CN210809283U

CN210809283U - Heating tube and electronic device for non-combustion cigarette

Info

Publication number: CN210809283U
Application number: CN201921222162.4U
Authority: CN
Inventors: 郭洪礼
Original assignee: Shenzhen Yukan Intelligent Technology Co ltd
Current assignee: Shenzhen Yukan Intelligent Technology Co ltd
Priority date: 2019-07-29
Filing date: 2019-07-29
Publication date: 2020-06-23
Anticipated expiration: 2029-07-29

Abstract

The application discloses heating pipe and electronic device of non-burning cigarette. The heating pipe includes: a metal body and a semiconductor insulating layer; the metal pipe body is used for accommodating a to-be-heated body; the semiconductor insulating layer is arranged on the outer surface of the metal tube body and used for isolating the metal tube body from the outside. This application is through setting up semiconductor insulation layer at the surface of metal pipe body to make the surface and the external insulation of metal pipe body.

Description

Heating tube and electronic device for non-combustion cigarette

Technical Field

The present disclosure relates to electronic devices, and particularly to a heating pipe and an electronic device with a non-combustion cigarette.

Background

Generally, after the cigarette is ignited, tobacco in the cigarette is burnt and carbonized to generate a large amount of tar and various harmful substances, which cause serious damage to human bodies. In recent years, non-combustible cigarettes have been subjected to non-combustible heat treatment, and thus have been characterized by non-combustion and low harm. However, in the existing non-burning cigarette electronic device, the heat conduction effect of the heating pipe is not ideal, the cigarette in the heat conduction pipe has the conditions of uneven heating or excessive heating, and the actual experience of the user is poor.

SUMMERY OF THE UTILITY MODEL

An object of the application is to provide an electron device of heating pipe and non-burning cigarette to solve the relatively poor problem of current heating pipe heat conduction.

In order to solve the technical problem, the application provides a heating pipe. The heating pipe includes: a metal body and a semiconductor insulating layer; the metal pipe body is used for accommodating a to-be-heated body; the semiconductor insulating layer is arranged on the outer surface of the metal tube body and used for isolating the metal tube body from the outside.

In one embodiment, the semiconductor insulating layer comprises a semiconductor material and a heat conducting glue; the semiconductor material is doped in the heat-conducting glue and coated on the outer surface of the metal pipe body to form the semiconductor insulating layer.

In one embodiment, the semiconductor material includes a silicon material or a germanium material.

In one embodiment, the semiconductor insulating layer includes an adhesion material layer and a semiconductor material layer; the adhesion material layer is located between the semiconductor material layer and the metal pipe body and is used for bonding the semiconductor material layer and the metal pipe body.

In one embodiment, the semiconductor material layer includes a silicon material or a germanium material, and the adhesion material layer includes a thermal conductive paste or a thermal conductive sheet.

In one embodiment, the heating tube further includes a heating sheet, and the heating sheet is disposed on a side of the semiconductor insulating layer away from the metal tube body.

In one embodiment, the semiconductor insulating layer completely covers the outer surface of the metal tube.

In one embodiment, the semiconductor insulating layer is disposed to have a pattern corresponding to a projection range of the heating sheet on the outer surface of the metal tube.

The application also provides an electronic device of non-burning cigarette. The non-smoke-burning electronic device comprises a battery and the heating pipe; the battery is electrically connected with the heating pipe and is used for supplying power to the heating pipe.

In one embodiment, the non-smoke-fired electronic device further comprises a processing unit, and the processing unit is electrically connected with the battery and the heating pipe respectively; wherein the processing unit is powered by the battery and is configured to control the heating tube.

This application is through setting up semiconductor insulation layer at the surface of metal pipe body to make the surface and the external insulation of metal pipe body. And then utilize the good heat conductivility of metal body and semiconductor insulation layer for the produced heat of heating plate can evenly pass through semiconductor insulation layer and conduct the region that the metal body corresponds, and treats the heating member and heat, and power loss when having reduced the heating has reduced the equipment volume to a certain extent.

Drawings

Fig. 1 is a schematic view of a heating tube according to an embodiment of the present application.

Fig. 2 is a schematic view of a heating tube according to an embodiment of the present application.

FIG. 3 is a schematic view of a heating tube according to an embodiment of the present application.

FIG. 4 is a schematic view of a non-smoke-fired electronic device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

As shown in fig. 1, the embodiment of the present application provides a heating tube 11, wherein the outer surface of the heating tube 11 is provided with a semi-conductive insulating layer 120, and the heating tube 11 and the exterior of the heating tube 11 are isolated by the semi-conductive insulating layer 120, so that the heating tube 11 is insulated from the exterior. Furthermore, the heating sheet 130 disposed on the semiconductor insulating layer 120 can uniformly conduct heat into the heating tube 11 through the semiconductor insulating layer 120, so that the heating tube 11 has a good heat conducting effect, power loss during heating is reduced, and the volume of the device is reduced to a certain extent.

