CN210925989U - Integrated circuit board assembly - Google Patents
Integrated circuit board assembly Download PDFInfo
- Publication number
- CN210925989U CN210925989U CN201921821877.1U CN201921821877U CN210925989U CN 210925989 U CN210925989 U CN 210925989U CN 201921821877 U CN201921821877 U CN 201921821877U CN 210925989 U CN210925989 U CN 210925989U
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- China
- Prior art keywords
- circuit board
- integrated circuit
- water cooling
- cooling plate
- water
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- Expired - Fee Related
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Abstract
The utility model discloses an integrated circuit board assembly, which comprises an integrated circuit board, wherein the bottom end of the integrated circuit board is coated with a waterproof sealing glue layer, four corners of the integrated circuit board are fixedly arranged at the top end of a water cooling plate through fixing columns, the bottom end of the waterproof sealing glue layer of the integrated circuit board is fixedly connected with an inner heat dissipation short sheet, the bottom end of the inner heat dissipation short sheet is fixedly connected with the top end of the water cooling plate, the water cooling plate is of a mesoporous structure, the inner side of the water cooling plate is provided with a middle partition plate, one side of the water cooling plate is provided with a first side wrapping box, the other side of the water cooling plate is provided with a second side wrapping box, the inner side of the first side wrapping box is fixedly provided with a first micropump, when the integrated circuit board assembly is used, the integrated circuit board assembly is difficult to dissipate heat for the circuit board by using circulating cooling water, and is inconvenient, the heat dissipation effect of the integrated circuit board assembly is affected.
Description
Technical Field
The utility model belongs to the technical field of the integrated circuit board subassembly, concretely relates to integrated circuit board subassembly.
Background
At present, the integration level of the integrated circuit is increased, the size is reduced, but the power consumption is relatively large, for example, if the heat generated by the integrated circuit is not timely dissipated during working, the normal work of the integrated circuit is influenced, and even the device is overheated and burned out during serious working, if the heat is not timely dissipated during working. One of the traditional integrated circuit air-cooled heat dissipation assemblies is a heat dissipation assembly formed by integrally extruding a heat conduction substrate and heat dissipation fins, and the other is a heat dissipation assembly formed by combining the heat conduction substrate and the heat dissipation fins in a penetrating manner. The two air-cooled radiating assemblies adopt the radiating assembly formed by integrally extruding, and are limited by an extruding process, the thickness of the radiating fins is thicker, the intervals among the radiating fins are more sparse, and the quantity of the radiating fins is less, so that the total radiating area is smaller, and the radiating efficiency is lower.
But the integrated circuit board subassembly in the existing market still has certain defect at the in-process that uses, for example, when using the integrated circuit board subassembly, the integrated circuit board subassembly is difficult to utilize the circulating cooling water to dispel the heat for the circuit board, be not convenient for last stable cooling for the integrated circuit board, has influenced the radiating effect of integrated circuit board subassembly, and when using the integrated circuit board subassembly simultaneously, the integrated circuit board subassembly is difficult to improve the radiating efficiency of original radiating fin, has influenced the result of use of integrated circuit board subassembly.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an integrated circuit board subassembly to when solving the use integrated circuit board subassembly that proposes in the above-mentioned background art, integrated circuit board subassembly is difficult to utilize endless cooling water to dispel the heat for the circuit board, is not convenient for last stable cooling for integrated circuit board, and integrated circuit board subassembly is difficult to improve original radiating fin's radiating efficiency, has influenced integrated circuit board subassembly's result of use problem.
In order to achieve the above object, the utility model provides a following technical scheme: an integrated circuit board assembly comprising an integrated circuit board, characterized in that: the bottom end of the integrated circuit board is coated with a waterproof sealing glue layer, four corners of the integrated circuit board are fixedly arranged at the top end of the water cooling plate through fixing columns, the bottom end of the waterproof sealing glue layer of the integrated circuit board is fixedly connected with inner radiating short pieces, the bottom ends of the inner radiating short pieces are fixedly connected with the top end of the water cooling plate, the water cooling plate is of a hollow structure, the inner side of the water cooling plate is provided with a middle partition plate, one side of the water cooling plate is provided with a first side wrapping box, the other side of the water cooling plate is provided with a second side wrapping box, the inner side of the first side wrapping box is fixedly provided with a first micro pump, the inner side of the second side wrapping box is fixedly provided with a second micro pump, the water inlet end of the first micro pump is connected to the upper part of the middle partition plate of the water cooling plate through a pipeline, and the water outlet end of the first micro, the water outlet end of the second micro pump is connected to the upper part of the middle partition plate of the water cooling plate through a pipeline, and the water inlet end of the second micro pump is connected to the lower part of the middle partition plate of the water cooling plate through a pipeline.
