CN210927615U

CN210927615U - TDD interference resistant mobile communication equipment

Info

Publication number: CN210927615U
Application number: CN201922037203.9U
Authority: CN
Inventors: 王伟明
Original assignee: Heyuan Zhongqi Communication Technology Co ltd
Current assignee: Heyuan Zhongqi Communication Technology Co ltd
Priority date: 2019-11-22
Filing date: 2019-11-22
Publication date: 2020-07-03
Anticipated expiration: 2029-11-22

Abstract

The utility model relates to an anti TDD disturbs mobile communication equipment, including the PCB circuit board, be equipped with baseband chip, audio module and radio frequency module on the PCB circuit board, one side that the top of PCB circuit board is close to the speaker is equipped with the sound card driver, the bottom of audio module is equipped with the audio frequency manager, the audio module respectively with the audio frequency manager with sound card driver electric connection, radio frequency module's periphery is equipped with the isolation shroud, be equipped with the baffle between audio module and the radio frequency module, signal receiver's bottom is equipped with the RF filter rather than electric connection. The TDD current sound is transmitted in two modes of conduction and radiation and is blocked or attenuated by the scheme, and compared with the existing communication equipment, the TDD current sound has better TDD interference resistance.

Description

TDD interference resistant mobile communication equipment

Technical Field

The utility model relates to a communication equipment technical field especially relates to an anti TDD disturbs mobile communication equipment.

Background

The TDD current sound is mainly propagated through two modes of conduction and radiation, the conduction mainly influences an audio circuit through a mode of power supply current ripple and ground wire ripple current, and the radiation mainly couples an RF signal to an audio system and audio peripheral devices through antenna transmission, and an audio envelope signal of 217Hz is generated through the modulation of the audio devices.

A utility model with application number 201590000008.6 discloses an anti-TDD interference mobile communication device, which comprises a PCB circuit board, wherein the PCB circuit board is provided with a baseband chip, an audio module, a radio frequency module, a USB port, an antenna and a battery connector; the audio module and the radio frequency module are respectively arranged on two sides of the PCB, and the baseband chip is arranged between the audio module and the radio frequency module; the circuit related to the audio frequency on the PCB circuit board is arranged far away from the area between the radio frequency module and the battery connector; a grounding pin of the USB port is connected to the audio ground of the baseband chip by avoiding a ground backflow path of the radio frequency module through a first ground wire; the battery connector is arranged at a position close to the USB port below the radio frequency module; and the grounding pin of the battery connector is connected to one end, far away from the baseband chip, of the radio frequency module through a second ground wire. Adopt the utility model discloses the scheme can avoid TDD electric current sound to propagate the interference problem that brings audio signal through the conduction mode. However, in the application of the existing communication equipment, compared with the existing communication equipment, the sensing or remote sensing functions are more and more, the precision requirement is higher and higher, and along with the improvement of the battery capacity, the original communication equipment technology for resisting the TDD current sound cannot be met in the existing communication equipment, and the TDD current sound still generates interference to the audio signal at times in the communication process.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an anti TDD disturbs mobile communication equipment to solve the problem that meets in the above-mentioned background art.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

a TDD interference resistant mobile communication device comprises a PCB circuit board, wherein a baseband chip, an audio module and a radio frequency module are arranged on the PCB circuit board, the audio module and the radio frequency module are respectively arranged at two sides of the PCB circuit board, a loudspeaker is arranged at one side end part of the top of the PCB circuit board, a USB port and a battery connector are arranged at the bottom of the PCB circuit board, a signal receiver is arranged at one side of the top of the PCB circuit board, a sound card driver is arranged at one side of the top of the PCB circuit board close to the loudspeaker, an audio manager is arranged at the bottom of the audio module, the audio module is respectively electrically connected with the audio manager and the sound card driver, an isolation shroud is arranged at the periphery of the radio frequency module, a partition plate is arranged between the audio module and the radio frequency module, the baseband chip is arranged at the bottom of the audio module, and the baseband chip is respectively electrically, the bottom of the signal receiver is provided with an RF filter electrically connected with the signal receiver, a grounding pin of the USB port avoids a ground return path of the radio frequency module through a first wiring and is connected to an audio interface of the baseband chip, and the battery connector is connected to the radio frequency interface of the radio frequency module through a second wiring.

Preferably, the isolation shroud ring is rectangular, and a trunking for a wiring line to pass through is arranged at the bottom of the isolation shroud ring.

Preferably, two sides of the partition board are provided with radiation isolation strips.

Preferably, an isolation frame plate is arranged between the baseband chip and the audio module.

Preferably, the audio module is located obliquely above the radio frequency module, and respective connecting wires between the audio module and the radio frequency module are located at positions close to two sides of the PCB.

Preferably, the distance between the wiring of the audio module and the battery connector is greater than or equal to the distance between the wiring of the radio frequency module and the battery connector.

