CN210956397U - Inductor - Google Patents

Abstract

The utility model discloses an inductor. This inductor includes the magnetic core, still includes around locating enameled wire on the magnetic core and locating the glue film of magnetic core one side, the enameled wire is including around locating multilayer coil group on the magnetic core, the glue film is attached in the magnetic core with on the enameled wire. The utility model provides an inductor has big inductance value, accords with the trend of the miniaturized development of electronic components.

Description

Inductor

Technical Field

The utility model relates to an inductance device technical field especially relates to an inductor.

Background

An inductor, also known as a choke, a reactor or a dynamic reactor, is a component that converts electrical energy into magnetic energy for storage. The inductor has an inductance that only impedes the change in current. If the inductor is in a state where no current is passing, it will try to block the current from flowing through it when the circuit is on; if the inductor is in a current passing state, the inductor will try to keep the current unchanged when the circuit is opened.

The inductor mainly comprises a plug-in inductor and a patch inductor, the patch inductor has the advantages of small volume, high space utilization rate and the like, is suitable for surface assembly and high-density mounting, can well meet the requirements of an integrated circuit, and is widely used. The plug-in inductor needs to be inserted on the circuit board and then fixed on the PCB through wave soldering, and the assembly process is troublesome. On the premise that both space and functions are satisfied, the product cost can be reduced by preferentially selecting the patch inductor.

However, with the trend of miniaturization of various electronic components, the size of the chip inductor is limited, and most of the conventional chip inductors only wind a layer of coil on the magnetic core, so that the inductance value of the inductor cannot meet the requirement.

SUMMERY OF THE UTILITY MODEL

The utility model provides an inductor to the inductance value of solving the inductor among the prior art does not reach the technical problem who requires.

In order to achieve the above object, the utility model provides an inductor, including the magnetic core, still include around locating enameled wire on the magnetic core and locating the glue film of magnetic core one side, the enameled wire is including around locating multilayer winding circle group on the magnetic core, the glue film attached in the magnetic core with on the enameled wire.

Optionally, the winding numbers of the winding coil groups of the layers are the same or different.

Optionally, the number of layers of the multilayer winding coil group is an odd number.

Optionally, the magnetic core is i-shaped, and includes two fixing portions and a winding portion connected between the two fixing portions, the enameled wire is wound on the winding portion, each fixing portion is provided with a plating layer thereon, and two free ends of the enameled wire are respectively connected to one plating layer.

Optionally, the main material of the plating layer is Ag-Ni-Sn, and the plating layer is sequentially stacked in a direction away from the fixing portion.

Optionally, a plurality of sides of the fixing portion are provided with the plating layer.

Optionally, the two free ends of the enameled wire are connected with the coating layer by welding.

Optionally, the primary material of the magnetic core is nickel zinc ferrite.

Optionally, the glue layer is a UV glue layer.

Optionally, the enameled wire is an enameled copper wire.

According to the inductor, the enameled wire wound on the magnetic core is set into the multilayer winding coil group, and the magnetic core and the enameled wire are fixed through the glue layer arranged on one side of the magnetic core, so that the enameled wire fully utilizes the winding space on the magnetic core, the number of winding turns is increased, the inductance value of the inductor is increased, and the trend of miniaturization development of electronic components is met; and both the magnetic core and the enameled wire are fixed through the glue layer, so that a large number of gluing processes can be completed within a preset time, batch production is facilitated, and the production efficiency is greatly improved.

Drawings

Fig. 1 is a perspective view of a first embodiment of an inductor of the present invention;

figure 2 is a cross-sectional view of a first embodiment of an inductor of the present invention;

fig. 3 is a perspective view of a second embodiment of the inductor of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention. The following embodiments and their technical features may be combined with each other without conflict.

The following description of the various embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], refer to the directions of the attached drawings only. Accordingly, the directional terms used are used for describing and understanding the present invention, and are not used for limiting the present invention. In the drawings, elements having similar structures are denoted by the same reference numerals.

