CN210895324U - Singlechip installation frame with heat dissipation function - Google Patents
Singlechip installation frame with heat dissipation function Download PDFInfo
- Publication number
- CN210895324U CN210895324U CN201922286966.7U CN201922286966U CN210895324U CN 210895324 U CN210895324 U CN 210895324U CN 201922286966 U CN201922286966 U CN 201922286966U CN 210895324 U CN210895324 U CN 210895324U
- Authority
- CN
- China
- Prior art keywords
- mounting
- heat dissipation
- sealing ring
- ring
- singlechip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a singlechip installation frame with heat dissipation function, including installation box, top cap, mounting panel, treat dress singlechip, mounting hole, fan seat and sealing ring. The utility model has the advantages that: this singlechip installation frame with heat dissipation function is through setting up the mounting hole, the fan seat, sealing ring and electric fan etc, two electric fan make the air current in the cavity that installation box and top cap are constituteed flow to the orientation and then treat the dress singlechip and dispel the heat, can absorb the moisture in the air current through the ring that absorbs water, the fan seat, sealing ring and the intimate contact between installation box or the top cap, can prevent that outside steam from passing through the junction entering device inside of installation box and sealing ring and the junction of top cap and sealing ring, the device has when treating the dress singlechip and blow the heat dissipation, also can effectively prevent the inside function of outside steam entering device.
Description
Technical Field
The utility model relates to a singlechip installation frame specifically is a singlechip installation frame with heat dissipation function, belongs to singlechip installation technical field.
Background
The single chip microcomputer is widely applied to a single chip microcomputer, and certain high temperature can be generated when the single chip microcomputer is used, so that the practical performance of the single chip microcomputer is influenced, and therefore a single chip microcomputer installation frame with a heat dissipation function is needed.
The singlechip installation frame that has heat dissipation function now has not enough below, partial singlechip installation frame that has heat dissipation function all bloies the singlechip through adding the fan, and then reduces the temperature of singlechip, thereby reach the effect of cooling, but contain moisture in the air, blow the inside that can bring the moisture in the air into the singlechip to the singlechip, especially more serious under the very moist condition of air, the singlechip is wet also can be impaired or even scrap, so one kind can also prevent the singlechip installation frame that has heat dissipation function of a large amount of moisture and singlechip contact when carrying out the heat dissipation to the singlechip. Not enough to prior art, the utility model discloses a singlechip installation frame with heat dissipation function to solve above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a singlechip installation frame with heat dissipation function just in order to solve above-mentioned problem, can also prevent that a large amount of moisture from contacting with the singlechip when carrying out the heat dissipation to the singlechip.
The utility model achieves the above purpose by the following technical proposal, a single chip microcomputer installation frame with heat dissipation function comprises an installation box body, a top cover, an installation plate, a single chip microcomputer to be installed, installation holes, a fan seat and sealing rings, wherein the single chip microcomputer to be installed is fixedly connected on the upper surface of the installation plate, the lower surface of the installation plate is fixedly connected on the upper surface of a placing frame, the side wall of the installation plate is contacted with a positioning block, the top of the installation box body is fixedly connected with the top cover, the installation box body and the top cover can form a closed cavity, the bottom of the installation box body and the top of the top cover are both provided with the installation holes, the number of the fan seat and the number of the sealing rings are two, the two sealing rings are both fixedly connected with an electric fan, the two sealing rings are respectively rotatably installed on the top of the top cover and the bottom of the installation box, the outer surface of the fan seat is in contact with the inner surface of the sealing ring, the inner surface of the fan seat is in contact with the outer surface of the water absorption ring, and the upper surface of the sealing ring is in contact with the lower surface of the pressing ring.
Preferably, the inner cavity of the installation box body is provided with a placing frame, and the top of the placing frame is provided with four positioning blocks which are in contact with the side wall of the installation plate.
Preferably, two insertion grooves are formed in the top of the top cover and the bottom of the mounting box body, and the two insertion grooves are symmetrically distributed around the axis of the mounting hole and are communicated with the mounting hole.
