CN210826335U

CN210826335U - Target with structure convenient to assemble and disassemble

Info

Publication number: CN210826335U
Application number: CN201921720680.9U
Authority: CN
Inventors: 姚力军; 潘杰; 边逸军; 王学泽; 李小萍
Original assignee: Ningbo Jiangfeng Electronic Material Co Ltd
Current assignee: Ningbo Jiangfeng Electronic Material Co Ltd
Priority date: 2019-10-14
Filing date: 2019-10-14
Publication date: 2020-06-23
Anticipated expiration: 2029-10-14

Abstract

The utility model provides a target material with a structure convenient for loading and unloading, which takes a sputtering surface as an upper surface and comprises a first cylindrical target material, a round table target material and a second cylindrical target material which are arranged from top to bottom in sequence; the top surface of the circular truncated cone target is connected with the bottom surface of the first cylindrical target, and the bottom surface of the circular truncated cone target is connected with the top surface of the second cylindrical target. The utility model discloses a ripe prior art sets up the target into cylinder, round platform and cylinder structure from the top down, has avoided the magnetron sputtering in-process, and the problem that the too much sealing ring that causes of target sputter surface atomic deposition can't take out has guaranteed the smooth operation of magnetron sputtering production line.

Description

Target with structure convenient to assemble and disassemble

Technical Field

The utility model belongs to the technical field of the semiconductor, a target is related to, especially, relate to a target with loading and unloading structure.

Background

The target material is a sputtering source which forms various functional films on a substrate by sputtering through a magnetron sputtering system, multi-arc ion plating system or other types of film coating systems under proper process conditions.

Wherein, the principle of magnetron sputtering is as follows: an orthogonal magnetic field and an electric field are added between the sputtered target pole and the anode, the required inert gas is filled in the high vacuum chamber, the permanent magnet forms a magnetic field of 250-350 gauss on the surface of the target, and the orthogonal magnetic field is formed by the permanent magnet and the high voltage electric field. Under the action of electric field, the inert gas is ionized into positive ions and electrons, a certain negative high voltage is added on the target, the electrons emitted from the target electrode are affected by the magnetic field and the ionization probability of the working gas is increased, high-density plasma is formed near the cathode, the inert gas ions accelerate to fly to the target surface under the action of Lorentz force, the target surface is bombarded at high speed, and the atoms sputtered from the target are separated from the target surface by high kinetic energy to fly to the substrate to deposit and form a film under the momentum conversion principle.

Because the direction of atom bombardment is not fixed in the magnetron sputtering process, the phenomenon of atom deposition exists at the edge of the target, and the diameter and/or height of the top edge of the target are increased.

The sealing ring and the ceramic ring are indispensable parts when vacuum in a sputtering chamber is kept in the magnetron sputtering process. CN 202830156U discloses a target backing plate, which reduces the part of a sealing ring entering a sealing groove and increases the part exposed outside the sealing groove by changing the structure of the sealing groove, so as to increase the distance between a ceramic ring and the target backing plate, so that the ceramic ring is not easily ionized, and the probability of forming a black mark on the surface of the target backing plate close to the ceramic ring in the sputtering process is reduced. However, when the magnetron sputtering is performed, the diameter and the height of the top edge of the target are increased, and the ceramic ring has the defect that the ceramic ring is not easy to take out.

CN 103602952A discloses vacuum sputtering equipment, vacuum sputtering equipment is through setting up the bolster that hardness is lower than the ceramic circle at the backplate edge, and the lower extreme of bolster is fixed to be set up on sputtering the chamber mounting panel, and the upper end setting is between ceramic circle upper surface and backplate lower surface, makes backplate lower surface contact bolster top surface earlier before wearing and tearing ceramic circle upper surface to ceramic circle has been protected, the leakproofness of equipment has been guaranteed. Although the equipment can solve the problem that the ceramic ring is easy to wear, the problem that the ceramic ring cannot be taken out due to the fact that the diameter of the top end of the target is increased and the height of the top end of the target is increased on the premise that the magnetron sputtering quality is guaranteed cannot be avoided.