The existing inductors are mainly divided into plug-in inductors and patch inductors, the patch inductors have the advantages of small size, high space utilization rate and the like, are suitable for surface assembly and high-density mounting, can well meet the requirements of integrated circuits, and are widely used. The plug-in inductor needs to be inserted on the circuit board and then fixed on the PCB through wave soldering, and the assembly is troublesome. On the premise that both space and functions are satisfied, the product cost can be reduced by preferentially selecting the patch element. However, with the trend of miniaturization of electronic components, the size of the electronic components is limited, and most of the conventional chip inductors only wind a layer of wire on the magnetic core, so that the inductance value of the inductor cannot meet the requirement.

Therefore the utility model provides an inductor to improve the inductance value of miniaturized inductor, with the trend that adapts to electronic components toward miniaturization development.

Referring to fig. 1 to 2, an inductor 10 according to a first embodiment of the present invention includes a magnetic core 11, an enamel wire 12 and a glue layer 13. Wherein:

the main material of the magnetic core 11 is nickel zinc ferrite. The initial permeability μ i (f ═ 10KHz) was 800. The nickel-zinc ferrite mainly comprises oxides or salts of iron, nickel and zinc, has the characteristics of high frequency, wide frequency, high impedance and low loss, and becomes a soft magnetic ferrite material with wide application in a high frequency range and excellent performance in recent years.

The magnetic core 11 is i-shaped, and includes two fixing portions 111 and a winding portion 112 connected between the two fixing portions 111, wherein the enameled wire 12 is wound on the winding portion 112, the enameled wire 12 has two free ends, and the two free ends are respectively connected to a plating layer disposed on one fixing portion 111.

The two fixing portions 111 in this embodiment are disposed at two ends of the winding portion 112 in the length direction, and both the two fixing portions 111 and the winding portion 112 are disposed vertically. The fixing portion 111 and the winding portion 112 are each rectangular parallelepiped. It is to be understood that, in order to facilitate winding, the length of the winding portion 112 is greater than the length of the fixing portion 111 in the length direction of the magnetic core 11. Of course, in other embodiments of the present invention, the fixing portion 111 and the winding portion 112 may have other shapes according to actual situations and specific requirements, and the fixing portion 111 and the winding portion 112 are not necessarily connected vertically, which is not limited herein.

Preferably, as a specific embodiment of the inductor 10 provided by the present invention, the fixing portion 111 and the winding portion 112 are integrally formed during the production, that is, the two fixing portions 111 and the winding portion 112 are processed by an integral forming process, so that the processing process of the whole magnetic core 11 is simple, the cost is low, and the connection between the two fixing portions 111 and the winding portion 112 is also stable. Of course, in other embodiments of the present invention, the winding portion 112 and the fixing portion 111 may be formed separately according to actual conditions and specific requirements, and then fixed and connected by a fastening member such as a bolt or an adhesive member such as an adhesive, which is not limited herein.

The length of the entire magnetic core 11 in this embodiment ranges from 0.90mm to 1.0 mm. In this embodiment, the length of the magnetic core 11 is 0.92mm to adapt to the size of the circuit board. In other embodiments of the present invention, the overall length of the magnetic core 11 can take other values according to actual conditions and specific requirements.

Along the width direction cross-section of wire winding portion 112, the cross-section of wire winding portion 112 is the square, in the utility model discloses an embodiment, specific size is 0.5 mm. In other embodiments, the cross-sectional dimension of the winding portion 112 may take other values depending on the actual situation and the specific requirements. It will be appreciated that the cross-section of the wire winding portion 112 may also be rectangular. Wherein the length of the winding part 112 ranges between 0.82 mm and 0.87 mm. In one embodiment, the length of the winding portion 112 is 0.85mm, and in other embodiments, the length of the winding portion 112 may take other values. It is understood that the length of the winding portion 112 is much greater than that of the fixing portion 111, so that the enamel wire 12 is wound in multiple layers.

