CN210966024U

CN210966024U - Carborundum wafer brushing device

Info

Publication number: CN210966024U
Application number: CN201921065577.5U
Authority: CN
Inventors: 蒋宇飞; 蒋焰云; 朱建国
Original assignee: Wuxi Symantec Technology Co ltd
Current assignee: Wuxi Symantec Technology Co ltd
Priority date: 2019-07-09
Filing date: 2019-07-09
Publication date: 2020-07-10
Anticipated expiration: 2029-07-09

Abstract

The utility model discloses a silicon carbide wafer scrubbing device, which comprises a C-shaped frame, wherein the inner bottom wall of the C-shaped frame is fixedly connected with a positioning box, the inner bottom wall of the positioning box is provided with a first chute, the upper surface of the positioning box is provided with a first through hole, the inner side wall of the positioning box is fixedly embedded with a first threaded pipe, the inner part of the first chute is clamped with a first slide block matched with the first chute, the left side surface of the first slide block is fixedly embedded with a first bearing, the top end of the first slide block runs through the first through hole and extends to the upper part of the positioning box, the left side of the positioning box is provided with a first threaded rod, the right end of the first threaded rod runs through the first threaded pipe and is fixedly connected with the inner ring of the first bearing, the outer surface of the first threaded rod is in threaded connection with the inner wall of the first threaded pipe, the utility model has reasonable design structure, and can adjust, the silicon carbide wafer can be clamped, and the cleaning balls can be wetted.

Description

Carborundum wafer brushing device

Technical Field

The utility model relates to a carborundum wafer brushes technical field, specifically is a carborundum wafer brushing device.

Background

The main application fields of the silicon carbide wafer are L ED solid illumination and high-frequency devices, the material has the advantages of forbidden band, drift velocity, breakdown voltage, heat conductivity, high temperature resistance and the like which are several times higher than those of the traditional silicon, and has irreplaceable advantages in the electronic application fields of high temperature, high pressure, high frequency, high power, photoelectricity, radiation resistance, microwave resistance and the like and the extreme environment application of aerospace, military industry, nuclear energy and the like, the unique silicon carbide single crystal suppliers in China are in the leading position in the aspects of research and development, technology, market development, commercial operation and the like, and the core technology process of the 76mm super large gem grade SiC2 crystal growth is successfully mastered.

The silicon carbide wafer brushing device is used in the silicon carbide wafer brushing process, a brushing machine is basically adopted for brushing the silicon carbide wafer at the present stage, a brush brushing track of the brushing machine can only be brushed back and forth from left to right, and the cleaning effect cannot be achieved due to the fact that the contact area of the brush is insufficient, so that the silicon carbide wafer brushing device is provided for solving the problems.

SUMMERY OF THE UTILITY MODEL

One) technical problem to be solved

The utility model aims at providing a carborundum wafer brushing device in order to make up the deficiency of the prior art.

II) technical scheme

In order to achieve the purpose, the utility model provides a carborundum wafer brushing device, including C-shaped frame, the interior diapire fixedly connected with location case of C-shaped frame, the interior diapire of location case has seted up first spout, the upper surface of location case has seted up first through-hole, the inside wall of location case is fixed to inlay and has been inlayed first screwed pipe, the inside joint of first spout has the first slider with first spout looks adaptation, the left surface of first slider is fixed to be inlayed and is had first bearing, the top of first slider runs through first through-hole and extends to the top of location case, first threaded rod has been placed in the left side of location case, the inner circle fixed connection of first threaded rod runs through first screwed pipe and with first bearing, the surface of first threaded rod and the inner wall threaded connection of first screwed pipe, the upper surface of location case is fixed to be connected with the fixed block, the fixed block and the inside of first slider have all seted up the cavity, the inner thread roof of every cavity all is fixed with the second screwed pipe inlay and have set up the fixed block, the fixed block and the inner ring side of first threaded pipe is connected with the fixed block 3535, the bottom surface of each second threaded plate is connected with the fixed block and has all placed the bottom surface of the second threaded plate, 3683, the fixed block is connected with the second threaded plate, the bottom surface of the fixed plate, the fixed block is connected with the second threaded rod, the fixed block, the fixed plate, the second threaded rod is connected with the fixed plate, the second threaded rod is connected with the bottom surface of L, the fixed plate, the bottom surface of the fixed plate, the fixed plate is connected with;

