly connected with connecting rod of pivot, the connecting rod is located the equal fixedly connected with universal wheel of the outside one end of hidden groove.

As an optimal technical scheme of the utility model, the position excavation of a relative spacing groove is equipped with No. two spacing grooves under the connecting rod vertical state.

As an optimal technical scheme of the utility model, the inside interlude of a spacing groove is equipped with the gag lever post.

The utility model discloses the beneficial effect who reaches is: this semiconductor transmission equipment has made things convenient for the transportation of equipment, through place the board at equipment set up lifting mechanism all around, place the board lifting back with equipment through lifting mechanism, emit moving mechanism, can be used to remove, moving mechanism alternates between two spacing grooves through the gag lever post, it is spacing to fix the universal wheel, pushing equipment places the board and can remove equipment, insert a gag lever post spacing inslot after the universal wheel is packed up, can prevent that the universal wheel from falling down, and easy operation, it is convenient to remove.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic three-dimensional structure of the present invention;

FIG. 2 is a schematic cross-sectional view of the moving mechanism;

FIG. 3 is a schematic view of a stowed configuration of the castor.

In the figure: 1. a device placement plate; 11. an equipment placing groove; 2. a lifting mechanism; 21. a support plate; 22. a threaded rod; 23. supporting the foot pad; 3. a moving mechanism; 31. hiding the groove; 32. a rotating shaft; 33. a connecting rod; 34. a universal wheel; 4. a first limit groove; 5. a second limiting groove; 6. a limiting rod.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Examples

As shown in fig. 1 to 3, the tool for transporting semiconductor devices includes a device placing plate 1, a device placing groove 11 is cut at the top of the device placing plate 1, lifting mechanisms 2 are respectively arranged at two ends of two sides of the device placing plate 1, a plurality of moving mechanisms 3 are equidistantly arranged between two adjacent lifting mechanisms 2, each moving mechanism 3 includes a hidden groove 31, a rotating shaft 32 is arranged inside the hidden groove 31, an inner shaft of the rotating shaft 32 is fixedly connected with the hidden groove 31, and a first limiting groove 4 is cut at the inner side of the hidden groove 31 below the rotating shaft 32.

Lifting mechanism 2 includes

backup pad

21, 1 fixed connection of backup pad 21 and equipment placing board, the equal threaded connection in middle part of backup pad 21 has threaded rod 22, threaded rod 22's bottom is rotated and is connected with support callus on the sole 23, the outer axle fixedly connected with connecting rod 33 of pivot 32, connecting rod 33 is located the equal fixedly connected with universal wheel 34 of the outside one end of hidden groove 31, the position excavation of a relative spacing groove 4 is equipped with No. two spacing grooves 5 under the connecting rod 33 vertical state, the inside interlude of a spacing groove 4 is equipped with gag lever post 6.

Specifically, during the use of the utility model, place semiconductor device in equipment standing groove 11, when equipment needs the transmission, rotate threaded rod 22, threaded rod 22 promotes and supports callus on the sole 23 downstream, continue to rotate threaded rod 22 after supporting callus on the sole 23 and ground contact, equipment is placed board 1 and is risen by reaction force, with the semiconductor device lifting, get down gag lever post 6 from a gag lever post 4, universal wheel 34 emits through the rotation of pivot 32, insert No. two gag lever posts 5 and a gag lever post 4 in proper order with gag lever post 6, gag lever post 6 carries on spacingly to universal wheel 34, pushing equipment is placed 1 mobile device of board and is advanced, after the removal is accomplished, reverse rotation threaded rod 22, support callus on the sole 23 and rise relatively, equipment is placed board 1 and is descended and is supported equipment.

This semiconductor transmission equipment has made things convenient for the transportation of equipment, through place the board at equipment set up lifting mechanism all around, place the board lifting back with equipment through lifting mechanism, emit moving mechanism, can be used to remove, moving mechanism alternates between two spacing grooves through the gag lever post, it is spacing to fix the universal wheel, pushing equipment places the board and can remove equipment, insert a gag lever post spacing inslot after the universal wheel is packed up, can prevent that the universal wheel from falling down, and easy operation, it is convenient to remove.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A instrument for transmitting semiconductor equipment, its characterized in that places board (1) including equipment, the top excavation that board (1) was placed to equipment is equipped with equipment standing groove (11), the both ends of board (1) both sides are placed to equipment all are equipped with lifting mechanism (2), adjacent two the equidistance is equipped with a plurality of moving mechanism (3) between lifting mechanism (2), moving mechanism (3) are including hiding groove (31), the inside of hiding groove (31) is equipped with pivot (32), the interior axle and hidden groove (31) fixed connection of pivot (32), the inboard excavation that hidden groove (31) are located pivot (32) below is equipped with spacing groove (4).

2. The tool for transferring semiconductor devices according to claim 1, wherein the lifting mechanism (2) comprises a support plate (21), the support plate (21) is fixedly connected with the device placing plate (1), a threaded rod (22) is screwed in the middle of the support plate (21), and a support foot pad (23) is rotatably connected to the bottom of the threaded rod (22).

3. The tool for transferring semiconductor devices according to claim 1, wherein a connecting rod (33) is fixedly connected to the outer shaft of the rotating shaft (32), and universal wheels (34) are fixedly connected to the ends of the connecting rod (33) located outside the hidden groove (31).

4. The tool for transferring semiconductor devices as claimed in claim 3, wherein the connecting rod (33) is provided with a second stopper groove (5) bored at a position corresponding to the first stopper groove (4) in a vertical state.

5. The tool for transferring semiconductor devices according to claim 1, wherein a stopper rod (6) is inserted into the first stopper groove (4).