CN210832372U

CN210832372U - Self-cooling semiconductor fan

Info

Publication number: CN210832372U
Application number: CN201921711049.2U
Authority: CN
Inventors: 廖佰军
Original assignee: Shenzhen Ranvoo Technology Co Ltd
Current assignee: Shenzhen Ranvoo Technology Co Ltd
Priority date: 2019-10-12
Filing date: 2019-10-12
Publication date: 2020-06-23
Anticipated expiration: 2029-10-12

Abstract

The utility model provides a self-cooling semiconductor fan, which comprises a housin, the casing includes the base and connects the air-out portion at base top, be equipped with circuit board, semiconductor component and fan in the base, semiconductor component with the fan respectively with the circuit board electricity is connected, the fan is located one side of semiconductor component, semiconductor component includes semiconductor refrigeration end and semiconductor refrigeration end, the fan be used for with the cold volume that semiconductor refrigeration end produced is derived, be equipped with water conservancy diversion mechanism in the casing, water conservancy diversion mechanism be used for with some direction of the amount of wind that the fan was derived air-out portion, the direction of another part semiconductor refrigeration end is with right semiconductor component dispels the heat.

Description

Self-cooling semiconductor fan

Technical Field

The utility model relates to a semiconductor fan field, in particular to self-cooling semiconductor fan.

Background

There are currently available cooling and heating fans made by using the peltier effect of semiconductor materials, whose working principle is to install a semiconductor cooling element in a conventional fan. When in a refrigeration mode, air is cooled from the cold end of the semiconductor refrigeration piece to form cold air; when in the heating mode, the semiconductor refrigerating element is connected with current in the direction opposite to that of the refrigerating mode, the original cold end is changed into the hot end, and air forms hot air from the hot end. In the prior art, when a semiconductor cooling fan is used for cooling a semiconductor heating end, a heat dissipation hole is generally formed in a shell corresponding to the heating end for natural heat dissipation, or a heat dissipation fan is used for heat dissipation, but the heat dissipation and cooling effects are not good.

SUMMERY OF THE UTILITY MODEL

In view of this, the present invention provides a self-cooling semiconductor fan.

In an embodiment, the fan is located on one side of the semiconductor assembly close to the air outlet portion, and the flow guide mechanism is configured to guide a part of the cold air guided by the fan to the air outlet portion, and guide the other part of the cold air to the semiconductor heating end to dissipate heat of the semiconductor assembly.

In some embodiments, the air guiding mechanism includes a first air guiding portion and a second air guiding portion disposed at the bottom of the housing, the first air guiding portion is configured to guide a part of the air quantity guided by the fan into the air outlet portion, and the second air guiding portion is configured to guide another part of the air quantity guided by the fan to the semiconductor heating end.

In an embodiment, the air-out portion is a structure with two open ends, the top opening of the air-out portion forms the air outlet of the air-out portion, the bottom of the air-out portion bends inward and extends to form an arc-shaped first flow guiding portion, the air outlet cover is provided with a fan cover, and the bottom of the fan cover extends to the inner side of the first flow guiding portion and forms a first gap with the first flow guiding portion.

In an embodiment, the bottom of the end of the base connected with the air outlet portion is bent and extended towards the fan to form an arc-shaped second flow guide portion, the second flow guide portion is located between one side of the fan facing the air outlet portion and the side wall of the fan housing, and a second gap is formed between the end of the second flow guide portion and the fan.

In one embodiment, a first flow guiding channel is formed among the first flow guiding part, the fan cover and the second flow guiding part, and the first flow guiding channel is communicated with the air outlet part; a second flow guide channel is formed between the second flow guide part and the fan, the semiconductor heating end is located in a cavity, and the second flow guide channel is communicated with the cavity.

In an embodiment, a battery is further disposed in the base, the battery is electrically connected to the circuit board, the circuit board and the battery are disposed on a side of the semiconductor assembly away from the air outlet portion, a first blocking portion is disposed between the battery and the semiconductor assembly, and a second blocking portion is disposed between the semiconductor heating end and the fan.

