CN210886281U - High-speed electroplating device with selective surface treatment - Google Patents

High-speed electroplating device with selective surface treatment Download PDF

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Publication number
CN210886281U
CN210886281U CN201921407182.9U CN201921407182U CN210886281U CN 210886281 U CN210886281 U CN 210886281U CN 201921407182 U CN201921407182 U CN 201921407182U CN 210886281 U CN210886281 U CN 210886281U
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Prior art keywords
electroplating
surface treatment
selective surface
centre gripping
clamping plate
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CN201921407182.9U
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Chinese (zh)
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郭建琴
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Huangshan Jintu Surface Treatment Co ltd
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Huangshan Jintu Surface Treatment Co ltd
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Abstract

The utility model discloses a high-speed electroplating device with selective surface treatment, in particular to the electroplating field, which comprises a U-shaped supporting rod, wherein a first clamping component and a second clamping component are arranged on the inner side of the top of the U-shaped supporting rod, and a switching component is arranged on the inner side of the U-shaped supporting rod; first centre gripping subassembly and second centre gripping subassembly all include the cylinder, the fixed strip that is equipped with in cylinder bottom, the connecting strip has all been welded to fixed strip both ends bottom. The utility model discloses a first centre gripping subassembly and second centre gripping subassembly are electroplated in sending the work piece to the electroplating solution in the electroplating solution jar in turn, and during electroplating, can accomplish work piece centre gripping and switching-over operation on first centre gripping subassembly or the second centre gripping subassembly to improve electroplating efficiency, can carry out the electroplating of selectivity many times to the work piece fast, reduced electroplating solution's fluctuation through the partition section of thick bamboo that sets up simultaneously, make the electroplating process more stable.