Preferably, two rotary grooves are formed in the top of the top cover and the bottom of the mounting box body, and the two rotary grooves are symmetrically distributed about the axis of the mounting hole and communicated with the insertion groove.
Preferably, the outer surface of the fan base is provided with a pressing ring, the lower surface of the pressing ring is provided with two rotating shafts which are symmetrically distributed about the axis of the fan base, and the rotating shafts are in contact with the rotating grooves.
Preferably, the end of the rotary shaft, which is far away from the compression ring, is provided with a clamping shaft, and the diameter of the clamping shaft is larger than that of the rotary shaft.
Preferably, two matching holes are formed in the upper surface of the sealing ring, the two matching holes are symmetrically distributed about the axis of the sealing ring, a water absorbing ring is arranged at the bottom of the sealing ring, and an embedded ring is arranged on the upper surface of the water absorbing ring.
The utility model has the advantages that: 1. this singlechip installation frame with heat dissipation function is through setting up the mounting hole, the fan seat, sealing ring and electric fan etc, two electric fan make the air current in the cavity that installation box and top cap are constituteed flow to the orientation and then treat the dress singlechip and dispel the heat, can absorb the moisture in the air current through the ring that absorbs water, the fan seat, sealing ring and the intimate contact between installation box or the top cap, can prevent that outside steam from passing through the junction entering device inside of installation box and sealing ring and the junction of top cap and sealing ring, the device has when treating the dress singlechip and blow the heat dissipation, also can effectively prevent the inside function of outside steam entering device.
2. This singlechip installation frame with heat dissipation function can dismantle fan seat and sealing ring and install simply through setting up rotation axis, card axle, mating holes, insertion groove and swivelling chute etc. also can dismantle and install between fan seat and sealing ring and installation box or the top cap simply, and the convenience is to the maintenance and the change of fan seat and sealing ring. The device has the function of conveniently dismantling and installing between fan seat and the sealing ring and between fan seat and sealing ring and installation box or top cap.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a cross-sectional view of FIG. 1;
FIG. 3 is a schematic view of the structure of the mounting box shown in FIG. 1;
FIG. 4 is a schematic view of the top cover structure shown in FIG. 1;
FIG. 5 is a schematic view of the fan base shown in FIG. 1;
fig. 6 is a schematic view of the sealing ring structure shown in fig. 1.
In the figure: 1. the mounting box body comprises a mounting box body, 101, a placing frame, 102, a positioning block, 2, a top cover, 3, a mounting plate, 4, a single chip microcomputer to be mounted, 5, a mounting hole, 501, an insertion groove, 502, a rotary groove, 6, a fan seat, 601, a pressing ring, 602, a rotary shaft, 603, a clamping shaft, 7, a sealing ring, 701, a water absorption ring, 702, an embedded ring, 703, a matching hole, 8 and an electric fan.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-6, a single chip mounting frame with a heat dissipation function includes a mounting box 1, a top cover 2, a mounting plate 3, a single chip 4 to be mounted, a mounting hole 5, a fan seat 6 and a sealing ring 7, wherein the single chip 4 to be mounted is fixedly connected to the upper surface of the mounting plate 3, the lower surface of the mounting plate 3 is fixedly connected to the upper surface of a placing frame 101, the side wall of the mounting plate 3 contacts with a positioning block 102, an inner cavity of the mounting box 1 is provided with a placing frame 101, the top of the placing frame 101 is provided with four positioning blocks 102 contacting with the side wall of the mounting plate 3, so that the mounting plate 3 fixedly mounted with the single chip 4 to be mounted can be fixed in the inner cavity.