In one embodiment, the heating tube 11 comprises: a metal body 110 and a semiconductor insulating layer 120. The metal tube 110 may be made of copper alloy or aluminum alloy, which has a certain heat conductivity. The metal tube 110 may be a hollow cylindrical tube or a hollow prismatic tube, and the shape of the metal tube 110 is not limited in this application.

The metal tube body 110 has opposite inner and outer surfaces, and the inner surface of the metal tube body 110 forms an inner space for accommodating a body to be heated (not shown). The semiconductor insulating layer 120 is disposed on one side of the outer surface of the metal body 110, and the metal body 110 is isolated from the outside of the metal body 110 by the semiconductor insulating layer 120.

As shown in fig. 1, in an embodiment, the semiconductor insulating layer 120 may have a single-layer structure, and the semiconductor insulating layer 120 includes a semiconductor material and a thermal conductive adhesive. And the semiconductor material is doped in the heat-conducting glue to form mixed semiconductor glue. The semiconductor paste may be applied to the outer surface of the metal pipe body 110, thereby forming the semiconductor insulating layer 120.

Specifically, the semiconductor material may include silicon, germanium, or the like as a semiconductor material. Specifically, the silicon material may be powdered silicon or a silicon-based material, and the germanium material may be powdered germanium or a germanium-based material. The heat-conducting gel may include a heat-conducting silica gel, a heat-conducting silicone rubber or a heat-conducting silica gel.

Taking powdered silicon as an example, the powdered silicon and the heat conductive paste are mixed in advance to form the semiconductor paste, and then the semiconductor paste is coated on the outer surface of the metal tube 110 and cured to form the silicon semiconductor insulating layer 120.

As shown in fig. 2, in one embodiment, the semiconductor insulating layer 120 may have a double-layer structure; the semiconductor insulating layer 120 includes an adhesion material layer 121 and a semiconductor material layer 122. Wherein the adhesion material layer 121 is located between the semiconductor material layer 122 and the metal pipe body 110, and is used for bonding the semiconductor material layer 122 and the metal pipe body 110.

The semiconductor material layer 122 includes silicon or germanium, etc. as a semiconductor material. Specifically, the silicon material may be powdered silicon or a silicon-based material, and the germanium material may be powdered germanium or a germanium-based material. The adhesive material layer 121 includes a heat conductive adhesive or a heat conductive sheet. The semiconductor material layer 122 is adhered to the outer surface of the metal tube 110 by the heat conducting glue or the heat conducting sheet, so that the formed heating tube 11 has a good heat conducting effect.

In an implementation scenario, for example, powdered silicon in the silicon material is coated on the outer surface of the metal tube 110 in advance, and then the powdered silicon is coated on the outer surface of the metal tube 110, so as to form the (silicon) semiconductor insulating layer 120 with a double-layer structure by using the bonding effect of the semiconductor adhesive.

In another implementation scenario, the heat conducting sheet is pre-attached to the outer surface of the metal tube 110, and then the powdered silicon is coated on the heat conducting sheet to form the (silicon) insulating semiconductor layer 120 with a double-layer structure.

It should be understood that the semiconductor insulating layer 120 may be doped with other auxiliary materials according to the usage requirement. For example: doping powdery germanium into the powdery silicon; or doping auxiliary bonding materials in the heat-conducting glue; alternatively, a material for assisting heat conduction is doped in the semiconductor insulating layer 120.

As shown in fig. 1 to 3, in an embodiment, the heating tube 11 further includes a heating sheet 130, and the heating sheet 130 is disposed on a side of the semiconductor insulating layer 120 away from the metal tube body 110; that is, the semiconductor insulating layer 120 is interposed between the heating sheet 130 and the metal tube body 110. Specifically, the heating sheet 130 may be a multi-segment heating wire (not shown), and the number of segments of the heating wire may be two, three, or more than three. The plurality of segments of heating wires may be respectively energized to generate heat, and the heat generated by the plurality of segments of heating wires is conducted to a corresponding region of the metal tube 110 through the semiconductor insulating layer 120, so as to heat the to-be-heated body in the metal tube 110.

As shown in fig. 1 and 2, in one embodiment, the semiconductor insulating layer 120 completely covers the outer surface of the metal body 110, so as to form a uniform semiconductor insulating layer 120 on the outer surface of the metal body 110. Based on the structure of the semiconductor insulating layer 120, the heating sheet 130 can be conveniently arranged on the semiconductor insulating layer 120 in the following process, so as to improve the installation efficiency of the heating tube 11.