Description

High-speed electroplating device with selective surface treatment
Technical Field
The utility model relates to an electroplate the field, more specifically say, the utility model relates to a high-speed electroplating device of selectivity surface treatment.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.
Chinese patent of patent grant publication No. CN 208293098U discloses a high-speed electroplating device with selective surface treatment, including a sub-tank and a main tank, the sub-tank is provided with an electrode unit, a water retaining device and a positioning device, the water retaining device passes through the sub-tank is fixed, the water retaining device is provided with at least one opening, the positioning device is arranged above the water retaining device and fixes the position of a to-be-electroplated part, and when electroplating, the electroplating solution in the main tank is uninterruptedly transported. The utility model discloses a can treat that electroplating product carries out selectivity surface treatment, the treatment effect is good, practices thrift treatment cost moreover.
However, in practical use, there are major technical problems that, if the processing position of the selective surface treatment is a plurality of unconnected positions, the workpiece needs to be changed for many times during the electroplating process, and in this case, the electroplating operation efficiency is slow and the electroplating effect is unstable.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above-mentioned defect of prior art, the embodiment of the utility model provides a selective surface treatment's high-speed electroplating device, send the work piece to electroplating solution in the electroplating solution jar in turn through first centre gripping subassembly and second centre gripping subassembly and electroplate, and during electroplating, can accomplish work piece centre gripping and the switching-over operation on first centre gripping subassembly or the second centre gripping subassembly, thereby electroplating efficiency has been improved, can carry out the electroplating of selectivity many times to the work piece fast, it is effectual to electroplate, the electroplating solution in will electroplating solution jar is separated into the small size through the partition section of thick bamboo that sets up simultaneously, thereby electroplating solution's fluctuation has been reduced greatly, make electroplating process more stable, in order to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a high-speed electroplating device for selective surface treatment comprises a U-shaped supporting rod, wherein a first clamping assembly and a second clamping assembly are arranged on the inner side of the top of the U-shaped supporting rod, and a switching assembly is arranged on the inner side of the U-shaped supporting rod;
the first clamping assembly and the second clamping assembly respectively comprise an air cylinder, a fixing strip is fixedly arranged at the bottom of the air cylinder, connecting strips are welded at the bottoms of two ends of each fixing strip, a bearing is arranged at one end, away from the fixing strip, of each connecting strip in a penetrating manner, a cross rod is arranged inside the bearing in a penetrating manner, a plurality of clamps are fixedly arranged on the cross rod, a rotary table is fixedly arranged at one end of the cross rod, a plurality of first through grooves are formed in the rotary table, bolts are arranged inside the first through grooves in a penetrating manner, second through grooves are formed in the connecting strips, and one ends, away from the rotary table, of the bolts are arranged;
the switching assembly comprises a slide rail, a trolley is arranged at the top of the slide rail, an electroplating solution tank is placed at the top of the trolley, and a plurality of separating cylinders are fixedly arranged on the inner wall of the connecting strip.
In a preferred embodiment, the bottom of the electroplating solution tank is provided with a groove, the top of the trolley is fixedly provided with a lug, and the lug is arranged inside the groove.
In a preferred embodiment, a first clamping plate is welded at the bottom of the U-shaped support rod, and a plurality of screws penetrate through the first clamping plate.
In a preferred embodiment, a nut is sleeved at one end of the screw rod and is arranged on the top of the first clamping plate.
In a preferred embodiment, a second clamping plate is fixedly arranged at the bottom of the first clamping plate, and a plurality of gaskets are placed at the top of the second clamping plate.
In a preferred embodiment, the spacer is disposed between the first clamping plate and the second clamping plate.
In a preferred embodiment, the air cylinder is fixedly arranged on the inner side of the top of the U-shaped supporting rod.
In a preferred embodiment, the sliding rail is fixedly arranged inside the U-shaped supporting rod.
The utility model discloses a technological effect and advantage:
1. the workpiece is alternately conveyed to the electroplating solution in the electroplating solution tank for electroplating through the first clamping assembly and the second clamping assembly, and in the electroplating period, the workpiece clamping and reversing operation on the first clamping assembly or the second clamping assembly can be completed, so that the electroplating efficiency is improved, the workpiece can be quickly selectively electroplated for multiple times, the electroplating effect is good, meanwhile, the electroplating solution in the electroplating solution tank is divided into small areas through the arranged separating cylinder, the fluctuation of the electroplating solution is greatly reduced, the electroplating process is more stable, compared with the prior art, the electroplating effect is good, meanwhile, the electroplating solution in the electroplating solution tank is divided into small areas through the arranged separating cylinder, the fluctuation of the electroplating solution is greatly reduced, and the electroplating process is more stable and advanced;
2. through place the gasket of quantity simultaneously between first splint 21 and second splint 24 in order to change the distance between first splint and the second splint, thereby make the utility model discloses can put steadily on uneven ground, a plurality of gaskets of placing simultaneously have increased weight, make the utility model discloses put more stably, compare with prior art, have the messenger the utility model discloses put stable progress.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is an enlarged view of a portion a in fig. 1 according to the present invention.
Fig. 3 is a schematic side view of the turntable of the present invention.
Fig. 4 is a schematic side view of the connecting strip of the present invention.
Fig. 5 is a schematic view of the three-dimensional structure of the separating cylinder of the present invention.