As is clear from the above description, in the present embodiment, the cross-sectional shape of the fixing portion 111 is rectangular when viewed in the width direction of the core 11. Further, referring to fig. 1, as an embodiment of the inductor 10 according to the present invention, the fixing portion 111 has a plurality of sides, including a first side 1111 and a second side 1112 disposed opposite to each other in a width direction of a cross section of the fixing portion 111, and the fixing portion 111 further has a third side 1113 and a fourth side 1114 disposed opposite to each other in a length direction of the cross section of the fixing portion 111. The first side 1111 is the left side in fig. 1, the second side 1112 is the right side in fig. 1, the third side 1113 is the upper side in fig. 1, and the fourth side 1114 is the lower side in fig. 1. As can be seen, the first side 1111, the second side 1112, the third side 1113 and the fourth side 1114 all protrude out of the winding portion 112.

The two fixing portions 111 are each provided with a plating 1115 to form two electrodes of the inductor 10. The enamel wire 12 comprises two free ends: specifically, referring to fig. 1, the first free end 121 and the second free end 122 are both welded on the plating layer 1115, so as to electrically connect the two ends of the enameled wire 12 with the two plating layers 1115, and thus can be used as mounting electrodes.

In this embodiment, the plating layer 1115 is mainly made of Ag-Ni-Sn and is stacked in this order in a direction away from the fixing portion 111. The plating layer 1115 is provided for hot-press welding with both free ends of the enamel wire 12, so that both free ends of the enamel wire 12 are fixed to the two fixing portions 111. And the electrodes can not form welding spot bulges after being conducted and connected, and meanwhile, the two free ends of the coil can be conveniently welded with the matched welding pads.

In an embodiment of the present invention, the total thickness of the Ag layer, the Ni layer, and the Sn layer coated on the fixing portion 111 ranges from 28 to 32 μm, wherein the thickness of each layer may be the same or different.

In one embodiment of the present invention, the thickness range of the Ag layer is between 10.0-18.0 micrometers, and preferably, the thickness value range of the Ag layer is between 10.0-14.0 micrometers.

In an embodiment of the present invention, the thickness range of the Ni layer is between 2.0-5.0 microns, and preferably, the thickness value range of the Ni layer is between 2.0-3.0 microns.

In an embodiment of the present invention, the thickness range of the Sn layer is between 5.0-12.0 microns, and preferably, the thickness value range of the Sn layer is between 6.0-10.0 microns.

Wherein the Ni layer is sandwiched between the Ag layer and the Sn layer. The thickness of the Ag layer is larger than that of the Sn layer at the outermost layer, and the thickness of the Ag layer and the Sn layer at the outermost layer are both larger than that of the Ni layer at the middle layer.

In other embodiments of the present invention, the Ag layer can be replaced by Ag alloy, such as Ag-Pd alloy, according to practical conditions and specific requirements. In the Ag-Pd alloy, the mass or molar ratio of Ag to Pd may be between 60% and 70%.

Specifically, the Ag — Ni — Sn plating layer is formed, and in one embodiment, is applied to the surface of the third side 1113 of the fixing portion 111, and may be completely or partially applied. When the surface of the third side 1113 of the fixing portion 111 is completely coated, the Ag-Ni-Sn coating layer has a square shape. When the surface portion of the third side 1113 of the fixing portion 111 is coated, the Ag-Ni-Sn coating layer may have other shapes such as a circle, a polygon, and the like.

In an embodiment of the present invention, the surface of the third side 1113 of the fixing portion 111 may be coated with an Ag-Ni-Sn plating layer, which is preferable, to facilitate the subsequent mounting process.

