CN210956999U - LDS subassembly structure - Google Patents

Abstract

The utility model discloses a LDS subassembly structure, including the circuit board with locate the injection molding on the circuit board, be equipped with the conducting sheet on the circuit board, the top surface of injection molding is equipped with the LDS circuit, the embedded spring needle that is equipped with of injection molding, the one end of spring needle links to each other with the LDS circuit and switches on, the other end of spring needle supports presses the conducting sheet. The LDS component has novel structure and easy manufacture; the injection molding piece is not required to be provided with a via hole, and the LDS component product has good waterproof performance and can meet the characteristic design requirement in a narrow space; the LDS wiring cannot pass through a parting line, and the risk of disconnection is avoided, so that the electrical performance of the LDS assembly is ensured; LDS is not required to be printed on two sides, processing of LDS equipment is facilitated, and production efficiency of LDS components is improved; the circuit board does not need to be welded with an elastic sheet, and the manufacturing cost of the LDS component is favorably controlled.

Description

LDS subassembly structure

Technical Field

The utility model relates to a LDS subassembly structure.

Background

The LDS component is widely applied to a plurality of fields such as communication, and a typical application of the LDS component is to manufacture the LDS antenna component.

As shown in fig. 1, the existing LDS component includes a circuit board 1, an injection molding part 2, a first LDS surface 30, a second LDS surface 40 and a spring plate 50, the injection molding part 2 and the spring plate 50 are respectively disposed on the circuit board 1, the first LDS surface 30 is disposed on the top surface of the injection molding part 2, the second LDS surface 40 is disposed at the bottom of the injection molding part 2 and is abutted against and conducted with the spring plate 50, wherein a via hole 60 is disposed on the injection molding part 2, and the first LDS surface 30 and the second LDS surface 40 are connected and conducted through the wall surface of the via hole 60. Such an LDS component structure has the following problems: 1. due to the presence of the via 60, the LDS device product is not waterproof; 2. due to the injection molding process, when the injection molded part 2 is injection molded, a parting line 70 exists in the via hole 60, and the position of the parting line 70 has unavoidable step difference and burrs, which may cause the risk of open circuit of the LDS routing; 3. because the position of the via hole 60 needs to be reserved, the injection molding piece 2 cannot be designed in a miniaturized manner; 4. LDS is required to be drilled on the upper and lower parts of the injection molding part 2, two-side laser processing is required, and the production efficiency of LDS equipment is low.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: provides an LDS component structure with a novel structure.

In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a LDS subassembly structure, includes the circuit board and locates injection molding on the circuit board, be equipped with the conducting sheet on the circuit board, the top surface of injection molding is equipped with the LDS circuit, the embedded spring needle that is equipped with of injection molding, the one end of spring needle with the LDS circuit links to each other and switches on, the other end of spring needle supports and presses the conducting sheet.

Furthermore, the spring needle and the injection molding piece are molded into an integrated structure through an insert injection molding process.

Furthermore, the top surface of injection molding is equipped with heavy groove, partly of LDS circuit and one end of pogo pin all is located heavy inslot.

Further, the spring pins are connected with the LDS circuit through soldering tin.

Further, the soldering tin covers the end part of the spring pin.

Furthermore, the spring needle comprises a movable body, an elastic piece and a shell with one end provided with an open hollow structure, the elastic piece is arranged in the shell, one end of the movable body is positioned in the shell and abuts against the elastic piece, and the other end of the movable body extends out of the shell through the opening.

Furthermore, a limiting block extending outwards is arranged on the peripheral wall of the shell.

Furthermore, a knurling is arranged on the peripheral wall of the shell.

Further, the movable body is pressed against the conducting sheet.

Furthermore, the conducting sheet is a printed circuit or a bonding pad.

The beneficial effects of the utility model reside in that: the LDS component has novel structure and easy manufacture; the injection molding piece is not required to be provided with a via hole, and the LDS component product has good waterproof performance and can meet the characteristic design requirement in a narrow space; the LDS wiring cannot pass through a parting line, and the risk of disconnection is avoided, so that the electrical performance of the LDS assembly is ensured; LDS is not required to be printed on two sides, processing of LDS equipment is facilitated, and production efficiency of LDS components is improved; the circuit board does not need to be welded with an elastic sheet, so that the manufacturing cost of the LDS assembly is favorably controlled, the LDS assembly product can be designed more freely in the height direction, and the design difficulty of the LDS assembly is reduced.