In an embodiment, a plurality of heat dissipation holes are formed in a side of the base, which is close to the semiconductor hot end, and the heat dissipation holes are used for dissipating heat generated by the semiconductor hot end.

In one embodiment, the base is provided with a plurality of air inlet portions, so that when one or more air inlet portions are shielded, external air can enter the base from at least one other air inlet portion.

In an embodiment, the base is provided with a plurality of control buttons electrically connected to the circuit board, including a switch button, a gear button and a mode adjustment button, the switch button is used for controlling the on/off of the self-cooling semiconductor fan, the gear button is used for adjusting the wind power of the self-cooling semiconductor fan, and the mode adjustment button is used for adjusting the operation mode of the self-cooling semiconductor fan.

To sum up, the utility model provides a self-cooling semiconductor fan sets up water conservancy diversion mechanism in the casing. When the self-cooling semiconductor fan works, for example, the self-cooling semiconductor fan enters a cooling mode, the cooling capacity generated by the semiconductor cooling end cools the ambient air, the fan guides the cold air out, and the cold air is guided from the first guide channel to the air outlet part through the first guide part and then flows out from the air outlet for cooling and radiating the human body; the cold air is guided to the semiconductor heating end from the second flow guide channel through the second flow guide part to dissipate heat of the semiconductor heating end, and the cold air can accelerate the discharge of hot air at the semiconductor heating end through the heat dissipation holes, so that the heat dissipation efficiency is improved, and a good heat dissipation effect is achieved. Because the temperature difference between the semiconductor refrigerating end and the semiconductor refrigerating end is constant, when the temperature of the semiconductor refrigerating end is reduced, and therefore the cooling effect is improved. The utility model discloses a self-cooling semiconductor fan utilizes the cold volume that self semiconductor refrigeration end produced to carry out cooling to self semiconductor system hot junction, and the cooling effect is showing, can prolong self-cooling semiconductor fan's life.

Drawings

Fig. 1 is a schematic perspective view of a self-cooling semiconductor fan according to the present invention.

Fig. 2 is a perspective view of the self-cooling semiconductor fan of fig. 1 from another angle.

Fig. 3 is a side sectional view of the self-cooling semiconductor fan of fig. 1.

Fig. 4 is a partial exploded view of the self-cooling semiconductor fan of fig. 1.

Detailed Description

Before the embodiments are described in detail, it is to be understood that the invention is not limited in its application to the details of construction and the arrangements of components set forth in the following description or illustrated in the drawings. The utility model discloses can be the embodiment that other modes realized. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of "including," "comprising," "having," and the like, herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. In particular, when "a certain element" is described, the present invention is not limited to the number of the element being one, and may include a plurality of the elements.

As shown in fig. 1-4, the present invention provides a self-cooling semiconductor fan 10, which comprises a housing 12, wherein the housing 12 comprises a base 14 and an air outlet portion 16 connected to the top of the base 14. In this embodiment, the base 14 and the air outlet 16 are integrally formed. In other embodiments, the base 14 and the air outlet 16 may be connected separately. A circuit board 18, a semiconductor component and a fan 22 are arranged in the base 14, and a battery 20 can also be arranged in the base 14, wherein the battery 20 is electrically connected with the circuit board 18 to supply power to the circuit board 18, and the semiconductor component and the fan 22 are respectively electrically connected with the circuit board 18 so that the semiconductor component and the fan 22 can normally operate. The fan 22 is located at one side of the semiconductor assembly, in this embodiment, the fan 22 is disposed at one side of the semiconductor assembly close to the air outlet portion 16, the circuit board 18 and the battery 20 are located at one side of the semiconductor assembly far away from the air outlet portion 16, and the circuit board 18 is disposed at the top of the battery 20. The semiconductor assembly includes a semiconductor cooling end 24 and a semiconductor heating end 26 arranged at intervals, and the fan 22 is used for guiding cooling energy generated by the semiconductor cooling end 24 to the air outlet portion 16. The structure of the air outlet portion 16 in this embodiment is not particularly limited, but is preferably an air outlet structure of a bladeless fan as shown in fig. 1, and may be other air outlet structures.