In one embodiment of the present invention, the Ag-Ni-Sn plating layer may be formed on the surface of the third side 1113 of the fixing portion 111 by magnetron sputtering. Before magnetron sputtering, the magnetic core 11 is first cleaned, and specifically, the surface of the magnetic core 11 may be cleaned by plasma to remove oil stains and oxides on the surface of the substrate, thereby improving the bonding force of the plating layer.

The enamel wire 12 includes a plurality of layers of winding coil groups, and the number of winding turns of each layer of winding coil group may be the same or different. It is understood that, when the enamel wire 12 includes 3 layers of winding coil groups, the first winding coil group, the second winding coil group and the third winding coil group are arranged in sequence from inside to outside, wherein the number of winding coils of the first winding coil group, the second winding coil group and the third winding coil group may be the same, or the number of winding coils of the first winding coil group and the second winding coil group may be the same, but the number of winding coils of the first winding coil group and the second winding coil group is different from the number of winding coils of the third winding coil group.

As can be seen from the above description, the two free ends (the first free end 121 and the second free end 122) of the enamel wire 12 in the present embodiment are welded to the two fixing portions 111, so that the effect of positioning the two free ends of the enamel wire 12 on the two fixing portions 111 can be achieved only when the number of layers of the multi-layer winding coil assembly is odd.

In an embodiment of the present invention, the number of winding coil groups of the enameled wire 12 is five, and the direction away from the winding portion 112 is from inside to outside: a first winding coil group 121, a second winding coil group 122, a third winding coil group 123, a fourth winding coil group 124, and a fifth winding coil group 125. Therefore, the space of the winding part 112 can be fully utilized, the inductance value of the inductor 10 is increased, and the development trend of miniaturization of electronic components is met.

Further, the numbers of winding turns of the first, second, third, fourth and fifth winding coil groups 121, 122, 123, 124 and 125 may be the same or different. Or some of the winding coil groups have the same number of winding coils, but have different numbers of winding coils from the remaining winding coil groups, and the remaining winding coil groups have different numbers of winding coils.

In an embodiment of the present invention, the number of winding turns of the first winding coil group 121, the second winding coil group 122, the third winding coil group 123, the fourth winding coil group 124, and the fifth winding coil group 125 generally tends to decrease gradually. The number of winding turns of the first winding coil group 121, the second winding coil group 122, the third winding coil group 123, the fourth winding coil group 124, and the fifth winding coil group 125 may be the same for some layers. The number of winding turns of each layer can be properly adjusted within a certain range according to the electrical property requirement of the required product.

The enameled wire 12 in this embodiment is an enameled copper wire, wherein the outer diameter of the enameled copper wire is 0.033 mm.

In a specific winding manner, one free end of the enamel wire 12 is drawn from the electrode of one fixing portion 111, and is densely wound in a direction toward the other fixing portion 111 according to a preset wire pitch to form a rectangular coil, to form a first winding coil group 121, drawn from the last turn of the first winding coil group 121, reversely wound, and wound from the other fixing portion 111 toward the fixing portion 111 of the initial winding to form a second winding coil group 122, wherein a part of the winding of the second winding coil group 122 is overlapped on the first winding coil group 121, and so on until the fifth winding coil group 125 completes the winding, so that the other free end of the enamel wire 12 can be hung on the plating layer 1115 of the other fixing portion 111. Finally, removing the tail of the enameled wire 12 with more long wire by hot-press welding to obtain an initial semi-finished product.

In a specific embodiment, an inductor 10 having an inductance of 22uH is provided. The enameled wire 12 has a total number of five windings of 71 layers, wherein the number of windings of each layer is as follows: the number of winding turns from the inside to the outside is gradually decreased, wherein the number of winding turns of the first winding turn group 121 is 18, the number of winding turns of the second winding turn group 122 is 19, the number of winding turns of the third winding turn group 123 is 18, the number of winding turns of the fourth winding turn group 124 is 16, and the number of winding turns of the fifth winding turn group 125 is 0. It can be understood that, since the first free end 121 and the second free end 122 of the enamel wire 12 are located on the two opposite fixing portions 111, after the winding of the fourth winding coil group 124 is completed, the first free end 121 and the second free end 122 of the enamel wire 12 need to be separated, and if the first free end 121 is assumed to be fixed, the second free end 122 of the enamel wire 12 is directly and transversely pulled back to the other fixing portion 111, that is, the fifth winding coil group 125 is not wound for multiple turns, and the actual winding is 0 turn.