Therefore, the target with the structure convenient to assemble and disassemble is provided, after the target with the structure convenient to assemble and disassemble is applied to magnetron sputtering, the problem that the ceramic ring cannot be taken out is solved, and the target has important significance for improving the magnetron sputtering efficiency.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a target with handling structure of being convenient for, the target with handling structure of being convenient for makes the assurance through changing the top structure under the prerequisite of the magnetron sputtering quality of the target that is convenient for connect the structure of unloading, can make the ceramic ring take out easily after magnetron sputtering.

In order to achieve the purpose of the utility model, the utility model adopts the following technical proposal:

the utility model provides a target with handling structure of being convenient for to the sputtering surface is the upper surface, the target with handling structure of being convenient for includes first cylinder target, round platform target and the second cylinder target that from the top down set gradually.

The top surface of the circular truncated cone target is connected with the bottom surface of the first cylindrical target, and the bottom surface of the circular truncated cone target is connected with the top surface of the second cylindrical target.

The setting of the utility model comprises the steps of combining a first cylindrical target material, a circular truncated cone target material and a second cylindrical target material by using a conventional welding method; or the cylindrical target is processed to form a cylinder, a circular truncated cone and a cylinder which are sequentially arranged from top to bottom. Preferably, the cylindrical target is machined to form a cylinder, a circular truncated cone and a cylindrical structure which are sequentially arranged from top to bottom, the consistency of microstructures in the target can be ensured by integrally machining the same target, and the magnetron sputtering quality is ensured.

The target material of the utility model comprises any one or the combination of at least two of metal target material, ceramic target material or alloy target material, preferably metal target material.

The metal target material comprises any one or combination of at least two of a nickel target material, a titanium target material, a zinc target material, a chromium target material, a magnesium target material, a niobium target material, a tin target material, an aluminum target material, an indium target material, an iron target material, a zirconium target material, a copper target material, a germanium target material, a silver target material, a cobalt target material, a gold target material, a lanthanum target material, an yttrium target material, a cerium target material, a molybdenum target material or a tungsten target material, and typical but non-limiting combinations include a combination of a titanium target material and a copper target material, a combination of a nickel target material and a copper target material, a combination of a copper target material and an aluminum target material, a combination of a gold target material and a molybdenum target material, a combination of an aluminum target material and a tungsten target material, a combination of a nickel target material, a titanium target material and a copper target material, a combination of a zinc target material, an indium target material and a molybdenum target material, A combination of a chromium target, a magnesium target, a niobium target, a tin target, an aluminum target, an indium target, an iron target, a zirconium target, a copper target, a germanium target, a silver target, a cobalt target, a gold target, a lanthanum target, an yttrium target, a cerium target, a molybdenum target, and a tungsten target.

In the magnetron sputtering process, in order to ensure that the ceramic ring of the sealing performance of the magnetron sputtering cavity is sintered and formed, the deformation amount in use is smaller, the deformation amount of the target in the magnetron sputtering process is larger, and once the diameter and the height of the edge of the sputtering surface of the target are increased, the situation that the ceramic ring cannot be detached easily occurs, so that the recycling of the ceramic ring is influenced, and the whole process flow of magnetron sputtering is influenced. The utility model discloses a set up the target into cylinder, round platform and cylinder structure from the top down, avoided the target when sputter face edge atomic deposition is too thick, the unable condition of dismantling of ceramic circle.

Preferably, the diameter of the first cylindrical target is 200mm and 300mm, such as 200mm, 210mm, 220mm, 230mm, 240mm, 250mm, 260mm, 270mm, 280mm, 290mm or 300mm, but is not limited to the values listed, and other values not listed in the range of the values are also applicable.

Preferably, the height of the first cylindrical target is 5-15mm, for example, 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, 11mm, 12mm, 13mm, 14mm or 15mm, but is not limited to the values listed, and other values not listed in the range of the values are also applicable.

Preferably, the diameter of the top surface of the circular table target is 200mm and 300mm, such as 200mm, 210mm, 220mm, 230mm, 240mm, 250mm, 260mm, 270mm, 280mm, 290mm or 300mm, but is not limited to the values listed, and other values not listed in the range of the values are also applicable.

Preferably, the diameter of the top surface of the circular truncated cone target is equal to the diameter of the first cylindrical target.