In the illustrated embodiment, the base 14 includes a first base housing portion 14a and a second base housing portion 14b that snap together, wherein the top end of the first base housing portion 14a is connected to the air outlet portion 16 and is integrally formed with the air outlet portion 16, and the second base housing portion 14b is removably snap-fitted to the first base housing portion 14a, such as by a snap-fit. In this embodiment, the semiconductor hot end 26 is located in the first base housing portion 14a, and more specifically, a cavity for accommodating the semiconductor hot end 26 is disposed in the first base housing portion 14a, and the semiconductor hot end 26 is accommodated in the cavity; a semiconductor refrigeration end 24 is located within the second pedestal housing portion 14 b.

A first blocking portion 28a is disposed between the battery 20 and the semiconductor device, the first blocking portion 28a is, for example, a heat insulation board, the first blocking portion 28a is disposed to insulate the heat generated by the semiconductor heating end 26, so as to prevent the heat from entering the area of the battery 20 and affecting the battery 20, and to block the air inlet portion of the base 14 from entering the air inlet portion for dissipating heat from the semiconductor device. A second blocking part 28b is arranged between the semiconductor heating end 26 of the semiconductor component and the fan 22, the second blocking part 28b is a heat insulation plate for example, and the second blocking part 28b is arranged for isolating heat generated by the semiconductor heating end 26, so that the problem of poor refrigeration effect caused by that the heat generated by the semiconductor heating end 26 and cold generated by the semiconductor cooling end 24 are led out of the air outlet together is solved.

A plurality of heat dissipation holes 30 are formed in one side of the base 14 close to the semiconductor hot end 26, so that the heat dissipation holes 30 are close to the semiconductor hot end 26, and heat generated by the semiconductor hot end 26 can be dissipated to the outside through the heat dissipation holes 30. In this embodiment, the heat dissipation holes 30 are disposed on the side surface of the first housing portion 14 a.

The base 14 is provided with a plurality of air inlets, so that when one or more air inlets are shielded, external air can enter the base 14 from at least one other air inlet. In this embodiment, the base 14 is provided with two air inlet portions, which are a first air inlet portion 32 and a second air inlet portion 34, for example, a plurality of air inlet holes. The first air inlet portion 32 is provided on the bottom end surface of the base 14 and the second air inlet portion 34 is provided on the side surface of the base 14, for example, the second air inlet portion 34 is provided on the side surface of the first base housing portion 14a near the bottom thereof. When the second air inlet portion 34 is shielded, for example, by hand when held in a hand, external air can enter the base 14 from the first air inlet portion 32; when the first air inlet portion 32 is shielded, for example, when the base 14 is standing on a table, external air can enter the base 14 through the second air inlet portion 34.

The base 14 may also have a plurality of control buttons electrically connected to the circuit board 18. For example, an on-off button, which can be used to control the on-off of the self-cooling semiconductor fan 10; a gear button for adjusting the wind power of the self-cooling semiconductor fan 10; mode adjustment button, the utility model discloses a self-cooling semiconductor fan 10 is cold and hot fan, both can refrigerate and also can heat, consequently sets up mode adjustment button and can adjust semiconductor component's the refrigeration mode and the switching of the mode of heating through the positive negative pole of regulating current. In the illustrated embodiment, only the switch button 36 and the range button 38 are shown, and the mode adjustment buttons are not shown. In other embodiments, other control buttons may be provided on the base 14 or on the outlet 16.

A flow guiding mechanism is disposed in the housing 12, and is configured to guide a part of the air quantity guided by the fan 22 to the air outlet portion 16, and guide the other part of the air quantity to the semiconductor heating end 26 to dissipate heat of the semiconductor assembly. Namely, the cooling capacity generated by the semiconductor refrigerating end 24 is utilized to cool the semiconductor refrigerating end 26, and then the whole semiconductor assembly is cooled.