The reference signs are: the device comprises a 1U-shaped supporting rod, a 2 first clamping component, a 3 second clamping component, a 4 switching component, a 5 air cylinder, a 6 fixing strip, a 7 connecting strip, a 8 bearing, a 9 cross rod, a 10 clamp, a 11 rotating disc, a 12 first through groove, a 13 bolt, a 14 second through groove, a 15 sliding rail, a 16 trolley, a 17 electroplating solution tank, a 18 separating cylinder, a 19 groove, a 20 convex block, a 21 first clamping plate, a 22 screw rod, a 23 nut, a 24 second clamping plate and a 25 gasket.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in the attached drawings 1-5, the utility model provides a high-speed electroplating device with selective surface treatment, which comprises a U-shaped supporting rod 1, wherein the inner side of the top of the U-shaped supporting rod 1 is provided with a first clamping component 2 and a second clamping component 3, and the inner side of the U-shaped supporting rod 1 is provided with a switching component 4;
the first clamping assembly 2 and the second clamping assembly 3 both comprise an air cylinder 5, a fixing strip 6 is fixedly arranged at the bottom of the air cylinder 5, connecting strips 7 are welded at the bottoms of two ends of the fixing strip 6, one ends, far away from the fixing strip 6, of the connecting strips 7 are provided with bearings 8 in a penetrating manner, a cross rod 9 is arranged inside the bearings 8 in a penetrating manner, a plurality of clamps 10 are fixedly arranged on the cross rod 9, one end of the cross rod 9 is fixedly provided with a turntable 11, the turntable 11 is provided with a plurality of first through grooves 12, a bolt 13 is arranged inside the first through grooves 12 in a penetrating manner, a second through groove 14 is arranged on the connecting strips 7, and one end, far away from the turntable 11, of the bolt 13 is arranged inside the;
the switching assembly 4 comprises a slide rail 15, a trolley 16 is arranged at the top of the slide rail 15, an electroplating solution tank 17 is placed at the top of the trolley 16, and a plurality of separating cylinders 18 are fixedly arranged on the inner wall of the connecting strip 7;
a groove 19 is formed at the bottom of the electroplating solution tank 17, a bump 20 is fixedly arranged at the top of the trolley 16, and the bump 20 is arranged in the groove 19;
the air cylinder 5 is fixedly arranged on the inner side of the top of the U-shaped support rod 1;
the slide rail 15 is fixedly arranged on the inner side of the U-shaped support rod 1.
The implementation mode is specifically as follows: when the electroplating device works, a workpiece to be electroplated is clamped on the clamp 10 on the first clamping component 2, then the cylinder 5 on the first clamping component 2 works to drive the clamp 10 and the workpiece on the clamp to move downwards to the part of the workpiece to be electroplated, which is immersed in the electroplating solution tank 17, so as to carry out electroplating, the operation of clamping the workpiece to be electroplated on the clamp 10 on the second clamping component 3 can be completed in the electroplating process of the workpiece on the first clamping component 2, after the workpiece on the first clamping component 2 is initially electroplated, the first clamping component 2 works to drive the workpiece to ascend, then the trolley 16 drives the electroplating solution tank 17 to move to the bottom of the second clamping component 3, the cylinder 5 on the second clamping component 3 works to drive the workpiece to move downwards to the electroplating solution in the electroplating solution tank 17, in the electroplating process of the workpiece on the second clamping component 3, the angle of the workpiece on the first clamping component 2 can be changed by pulling out the bolt 13 on the first clamping component 2 and rotating the turntable 11 on the first clamping component 2 to prepare for the next electroplating work, by the circulation, the workpiece is alternately sent to the electroplating solution in the electroplating solution tank 17 for electroplating through the first clamping component 2 and the second clamping component 3, and during the electroplating, can complete the work piece clamping and reversing operation on the first clamping component 2 or the second clamping component 3, thereby improving the electroplating efficiency, being capable of quickly and selectively electroplating the workpiece for a plurality of times, having good electroplating effect, meanwhile, the electroplating solution in the electroplating solution tank 17 is divided into small areas by the arranged separating cylinder 18, thereby greatly reducing the fluctuation of the electroplating solution, ensuring the electroplating process to be more stable, the embodiment specifically solves the problems of low electroplating operation efficiency and unstable electroplating effect in the prior art.
As shown in fig. 1, the high-speed electroplating device with selective surface treatment further comprises a first clamping plate 21, wherein the first clamping plate 21 is welded at the bottom of the U-shaped support rod 1, and a plurality of screws 22 are arranged on the first clamping plate 21 in a penetrating manner;
one end of the screw rod 22 is sleeved with a nut 23, and the nut 23 is arranged at the top of the first clamping plate 21;
a second clamping plate 24 is fixedly arranged at the bottom of the first clamping plate 21, and a plurality of gaskets 25 are placed at the top of the second clamping plate 24;
the spacer 25 is disposed between the first clamping plate 21 and the second clamping plate 24.
The implementation mode is specifically as follows: through placing a plurality of gaskets 25 between first splint 21 and second splint 24 to through twisting nut 23 make first splint 21 and second splint 24 be close to and press from both sides tight gasket 25, place the gasket 25 of different quantity in order to change the distance between first splint 21 and the second splint 24, thereby make the utility model discloses can put steadily on uneven ground, a plurality of gaskets 25 of placing simultaneously have increased weight, make the utility model discloses put more stably, this embodiment has specifically solved the unstable problem of putting that exists among the prior art.
The utility model discloses the theory of operation:
referring to the attached drawings 1-5 of the specification, a workpiece is alternately conveyed to an electroplating solution in an electroplating solution tank 17 by a first clamping assembly 2 and a second clamping assembly 3 for electroplating, and during electroplating, the workpiece clamping and reversing operation on the first clamping assembly 2 or the second clamping assembly 3 can be completed, so that the electroplating efficiency is improved, the workpiece can be quickly and selectively electroplated for multiple times, the electroplating effect is good, and meanwhile, the electroplating solution in the electroplating solution tank 17 is divided into small areas by a separating cylinder 18, so that the fluctuation of the electroplating solution is greatly reduced, and the electroplating process is more stable;
referring to the description attached figure 1, through place the gasket 25 of different quantity in order to change the distance between first splint 21 and the second splint 24, thereby make the utility model discloses can put steadily on uneven ground, a plurality of gaskets 25 of placing simultaneously have increased weight, make the utility model discloses put more stably.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;
and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (8)