Preferably, a cross-sectional width of the second wire is equal to or greater than a cross-sectional width of the first wire.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model optimizes the audio module by adding the sound card driver and the audio manager on the PCB circuit board, so that the volume is adjusted to a reasonable frequency for further attenuating or eliminating TDD current sound, thereby avoiding the interference problem brought to the audio signal by the transmission of the TDD current sound through a conduction mode; the bottom of the signal receiver is provided with the RF filter which is electrically connected with the signal receiver, so that high-frequency interference signals generated by high-frequency electronic equipment and interference signals generated in the process of receiving the signals are attenuated by the RF filter; the isolation surrounding belt is arranged on the periphery of the radio frequency module, the partition plate is arranged between the audio frequency module and the radio frequency module, the radiation isolation strips are arranged on two sides of the partition plate, the isolation surrounding belt and the radiation isolation strips can be made of tinfoil, aluminum foil or radiation-proof films, and the problem of interference of TDD current sound on audio signals due to radiation mode propagation is solved. Therefore, the TDD current sound is transmitted in two modes of conduction and radiation and is blocked or attenuated by the scheme, and compared with the existing communication equipment, the TDD current sound has better TDD interference resistance.

Drawings

Fig. 1 shows the layout structure of the PCB of the present invention.

Reference numbers in the figures: 1-PCB circuit board; 11-a loudspeaker; 12-a sound card driver; 2-baseband chip; 21-a first connection; 3-an audio module; 31-an audio manager; 4-a radio frequency module; 41-a second connection; 42-isolation shroud; 43-a separator; 5-an RF filter; 6-USB port; 7-a battery connector; 8-signal receiver.

Detailed Description

The technical solution of the present invention will be further described in detail with reference to the accompanying drawings and embodiments.

As shown in fig. 1, a TDD interference resistant mobile communication device, including a PCB 1, a baseband chip 2, an audio module 3 and a radio frequency module 4 are disposed on the PCB 1, the audio module 3 and the radio frequency module 4 are disposed on two sides of the PCB 1, a speaker 11 is disposed on an end of one side of a top of the PCB 1, a USB port 6 and a battery connector 7 are disposed on a bottom of the PCB 1, a signal receiver 8 is disposed on one side of the top of the PCB 1, the signal receiver 8 can be replaced by an antenna, an RF filter 5 electrically connected to the signal receiver 8 is disposed on the bottom of the signal receiver 8, the RF filter 5 attenuates a high-frequency interference signal generated by a high-frequency electronic device, and an interference signal generated in a received signal process. At the power supply end of the power amplifier, a filter capacitor of 10 pF-100 pF is added at the input end and the output end to filter the RF interference signal brought by the signal receiver 8.

One side that the top of PCB circuit board 1 is close to speaker 11 is equipped with sound card driver 12 for eliminate TDD electric current sound, sound card driver 12 can adopt ALC5640 type, the bottom of audio module 3 is equipped with audio frequency manager 31, be used for managing the frequency of audio frequency, stabilize the output quality of audio frequency, audio module 3 respectively with audio frequency manager 31 and sound card driver 12 electric connection, optimize audio module 3 through establishing sound card driver 12 and audio frequency manager 31 additional, make the volume adjustment to a reasonable frequency, be used for further attenuating or eliminating TDD electric current sound.

The periphery of radio frequency module 4 is equipped with isolation shroud 42, and isolation shroud 42 can adopt the tinfoil, aluminium foil paper or the pad pasting preparation of protecting against radiation, and isolation shroud 42 is the rectangle form, and the bottom of isolation shroud 42 is equipped with the wire casing that supplies the wiring circuit to pass through, for example supplies second wiring 41 to pass through the circuit of connecting radio frequency module 4. A partition plate 43 is arranged between the audio module 3 and the radio frequency module 4, radiation isolation strips are arranged on two sides of the partition plate 43, the radiation isolation strips can also be made of tinfoil, aluminum foil or radiation-proof adhesive films, the audio module 3 and the radio frequency module 4 are isolated by being adhered to the partition plate 43, the radiation isolation strips are used for further isolating radiation generated by the radio frequency module 4 relative to the isolation surrounding band 42, and high-frequency audio envelope signals generated by modulation of audio devices are reduced.

The baseband chip 2 is located at the bottom of the audio module 3, and an isolation frame plate is arranged between the baseband chip 2 and the audio module 3 to reduce the heat released by the baseband chip 2 in the working process, so as to avoid influencing the audio module 3, thereby indirectly reducing the TDD current sound. The baseband chip 2 is electrically connected to the audio module 3 and the radio frequency module 4, respectively, to provide management for the operation of the two, and during wiring, wiring should be performed from the left side of the baseband chip 2 to the audio module 3, and wiring should be performed from the right side of the baseband chip 2 to the audio module 3.