As a technical optimization scheme, the top fixedly connected with top cap 2 of installation box 1, airtight cavity can be constituteed to installation box 1 and top cap 2, mounting hole 5 has all been seted up at the bottom of installation box 1 and top cap 2's top, mounting hole 5 makes for installation fan seat 6 and sealing ring 7, fan seat 6 and sealing ring 7's quantity is two, two sealing rings 7 all rotate respectively through mounting hole 5 and install the top at top cap 2 and the bottom of installation box 1, equal fixedly connected with electric power fan 8 in two sealing rings 7, can make the air current flow in the cavity that installation box 1 and top cap 2 are constituteed oriented so to dispel the heat to waiting to adorn singlechip 4 through the work of two electric power fans 8.
As a technical optimization scheme, the lower surface of two sealing rings 7 contacts with the lower surface of installation box 1 and the upper surface of top cap 2 respectively, the surface of fan seat 6 contacts with the internal surface of sealing ring 7, sealing ring 7 has certain elasticity and can be waterproof, the bottom of sealing ring 7 is provided with water absorption ring 701, water absorption ring 701 specifically is the calcium chloride panel of fine capillary form, can absorb the moisture in the air current, water absorption ring 701's upper surface is provided with interior abaculus ring 702, fan seat 6's internal surface and the surface of interior abaculus ring 702 contact, sealing ring 7's upper surface and clamping ring 601's lower surface contact, can be treating like this and adorn singlechip 4 and carry out the radiating while of blowing, also can effectively prevent inside outside steam admission device.
The device is through setting up mounting hole 5, fan seat 6, sealing ring 7 and electric fan 8 etc, two electric fan 8 make the air current in the cavity that installation box 1 and top cap 2 are constituteed directional flow and then dispel the heat to waiting to adorn singlechip 4, can absorb the moisture in the air current through ring 701 that absorbs water, and through fan seat 6, sealing ring 7 and installation box 1 or top cap between 2 in close contact with, can prevent like this that outside steam from passing through the junction of installation box 1 and sealing ring 7 and the junction entering device of top cap 2 and sealing ring 7 inside, the device has when treating dress singlechip 4 and blow the heat dissipation, also can effectively prevent the inside function of outside steam admission plant.
As a technical optimization scheme of the utility model, two insertion grooves 501 have all been seted up to the top of top cap 2 and the bottom of installation box 1, two insertion grooves 501 just are linked together with mounting hole 5 about the axis symmetric distribution of mounting hole 5, two swivelling flutes 502 have all been seted up to the top of top cap 2 and the bottom of installation box 1, two swivelling flutes 502 just are linked together with insertion groove 501 about the axis symmetric distribution of mounting hole 5, the surface of fan seat 6 is provided with clamping ring 601, the lower surface of clamping ring 601 is provided with two rotation axis 602 about the axis symmetric distribution of fan seat 6, rotation axis 602 contacts with swivelling flute 502, the one end that clamping ring 601 was kept away from to rotation axis 602 all is provided with calorie axle 603, the diameter of calorie axle 603 is greater than the diameter of rotation axis 602, rotation axis 602 and calorie axle 603 can pass insertion groove 501 and make rotation axis 602 can be in.
As a technical optimization scheme of the utility model, two mating holes 703 have been seted up to the upper surface of sealing ring 7, and two mating holes 703 just can be with fan seat 6 and the installation of sealing ring 7 with rotation axis 602 and card axle 603 pass mating holes 703 about the axis symmetric distribution of sealing ring 7.
The device is through setting up rotation axis 602, card axle 603, mating holes 703, insertion groove 501 and rotation groove 502 etc. can dismantle and install fan seat 6 and sealing ring 7 simply, also can dismantle and install between fan seat 6 and sealing ring 7 and installation box 1 or top cap 2 simply, conveniently to the maintenance and the change of fan seat 6 and sealing ring 7. The device has the function of conveniently dismantling and installing between the fan seat 6 and the sealing ring 7 and the installation box body 1 or the top cover 2.
