CN210219362U

CN210219362U - Micro-size LED chip array packaging structure

Info

Publication number: CN210219362U
Application number: CN201921260566.2U
Authority: CN
Inventors: Sunan Chen; 陈苏南
Original assignee: Shenzhen Huatian Maike Photoelectric Technology Co Ltd
Current assignee: Shenzhen Huatian Maike Photoelectric Technology Co Ltd
Priority date: 2019-08-05
Filing date: 2019-08-05
Publication date: 2020-03-31
Anticipated expiration: 2029-08-05

Abstract

The utility model relates to a LED chip technical field just discloses small-size LED chip array packaging structure, including the mounting panel, the mounting hole has been seted up in the front of mounting panel, the positive swing joint of mounting panel has the second fixed plate, the first fixed plate of one side fixedly connected with of second fixed plate, the louvre has been seted up in the front of first fixed plate, the positive fixedly connected with chip package body of mounting panel, the mounting groove has been seted up in the front of mounting panel. This small-size LED chip array packaging structure, through the mounting panel, the chip package body, first fixed plate, the second fixed plate, the lug, the recess, the use of mutually supporting of connecting hole and fixed block, reached the purpose that the result of use is good, the relatively poor problem of general small-size LED chip array packaging structure result of use has been solved, made things convenient for people to LED chip array packaging structure's use, also further satisfied people's user demand when having improved availability factor.

Description

Micro-size LED chip array packaging structure

Technical Field

The utility model relates to a LED chip technical field specifically is small-size LED chip array packaging structure.

Background

The package is a package of a light emitting chip, which is different from the package of an integrated circuit, and the package of an LED not only requires protection of a wick, but also requires light transmission, so the package of the LED has special requirements on a package material.

With the continuous development of the LED chip packaging technology, the use of LED chip packaging is more and more popular, and the packaged micro-size LED chips are required to be used in some street lamps, explosion-proof lamps, floodlights and the like.

At present, most of common small-size LED chip packaging structures fix a fixing support and an encapsulated LED chip through bolts, only play a role in fixing, lack of protection on the encapsulated LED chip, and are easy to corrode and rust after being used for a long time, so that the use of the LED chip is influenced.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a small-size LED chip array packaging structure possesses advantages such as excellent in use effect, has solved the relatively poor problem of general small-size LED chip array packaging structure result of use.

(II) technical scheme

For the purpose that realizes that above-mentioned small-size LED chip array packaging structure excellent in use effect, the utility model provides a following technical scheme: micro-size LED chip array packaging structure, including the mounting panel, the mounting hole has been seted up in the front of mounting panel, the positive swing joint of mounting panel has the second fixed plate, the first fixed plate of one side fixedly connected with of second fixed plate, the louvre has been seted up in the front of first fixed plate, the positive fixedly connected with chip package body of mounting panel, the mounting groove has been seted up in the front of mounting panel, the top fixedly connected with fixed block of mounting panel, the positive fixedly connected with lug of mounting panel, the top swing joint of second fixed plate has the pivot, the outer wall fixedly connected with sleeve of pivot, telescopic top fixedly connected with connecting plate, the positive fixedly connected with fin of second fixed plate.

Preferably, the number of the connecting plates is two, the connecting holes are formed in the surfaces of the two connecting plates, the connecting holes and the fixing blocks are matched with each other in shape and size, and the second fixing plate is movably connected with the mounting plate through the connecting holes and the fixing blocks.

Preferably, the front surface of the first fixing plate is provided with a groove, the shape and size of the groove and the size of the lug are matched with each other, and the first fixing plate is movably connected with the mounting plate through the groove and the lug.

Preferably, the outer wall of the chip package body is fixedly connected with a sealing strip, and the sealing strip is a rubber sealing strip.

Preferably, the first fixing plate and the second fixing plate are divided into two parts by the sealing strip, the two first fixing plates are respectively arranged on two sides of the sealing strip, and the two second fixing plates are respectively arranged at the top and the bottom of the sealing strip.

Preferably, the number of the radiating fins is fourteen, seven radiating fins form one group, and two groups of radiating fins are respectively arranged on the front faces of the two second fixing plates.

Preferably, the number of the heat dissipation holes is six, and a protective net is fixedly connected inside the six heat dissipation holes.