Preferably, the heat dissipation column penetrates through the inner side of the water cooling plate, penetrates through the bottom ends of the middle partition plate and the water cooling plate and extends to the outer side of the water cooling plate.
Preferably, the heat dissipation post is provided with a plurality of altogether, a plurality of the heat dissipation post is the rectangle array form and distributes in water-cooling board bottom.
Preferably, the bottom end of the heat dissipation column is fixedly connected with a mounting bottom plate.
Preferably, four corners of the mounting base plate are fixedly mounted at the bottom end of the water cooling plate through base plate mounting columns.
Preferably, a sealing rubber block is arranged at the joint of the water cooling plate and the radiating column.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model discloses in user's accessible bottom plate erection column installs the mounting groove with integrated circuit board subassembly, the heat transfer that integrated circuit board produced interior heat dissipation stub, interior heat dissipation stub passes through the water-cooling board heat dissipation, the lower part is gone into with the water pump on middle part baffle upper portion to the first micropump of water-cooling board one side, the water pump of second micropump with middle part baffle lower part gets back to upper portion, after the heat of heat dissipation stub in the water absorption on middle part baffle upper portion, flow to the lower part heat dissipation, be convenient for continuously dispel the heat for the circuit board, when having solved and using integrated circuit board subassembly, integrated circuit board subassembly is difficult to utilize the circulating cooling water to dispel the heat for the circuit board, be not convenient for continuously stable for the cooling for integrated circuit board.
(2) The utility model discloses the heat dissipation post that inboard of water-cooling board runs through is convenient for dispel the heat of the cooling water in the water-cooling board fast, and the religion is compared and is had higher heat dissipation rate in the radiating fin who sets up in the bottom, and when having solved and having used integrated circuit board assembly, integrated circuit board assembly is difficult to improve the radiating efficiency of original radiating fin, has influenced the problem of integrated circuit board assembly's result of use
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a side sectional view of the present invention.
In the figure: 1-a first side packing box, 2-a first micropump, 3-a bottom plate mounting column, 4-a fixing column, 5-an inner heat dissipation short sheet, 6-a waterproof sealing glue layer, 7-an integrated circuit board, 8-a middle partition plate, 9-a second micropump, 10-a second side packing box, 11-a water cooling plate, 12-a heat dissipation column, 13-a mounting bottom plate and 14-a sealing glue block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: an integrated circuit board assembly comprising an integrated circuit board 7, characterized in that: the bottom end of the integrated circuit board 7 is coated with a waterproof sealing glue layer 6, four corners of the integrated circuit board 7 are fixedly arranged at the top end of a water cooling plate 11 through fixing columns 4, the bottom end of the waterproof sealing glue layer 6 of the integrated circuit board 7 is fixedly connected with an inner heat dissipation short piece 5, the bottom end of the inner heat dissipation short piece 5 is fixedly connected with the top end of the water cooling plate 11, the water cooling plate 11 is of a hollow structure, the inner side of the water cooling plate 11 is provided with a middle partition plate 8, one side of the water cooling plate 11 is provided with a first side packing box 1, the other side of the water cooling plate 11 is provided with a second side packing box 10, the inner side of the first side packing box 1 is fixedly provided with a first micro pump 2, the inner side of the second side packing box 10 is fixedly provided with a second micro pump 9, the water inlet end of the first micro pump 2 is connected to the upper part of the middle partition plate 8 of the water cooling, the water outlet end of the second micro pump 9 is connected to the upper part of the middle partition plate 8 of the water cooling plate 11 through a pipeline, and the water inlet end of the second micro pump 9 is connected to the lower part of the middle partition plate 8 of the water cooling plate 11 through a pipeline.
The inside of water-cooling plate 11 has run through heat dissipation post 12, and heat dissipation post 12 runs through in the bottom of middle part baffle 8 and water-cooling plate 11 and extends to the outside of water-cooling plate 11.
The heat dissipation columns 12 are provided with a plurality of heat dissipation columns 12 which are distributed at the bottom end of the water cooling plate 11 in a rectangular array shape.
The bottom end of the heat dissipation column 12 is fixedly connected with a mounting bottom plate 13.