the inner top wall of the C-shaped frame is fixedly connected with a first telescopic rod, the bottom end of the first telescopic rod is fixedly connected with a positioning block, the bottom surface of the positioning block is provided with a second chute, a second sliding block matched with the second chute is clamped inside the second chute, a through pipe is fixedly embedded inside the second sliding block, a bearing rod is placed inside the through pipe, the left end and the right end of the bearing rod are fixedly connected with the inner side wall of the second chute, the bottom surface of the positioning block is fixedly connected with a baffle, the left side surface of the baffle is fixedly connected with a second telescopic rod, the left end of the second telescopic rod is fixedly connected with the right side surface of the second sliding block, the bottom surface of the second sliding block is provided with a groove, the inner top wall of the groove is fixedly connected with a motor, the outer surface of the output end of the motor is fixedly connected with a cleaning ball, and, the output end of the water pump is fixedly communicated with a plastic hose, and one end, far away from the water pump, of the plastic hose is fixedly communicated with a spray head.

Furthermore, the left end of the first threaded rod is fixedly connected with a first rotating handle, and the outer surface of the first rotating handle is fixedly connected with a first handle sleeve.

Furthermore, every the top of second threaded rod all fixedly connected with second changes the handle, and the second changes the equal fixedly connected with second of surface of handle and is held the cover.

Further, the vertical length value of the bearing rod is smaller than that of the through pipe, and the bearing rod is located inside the through pipe.

Furthermore, the left side surface of the second sliding block is fixedly connected with a fixing plate, and the left side surface of the fixing plate is fixedly connected with the outer surface of the plastic hose.

Further, the L shaped plate has a vertical length value less than that of the second through hole, and the L shaped plate is located inside the second through hole.

III) beneficial effects

Compared with the prior art, the silicon carbide wafer brushing device has the following beneficial effects:

firstly, the method comprises the following steps: the utility model can adjust the left and right length of the silicon carbide wafer by rotating the first rotating handle according to the size of the silicon carbide wafer and by using the matching of the first threaded rod and the first threaded pipe by placing the silicon carbide wafer on the upper surface of the positioning box, meanwhile, the second rotating handle is rotated, and the silicon carbide wafer can be clamped by using the matching of the second threaded rod and the second threaded pipe, so that the phenomenon that the silicon carbide wafer falls off in the cleaning process is avoided, meanwhile, the first telescopic rod is communicated with an external power supply to enable the first telescopic rod to extend up and down, and the motor is communicated with the external power supply to enable the cleaning ball to rotate, and then the second telescopic rod is communicated with an external power supply, so that the second telescopic rod can stretch left and right, the silicon carbide wafer is cleaned, and the working efficiency of the cleaning device is improved.

Secondly, the method comprises the following steps: the utility model discloses a be linked together water pump and external power supply, can make the water pump rotate, utilize the cooperation of plastic hose and shower nozzle to use simultaneously under, can drench the cleaning ball, improved the washing to silicon carbide wafer, utilize the fixed plate simultaneously, can fix plastic hose, promoted the stability of plastic hose in the use.

Drawings

FIG. 1 is a cross-sectional view of a front view of a C-shaped frame of the present invention;

FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1 according to the present invention;

fig. 3 is an enlarged schematic view of the structure at B in fig. 1 according to the present invention.

In the drawing, the device comprises a C-shaped frame 1, a first telescopic rod 2, a water pump 3, a plastic hose 4, a cavity 5, a cavity 6, a first bearing 7, a first threaded rod 8, a first rotating handle 9, a first threaded pipe 10, a first sliding block 11, a first through hole 12, a first sliding groove 13, a baffle plate 14, a positioning block 15, a bearing rod 16, a through pipe 17, a second sliding groove 18, a second sliding block 19, a second telescopic rod 20, a motor 21, a cleaning ball 22, a nozzle 23, a fixing plate 24, a groove 25, a second rotating handle 26, a second threaded pipe 26, a fixing block 27, a 28 and L shaped plate 29, a positioning box 30, a protective pad 31, a second through hole 32, a second bearing 33 and a second threaded rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1-3, the utility model provides a technical scheme, a silicon carbide wafer brushing device, including C-shaped frame 1, the inner bottom wall of C-shaped frame 1 is fixedly connected with location case 29, the inner bottom wall of location case 29 is equipped with first spout 12, the upper surface of location case 29 is equipped with first through-hole 11, the inside wall of location case 29 is fixedly inlayed with first screwed pipe 9, the inside joint of first spout 12 has first slider 10 with first spout 12 looks adaptation, the left side fixed of first slider 10 is inlayed with first bearing 6, the top of first slider 10 runs through first through-hole 11 and extends to the top of location case 29, first threaded rod 7 has been placed on the left side of location case 29, the right-hand member of first threaded rod 7 runs through first screwed pipe 9 and is connected with the inner circle fixed connection of first bearing 6, the surface of first slider 7 and the inner wall threaded connection of first slider 9, the upper surface of location case 29 is connected with the inner wall thread 6327, fixed block 27 and the inside of first slider 10 are all equipped with cavity L, the inner side fixed threaded rod of each other fixed block 27 and the second threaded rod 33 is connected with the top fixed block L of second threaded plate, the top fixed plate L, the fixed block 32 is equipped with the top fixed block 27 and the top fixed block 32, the top fixed block 32 of the second threaded block 20 is connected with the second threaded block 35, the fixed block 35 and the second threaded block 35, the top fixed block 35 is connected with the top fixed block 35, the top fixed block 35 fixed with the second threaded block 35, the top fixed block 35, the top plate is placed with the top fixed block 35, the second threaded block 35 and the top fixed block 35, the top plate is connected with the top plate 35 fixed block;