(III) advantageous effects

Compared with the prior art, the utility model provides a small-size LED chip array packaging structure possesses following beneficial effect:

1. this small-size LED chip array packaging structure, through the mounting panel, the chip package body, first fixed plate, the second fixed plate, the lug, the recess, the use of mutually supporting of connecting hole and fixed block, reached the purpose that the result of use is good, the relatively poor problem of general small-size LED chip array packaging structure result of use has been solved, made things convenient for people to LED chip array packaging structure's use, also further satisfied people's user demand when having improved availability factor.

2. This small-size LED chip array packaging structure through louvre and the fin that sets up, can dispel the heat and cool down to the heat that the LED chip during operation produced, thereby avoids influencing the use of LED chip because the heat is too high, excellent in use effect is worth using widely.

3. This small-size LED chip array package structure through louvre and the protection network that sets up, can give and avoid when first fixed plate exposes outside, and foreign matters such as some insects enter into the inside of first fixed plate through the louvre to cause the damage to some parts on the mounting panel, thereby influenced LED chip's use, made things convenient for people's use.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic diagram of the structure of the mounting plate of the present invention;

fig. 3 is a schematic diagram of the structure of the first fixing plate and the second fixing plate of the present invention.

In the figure: 1. mounting a plate; 2. heat dissipation holes; 3. a chip package body; 4. mounting holes; 5. a first fixing plate; 6. a second fixing plate; 7. a fixed block; 8. mounting grooves; 9. a bump; 10. a connecting plate; 11. connecting holes; 12. a rotating shaft; 13. a heat sink; 14. a groove; 15. a sealing strip; 16. a sleeve; 17. and (4) a protective net.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the micro-scale LED chip array package structure includes a mounting plate 1, a mounting hole 4 is formed in a front surface of the mounting plate 1, a second fixing plate 6 is movably connected to the front surface of the mounting plate 1, a first fixing plate 5 is fixedly connected to one side of the second fixing plate 6, the first fixing plate 5 and the second fixing plate 6 are divided into two parts by a sealing strip 15, the two first fixing plates 5 are respectively disposed at two sides of the sealing strip 15, the two second fixing plates 6 are respectively disposed at a top and a bottom of the sealing strip 15, heat dissipation holes 2 are formed in the front surface of the first fixing plate 5, the number of the heat dissipation holes 2 is six, a protective screen 17 is fixedly connected to an inner portion of each of the six heat dissipation holes 2, the heat dissipation holes 2 and the heat dissipation fins 13 are disposed to dissipate heat generated during operation of the LED chip, thereby preventing the use of, excellent in use effect, be worth using widely, louvre 2 and protection network 17 through setting up, can give and avoid when first fixed plate 5 exposes outside, foreign matters such as some insects enter into the inside of first fixed plate 5 through louvre 2, thereby cause the damage to some parts on the mounting panel 1, thereby the use of LED chip has been influenced, people's use has been made things convenient for, the positive fixedly connected with chip package body 3 of mounting panel 1, the outer wall fixedly connected with sealing strip 15 of chip package body 3, sealing strip 15 is the rubber sealing strip, rubber is the high elasticity polymer material that has reversible deformation, be rich in elasticity at room temperature, can produce great deformation under very little exogenic action, can resume the original state after detaching external force, through setting up sealing strip 15, also can strengthen the leakproofness after first fixed plate 5 and the second fixed plate 6 installation when avoiding installing first fixed plate 5 and second fixed plate 6 with the direct contact of chip package body 3 in the time, simultaneously The front surface of the mounting plate 1 is provided with a mounting groove 8, the top of the mounting plate 1 is fixedly connected with a fixed block 7, the front surface of the mounting plate 1 is fixedly connected with a lug 9, the front surface of the first fixing plate 5 is provided with a groove 14, the shape and the size of the groove 14 are matched with those of the lug 9, the first fixing plate 5 is movably connected with the mounting plate 1 through the groove 14 and the lug 9, the groove 14 and the lug 9 are arranged at the same time, the first fixing plate 5 can be conveniently mounted and dismounted, and the mounting plate 1, the chip packaging body 3, the first fixing plate 5, the second fixing plate 6, the lug 9, the groove 14, the connecting hole 11 and the fixed block 7 are matched with each other for use, so that the purpose of good use effect is achieved, the problem of poor use effect of a common micro-size LED chip array packaging structure is solved, the use of people for the LED chip array packaging structure is facilitated, the use, the top of the second fixing plate 6 is movably connected with a rotating shaft 12, the outer wall of the rotating shaft 12 is fixedly connected with a sleeve 16, the top of the sleeve 16 is fixedly connected with two connecting plates 10, the number of the connecting plates 10 is two, the surfaces of the two connecting plates 10 are respectively provided with a connecting hole 11, the shapes and the sizes of the connecting holes 11 and the fixing blocks 7 are matched with each other, the second fixing plate 6 can be conveniently installed and disassembled by arranging the connecting holes 11 and the fixing blocks 7, the second fixing plate 6 is movably connected with the installing plate 1 through the connecting holes 11 and the fixing blocks 7, the front surface of the second fixing plate 6 is fixedly connected with radiating fins 13, the number of the radiating fins 13 is fourteen, the radiating fins 13 are in one group, the seven radiating fins 13 are respectively arranged on the front surfaces of the two second fixing plates 6, the radiating fins are a device for radiating heat of easily-generated electronic, the sheet shape is realized by arranging fourteen radiating fins 13, so that the mounting plate 1 can be effectively radiated, and heat generated during the working of the LED chip is radiated.

When the LED packaging structure is used, the mounting plate 1 is mounted on an article needing to use the LED chip through the mounting hole 4, the second fixing plate 6 and the first fixing plate 5 are fixed on the mounting plate 1 through the fixing block 7, the connecting hole 11, the bump 9 and the groove 14 respectively, and the heat generated by the LED chip is dissipated through the radiating fins 13 and the radiating holes 2 when the packaged LED chip works, so that the work is completed.

To sum up, this small size LED chip array packaging structure has reached the purpose that excellent in use effect, has solved the relatively poor problem of general small size LED chip array packaging structure result of use, has made things convenient for people's installation and dismantlement, further has satisfied people's user demand.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Micro-size LED chip array packaging structure, including mounting panel (1), its characterized in that: the front surface of the mounting plate (1) is provided with a mounting hole (4), the front surface of the mounting plate (1) is movably connected with a second fixing plate (6), one side of the second fixing plate (6) is movably connected with a first fixing plate (5), the front surface of the first fixing plate (5) is provided with a heat dissipation hole (2), the front surface of the mounting plate (1) is fixedly connected with a chip packaging body (3), the front surface of the mounting plate (1) is provided with a mounting groove (8), the top of the mounting plate (1) is fixedly connected with a fixed block (7), the front surface of the mounting plate (1) is fixedly connected with a convex block (9), the top part of the second fixing plate (6) is movably connected with a rotating shaft (12), the outer wall of the rotating shaft (12) is fixedly connected with a sleeve (16), the top of the sleeve (16) is fixedly connected with a connecting plate (10), the front surface of the second fixing plate (6) is fixedly connected with a radiating fin (13).

2. The micro-scale LED chip array package structure according to claim 1, wherein: the quantity of connecting plate (10) is two, and connecting hole (11) have all been seted up on the surface of two connecting plates (10), the shape size of connecting hole (11) and fixed block (7) all matches each other, and second fixed plate (6) pass through connecting hole (11) and fixed block (7) and mounting panel (1) swing joint.

3. The micro-scale LED chip array package structure according to claim 1, wherein: the front surface of the first fixing plate (5) is provided with a groove (14), the shapes and the sizes of the groove (14) and the bump (9) are matched with each other, and the first fixing plate (5) is movably connected with the mounting plate (1) through the groove (14) and the bump (9).

4. The micro-scale LED chip array package structure according to claim 1, wherein: the outer wall fixedly connected with sealing strip (15) of chip package body (3), sealing strip (15) are rubber sealing strip.

5. The micro-scale LED chip array package structure according to claim 1, wherein: first fixed plate (5) and second fixed plate (6) all divide into two parts through sealing strip (15), and two first fixed plates (5) set up respectively in the both sides of sealing strip (15), and two second fixed plates (6) set up respectively in the top and the bottom of sealing strip (15).

6. The micro-scale LED chip array package structure according to claim 1, wherein: the number of the radiating fins (13) is fourteen, seven radiating fins (13) form one group, and two groups of radiating fins (13) are respectively arranged on the front surfaces of the two second fixing plates (6).

7. The micro-scale LED chip array package structure according to claim 1, wherein: the number of the heat dissipation holes (2) is six, and the inside of the six heat dissipation holes (2) is fixedly connected with a protective net (17).