Preferably, the height of the circular table target is 5-10mm, for example, 5mm, 6mm, 7mm, 8mm, 9mm or 10mm, but is not limited to the values listed, and other values not listed in the range of the values are also applicable.

Preferably, the diameter of the bottom surface of the circular truncated cone target is 220mm and 330mm, and may be, for example, 220mm, 230mm, 240mm, 250mm, 260mm, 270mm, 280mm, 290mm, 300mm, 310mm, 320mm or 330mm, but is not limited to the values listed, and other values not listed in the range of the values are also applicable.

Preferably, the diameter of the second cylindrical target is 220-330mm, and may be, for example, 220mm, 230mm, 240mm, 250mm, 260mm, 270mm, 280mm, 290mm, 300mm, 310mm, 320mm or 330mm, but is not limited to the recited values, and other values not recited in the range of the values are also applicable.

Preferably, the diameter of the second cylindrical target is equal to the diameter of the bottom surface of the circular truncated cone target.

Preferably, the height of the second cylindrical target is 110mm and 240mm, and may be, for example, 110mm, 120mm, 130mm, 140mm, 150mm, 160mm, 170mm, 180mm, 190mm, 200mm, 210mm, 220mm, 230mm or 240mm, but is not limited to the enumerated values, and other non-enumerated values within the range are also applicable.

Preferably, the height ratio of the first cylindrical target, the circular truncated cone target and the second cylindrical target is (5-15): 5-10): 110-240, and may be, for example, 5:5:110, 7:6:120, 9:7:140, 11:8:160, 13:9:180 or 15:10: 240.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses a ripe prior art sets up the target into cylinder, round platform and cylinder structure from the top down, has avoided the magnetron sputtering in-process, and the problem that the too much sealing ring that causes of target sputter surface atomic deposition can't take out has guaranteed the smooth operation of magnetron sputtering production line.

Drawings

FIG. 1 is a schematic structural diagram of a magnetron sputtering apparatus in the prior art;

fig. 2 is a schematic structural view of the target material with a structure convenient for loading and unloading according to the present invention;

fig. 3 is a schematic structural diagram of a magnetron sputtering apparatus using the target material with a structure convenient for loading and unloading.

Wherein: 1, a back plate; 2, sealing a ring; 3, a ceramic ring; 4', a target material; 4-1, a first cylindrical target; 4-2, a circular truncated cone target; 4-3, a second cylindrical target material; a, the overall height of the target material; b, the height of the first cylindrical target material; and C, the height of the circular truncated cone target.

Detailed Description

The technical solution of the present invention will be further explained by the following embodiments. It should be understood by those skilled in the art that the described embodiments are merely provided to assist in understanding the present invention and should not be construed as specifically limiting the present invention.

A schematic structural diagram of a magnetron sputtering apparatus in the prior art is shown in fig. 1, a target is fixed on the lower surface of a back plate 1, a vacuum cover fixed on the lower surface of the back plate 1 and the back plate 1 form a magnetron sputtering chamber, and a target 4' is located in the magnetron sputtering chamber. In the magnetron sputtering process, the magnetron sputtering cavity is required to be kept in a vacuum state, in order to enhance the sealing effect at the interface of the back plate 1 and the vacuum cover, the magnetron sputtering cavity forms a real vacuum environment, the vacuum cover is connected with the back plate 1 through the ceramic ring 3, the sealing ring 2 is arranged between the ceramic ring 3 and the back plate 1, the sealing ring 2 is easy to compress and deform, the ceramic ring 3 is tightly attached to the sealing ring 2, so that the gas in the outside cannot enter the magnetron sputtering cavity, and the magnetron sputtering cavity is kept in the vacuum state.

In the magnetron sputtering process, under the atom bombardment of the sputtering surface of the target, unavoidable atom deposition occurs at the edge of the sputtering surface, so that the diameter and the height of the edge of the sputtering surface are increased, and the ceramic ring 3 cannot be removed.

In view of the above, the present invention provides a target material with a structure convenient for loading and unloading, the target material is preferably a metal target material, the sputtering surface is the upper surface, and the structural schematic diagram of the target material with the structure convenient for loading and unloading is shown in fig. 2, and includes a first cylindrical target material 4-1, a circular truncated cone target material 4-2 and a second cylindrical target material 4-3, which are sequentially arranged from top to bottom.