the inner top wall of the C-shaped frame 1 is fixedly connected with a first telescopic rod 2, the bottom end of the first telescopic rod 2 is fixedly connected with a positioning block 14, the bottom surface of the positioning block 14 is provided with a second chute 17, the inside of the second chute 17 is clamped with a second slide block 18 matched with the second chute 17, the inside of the second slide block 18 is fixedly embedded with a through pipe 16, a bearing rod 15 is placed inside the through pipe 16, the left end and the right end of the bearing rod 15 are fixedly connected with the inner side wall of the second chute 17, the bottom surface of the positioning block 14 is fixedly connected with a baffle plate 13, the left side surface of the baffle plate 13 is fixedly connected with a second telescopic rod 19, the left end of the second telescopic rod 19 is fixedly connected with the right side surface of the second slide block 18, the bottom surface of the second slide block 18 is provided with a groove 24, the inner top wall of the groove 24 is fixedly connected with a motor 20, the, the output end of the water pump 3 is fixedly communicated with a plastic hose 4, and one end of the plastic hose 4 far away from the water pump 3 is fixedly communicated with a spray head 22.

Furthermore, the left end of the first threaded rod 7 is fixedly connected with a first rotating handle 8, and the outer surface of the first rotating handle 8 is fixedly connected with a first handle sleeve. Can effectual first threaded rod 7 of rotation, can reduce the damage of adversary at the in-process of rotating first threaded rod 7.

Furthermore, the top end of each second threaded rod 33 is fixedly connected with a second rotating handle 25, and the outer surface of the second rotating handle 25 is fixedly connected with a second handle sleeve. The second threaded rod 33 can be effectively rotated, and damage to an opponent can be reduced in the process of rotating the second threaded rod 33.

Further, the vertical length value of the bearing rod 15 is smaller than that of the through pipe 16, and the bearing rod 15 is located inside the through pipe 16. The through pipe 16 can be moved left and right, and the phenomenon of jamming of the through pipe 16 in the process of moving left and right can be avoided.

Furthermore, a fixing plate 23 is fixedly connected to the left side surface of the second slider 18, and the left side surface of the fixing plate 23 is fixedly connected to the outer surface of the plastic hose 4. The plastic hose 4 can be fixed, and the stability of the plastic hose 4 can be improved.

Furthermore, the vertical length value of the L shaped plate 28 is smaller than that of the second through hole 31, and the L shaped plate 28 is located inside the second through hole 31, so that the L shaped plate 28 can be effectively moved up and down, and the phenomenon that the L shaped plate 28 is jammed in the process of moving up and down can be avoided.

The working principle is as follows: by placing the silicon carbide wafer on the upper surface of the positioning box 29, adjusting the left and right length of the silicon carbide wafer by rotating the first rotating handle 8 according to the size of the silicon carbide wafer by using the first threaded rod 7 and the first threaded pipe 9 in cooperation, simultaneously rotating the second rotating handle 25, clamping the silicon carbide wafer by using the second threaded rod 33 and the second threaded pipe 26 in cooperation, simultaneously communicating the first telescopic rod 2 with an external power supply, enabling the first telescopic rod 2 to extend and retract up and down, simultaneously communicating the motor 20 with the external power supply, enabling the cleaning ball 21 to rotate, then communicating the second telescopic rod 19 with the external power supply, enabling the second telescopic rod 19 to extend and retract left and right, enabling the water pump 3 to rotate by communicating the water pump 3 with the external power supply, and simultaneously using the plastic hose 4 and the nozzle 22 in cooperation, the cleaning ball 21 can be wetted and the plastic hose 4 can be fixed by the fixing plate 23.