The utility model discloses when using, the fan seat 6 that sets up at top cap 2 top is the supply-air outlet, fan seat 6 that installation box 1 bottom set up is the air outlet, when the electric power fan 8 that is in top cap 2 top begins the during operation, pass through the inner chamber of fan seat 6 and the inner chamber of interior abaculus ring 702 with the air current, the dry of rethread ring 701 that absorbs water carries out drying process to the air current, make the air current moisture that gets into the inner chamber of installing box 1 and top cap 2 constitution reduce greatly, and finally through being in the electric power fan 8 of installation box 1 below with the air current eduction gear outside, make the device when treating dress singlechip 4 and carry out the radiating, also can avoid bringing the outside steam of device into the inside of device into.
Because the surface of fan seat 6 and the internal surface of sealing ring 7 contact, the internal surface of fan seat 6 and the surface of embedded ring 702 contact, the upper surface of sealing ring 7 and the lower surface of clamping ring 601 contact, the lower surface of two sealing rings 7 contacts with the lower surface of installation box 1 and the upper surface of top cap 2 respectively, and sealing ring 7 has certain elasticity and can be waterproof, can prevent like this that outside steam from passing through the junction of installation box 1 and sealing ring 7 and the junction entering device of top cap 2 and sealing ring 7 inside.
When the fan base 6 and the sealing ring 7 are detached, the fan base 6 is rotated to rotate the rotating shaft 602 in the rotating groove 502, when the rotating shaft 602 is rotated into the insertion groove 501, the rotating shaft 602 and the clamping shaft 603 are inserted through the insertion groove 501, the fan base 6 and the sealing ring 7 can be detached from the top cover 2 or the mounting case 1, if the rotating shaft 602 is not rotated into the insertion groove 501, the diameter of the clamping shaft 603 is larger than that of the rotating shaft 602, and the rotating shaft 602 is in contact with the rotating groove 502, the fan base 6 and the sealing ring 7 cannot be detached from the mounting case 1 or the top cover 2, and then the rotating shaft 602 and the clamping shaft 603 are inserted through the matching hole 703, and the fan base 6 and the sealing ring 7 can be detached.
For technical personnel in the field, the device has the function of effectively preventing external water vapor from entering the device while blowing and radiating the single chip microcomputer 4 to be installed, and also has the function of conveniently detaching and installing the space between the fan seat 6 and the sealing ring 7 and the installation box body 1 or the top cover 2.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. The utility model provides a singlechip installation frame with heat dissipation function, includes installation box (1), top cap (2), mounting panel (3), treats dress singlechip (4), mounting hole (5), fan seat (6) and sealing ring (7), its characterized in that: the to-be-installed single chip microcomputer (4) is fixedly connected to the upper surface of the mounting plate (3), the lower surface of the mounting plate (3) is fixedly connected to the upper surface of the placing frame (101), and the side wall of the mounting plate (3) is in contact with the positioning block (102);
the top of the mounting box body (1) is fixedly connected with a top cover (2), the mounting box body (1) and the top cover (2) can form a closed cavity, mounting holes (5) are formed in the bottom of the mounting box body (1) and the top of the top cover (2), the number of the fan seat (6) and the number of the sealing rings (7) are two, an electric fan (8) is fixedly connected in each of the two sealing rings (7), the two sealing rings (7) are respectively rotatably mounted on the top of the top cover (2) and the bottom of the mounting box body (1) through the mounting holes (5), the lower surfaces of the two sealing rings (7) are respectively contacted with the lower surface of the mounting box body (1) and the upper surface of the top cover (2), the outer surface of the fan seat (6) is contacted with the inner surfaces of the sealing rings (7), and the inner surface of the fan seat (6) is contacted with the outer surface of the, the upper surface of the sealing ring (7) is in contact with the lower surface of the pressing ring (601).
2. The single chip microcomputer mounting frame with the heat dissipation function according to claim 1, wherein: the inner cavity of the mounting box body (1) is provided with a placing rack (101), and the top of the placing rack (101) is provided with four positioning blocks (102) which are in contact with the side wall of the mounting plate (3).
3. The single chip microcomputer mounting frame with the heat dissipation function according to claim 1, wherein: two insertion grooves (501) are formed in the top of the top cover (2) and the bottom of the mounting box body (1), and the two insertion grooves (501) are symmetrically distributed about the axis of the mounting hole (5) and are communicated with the mounting hole (5).