The ground pin of the USB port 6 is connected to the audio interface of the baseband chip 2 through the first connection 21, avoiding the ground return path of the rf module 4, and the battery connector 7 is connected to the rf interface of the rf module 4 through the second connection 41. The distance between the wiring of the audio module 3 and the battery connector 7 is equal to or greater than the distance between the wiring of the radio frequency module 4 and the battery connector 7, and the cross-sectional width of the second wiring 41 is equal to or greater than the cross-sectional width of the first wiring 21. The respective working states of the radio frequency module 4 and the audio module 3 are stabilized by pulling the wiring distance apart and utilizing the difference of the width of the wiring section, and the generation of TDD current sound is avoided.

The audio module 3 is positioned above the radio frequency module 4 in an inclined manner, and respective connecting wires between the audio module and the radio frequency module are positioned at two sides close to the PCB circuit board 1. As can be seen from fig. 1, if the audio module 3 is located on the left side of the PCB 1, the audio module 3 is located on the upper left of the rf module 4, the connection of the audio module 3 is connected from the left side of the PCB 1, and the connection of the rf module 4 is connected from the right side of the PCB 1.

The utility model optimizes the audio module 3 by adding the sound card driver 12 and the audio manager 31 on the PCB 1, so that the volume is adjusted to a reasonable frequency for further attenuating or eliminating TDD current sound, thereby avoiding the interference problem brought to the audio signal by the transmission of the TDD current sound through a conduction mode; the bottom of the signal receiver 8 is provided with the RF filter 5 which is electrically connected with the signal receiver, and the high-frequency interference signal generated by the high-frequency electronic equipment and the interference signal generated in the process of receiving the signal are attenuated by the RF filter 5; through being equipped with isolation shroud 42 in the periphery of radio frequency module 4, be equipped with baffle 43 between audio frequency module 3 and the radio frequency module 4, the both sides of baffle 43 are equipped with the radiation parting bead, and isolation shroud 42 and radiation parting bead can adopt tinfoil, aluminium foil paper or the preparation of radiation protection pad pasting, have avoided TDD electric current sound to propagate the interference problem that brings audio signal through the radiation mode. Therefore, the TDD current sound is transmitted in two modes of conduction and radiation and is blocked or attenuated by the scheme, and compared with the existing communication equipment, the TDD current sound has better TDD interference resistance.

The above-mentioned embodiments further explain in detail the objects, technical solutions and advantages of the present invention, and it should be understood that the above-mentioned embodiments are only the embodiments of the present invention, and are not intended to limit the scope of the present invention, any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the scope of the present invention.

Claims

1. The utility model provides an anti TDD disturbs mobile communication equipment, includes PCB circuit board (1), be equipped with baseband chip (2), audio module (3) and radio frequency module (4) on PCB circuit board (1), audio module (3) and radio frequency module (4) are located respectively the both sides of PCB circuit board (1), a top side end of PCB circuit board (1) is equipped with speaker (11), the bottom of PCB circuit board (1) is equipped with USB port (6) and battery connector (7), top one side of PCB circuit board (1) is equipped with signal receiver (8), its characterized in that: one side of the top of the PCB (1) close to the loudspeaker (11) is provided with a sound card driver (12), the bottom of the audio module (3) is provided with an audio manager (31), the audio module (3) is respectively electrically connected with the audio manager (31) and the sound card driver (12), the periphery of the radio frequency module (4) is provided with an isolation shroud band (42), a partition plate (43) is arranged between the audio module (3) and the radio frequency module (4), the baseband chip (2) is positioned at the bottom of the audio module (3), the baseband chip (2) is respectively electrically connected with the audio module (3) and the radio frequency module (4), the bottom of the signal receiver (8) is provided with an RF filter (5) electrically connected with the signal receiver, the grounding pin of the USB port (6) avoids the ground return path of the radio frequency module (4) through a first wiring (21) to be connected to the audio interface of the baseband chip (2), the battery connector (7) is connected to the radio frequency interface of the radio frequency module (4) by a second connection (41).

2. The TDD interference resistant mobile communication device as claimed in claim 1, wherein: the isolation shroud ring (42) is rectangular, and a wire slot for a wiring line to pass through is formed in the bottom of the isolation shroud ring (42).

3. The TDD interference resistant mobile communication device as claimed in claim 1, wherein: and radiation isolating strips are arranged on two sides of the partition plate (43).

4. The TDD interference resistant mobile communication device as claimed in claim 1, wherein: and an isolation frame plate is arranged between the baseband chip (2) and the audio module (3).

5. The TDD interference resistant mobile communication device as claimed in claim 1, wherein: the audio module (3) is positioned above the radio frequency module (4) in an inclined mode, and the connection wires of the audio module and the radio frequency module are positioned at positions close to two sides of the PCB (1).

6. The TDD interference resistant mobile communication device as claimed in claim 1, wherein: the distance between the wiring of the audio module (3) and the battery connector (7) is greater than or equal to the distance between the wiring of the radio frequency module (4) and the battery connector (7).

7. The TDD interference resistant mobile communication device as claimed in claim 1, wherein: the cross-sectional width of the second wire (41) is equal to or greater than the cross-sectional width of the first wire (21).