More specifically, the guiding mechanism includes a first guiding portion 40 and a second guiding portion 42 disposed at the bottom of the housing 12, the first guiding portion 40 is used for guiding a part, such as a majority, of the air quantity guided by the fan 22 into the air outlet portion 16 for cooling and dissipating heat of the human body, and the second guiding portion 42 is used for guiding another part, such as a minority, of the air quantity guided by the fan to the semiconductor heating end 26 for cooling and dissipating heat of the semiconductor heating end 26.

In the illustrated embodiment, the air outlet 16 is a cylinder with openings at the upper and lower ends, and the base 14 is connected to the sidewall of the air outlet 16. The top opening of the air outlet portion 16 forms an air outlet 44 of the air outlet portion 16, the first base housing portion 14a is located on a side away from the air outlet 44, the second base housing portion 14b is located on a side close to the air outlet 44, and the opening of the first base housing portion 14a faces the same direction as the air outlet 44 of the air outlet portion 16. The bottom end of the air outlet portion 16 is bent inward to form an arc-shaped first guiding portion 40, the first guiding portion 40 is, for example, a curved plate, and the end of the first guiding portion 40 faces the air outlet 44. The air outlet 44 is covered by a hood 46, the hood 46 extends obliquely toward the air outlet 16, and a bottom end of the hood 46 extends to a position near the inner side of the first flow guiding portion 40 facing the air outlet 44 and forms a first gap 48 with the inner side of the first flow guiding portion 40. The bottom of the end of the base 14, which is connected to the air outlet portion 16, of the first base housing portion 14a is bent and extended toward the fan 22 to form an arc-shaped second flow guiding portion 42, the second flow guiding portion 42 is, for example, a bent plate, the second flow guiding portion 42 is located between one side of the fan 22 facing the air outlet portion 16 and the side wall of the fan housing 46, and a second gap 50 is formed between an end of the second flow guiding portion 42 and the fan 22.

The first flow guiding portion 40 and the second flow guiding portion 42 are disposed such that a first flow guiding channel 52 is formed between the first flow guiding portion 40, the side wall of the fan housing 46 and the second flow guiding portion 42, and the first flow guiding channel 52 is communicated with the inside of the air outlet portion 16. A second diversion channel 54 is formed between the second diversion part 42 and the fan 22, and the second diversion channel 54 is communicated with the cavity for accommodating the semiconductor heating end 26. In the illustrated embodiment, a support plate 56 is disposed on a side of the fan 22 adjacent to the bottom of the first base housing portion 14a, the support plate 56 extends to the semiconductor assembly, and a communication passage is formed between the support plate 56 and the bottom of the first base housing portion 14a to communicate the second air guiding passage 54 and the cavity. The cold energy generated by the semiconductor refrigeration end 24 cools the ambient air, the fan 22 guides the cold air out, and a part of the cold air flows into the first flow guide channel 52, enters the air outlet part 16 through the first gap 48, and then flows out of the air outlet 44 to cool and dissipate the heat of the human body; another part of the cold air enters the second flow guiding channel 54 from the second gap 50 and flows to the semiconductor heating end 26 through the communicating channel, so as to cool and dissipate the heat of the semiconductor heating end 26.

In the above embodiment, the fan is disposed on a side of the semiconductor module near the air outlet portion, in such a manner that a part of the cooling energy generated by the semiconductor cooling end is directly introduced into the semiconductor heating end through the fan, and the air for cooling the semiconductor heating end passes through the semiconductor cooling end. In some embodiments, the fan may be disposed on a side of the semiconductor device away from the air outlet portion, a portion of air generated by operation of the fan finally reaches the air outlet through the semiconductor cooling end, another portion of air enters the semiconductor heating end to take away heat and blows out the heat from the heat dissipation hole, and the air for cooling the semiconductor heating end does not pass through the semiconductor cooling end.

