CN213991058U - Inorganic carbon film ceramic heating substrate - Google Patents
Inorganic carbon film ceramic heating substrate Download PDFInfo
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- CN213991058U CN213991058U CN202023263216.7U CN202023263216U CN213991058U CN 213991058 U CN213991058 U CN 213991058U CN 202023263216 U CN202023263216 U CN 202023263216U CN 213991058 U CN213991058 U CN 213991058U
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Abstract
The utility model discloses an inorganic carbon film ceramic heating substrate, which comprises a ceramic plate, a heating body and a mica layer; the heating element is superposed and fixed on the back of the ceramic chip and comprises an inorganic carbon film layer and a conductive electrode layer superposed on the surface of the inorganic carbon film layer, and the conductive electrode layer is jointed with the back of the ceramic chip; the mica layer is attached and fixed on the back of the inorganic carbon film layer. This product is by potsherd, heat-generating body and mica layer to the heat-generating body comprises inorganic carbon rete and conducting electrode layer, makes this product simple structure, and it is more even to generate heat, utilizes the mica layer can play fine insulating and thermal-insulated effect, satisfies the needs that use.
Description
Technical Field
The utility model relates to a base plate field technique that generates heat especially indicates an inorganic carbon membrane pottery base plate that generates heat.
Background
The heating substrate is a sheet-shaped electrical element which specially converts electric energy into heat energy, and is widely used in various heating occasions due to low price, convenient use, convenient installation and no pollution, and manufacturers and brands for producing the electrical heating elements are also numerous. The service life of the heating substrate is very long, the service life of the heating substrate is generally designed to be more than 5000 hours, and the service life of some far infrared radiation heating elements can be 5 heating seasons.
The existing heating substrate has a complex structure, is uneven in heating, is not ideal in heat insulation effect, and cannot meet the use requirement. Therefore, there is a need for an improvement in the current heat generating substrate.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention is directed to the defects in the prior art, and the main objective of the present invention is to provide an inorganic carbon film ceramic heating substrate, which can effectively solve the problems of complex structure, non-uniform heating and non-ideal heat insulation effect of the existing heating substrate.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
an inorganic carbon film ceramic heating substrate comprises a ceramic wafer, a heating body and a mica layer; the heating element is superposed and fixed on the back of the ceramic chip and comprises an inorganic carbon film layer and a conductive electrode layer superposed on the surface of the inorganic carbon film layer, and the conductive electrode layer is jointed with the back of the ceramic chip; the mica layer is attached and fixed on the back of the inorganic carbon film layer.
An inorganic carbon film ceramic heating substrate comprises a ceramic wafer, a heating element silica gel waterproof layer and a mica layer; the heating element is superposed and fixed on the back of the ceramic chip and comprises an inorganic carbon film layer and a conductive electrode layer superposed on the surface of the inorganic carbon film layer, and the conductive electrode layer is jointed with the back of the ceramic chip; the silica gel waterproof layer is fixed on the back of the inorganic carbon film layer in a superposition manner; the mica layer is adhered and fixed on the back of the silica gel waterproof layer.
As a preferred scheme, the front center of the ceramic plate is provided with a mounting hole, and the mounting hole penetrates through to the back of the mica layer.
As a preferred scheme, the conductive electrode layer is connected with two lead terminals, and the two lead terminals are exposed out of the back surface of the mica layer and are respectively connected with a lead.
Preferably, the lead terminals are respectively located at two corners of the back surface of the mica layer.
Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme:
this product is by potsherd, heat-generating body and mica layer to the heat-generating body comprises inorganic carbon rete and conducting electrode layer, makes this product simple structure, and it is more even to generate heat, utilizes the mica layer can play fine insulating and thermal-insulated effect, satisfies the needs that use.
To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a schematic rear view of a first preferred embodiment of the present invention;
FIG. 2 is a cross-sectional view of a first preferred embodiment of the present invention;
fig. 3 is a cross-sectional view of a second preferred embodiment of the present invention.
The attached drawings indicate the following:
10. ceramic plate 11 and mounting hole
20. Heating element 21 and inorganic carbon film layer
22. Conductive electrode layer 30, mica layer
41. Lead wire end 42, lead wire
50. And a silica gel waterproof layer.
Detailed Description
Referring to fig. 1 and 2, a specific structure of a first preferred embodiment of the present invention is shown, including a ceramic sheet 10, a heating element 20 and a mica layer 30.
