CN210885926U

CN210885926U - Flexible composite high-thermal-conductivity gasket

Info

Publication number: CN210885926U
Application number: CN201921875055.1U
Authority: CN
Inventors: 林秋燕; 黎海涛
Original assignee: Dongguan Hanpin Electronics Co ltd
Current assignee: Dongguan Hanpin Electronics Co ltd
Priority date: 2019-10-31
Filing date: 2019-10-31
Publication date: 2020-06-30
Anticipated expiration: 2029-10-31

Abstract

The utility model relates to a high heat conduction gasket of flexible compound, including the PI membrane, the first surface of PI membrane is provided with the heat conduction coating, the heat conduction coating is green silicon carbide coating, aluminium nitride coating, boron nitride coating or aluminium oxide coating. On the basis of the PI film, the gasket is added with a green silicon carbide coating, an aluminum nitride coating, a boron nitride coating or an aluminum oxide coating with good heat-conducting property. Compared with an independent PI film, the heat conducting performance of the whole gasket is improved. And has the following advantages: softness, good adhesion, high strength, tear resistance, folding resistance, good insulativity, high thermal conductivity and the like.

Description

Flexible composite high-thermal-conductivity gasket

Technical Field

The utility model relates to a heat conduction gasket especially relates to flexible compound high heat conduction gasket.

Background

The PI film, i.e., the polyimide film, can be used as an insulating material or the like, and has a wide range of applications. Such films have disadvantages in that: its heat-conducting property is lower.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a flexible composite high thermal conductivity gasket to solve the problem of low thermal conductivity of the conventional PI film.

The utility model provides a high heat conduction gasket of flexible compound, includes the PI membrane, the first surface of PI membrane is provided with the heat conduction coating, the heat conduction coating is green silicon carbide coating, aluminium nitride coating, boron nitride coating or aluminium oxide coating.

On the basis of the PI film, the gasket is added with a green silicon carbide coating, an aluminum nitride coating, a boron nitride coating or an aluminum oxide coating with good heat-conducting property. Compared with an independent PI film, the heat conducting performance of the whole gasket is improved.

In one embodiment, the second surface of the PI film is provided with a thermally conductive coating, which is a green silicon carbide coating, an aluminum nitride coating, a boron nitride coating, or an aluminum oxide coating.

In one embodiment, the first surface and the second surface of the PI film are provided with a heat conductive coating of green silicon carbide.

In one embodiment, the thickness of the heat-conducting coating on the first surface of the PI film is 0.01mm-0.1mm, the thickness of the heat-conducting coating on the second surface of the PI film is 0.01mm-0.1mm, the thickness of the PI film is 0.03mm-0.3mm, and the total thickness of the gasket is 0.15mm-0.5 mm.

In one embodiment, the thickness of the PI film is 0.05mm, and the total thickness of the flexible composite high thermal conductivity gasket is 0.15 mm.

In one embodiment, a glue layer is arranged on the outer surface of one of the heat-conducting coatings, and a release layer is arranged on the outer surface of the glue layer.

Drawings

Fig. 1 is a schematic diagram of the embodiment of the present invention in which heat conductive coatings are respectively disposed on two surfaces of a PI film.

Fig. 2 is a schematic diagram of an embodiment of the present invention, in which a glue layer is disposed on an outer surface of one of the thermal conductive coatings, and a release layer is disposed on an outer surface of the glue layer.

Wherein:

100. PI film

200. Thermally conductive coating

300. Glue layer

400. Release layer

110. First surface

120. Second surface

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

As shown in fig. 1, the embodiment of the utility model provides a high heat conduction gasket of flexible compound type, including the PI membrane, the first surface of PI membrane is provided with the heat conduction coating, the heat conduction coating is green silicon carbide coating, aluminum nitride coating, boron nitride coating or aluminium oxide coating.

Further, the gasket of the present invention may have a heat conductive coating on one of the surfaces of the PI film, or may have a heat conductive coating on both surfaces of the PI film. That is, a thermally conductive coating is provided on both the first and second surfaces of the PI film. The heat conducting coating is a green silicon carbide coating, an aluminum nitride coating, a boron nitride coating or an aluminum oxide coating.

It can be understood that several materials of green silicon carbide, aluminum nitride, boron nitride and aluminum oxide can be compounded to be used to prepare a coating, and the coating is coated on the surface of the PI film to form a heat-conducting coating.