In another specific embodiment, an inductor 10 with an inductance of 47uH is provided, and the enameled wire 12 has a total of 104 winding turns of five layers, wherein the winding turns of each layer are respectively as follows: the first winding coil group 121 is 22 turns, the second winding coil group 122 is 22 turns, the third winding coil group 123 is 21 turns, the fourth winding coil group 124 is 20 turns, and the fifth winding coil group 125 is 19 turns. Finally, the first free end 121 and the second free end 122 of the enamel wire 12 are fixed on the opposite two fixing portions 111 by thermocompression bonding.

Fig. 2 is a schematic cross-sectional view of the winding portion 112 after five layers of windings are completed. Wherein the cross-sectional view of the winding part 112 shown in fig. 2 after completing five-layer winding is a cross-sectional view of 104 winding turns.

As can be seen from the above description, the cross section of the winding portion 112 in the present embodiment is square, and the specific size is 0.5 × 0.5mm, the enamel wire 12 is an enameled copper wire, and the outer diameter of the enameled copper wire is 0.033mm, so that the side length of the entire winding portion after five layers of winding is completed is 0.83 mm. The specific calculation process is as follows: the thickness of the 0.5mm long winding portion plus the 10-layer enamel wire 12 on the left and right sides or the upper and lower sides is 0.33mm, and thus the side length of the entire winding portion is finally obtained as 0.83 mm.

After the winding of the magnetic core 11 is completed, a semi-finished product is obtained, and further, the inductor 10 further includes a glue layer 13, wherein the cured glue layer 13 is attached to the magnetic core 11 and the enameled wire 12, so that the enameled wire 12 formed by the multi-layer winding coil group is fixed to the magnetic core 11, thereby completing the manufacturing of the whole inductor 10. The specific way of forming the cured adhesive layer is as follows: after the glue is coated, radiation curing is carried out, and the glue layer 13 can be formed.

In an embodiment of the present invention, the adhesive layer 13 is a UV adhesive layer. The UV adhesive is cured by irradiation with ultraviolet light to form an adhesive and used as an adhesive. The photoinitiator (or photosensitizer) in the UV adhesive absorbs ultraviolet light under the irradiation of ultraviolet light to generate active free radicals or cations to initiate monomer polymerization and crosslinking chemical reaction, so that the adhesive is converted from liquid state to solid state within several seconds, and the enameled wire 12 and the magnetic core 11 are fixed.

The structure of the UV glue layer in this embodiment matches the structure of the magnetic core 11 after the winding is completed. Because the four sides of the fixing portion 111 of the magnetic core 11 protrude from the winding portion 112, it can be understood that the thickness of the glue layer 13 is not uniform, the thickness is thicker at the position close to the winding portion 112, and two opposite sides of the glue layer 13 respectively form a corresponding notch matched with the size of the winding portion 112, thereby facilitating the absorption and encapsulation during the surface mounting of the client.

Wherein the thickness of the glue layer 13 ranges between 45-55 microns. It can be understood that the bottom of the adhesive layer 13 is a flat surface, which is convenient for the client to suck and package when pasting the patch.

The utility model provides a finished product inductor 10, through the plane coating technique, it is fixed to make magnetic core 11 and enameled wire 12 pass through the bonding of UV glue, can once only accomplish the rubber coating of several hundreds of products in a cycle (about 40S), does benefit to mass production to can improve production efficiency greatly, save manufacturing cost.