The concepts described herein may be embodied in other forms without departing from the spirit or characteristics thereof. The particular embodiments disclosed should be considered illustrative rather than limiting. The scope of the invention is, therefore, indicated by the appended claims rather than by the foregoing description. Any changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

1. The utility model provides a self-cooling semiconductor fan, includes the casing, the casing includes the base and connects the air-out portion at base top, be equipped with circuit board, semiconductor component and fan in the base, semiconductor component with the fan respectively with the circuit board electricity is connected, the fan is located one side of semiconductor component, semiconductor component includes semiconductor refrigeration end and semiconductor refrigeration end, the fan be used for with the cold volume that semiconductor refrigeration end produced is derived, its characterized in that, be equipped with water conservancy diversion mechanism in the casing, water conservancy diversion mechanism be used for with the partly direction of the amount of wind that the fan was derived air-out portion, the direction of another part semiconductor refrigeration end is in order to right semiconductor component dispels the heat.

2. A self-cooling semiconductor fan as claimed in claim 1, wherein said fan is located at a side of said semiconductor device close to said air outlet portion, and said guiding mechanism is configured to guide a portion of the cool air guided by said fan to said air outlet portion, and another portion of the cool air guided by said fan to said semiconductor heating end for heat dissipation of said semiconductor device.

3. A self-cooling semiconductor fan as claimed in any one of claims 1 or 2, wherein said air guide mechanism includes a first air guide portion and a second air guide portion disposed at a bottom of said housing, said first air guide portion being adapted to guide a portion of air quantity guided by said fan into said air outlet portion, said second air guide portion being adapted to guide another portion of air quantity guided by said fan to said semiconductor heating terminal.

4. A self-cooling semiconductor fan as claimed in claim 3, wherein the air outlet portion is a structure with two open ends, the top end of the air outlet portion is open to form an air outlet of the air outlet portion, the bottom end of the air outlet portion is bent inward to form an arc-shaped first guiding portion, the air outlet cover is provided with a fan housing, and the bottom end of the fan housing extends to the inside of the first guiding portion and forms a first gap with the first guiding portion.

5. A self-cooling semiconductor fan as claimed in claim 4, wherein a bottom of an end of the base connected to the air outlet portion is curved toward the fan to form an arc-shaped second flow guiding portion, the second flow guiding portion is located between a side of the fan facing the air outlet portion and a side wall of the fan housing, and a second gap is formed between an end of the second flow guiding portion and the fan.

6. A self-cooling semiconductor fan as claimed in claim 5, wherein a first flow guide channel is formed between the first flow guide portion, the fan housing and the second flow guide portion, and the first flow guide channel is communicated with the air outlet portion; a second flow guide channel is formed between the second flow guide part and the fan, the semiconductor heating end is located in a cavity, and the second flow guide channel is communicated with the cavity.

7. A self-cooling semiconductor fan as claimed in claim 1, wherein a battery is further provided in said base, said battery is electrically connected to said circuit board, said circuit board and battery are provided on a side of said semiconductor package remote from said air outlet portion, a first barrier portion is provided between said battery and said semiconductor package, and a second barrier portion is provided between said semiconductor heating terminal and said fan.

8. A self-cooling semiconductor fan as claimed in claim 1, wherein said base has a plurality of heat dissipation holes formed on a side thereof adjacent to said semiconductor hot end, said heat dissipation holes being adapted to dissipate heat generated from said semiconductor hot end.

9. A self-cooling semiconductor fan as claimed in claim 1, wherein said base is provided with a plurality of air inlet portions so that external air can enter said base from at least one other air inlet portion when one or more of said air inlet portions are blocked.

10. A self-cooling semiconductor fan as claimed in claim 1, wherein said base has a plurality of control buttons electrically connected to said circuit board, including a switch button for controlling the switching of said self-cooling semiconductor fan, a shift button for adjusting the wind power of said self-cooling semiconductor fan, and a mode adjustment button for adjusting the operation mode of said self-cooling semiconductor fan.