The diameter of the first cylindrical target 4-1 is 200-300mm, the diameter of the top surface of the circular truncated cone target 4-2 is 200-300mm, the diameter of the bottom surface of the circular truncated cone target 4-2 is 220-330mm, and the diameter of the second cylindrical target 4-3 is 220-330 mm; preferably, the diameter of the first cylindrical target 4-1 is the same as the diameter of the top surface of the circular truncated cone target 4-2, and the diameter of the bottom surface of the circular truncated cone target 4-2 is the same as the diameter of the second cylindrical target 4-3.

The height of the first cylindrical target 4-1 is 5-15mm, the height of the circular truncated cone target 4-2 is 5-10mm, and the height of the second cylindrical target 4-3 is 110-240 mm; preferably, the height ratio B of the first cylindrical target 4-1, the circular table target 4-2 and the second cylindrical target 4-3 is (A-B-C) is (5-15) to (5-10) to (110) and C is (C-B-C) based on the overall height of the target A, the height of the first cylindrical target 4-1 is B and the height of the circular table target 4-2 is C.

Example 1

The embodiment provides a copper target material with a structure convenient to assemble and disassemble, which is characterized in that a sputtering surface is taken as an upper surface, and a cylindrical copper target material is subjected to cutting treatment, so that the obtained copper target material with the structure convenient to assemble and disassemble comprises a first cylindrical copper target material 4-1, a circular truncated cone copper target material 4-2 and a second cylindrical copper target material 4-3 which are sequentially arranged from top to bottom.

The diameter of the first cylindrical copper target 4-1 is 250mm, and the height of the first cylindrical copper target is 10 mm; the diameter of the top surface of the circular truncated cone copper target 4-2 is 250mm, the diameter of the bottom surface of the circular truncated cone copper target 4-2 is 280mm, and the height of the circular truncated cone copper target 4-2 is 8 mm; the diameter of the second cylindrical copper target 4-3 is 280mm, and the height of the second cylindrical copper target 4-3 is 180 mm.

Example 2

The embodiment provides a titanium target material with a structure convenient to assemble and disassemble, which is characterized in that a sputtering surface is taken as an upper surface, and a cylindrical titanium target material is subjected to cutting treatment, so that the obtained titanium target material with the structure convenient to assemble and disassemble comprises a first cylindrical titanium target material 4-1, a circular truncated cone titanium target material 4-2 and a second cylindrical titanium target material 4-3 which are sequentially arranged from top to bottom.

The diameter of the first cylindrical titanium target 4-1 is 220mm, and the height is 7 mm; the diameter of the top surface of the circular truncated cone titanium target 4-2 is 220mm, the diameter of the bottom surface of the circular truncated cone titanium target 4-2 is 250mm, and the height of the circular truncated cone titanium target 4-2 is 6 mm; the diameter of the second cylindrical titanium target 4-3 is 250mm, and the height of the second cylindrical titanium target 4-3 is 150 mm.

Example 3

The embodiment provides a nickel target material with a structure convenient to assemble and disassemble, which is characterized in that a sputtering surface is taken as an upper surface, and a cylindrical nickel target material is subjected to cutting treatment, so that the obtained nickel target material with the structure convenient to assemble and disassemble comprises a first cylindrical nickel target material 4-1, a truncated cone nickel target material 4-2 and a second cylindrical nickel target material 4-3 which are sequentially arranged from top to bottom.

The diameter of the first cylindrical nickel target 4-1 is 200mm, and the height is 5 mm; the diameter of the top surface of the circular truncated cone nickel target 4-2 is 200mm, the diameter of the bottom surface of the circular truncated cone nickel target 4-2 is 220mm, and the height of the circular truncated cone nickel target 4-2 is 5 mm; the diameter of the second cylindrical nickel target 4-3 is 220mm, and the height of the second cylindrical nickel target 4-3 is 110 mm.

Example 4

The embodiment provides a cobalt target with a structure convenient to assemble and disassemble, which is characterized in that a sputtering surface is taken as an upper surface, and a cylindrical cobalt target is subjected to cutting treatment, so that the obtained cobalt target with the structure convenient to assemble and disassemble comprises a first cylindrical cobalt target 4-1, a circular truncated cone cobalt target 4-2 and a second cylindrical cobalt target 4-3 which are sequentially arranged from top to bottom.