Drawings

FIG. 1 is a cross-sectional view of a prior art LDS assembly;

fig. 2 is a cross-sectional view of an LDS assembly according to a first embodiment of the present invention.

Description of reference numerals:

1. a circuit board; 2. an injection molded part; 3. an LDS circuit; 4. a pogo pin; 41. a movable body; 42. an elastic member; 43. a housing; 44. a limiting block; 5. sinking a groove; 6. soldering tin; 30. a first LDS surface; 40. a second LDS surface; 50. a spring plate; 60. a via hole; 70. a parting line.

Detailed Description

In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 2, the LDS assembly structure includes a circuit board 1 and an injection molding part 2 arranged on the circuit board 1, wherein a conducting sheet is arranged on the circuit board 1, an LDS circuit 3 is arranged on the top surface of the injection molding part 2, a spring pin 4 is embedded in the injection molding part 2, one end of the spring pin 4 is connected and conducted with the LDS circuit 3, and the other end of the spring pin 4 is pressed against the conducting sheet.

From the above description, the beneficial effects of the present invention are: the LDS component has novel structure and easy manufacture; the injection molding part 2 is not required to be provided with a via hole, and the LDS component product has good waterproof performance and can meet the characteristic design requirement in a narrow space; the LDS wiring cannot pass through a parting line, and the risk of disconnection is avoided, so that the electrical performance of the LDS assembly is ensured; LDS is not required to be printed on two sides, processing of LDS equipment is facilitated, and production efficiency of LDS components is improved; the circuit board 1 does not need to be welded with an elastic sheet, so that the manufacturing cost of the LDS assembly is favorably controlled, the LDS assembly product can be designed more freely in the height direction, and the design difficulty of the LDS assembly is reduced.

Furthermore, the spring needle 4 and the injection molding piece 2 are molded into an integral structure through an insert injection molding process.

As can be seen from the above description, the spring needle 4 is stably connected with the injection molding part 2, which is beneficial to ensuring the structural stability of the LDS assembly.

Further, the top surface of injection molding 2 is equipped with heavy groove 5, a part of LDS circuit 3 and one end of pogo pin 4 all are located in heavy groove 5.

As can be seen from the above description, the sink 5 can provide convenience for the processing of the LDS circuit 3.

Further, the pogo pins 4 are connected with the LDS circuit 3 through solder 6.

As can be known from the above description, the pogo pin 4 is stably connected with the LDS circuit 3, which is beneficial to ensuring the electrical performance of the LDS component.

Further, the solder 6 covers the end of the pogo pin 4.

From the above description, it can be known that the contact area between the soldering tin 6 and the pogo pin 4 is large, and the contact area between the soldering tin 6 and the LDS circuit 3 is large, which is beneficial to improving the conduction stability between the pogo pin 4 and the LDS circuit 3 and further ensuring the electrical performance of the LDS component.

Further, the pogo pin 4 includes a movable body 41, an elastic member 42, and a housing 43 having an opening at one end thereof, where the elastic member 42 is disposed in the housing 43, one end of the movable body 41 is located in the housing 43 and abuts against the elastic member 42, and the other end of the movable body 41 extends out of the housing 43 through the opening.

As can be seen from the above description, the spring needle 4 can be made of standard parts, and the spring needle 4 is widely available and low in acquisition cost.

Further, the housing 43 has a stopper 44 extending outward from the outer peripheral wall thereof.

As can be seen from the above description, the provision of the stopper 44 can improve the stability of the connection of the pogo pin 4 with the injection molded part 2.

Further, a knurling is provided on the outer peripheral wall of the housing 43.

As can be seen from the above description, the provision of knurling improves the stability of the connection of the pogo pin 4 to the injection molded part 2.

Further, the movable body 41 presses against the conductive sheet.

Furthermore, the conducting sheet is a printed circuit or a bonding pad.