1. A high-speed electroplating device for selective surface treatment comprises a U-shaped supporting rod (1), and is characterized in that: a first clamping assembly (2) and a second clamping assembly (3) are arranged on the inner side of the top of the U-shaped supporting rod (1), and a switching assembly (4) is arranged on the inner side of the U-shaped supporting rod (1);
the first clamping assembly (2) and the second clamping assembly (3) both comprise an air cylinder (5), a fixing strip (6) is fixedly arranged at the bottom of the air cylinder (5), connecting strips (7) are welded at the bottoms of the two ends of the fixing strip (6), a bearing (8) is arranged at one end, away from the fixing strip (6), of each connecting strip (7) in a penetrating manner, a cross rod (9) is arranged at the inner side of each bearing (8) in a penetrating manner, a plurality of clamps (10) are fixedly arranged on the cross rod (9), a rotary table (11) is fixedly arranged at one end of each cross rod (9), a plurality of first through grooves (12) are formed in each rotary table (11), a bolt (13) is arranged at the inner side of each first through groove (12) in a penetrating manner, a second through groove (14) is formed in each connecting strip (7), and one end, away from the rotary table (11;
the switching assembly (4) comprises a sliding rail (15), a trolley (16) is arranged at the top of the sliding rail (15), an electroplating solution tank (17) is placed at the top of the trolley (16), and a plurality of separating cylinders (18) are fixedly arranged on the inner wall of the connecting strip (7).
2. A high-speed plating apparatus for selective surface treatment according to claim 1, wherein: the bottom of the electroplating solution tank (17) is provided with a groove (19), the top of the trolley (16) is fixedly provided with a bump (20), and the bump (20) is arranged in the groove (19).
3. A high-speed plating apparatus for selective surface treatment according to claim 1, wherein: the welding of U type bracing piece (1) bottom has first splint (21), it is equipped with a plurality of screws (22) to run through on first splint (21).
4. A high-speed plating apparatus for selective surface treatment according to claim 3, wherein: and one end of the screw rod (22) is sleeved with a nut (23), and the nut (23) is arranged at the top of the first clamping plate (21).
5. A high-speed plating apparatus for selective surface treatment according to claim 3, wherein: the bottom of the first clamping plate (21) is fixedly provided with a second clamping plate (24), and the top of the second clamping plate (24) is provided with a plurality of gaskets (25).
6. The high-speed plating apparatus for selective surface treatment according to claim 5, wherein: the gasket (25) is arranged between the first clamping plate (21) and the second clamping plate (24).
7. A high-speed plating apparatus for selective surface treatment according to claim 1, wherein: the air cylinder (5) is fixedly arranged on the inner side of the top of the U-shaped supporting rod (1).
8. A high-speed plating apparatus for selective surface treatment according to claim 1, wherein: the slide rail (15) is fixedly arranged on the inner side of the U-shaped support rod (1).
CN201921407182.9U 2019-08-28 2019-08-28 High-speed electroplating device with selective surface treatment Active CN210886281U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921407182.9U CN210886281U (en) 2019-08-28 2019-08-28 High-speed electroplating device with selective surface treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921407182.9U CN210886281U (en) 2019-08-28 2019-08-28 High-speed electroplating device with selective surface treatment

Publications (1)

Publication Number Publication Date
CN210886281U true CN210886281U (en) 2020-06-30

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ID=71333834

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921407182.9U Active CN210886281U (en) 2019-08-28 2019-08-28 High-speed electroplating device with selective surface treatment

Country Status (1)

Country Link
CN (1) CN210886281U (en)

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