4. The single chip microcomputer mounting frame with the heat dissipation function according to claim 1, wherein: two rotating grooves (502) are formed in the top of the top cover (2) and the bottom of the mounting box body (1), and the two rotating grooves (502) are symmetrically distributed about the axis of the mounting hole (5) and are communicated with the insertion groove (501).
5. The single chip microcomputer mounting frame with the heat dissipation function according to claim 1, wherein: the outer surface of fan seat (6) is provided with clamping ring (601), the lower surface of clamping ring (601) is provided with two rotation axis (602) about the axis symmetric distribution of fan seat (6), rotation axis (602) contact with rotatory groove (502).
6. The single chip microcomputer mounting frame with the heat dissipation function according to claim 5, wherein: one end of the rotary shaft (602) far away from the pressing ring (601) is provided with a clamping shaft (603), and the diameter of the clamping shaft (603) is larger than that of the rotary shaft (602).
7. The single chip microcomputer mounting frame with the heat dissipation function according to claim 1, wherein: two matching holes (703) are formed in the upper surface of the sealing ring (7), the two matching holes (703) are symmetrically distributed about the axis of the sealing ring (7), a water absorbing ring (701) is arranged at the bottom of the sealing ring (7), and an inner embedded ring (702) is arranged on the upper surface of the water absorbing ring (701).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922286966.7U CN210895324U (en) | 2019-12-18 | 2019-12-18 | Singlechip installation frame with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922286966.7U CN210895324U (en) | 2019-12-18 | 2019-12-18 | Singlechip installation frame with heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210895324U true CN210895324U (en) | 2020-06-30 |
Family
ID=71337082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922286966.7U Expired - Fee Related CN210895324U (en) | 2019-12-18 | 2019-12-18 | Singlechip installation frame with heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210895324U (en) |
-
2019
- 2019-12-18 CN CN201922286966.7U patent/CN210895324U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105758059B (en) | A kind of semiconductor demoistener | |
| CN210895324U (en) | Singlechip installation frame with heat dissipation function | |
| CN208336852U (en) | A kind of power distribution equipment suitable for such environmental effects | |
| CN211670504U (en) | Switch board cooling dehydrating unit | |
| CN109386912A (en) | The thermoelectricity absorption dehumidifying device and its application method of rotational structure | |
| CN217307058U (en) | Low-voltage switch cabinet | |
| CN208386082U (en) | A kind of busbar side board of high heat dispersion | |
| CN210641247U (en) | Heat dissipation device of electric power automation equipment | |
| CN210519259U (en) | Heat dissipation protection device of electromechanical device | |
| CN208657236U (en) | A kind of radiator of Electric Power Automation Equipment | |
| CN108283866A (en) | It is a kind of to take aim at the band of system from drying function drying device for photoelectric observing | |
| CN215807201U (en) | Medical equipment dehumidification heat dissipation type radiator fan | |
| CN212777759U (en) | Logistics and storage management is with storage ventilation device | |
| CN209655466U (en) | A kind of sealed dehumidifier | |
| CN209056807U (en) | A kind of outdoor low voltage comprehensive distribution box | |
| CN207753992U (en) | A kind of high temperature resistant radiator shell | |
| CN204084714U (en) | A kind of dehydrating unit | |
| CN208754141U (en) | A kind of energy-saving electric machine with efficient radiating apparatus | |
| CN207763110U (en) | Dehumidifier | |
| CN206195205U (en) | Cabinet body is built -in small -size prevents congealing white dehumidifier | |
| CN220287628U (en) | Vertical regeneration wind structure | |
| CN215724774U (en) | Energy-saving hot air dryer | |
| CN219591856U (en) | Sealed insulating prefabricated cabin with good cooling effect | |
| CN216667852U (en) | Direct-expansion type dehumidifying heat pump unit | |
| CN201726638U (en) | Dehumidifying device for airtight box body |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200630 Termination date: 20211218 |