Four corners of the mounting base plate 13 are fixedly mounted at the bottom end of the water cooling plate 11 through the base plate mounting columns 3.
And a sealing rubber block 14 is arranged at the joint of the water cooling plate 11 and the heat dissipation column 12.
The utility model discloses a theory of operation and use flow: the utility model discloses when using, user's accessible bottom plate erection column 3 installs integrated circuit board assembly in the mounting groove, the heat transfer that integrated circuit board 7 produced is interior heat dissipation stub 5, interior heat dissipation stub 5 dispels the heat through water-cooling board 11, the water pump on 8 upper portions of middle part baffle is gone into to the lower part with first micropump 2 of water-cooling board 11 one side, upper portion is got back to with the water pump of 8 lower parts of middle part baffle to second micropump 9, after the heat of heat dissipation stub 5 in the water absorption on 8 upper portions of middle part baffle, flow to the lower part heat dissipation, be convenient for continuously for the circuit board heat dissipation, the heat dissipation post 12 that the inboard of water-cooling board 11 runs through, be convenient for dispel the heat of the cooling water in the water-cooling board 11 fast, the religion is compared and is had.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation. The use of the phrase "comprising one of the elements does not exclude the presence of other like elements in the process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. An integrated circuit board assembly comprising an integrated circuit board (7), characterized in that: the bottom of the integrated circuit board (7) is coated with a waterproof sealing adhesive layer (6), four corners of the integrated circuit board (7) are fixedly mounted at the top end of the water cooling plate (11) through fixing columns (4), the bottom end of the waterproof sealing adhesive layer (6) of the integrated circuit board (7) is fixedly connected with inner radiating short sheets (5), the bottom end of each inner radiating short sheet (5) is fixedly connected with the top end of the water cooling plate (11), the water cooling plate (11) is of a hollow structure, a middle partition plate (8) is arranged on the inner side of the water cooling plate (11), a first side wrapping box (1) is arranged on one side of the water cooling plate (11), a second side wrapping box (10) is arranged on the other side of the water cooling plate (11), a first micro pump (2) is fixedly mounted on the inner side of the first side wrapping box (1), a second micro pump (9) is fixedly mounted on the inner side of the second side wrapping box (10), the water inlet end of the first micro pump (2) is connected to the upper portion of the middle partition plate (8) of the water cooling plate (11) through a pipeline, the water outlet end of the first micro pump (2) is connected to the lower portion of the middle partition plate (8) of the water cooling plate (11) through a pipeline, the water outlet end of the second micro pump (9) is connected to the upper portion of the middle partition plate (8) of the water cooling plate (11) through a pipeline, and the water inlet end of the second micro pump (9) is connected to the lower portion of the middle partition plate (8) of the water cooling plate (11) through a pipeline.
2. An integrated circuit board assembly in accordance with claim 1, wherein: the inboard of water-cooling board (11) is run through and is had heat dissipation post (12), heat dissipation post (12) run through in the bottom of middle part baffle (8) and water-cooling board (11) and extend to the outside of water-cooling board (11).
3. An integrated circuit board assembly in accordance with claim 2, wherein: the heat dissipation columns (12) are provided with a plurality of heat dissipation columns (12) which are distributed at the bottom end of the water cooling plate (11) in a rectangular array mode.
4. An integrated circuit board assembly according to claim 3, wherein: the bottom end of the heat dissipation column (12) is fixedly connected with a mounting bottom plate (13).
5. An integrated circuit board assembly according to claim 4, wherein: four corners of the mounting bottom plate (13) are fixedly mounted at the bottom end of the water cooling plate (11) through bottom plate mounting columns (3).
6. An integrated circuit board assembly according to claim 5, wherein: and a sealing rubber block (14) is arranged at the joint of the water cooling plate (11) and the heat dissipation column (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921821877.1U CN210925989U (en) | 2019-10-28 | 2019-10-28 | Integrated circuit board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921821877.1U CN210925989U (en) | 2019-10-28 | 2019-10-28 | Integrated circuit board assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210925989U true CN210925989U (en) | 2020-07-03 |
Family
ID=71346120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921821877.1U Expired - Fee Related CN210925989U (en) | 2019-10-28 | 2019-10-28 | Integrated circuit board assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210925989U (en) |
-
2019
- 2019-10-28 CN CN201921821877.1U patent/CN210925989U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200703 Termination date: 20201028 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |