CN210910968U - Take buffer's mould - Google Patents

Abstract

The utility model relates to a mould with a buffer device, which comprises an upper mould, a lower mould, a hot nozzle and a demoulding mechanism, wherein the upper mould is arranged on the lower mould, the upper mould and the lower mould form a mould cavity through mould closing, the hot nozzle is positioned in the upper mould, the hot nozzle is communicated with the mould cavity, the demoulding mechanism comprises a liftable bottom plate, a plurality of thimbles and a plurality of push blocks for ejecting products, the bottom plate is positioned below the lower mould, the bottom ends of the thimbles are fixed on the bottom plate, the thimbles pass through the lower mould, the top parts of the thimbles are connected with the push blocks, the push blocks extend into the mould cavity, a plurality of buffer structures are arranged on the lower mould, the buffer structures comprise blind holes and springs, the blind holes are positioned at the top parts of the lower mould, the springs are arranged in the blind holes, and elastic blocks are also embedded on, the upper die abuts against the buffer structure and the elastic block. The assembly is more stable, and the abrasion generated by the assembly is reduced.

Description

Take buffer's mould

Technical Field

The utility model relates to a mould field especially relates to a take buffer's mould.

Background

The mill generally all need use the mould to carry out injection moulding when producing plastic products, and the mould all forms the die cavity by an last mould and a lower mould equipment usually, annotates moulding in the die cavity and becomes the product, can produce interact's power when wherein going up mould and lower mould equipment, leads to going up mould and lower mould and can producing wearing and tearing simultaneously, then need repair the mould in the time of the end, and the damage of mould has directly influenced the quality of product.

Disclosure of Invention

An object of the utility model is to provide a take buffer's mould to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a mould with a buffer device comprises an upper mould, a lower mould, a hot nozzle and a demoulding mechanism, wherein the upper mould is arranged on the lower mould, the upper die and the lower die form a die cavity through die assembly, the hot nozzle is positioned in the upper die and communicated with the die cavity, the demoulding mechanism comprises a liftable bottom plate, a plurality of ejector pins and a plurality of push blocks for ejecting products, the bottom plate is positioned below the lower die, the bottom end of the ejector pin is fixed on the bottom plate, the ejector pin penetrates through the lower die, the top of the thimble is connected with the push block, the push block extends into the die cavity, the lower die is provided with a plurality of buffer structures, the buffer structure comprises a blind hole and a spring, the blind hole is positioned at the top of the lower die, the spring is arranged in the blind hole, the upper surface of lower mould still has inlayed the elasticity piece, go up the mould butt in buffer structure with the elasticity piece.

Furthermore, the buffer structure further comprises a ring sleeve, the ring sleeve is cylindrical, the ring sleeve is located in the blind hole, the spring is located in the ring sleeve, and the bottom of the spring is connected with the bottom of the blind hole.

Furthermore, buffer structure still includes the top cap, the top cap lid is in on the spring, the bottom of top cap with go up the mould and contact, the top cap is in the middle of the ring cover.

Further, the bottom of going up the mould is equipped with a plurality of spacing grooves, the notch of spacing groove is down, the top cap stretches into in the spacing groove.

Further, the elastic block is a rubber block or a silica gel block.

Further, go up the mould upper end and be equipped with the mouth of moulding plastics, still be equipped with hot runner plate in the last mould, mould plastics the mouth with hot runner plate is linked together, hot runner plate with hot mouth is linked together.

The utility model has the advantages that: through setting up buffer structure with the elasticity piece makes the equipment go up the mould with during the lower mould, buffer structure with the elasticity piece can cushion last mould, and the assembling process is more steady, effectively reduces go up the mould with the wearing and tearing that produce when the lower mould used.

Drawings

The figures further illustrate the invention, but the embodiments in the figures do not constitute any limitation of the invention.

Fig. 1 is a schematic structural diagram according to an embodiment of the present invention;

fig. 2 is a cross-sectional view provided by an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a buffer structure;

FIG. 4 is a schematic view of the internal structure of the upper mold;

FIG. 5 is a schematic structural view of an upper mold core;

fig. 6 is a schematic structural view of the lower die.

Detailed Description

As shown in fig. 1 to 5, an embodiment of the present invention provides a mold with a cushion device, which includes an upper mold 1, a lower mold 2, a hot nozzle 3, and a demolding mechanism 4. The mold comprises an upper mold 1 and a lower mold 2, wherein the upper mold 1 is installed on the lower mold 2, the upper mold 1 and the lower mold 2 form a mold cavity through mold closing, a lower mold core 21 is arranged at the bottom of the lower mold 2, an upper mold core 13 is arranged at the top of the upper mold 1, and the mold cavity is located between the upper mold core 13 and the lower mold core 21.

As shown in fig. 1-5, the hot nozzle 3 is located in the upper die 1, the hot nozzle 3 is communicated with the die cavity, the upper end of the upper die 1 is provided with an injection nozzle 11, the upper die 1 is further provided with a hot runner plate 12, the injection nozzle 11 is communicated with the hot runner plate 12, and the hot runner plate 12 is communicated with the hot nozzle 3. When injection molding, firstly, plastic raw materials are poured into the injection molding nozzle 11 and fall into the hot runner plate 12, the hot runner plate 12 is continuously heated, so that the plastic raw materials are kept in a liquid state, then the plastic raw materials flow into the hot nozzle 3 from the hot runner plate 12, then the liquid plastic raw materials enter the mold cavity from the hot nozzle 3, and injection molding is carried out to form a set shape according to the shapes of the upper mold core 13 and the lower mold core 21. The demolding mechanism 4 comprises a liftable bottom plate 41, a plurality of ejector pins 42 and a plurality of pushing blocks 43 used for ejecting products, the bottom plate 41 is located below the lower mold 2, the bottom plate 41 is driven by an external motor or an oil cylinder to lift, the bottom ends of the ejector pins 42 are fixed on the bottom plate 41, the ejector pins 42 penetrate through the lower mold 2, the tops of the ejector pins 42 are connected with the pushing blocks 43, and the pushing blocks 43 extend into the mold cavity. After the product is injection molded, the upper mold 1 and the lower mold 2 are separated, the bottom plate 41 ascends, the ejector pin 42 ascends along with the ejector pin, the ejector pin 42 drives the ejector block 43 to ascend, the ejector block 43 pushes out the product after injection molding so as to complete demolding, and then the upper mold 1 and the lower mold 2 are combined together for repeated injection molding.

As shown in fig. 2-6, a plurality of buffer structures are arranged on the lower die 2, each buffer structure includes a blind hole 22 and a spring 23, the blind hole 22 is located at the top of the lower die 2, the spring 23 is installed in the blind hole 22, an elastic block 24 is further embedded on the upper surface of the lower die 2, the elastic block 24 is a high-temperature-resistant rubber block or a high-temperature-resistant silicone block, a butt-joint groove is arranged at the bottom of the upper die 1 corresponding to the elastic block 24, and when the upper die 1 and the lower die 2 are assembled together, the top of the elastic block 24 extends into the butt-joint groove and is extruded by the butt-joint groove. When the upper die 1 and the lower die 2 are assembled together, the upper die 1 abuts against the buffer structure. Through setting up buffer structure with elasticity piece 24 makes the equipment go up mould 1 with during lower mould 2, buffer structure with elasticity piece 24 can cushion last mould 1, and the assembling process is more steady, effectively reduces go up mould 1 with the wearing and tearing that produce when lower mould 2 used.

As shown in fig. 2-5, the cushioning structure further includes a ring 25, the ring 25 is cylindrical, the ring 25 is located in the blind hole 22, the spring 23 is located in the ring 25, the bottom of the spring 23 is connected to the bottom of the blind hole 22, and the ring 25 can effectively protect the spring 23. The buffer structure further comprises a top cover 26, the top cover 26 covers the spring 23, the top cover 26 is in a circular cup shape, the top cover 26 is arranged in the middle of the ring sleeve 25, the diameter of the top surface of the top cover 26 is smaller than the inner diameter of the ring sleeve 25, and the ring sleeve 25 can limit the top cover 26. The inner surface of the top cover 26 is fixed to the spring 23. The bottom of going up mould 1 is equipped with a plurality of spacing grooves 14, the notch of spacing groove 14 is down, top cap 26 stretches into in the spacing groove 14. When the upper die 1 and the lower die 2 are assembled together, the top surface of the top cover 26 is in contact with the bottom of the limiting groove 14, the spring 23 is extruded by the limiting groove 14, and the limiting groove 14 can limit the spring 23 to prevent the spring 23 from inclining.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (6)

1. The mold with the buffer device is characterized by comprising an upper mold, a lower mold, a hot nozzle and a demolding mechanism, wherein the upper mold is installed on the lower mold, the upper mold and the lower mold form a mold cavity through mold closing, the hot nozzle is positioned in the upper mold, the hot nozzle is communicated with the mold cavity, the demolding mechanism comprises a liftable bottom plate, a plurality of thimbles and a plurality of push blocks for ejecting products, the bottom plate is positioned below the lower mold, the bottom ends of the thimbles are fixed on the bottom plate, the thimbles penetrate through the lower mold, the tops of the thimbles are connected with the push blocks, the push blocks extend into the mold cavity, a plurality of buffer structures are arranged on the lower mold, each buffer structure comprises a blind hole and a spring, the blind hole is positioned at the top of the lower mold, the springs are installed in the blind hole, and elastic blocks are also embedded on the upper surface, the upper die abuts against the buffer structure and the elastic block.

2. The cushioned die as set forth in claim 1, wherein: the buffer structure further comprises a ring sleeve, the ring sleeve is cylindrical, the ring sleeve is located in the blind hole, the spring is located in the ring sleeve, and the bottom of the spring is connected with the bottom of the blind hole.

3. The cushioned die as set forth in claim 2, wherein: the buffer structure further comprises a top cover, the top cover covers the spring, the bottom end of the top cover is in contact with the upper die, and the top cover is arranged in the middle of the ring sleeve.

4. The cushioned die as set forth in claim 3, wherein: the bottom of going up the mould is equipped with a plurality of spacing grooves, the notch of spacing groove is down, the top cap stretches into the spacing inslot.

5. The cushioned die as set forth in claim 1, wherein: the elastic block is a rubber block or a silica gel block.

6. The cushioned die as set forth in claim 1, wherein: the mould is characterized in that an injection molding nozzle is arranged at the upper end of the upper mould, a hot runner plate is further arranged in the upper mould, the injection molding nozzle is communicated with the hot runner plate, and the hot runner plate is communicated with the hot nozzle.

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