In one embodiment, the first surface and the second surface of the PI film are provided with a heat conductive coating of green silicon carbide. On the basis, the thickness of the heat-conducting coating on the first surface of the PI film is 0.01mm-0.1mm, the thickness of the heat-conducting coating on the second surface of the PI film is 0.01mm-0.1mm, the thickness of the PI film is 0.03mm-0.3mm, and the total thickness of the gasket is 0.15mm-0.5 mm. Experiments show that the heat conducting performance of the green silicon carbide coating is superior to that of other heat conducting coatings. And the heat-conducting property can be obviously improved by reasonably configuring the thickness of each layer.

For example, the utility model discloses a high heat conduction gasket of flexible compound type includes PI membrane and heat conduction coating, the heat conduction coating that the first surface and the second surface of PI membrane set up all is green carborundum coating, the thickness of PI membrane is 0.05mm, high heat conduction gasket gross thickness of flexible compound type is 0.15mm, and the coefficient of heat conductivity of this kind of gasket is about 1.5W-2.5W, and the coefficient of heat conductivity of ordinary PI membrane is generally about 0.15W-0.2W. Therefore, the utility model discloses a heat conductivility of gasket is showing and is promoting.

Furthermore, the utility model discloses still carried out the contrast experiment to other types of heat conduction coating, all set up the heat conduction coating on the first surface and the second surface of PI membrane, this heat conduction coating is aluminium nitride coating, boron nitride coating or aluminium oxide coating. The thickness of the PI film is 0.05mm, the total thickness of the flexible composite high-thermal-conductivity gasket is 0.15mm, and the thermal conductivity coefficient of the gasket is about 0.4W-0.8W. It can be seen that the above gasket also has improved thermal conductivity compared to the PI film alone.

Further, as shown in fig. 2, the gasket of the present invention may have a glue layer on the outer surface of one of the heat conductive coatings, and the outer surface of the glue layer is provided with a release layer. The adhesive layer can adopt acrylic adhesive and the like.

Further, it is still right the utility model discloses a gasket has carried out the test of other performance, and the test result is as follows: the gasket includes PI membrane and heat conduction coating, the heat conduction coating that the first surface and the second surface of PI membrane set up all is green silicon carbide coating, the thickness of PI membrane is 0.05mm, gasket total thickness is 0.15 mm. The test shows that the adhesive force of the adhesive tape is measured by a hundred-grid knife, and no shedding image exists. The tensile strength is 250MPa-350 MPa. The breakdown voltage is 6-8 KV/mm. Comparative experiment: the tensile strength of the 0.05TPI film is 200MPa, and the breakdown voltage of the 0.05TPI film is 4-5 KV/mm.

Can find out through above experimental result, the utility model discloses a gasket has following advantage: softness, good adhesion, high strength, tear resistance, folding resistance, good insulativity, high thermal conductivity and the like.

The following describes the manufacturing method of the gasket of the present invention.

Taking the preparation of green silicon carbide coating as an example: firstly, silicon carbide powder, modified organic silicon oil, a cross-linking agent, a dispersing agent, a defoaming agent and a diluting agent are stirred into liquid coating. And then carrying out single-side coating or double-side coating on the surface of the heat-conducting PI film. And then baking and curing the PI film by an oven to form a heat-conducting coating on the surface of the PI film.

It is understood that other types of materials can be used to make the thermally conductive coating on the PI film, similar to the above method, from which reference is made.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a high heat conduction gasket of flexible compound, includes the PI membrane, its characterized in that, the first surface of PI membrane is provided with the heat conduction coating, the heat conduction coating is green silicon carbide coating, aluminium nitride coating, boron nitride coating or aluminium oxide coating.

2. The flexible composite high thermal conductivity gasket according to claim 1, wherein the second surface of the PI film is provided with a thermal conductive coating, the thermal conductive coating being a green silicon carbide coating, an aluminum nitride coating, a boron nitride coating or an aluminum oxide coating.

3. The flexible composite high thermal conductivity gasket according to claim 2, wherein the thermal conductive coatings provided on the first and second surfaces of the PI film are green silicon carbide coatings.

4. The flexible composite high thermal conductivity gasket according to claim 3, wherein the thickness of the thermal conductive coating layer on the first surface of the PI film is 0.01mm-0.1mm, the thickness of the thermal conductive coating layer on the second surface of the PI film is 0.01mm-0.1mm, the thickness of the PI film is 0.03mm-0.3mm, and the total thickness of the gasket is 0.15mm-0.5 mm.

5. The flexible composite high thermal conductivity gasket according to claim 4, wherein the thickness of the PI film is 0.05mm, and the total thickness of the flexible composite high thermal conductivity gasket is 0.15 mm.

6. The flexible composite high thermal conductivity gasket according to claim 2, wherein an adhesive layer is disposed on an outer surface of one of the thermal conductive coatings, and a release layer is disposed on an outer surface of the adhesive layer.