Specifically, the inductor 10 is mounted on a circuit board by a surface mounting technique, and the chip component is mounted on a surface of a printed circuit board or other substrate and is soldered and fixed by wave soldering, reflow soldering, or the like.

In the inductor, the enameled wire 12 wound on the magnetic core 11 is set to be a multi-layer winding coil group, and the magnetic core 11 and the enameled wire 12 are fixed through the glue layer on one side of the magnetic core 11, so that the enameled wire 12 fully utilizes the winding space on the magnetic core 11, the number of winding turns is increased, the inductance value of the inductor 10 is increased, and the trend of miniaturization development of electronic components is met; and the magnetic core 11 and the enameled wire 12 are fixed through the glue layer 13, so that a large number of gluing processes can be completed within a preset time, batch production is facilitated, and the production efficiency is greatly improved.

Referring to fig. 3, an inductor 10 according to a second embodiment of the present invention is shown, in which the inductor 10 in this embodiment is substantially the same as the inductor 10 in the first embodiment, except that:

plating layers 1115 are provided on a plurality of side surfaces of the fixing portion 111 of the core 11.

That is, when the Ag-Ni-Sn plating layer is formed, in the present embodiment, the Ag-Ni-Sn plating layer is applied not only to the surface of the third side 1113 of the fixing portion 111 but also to a plurality of side surfaces of the fixing portion 111. Specifically, the first side 1111 and the second side 1112 on both left and right side surfaces of the fixing portion 111 are formed with Ag — Ni — Sn plating layers. And an Ag-Ni-Sn plating layer is formed on the fifth side 1116 of the fixing portion 111.

Referring to fig. 3, Ag-Ni-Sn plating layers are formed on the first side 1111 and the second side 1112 of the left and right side surfaces of the fixing portion 111 in a triangular shape, and Ag-Ni-Sn plating layers are formed on the fifth side 1116 in a square shape. In other embodiments, the Ag — Ni — Sn plating layers formed on the first side 1111 and the second side 1112 on both left and right sides of the fixing portion 111 may have a square shape. By forming the Ag-Ni-Sn plating on each of the plurality of side surfaces, the strength of the electrode can be increased, and the inductor 10 and the circuit board can be connected more firmly when performing subsequent tin-on-board mounting with the circuit board.

In the inductor 10, the plating layers 1115 are provided on the plurality of side surfaces of the fixing portion 111 of the core 11, so that not only can the electrode strength be increased, but also the connection between the inductor 10 and the circuit board can be more firmly achieved during subsequent tin-plating on the circuit board.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. The utility model provides an inductor, includes the magnetic core, its characterized in that still includes to wind and locates enameled wire on the magnetic core and locating the glue film of magnetic core one side, the enameled wire is including winding and locating multilayer winding coil group on the magnetic core, the glue film attached in the magnetic core with on the enameled wire.

2. The inductor as claimed in claim 1, wherein the number of winding turns of each of said winding turn groups is the same or different.

3. The inductor according to claim 1 or 2, wherein the number of layers of the multilayer winding coil group is an odd number.

4. The inductor according to claim 1, wherein the core is i-shaped, and comprises two fixing portions and a winding portion connected between the two fixing portions, the enameled wire is wound around the winding portion, each of the fixing portions is provided with a coating, and two free ends of the enameled wire are connected to one of the coatings.

5. The inductor as claimed in claim 4, wherein the plating layer is made of Ag-Ni-Sn and is stacked in this order in a direction away from the fixing portion.

6. An inductor as claimed in claim 4 or 5, wherein a plurality of sides of the fixing portion are provided with the plating.

7. The inductor according to claim 6, wherein the free ends of the enameled wires are connected with the plating layer by welding.

8. An inductor according to claim 1, characterized in that the main material of the core is nickel zinc ferrite.

9. The inductor according to claim 1, wherein the glue layer is a UV glue layer.

10. The inductor according to claim 1, wherein the enameled wire is an enameled copper wire.

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