The diameter of the first cylindrical cobalt target 4-1 is 270mm, and the height is 12 mm; the diameter of the top surface of the circular truncated cone cobalt target 4-2 is 270mm, the diameter of the bottom surface of the circular truncated cone cobalt target 4-2 is 300mm, and the height of the circular truncated cone cobalt target 4-2 is 9 mm; the diameter of the second cylindrical cobalt target 4-3 is 300mm, and the height of the second cylindrical cobalt target 4-3 is 210 mm.

Example 5

The embodiment provides a molybdenum target material with a structure convenient to assemble and disassemble, which is characterized in that a sputtering surface is taken as an upper surface, and a cylindrical molybdenum target material is subjected to cutting treatment, so that the obtained molybdenum target material with the structure convenient to assemble and disassemble comprises a first cylindrical molybdenum target material 4-1, a circular truncated cone molybdenum target material 4-2 and a second cylindrical molybdenum target material 4-3 which are sequentially arranged from top to bottom.

The diameter of the first cylindrical molybdenum target 4-1 is 300mm, and the height of the first cylindrical molybdenum target is 15 mm; the diameter of the top surface of the circular table molybdenum target 4-2 is 300mm, the diameter of the bottom surface of the circular table molybdenum target 4-2 is 330mm, and the height of the circular table molybdenum target 4-2 is 10 mm; the diameter of the second cylindrical molybdenum target 4-3 is 330mm, and the height of the second cylindrical molybdenum target 4-3 is 240 mm.

Use the utility model discloses the target with loading and unloading structure of being convenient for that embodiment 1-5 provided carries out magnetron sputtering, and magnetron sputtering device's structural schematic diagram is shown in fig. 3, and in the target with loading and unloading structure of being convenient for, the bottom surface and the backplate 1 of second cylinder target 4-2 are connected, and after magnetron sputtering, even there is more atomic deposition in the face of sputtering, still can convenient dismantlement for ceramic circle 3.

To sum up, the utility model discloses a ripe prior art sets up the target into cylinder, round platform and cylinder structure from the top down, has avoided the magnetron sputtering in-process, and the problem that the too much sealing ring that causes of target sputter surface atomic deposition can't be taken out has guaranteed the smooth operation of magnetron sputtering production line.

The applicant states that the above description is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and those skilled in the art should understand that any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present invention are within the protection scope and the disclosure scope of the present invention.

Claims

1. A target with a structure convenient to assemble and disassemble is characterized in that a sputtering surface is taken as an upper surface, and the target with the structure convenient to assemble and disassemble comprises a first cylindrical target, a circular truncated cone target and a second cylindrical target which are sequentially arranged from top to bottom;

2. The target with a handling structure as claimed in claim 1, wherein the diameter of the first cylindrical target is 200-300 mm.

3. A target having a handling facilitating structure according to claim 1, wherein the first cylindrical target has a height of 5-15 mm.

4. The target with the structure convenient to assemble and disassemble as claimed in claim 1, wherein the diameter of the top surface of the circular truncated cone target is 200-300 mm.

5. A target having a load and unload facilitating structure as in claim 4, wherein the diameter of the top surface of the circular truncated cone target is equal to the diameter of the first cylindrical target.

6. A target having a structure facilitating handling as claimed in claim 3, wherein the height of the circular truncated cone target is 5-10 mm.

7. The target with the structure convenient to assemble and disassemble as claimed in claim 1, wherein the diameter of the bottom surface of the circular truncated cone target is 220-330 mm.

8. The target with the structure for facilitating handling of claim 7, wherein the diameter of the second cylindrical target is 220-330 mm.

9. A target having a mounting/demounting facilitating structure as claimed in claim 8, wherein the diameter of the second cylindrical target is equal to the diameter of the bottom surface of the circular truncated cone target.

10. The target with a handling structure as claimed in claim 6, wherein the height of the second cylindrical target is 110-240 mm.

11. The target with the structure convenient to assemble and disassemble as claimed in claim 10, wherein the height ratio of the first cylindrical target, the circular table target and the second cylindrical target is (5-15): (5-10): (110) -.