CN210928452U

CN210928452U - Porous flat plate type radiator

Info

Publication number: CN210928452U
Application number: CN201922019343.3U
Authority: CN
Inventors: 蒋建芳
Original assignee: Suzhou Difeite Electronics Co ltd
Current assignee: Suzhou Difeite Electronics Co ltd
Priority date: 2019-11-20
Filing date: 2019-11-20
Publication date: 2020-07-03
Anticipated expiration: 2029-11-20

Abstract

The utility model discloses a porous flat plate type radiator, which comprises a heat conducting plate; the heat conducting plate comprises an upper guide plate and a lower guide plate; the upper guide plate and the lower guide plate are fixedly connected through a plurality of reinforcing ribs, a plurality of grooves are formed in the surface of the upper guide plate at equal intervals, a plurality of heat dissipation holes are formed in the surface of the upper guide plate, a plurality of screw holes are formed in four sides of the lower guide plate, and a silica gel layer is arranged on the bottom surface of the lower guide plate; sliding grooves are formed in two sides of the surface of the lower guide plate, baffles are arranged at two ends of each sliding groove, sliding blocks are arranged in the sliding grooves, pressure springs are fixedly connected to opposite sides of the two sliding blocks, and the other ends of the pressure springs are fixed to the side faces of the baffles; the utility model discloses a cooperation between splint, connecting plate, spout, slider and the compression spring for the centre gripping that splint can stabilize fixes electronic component's both ends, thereby has avoided long-time use back, and the pine takes off between heat-conducting plate and the electronic component, and can be applicable to not unidimensional electronic component.

Description

Porous flat plate type radiator

Technical Field

The utility model relates to a heat abstractor technical field specifically is a porous flat radiator.

Background

With the improvement of semiconductor LED technology, the application of high-power electronic components is wider and wider, but the heat dissipation problem of the high-power electronic components always goes around the development of the technology. At present, heat dissipation of high-power electronic components is mainly carried out in three ways, wherein one way is a heat radiation way, namely a heat dissipation plate is directly in close contact with a substrate of the high-power electronic component, and heat generated by the high-power electronic component is dissipated through the heat dissipation plate in a heat radiation way; secondly, a hot return pipe mode is adopted, namely high-temperature gas carrying heat is led out through a pipeline; thirdly, a forced heat dissipation mode is adopted, namely a fan is adopted to blow away heat, so that the surface temperature is reduced. But none is ideal.

However, at present, the connection and fixation between many flat plate radiators and electronic components are not tight enough, so that the heat dissipation area is not large, and the heat dissipation effect is reduced; secondly, after long-time use, the flat plate radiator and the electronic element are easy to loosen, and the service life is reduced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a porous flat radiator to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a porous flat plate radiator comprises a heat conducting plate; the heat conducting plate comprises an upper guide plate and a lower guide plate; the upper guide plate and the lower guide plate are fixedly connected through a plurality of reinforcing ribs, a plurality of grooves are formed in the surface of the upper guide plate at equal intervals, a plurality of heat dissipation holes are formed in the surface of the upper guide plate, a plurality of screw holes are formed in four sides of the lower guide plate, and a silica gel layer is arranged on the bottom surface of the lower guide plate; sliding grooves are formed in two sides of the surface of the lower guide plate, baffles are arranged at two ends of each sliding groove, sliding blocks are arranged in the sliding grooves, pressure springs are fixedly connected to opposite sides of the two sliding blocks, the other ends of the pressure springs are fixed to the side faces of the baffles, connecting plates are fixedly connected to the upper portions of the two sliding blocks, and clamping plates are fixedly mounted at the ends, away from each other, of the two connecting plates; a plurality of sealed cavities are formed among the upper guide plate, the lower guide plate and the reinforcing ribs; and the heat dissipation plate is vertically arranged at the groove.

Preferably, a fastening bolt is fixed at the screw hole, and a fastening spring is wound on the surface of the fastening bolt; the lower guide plate is fixedly connected with the electronic element through a fastening screw, and a fastening spring wound on the surface of the fastening bolt enables a silica gel layer arranged on the bottom surface of the lower guide plate to be contacted with the electronic element more tightly.

Preferably, the heat conducting plate and the heat radiating plate are made of aluminum alloy materials; the aluminum alloy material has good thermal conductivity.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a cooperation between splint, connecting plate, spout, slider and the compression spring for the centre gripping that splint can stabilize fixes electronic component's both ends, thereby has avoided long-time use back, and the pine takes off between heat-conducting plate and the electronic component, and can be applicable to not unidimensional electronic component.