In another embodiment, as shown in fig. 3, the semiconductor insulating layer 120 is disposed in a pattern corresponding to a projection range of the heat patch 130 on the outer surface of the metal tube 110. Specifically, the semiconductor insulating layer 120 may cover only a portion of the metal body 110 and expose another portion of the metal body 110. Further, the heating sheet 130 is provided on the semiconductor insulating layer 120. This reduces the material costs of the heating tube 11 and reduces the weight of the heating tube 11.

It should be understood that the semiconductor paste may also be coated on the heating sheet 130, and the semiconductor insulating layer 120 is formed on one side of the heating sheet 130. Further, the heating sheet 130 is disposed on the metal tube body 110, and the semiconductor insulating layer 120 is interposed between the heating sheet 130 and the metal tube body 110. The semiconductor insulating layer 120 thereby covers only a portion of the metal body 110 and exposes another portion of the metal body 110.

Referring to fig. 1 to 4, an embodiment of the present application further provides a non-smoke-burning electronic device 10, where the non-smoke-burning electronic device 10 includes: a battery 12, a processing unit 13, and a heating tube 11 as described in the embodiments. The battery 12 is electrically connected to the processing unit 13. Wherein the battery 12 is used for supplying power to the processing unit 13 and the heating sheet 130 in the heating pipe 11, so as to operate the processing unit 13 and the heating sheet 130. The processing unit 13 is electrically connected to the heating pipe 11 and is used for controlling the heating pipe 11.

In particular, the processing unit 13 is configured to control the heating power of the heating wires in the heating sheet 130. Wherein, the heating temperature of the heating wire can be 200 ℃ to 400 ℃, for example: the heating temperature of the heating wire is 250 ℃, 320 ℃ or 380 ℃. The processing unit 13 is also used for controlling the number of heating segments of the heating wires in the heating sheet 130.

In one embodiment, the non-smoke-fired electronic device 10 further comprises an insulating tube (not shown), and the heating tube 11 and the heating sheet 130 are accommodated in the insulating tube. The heat insulation pipe isolates the heat dissipation amount of the heating sheet 130 from the outside of the heat insulation pipe, so as to improve the heating efficiency of the heating sheet 130, reduce the energy consumption of the electronic device 10 which does not burn smoke, and prevent potential safety hazards which may be caused by the heat overflow of the heating pipe 11.

While the foregoing is directed to embodiments of the present application, it will be appreciated by those skilled in the art that various changes and modifications may be made without departing from the principles of the application, and it is intended that such changes and modifications be covered by the scope of the application.

Claims

1. A heating tube, characterized in that the heating tube comprises: a metal body and a semiconductor insulating layer;

the metal pipe body is used for accommodating a to-be-heated body; the semiconductor insulating layer is arranged on the outer surface of the metal tube body and used for isolating the metal tube body from the outside.

2. The heating tube of claim 1, wherein the semiconducting insulating layer comprises a semiconducting material and a thermally conductive glue; the semiconductor material is doped in the heat-conducting glue and coated on the outer surface of the metal pipe body to form the semiconductor insulating layer.

3. The heating tube of claim 2, wherein the semiconductor material comprises a silicon material or a germanium material.

4. The heating tube of claim 1, wherein the semiconducting insulation layer comprises a layer of adhesive material and a layer of semiconducting material; the adhesion material layer is located between the semiconductor material layer and the metal pipe body and is used for bonding the semiconductor material layer and the metal pipe body.

5. The heating tube of claim 4, wherein the semiconductor material layer comprises a silicon material or a germanium material, and the adhesion material layer comprises a thermally conductive glue or a thermally conductive sheet.

6. The heating tube of claim 1, further comprising a heater chip disposed on a side of the semiconducting insulation layer remote from the metallic tube body.

7. The heating tube of claim 6, wherein the semi-conductive insulation layer completely covers the outer surface of the metallic tube body.

8. The heating pipe of claim 6, wherein the semiconducting insulation layer is arranged in a pattern corresponding to a projected extent of the heating sheet on the outer surface of the metallic pipe body.

9. A non-smoke-fired electronic device comprising a battery, and the heating tube of any one of claims 1 to 8; the battery is electrically connected with the heating pipe and is used for supplying power to the heating pipe.

10. The non-smoke fired electronic device of claim 9 further comprising a processing unit electrically connected to the battery and the heater tube, respectively; wherein the processing unit is powered by the battery and is configured to control the heating tube.