It should be noted that, in this document, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A silicon carbide wafer brushing device comprises a C-shaped frame (1), and is characterized in that a positioning box (29) is fixedly connected to the inner bottom wall of the C-shaped frame (1), a first sliding groove (12) is formed in the inner bottom wall of the positioning box (29), a first through hole (11) is formed in the upper surface of the positioning box (29), a first threaded pipe (9) is fixedly embedded in the inner side wall of the positioning box (29), a first sliding block (10) matched with the first sliding groove (12) is clamped in the first sliding groove (12), a first bearing (6) is fixedly embedded in the left side surface of the first sliding block (10), the top end of the first sliding block (10) penetrates through the first through hole (11) and extends to the upper side of the positioning box (29), a first threaded rod (7) is placed on the left side of the positioning box (29), the right end of the first threaded rod (7) penetrates through the first threaded pipe (9) and is fixedly connected with the inner ring of the first bearing (6), the outer surface of the first threaded pipe (9) is connected with the inner ring (3527) of the first bearing (27), a second threaded plate (27) is connected with the inner side surface of a second threaded plate (27), a second bearing pad (27) is connected with a second threaded plate (27), a second threaded plate (27) and a second bearing pad (27) is connected with a second bearing pad (27), a second bearing pad (27) connected with a second bearing pad (27) and a second threaded plate (27), a second bearing pad (27) connected with a first threaded plate (27), a second bearing pad (27) connected with a first threaded plate (27), a second bearing pad (27) connected with a second bearing pad (27) and a first threaded plate (27), a second bearing pad (27) connected with a first threaded plate (27) and a first threaded plate (27) connected with a first threaded plate (27), a;

the inner top wall of the C-shaped frame (1) is fixedly connected with a first telescopic rod (2), the bottom end of the first telescopic rod (2) is fixedly connected with a positioning block (14), the bottom surface of the positioning block (14) is provided with a second sliding chute (17), a second sliding block (18) matched with the second sliding chute (17) is clamped in the second sliding chute (17), a through pipe (16) is fixedly embedded in the second sliding block (18), a bearing rod (15) is placed in the through pipe (16), the left end and the right end of the bearing rod (15) are fixedly connected with the inner side wall of the second sliding chute (17), the bottom surface of the positioning block (14) is fixedly connected with a baffle (13), the left side surface of the baffle (13) is fixedly connected with a second telescopic rod (19), the left end of the second telescopic rod (19) is fixedly connected with the right side surface of the second sliding block (18), the bottom surface of the second sliding block (18) is provided with a groove (24), the inner top wall of the groove (24) is fixedly connected with a motor (20), the outer surface of the output end of the motor (20) is fixedly connected with a cleaning ball (21), the upper surface of the positioning block (14) is fixedly connected with a water pump (3), the output end of the water pump (3) is fixedly communicated with a plastic hose (4), and one end, far away from the water pump (3), of the plastic hose (4) is fixedly communicated with a spray head (22).

2. A silicon carbide wafer scrubbing apparatus as claimed in claim 1, wherein: the left end fixedly connected with of first threaded rod (7) changes handle (8), and the first surface fixedly connected with of first commentaries on classics handle (8) is first to overlap.

3. A silicon carbide wafer scrubbing apparatus as claimed in claim 1, wherein: every the top of second threaded rod (33) all fixedly connected with second is changeed handle (25), and the second is changeed the equal fixedly connected with second of the surface of handle (25) and is held the cover.

4. A silicon carbide wafer scrubbing apparatus as claimed in claim 1, wherein: the vertical length value of the bearing rod (15) is smaller than that of the through pipe (16), and the bearing rod (15) is located inside the through pipe (16).

5. A silicon carbide wafer scrubbing apparatus as claimed in claim 1, wherein: the left side surface of the second sliding block (18) is fixedly connected with a fixing plate (23), and the left side surface of the fixing plate (23) is fixedly connected with the outer surface of the plastic hose (4).

6. The silicon carbide wafer brushing device according to claim 1, wherein the L-shaped plate (28) has a vertical length value smaller than that of the second through hole (31), and the L-shaped plate (28) is located inside the second through hole (31).