Example one

Referring to fig. 2, a first embodiment of the present invention is: the utility model provides a LDS subassembly structure, includes circuit board 1 and locates injection molding 2 on the circuit board 1, be equipped with the conducting sheet on the circuit board 1, the top surface of injection molding 2 is equipped with LDS circuit 3, the embedded spring needle 4 that is equipped with of injection molding 2, the one end of spring needle 4 with LDS circuit 3 links to each other and switches on, the other end of spring needle 4 supports and presses the conducting sheet, the conducting sheet is printed wiring or pad, the 1 optional PCB board of circuit board. As will be readily appreciated, the pogo pins 4 are made of a conductive material.

Preferably, the pogo pin 4 and the injection molded part 2 are molded into an integral structure by an insert injection molding process.

In this embodiment, the pogo pin 4 includes a movable body 41, an elastic member 42, and a housing 43 having an opening at one end thereof and a hollow structure, the elastic member 42 is disposed in the housing 43, one end of the movable body 41 is located in the housing 43 and abuts against the elastic member 42, and the other end of the movable body 41 extends out of the housing 43 through the opening and abuts against the conductive sheet. Optionally, the outer circumferential wall of the housing 43 is provided with knurling, so that the connection between the pogo pin 4 and the injection molded part 2 is more stable. Optionally, the housing 43 has a stop 44 extending outwardly from the outer peripheral wall thereof.

Furthermore, the top surface of injection molding 2 is equipped with heavy groove 5, some of LDS circuit 3 and the tip of pogo pin 4 all is located in heavy groove 5, pogo pin 4 with LDS circuit 3 passes through soldering tin 6 and links to each other. Preferably, the solder 6 covers the end of the pogo pin 4, i.e. the solder 6 is deposited in the sunken groove 5.

In summary, the LDS component structure provided by the utility model has novel structure and easy manufacture; the injection molding piece is not required to be provided with a via hole, and the LDS component product has good waterproof performance and can meet the characteristic design requirement in a narrow space; the LDS wiring cannot pass through a parting line, and the risk of disconnection is avoided, so that the electrical performance of the LDS assembly is ensured; LDS is not required to be printed on two sides, processing of LDS equipment is facilitated, and production efficiency of LDS components is improved; the circuit board does not need to be welded with an elastic sheet, so that the manufacturing cost of the LDS assembly is favorably controlled, the LDS assembly product can be designed more freely in the height direction, and the design difficulty of the LDS assembly is reduced.

The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.

Claims (10)

1. The utility model provides a LDS subassembly structure, includes the circuit board and locates injection molding on the circuit board, be equipped with the conducting sheet on the circuit board, the top surface of injection molding is equipped with LDS circuit, its characterized in that: the injection molding piece is embedded to be equipped with the spring pin, the one end of spring pin with the LDS circuit links to each other and switches on, the other end of spring pin supports and presses the piece of leading to.

2. The LDS component structure of claim 1, wherein: the spring needle and the injection molding piece are molded into an integrated structure through an insert injection molding process.

3. The LDS component structure of claim 1, wherein: the top surface of injection molding is equipped with heavy groove, partly of LDS circuit and one end of pogo pin all is located heavy inslot.

4. The LDS component structure of claim 3, wherein: the spring pins are connected with the LDS circuit through soldering tin.

5. The LDS component structure of claim 4, wherein: the soldering tin covers the end part of the spring pin.

6. The LDS component structure of claim 1, wherein: the spring needle comprises a movable body, an elastic piece and a shell, wherein one end of the shell is provided with an open hollow structure, the elastic piece is arranged in the shell, one end of the movable body is located in the shell and abuts against the elastic piece, and the other end of the movable body extends out of the shell through the opening.

7. The LDS component structure of claim 6, wherein: the periphery wall of the shell is provided with a limiting block extending outwards.

8. The LDS component structure of claim 6, wherein: and a knurling is arranged on the peripheral wall of the shell.

9. The LDS component structure of claim 6, wherein: the movable body is pressed against the conducting sheet.

10. The LDS component structure of claim 1, wherein: the conducting sheet is a printed circuit or a bonding pad.

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