2. The utility model discloses a fastening spring and fastening bolt's effect, the silica gel layer that makes the bottom surface of the lower guide set up is inseparabler with electronic component's contact to increase heat radiating area improves the radiating effect.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

In the figure: 1. a heat conducting plate; 101. an upper heat conducting plate; 102. a lower heat conducting plate; 103. reinforcing ribs; 2. a groove; 3. a silica gel layer; 4. a chute; 5. a slider; 6. a baffle plate; 7. a pressure spring; 8. a connecting plate; 9. a splint; 10. a heat sink.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1, the present invention provides a technical solution: a porous flat plate type radiator comprises a heat conducting plate 1; the heat-conducting plate 1 comprises an upper guide plate 101 and a lower guide plate 102; the upper guide plate 101 and the lower guide plate 102 are fixedly connected through a plurality of reinforcing ribs 103, a plurality of grooves 2 are arranged on the surface of the upper guide plate 101 at equal intervals, a plurality of heat dissipation holes are formed in the surface of the upper guide plate 101, a plurality of screw holes are formed in four sides of the lower guide plate 102, a silica gel layer 3 is arranged on the bottom surface of the lower guide plate 102, and the lower guide plate 102 can be in closer contact with an electronic element through the silica gel layer 3, so that the heat dissipation area; the two sides of the surface of the lower guide plate 102 are provided with sliding grooves 4, two ends of each sliding groove 4 are provided with baffle plates 6, sliding blocks 5 are arranged inside each sliding groove 4, one opposite sides of the two sliding blocks 5 are fixedly connected with pressure springs 7, the other ends of the pressure springs 7 are fixed on the side surfaces of the baffle plates 6, connecting plates 8 are fixedly connected above the two sliding blocks 5, clamping plates 9 are fixedly arranged at the ends, away from each other, of the two connecting plates 8, the clamping plates 9 and the connecting plates 8 are integrally formed, the clamping plates 9 and the connecting plates 8 are slidably connected with the lower guide plate 102 through the sliding blocks 5 in the sliding grooves 4, and the two arranged pressure; a plurality of sealed cavities are formed among the upper guide plate 101, the lower guide plate 102 and the reinforcing ribs 103, and phase-changeable heat transfer media are filled in the sealed cavities and transfer heat through phase change of gas and liquid, so that the heat conduction plate has extremely high heat conductivity; the groove 2 is vertically provided with the heat dissipation plate 10, and the contact surface of the radiator and air is increased by arranging the heat dissipation plates 10, so that the heat dissipation area is increased, and the heat dissipation effect is improved.

A fastening bolt is fixed at the screw hole, and a fastening spring is wound on the surface of the fastening bolt; the lower guide plate 102 is fixedly connected with the electronic component through a fastening screw, and a fastening spring wound on the surface of the fastening screw enables the silica gel layer 3 arranged on the bottom surface of the lower guide plate 102 to be in contact with the electronic component more tightly.

The heat conducting plate 1 and the heat dissipation plate 10 are made of aluminum alloy materials; the aluminum alloy material has good thermal conductivity.

The working principle is as follows: when using, be fixed in the electronic component both ends with splint 9 centre gripping through the slip of connecting plate 8 in spout 4, and make more firm of splint 9 centre gripping by compression spring's 7 elastic action, later, by inseparable bolt with lower guide 102 and electronic component fixed connection, the winding fastening spring in fastening bolt surface makes the silica gel layer 3 that lower guide 102 bottom surface set up more inseparable with the electronic component contact, when the heat dissipation, the boiling phase change that is heated of medium in the sealed cavity is gaseous, take away the heat simultaneously, and conduct to inside the heating panel 10 by upper guide 101, give off to in the outside air by heating panel 10 at last.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A porous flat plate radiator is characterized in that: comprises a heat conducting plate (1); the heat-conducting plate (1) comprises an upper guide plate (101) and a lower guide plate (102); the upper guide plate (101) and the lower guide plate (102) are fixedly connected through a plurality of reinforcing ribs (103), a plurality of grooves (2) are formed in the surface of the upper guide plate (101) at equal intervals, a plurality of heat dissipation holes are formed in the surface of the upper guide plate (101), a plurality of screw holes are formed in four sides of the lower guide plate (102), and a silica gel layer (3) is arranged on the bottom surface of the lower guide plate (102); sliding chutes (4) are arranged on two sides of the surface of the lower guide plate (102), baffle plates (6) are arranged at two ends of each sliding chute (4), sliding blocks (5) are arranged in the sliding chutes (4), pressure springs (7) are fixedly connected to opposite sides of the two sliding blocks (5), the other ends of the pressure springs (7) are fixed to the side surfaces of the baffle plates (6), connecting plates (8) are fixedly connected to the upper portions of the two sliding blocks (5), and clamping plates (9) are fixedly installed at the ends, away from each other, of the two connecting plates (; a plurality of sealed cavities are formed among the upper guide plate (101), the lower guide plate (102) and the reinforcing ribs (103); the groove (2) is vertically provided with a heat dissipation plate (10).

2. The perforated plate heat sink of claim 1, wherein: and a fastening bolt is fixed at the screw hole, and a fastening spring is wound on the surface of the fastening bolt.

3. The perforated plate heat sink of claim 1, wherein: the heat conducting plate (1) and the heat dissipation plate (10) are made of aluminum alloy materials.