The heating element 20 is superposed and fixed on the back of the ceramic plate 10, the heating element 20 comprises an inorganic carbon film layer 21 and a conductive electrode layer 22 superposed on the surface of the inorganic carbon film layer 21, and the conductive electrode layer 22 is jointed with the back of the ceramic plate 10; the mica layer 30 is attached and fixed on the back of the inorganic carbon film layer 21, and the mica layer 30 is used for insulating and heat-insulating.
In this embodiment, a mounting hole 11 is formed in the center of the front surface of the ceramic sheet 10, the mounting hole 11 penetrates through the back surface of the mica layer 30, the mounting hole 11 can be used for mounting and fixing the product on one hand, and can play a role in ventilation on the other hand, and the mounting hole 11 is a circular hole; moreover, the conductive electrode layer 22 is connected to two lead terminals 41, the two lead terminals 41 are exposed on the back of the mica layer 30 and are respectively connected to a lead 42, and the lead terminals 41 are respectively located at two corners of the back of the mica layer 30, so as to facilitate connection of an external circuit.
Detailed description the working principle of the present embodiment is as follows:
when the ceramic sheet is used, the lead 42 is connected with an external circuit, and after the power supply is switched on, the conductive electrode layer 22 is electrified and generates heat, the heat is transmitted to the front side through the ceramic sheet 10, and the mica layer 30 can play a role in isolating the heat and can not be transmitted to the back side.
Referring to fig. 3, a specific structure of a second preferred embodiment of the present invention is shown, the specific structure of this embodiment is basically the same as that of the first preferred embodiment, except that:
in this embodiment, a silica gel waterproof layer 50 is further included, and the silica gel waterproof layer 50 is fixed on the back surface of the inorganic carbon film layer 21 in an overlapping manner; the mica layer 30 is attached and fixed on the back of the silica gel waterproof layer 50, and the silica gel waterproof layer 50 can be used for playing a waterproof role and preventing moisture from being transferred to the back from the front of the product.
The operation principle of this embodiment is the same as that of the first preferred embodiment, and the operation principle of this embodiment will not be described in detail herein.
The utility model discloses a design focus lies in: this product is by potsherd, heat-generating body and mica layer to the heat-generating body comprises inorganic carbon rete and conducting electrode layer, makes this product simple structure, and it is more even to generate heat, utilizes the mica layer can play fine insulating and thermal-insulated effect, satisfies the needs that use.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.
Claims (5)
1. An inorganic carbon film ceramic heating substrate is characterized in that: comprises a ceramic plate, a heating body and a mica layer; the heating element is superposed and fixed on the back of the ceramic chip and comprises an inorganic carbon film layer and a conductive electrode layer superposed on the surface of the inorganic carbon film layer, and the conductive electrode layer is jointed with the back of the ceramic chip; the mica layer is attached and fixed on the back of the inorganic carbon film layer.
2. An inorganic carbon film ceramic heating substrate is characterized in that: comprises a ceramic plate, a heating body silica gel waterproof layer and a mica layer; the heating element is superposed and fixed on the back of the ceramic chip and comprises an inorganic carbon film layer and a conductive electrode layer superposed on the surface of the inorganic carbon film layer, and the conductive electrode layer is jointed with the back of the ceramic chip; the silica gel waterproof layer is fixed on the back of the inorganic carbon film layer in a superposition manner; the mica layer is adhered and fixed on the back of the silica gel waterproof layer.
3. The inorganic carbon film ceramic heat generating substrate according to claim 1 or 2, wherein: the front center of the ceramic wafer is provided with a mounting hole, and the mounting hole penetrates through the back of the mica layer.
4. The inorganic carbon film ceramic heat generating substrate according to claim 1 or 2, wherein: the conductive electrode layer is connected with two lead ends, and the two lead ends are exposed out of the back of the mica layer and are respectively connected with a lead.
5. The inorganic carbon film ceramic heat generating substrate according to claim 4, wherein: the lead ends are respectively positioned at two corners of the back surface of the mica layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202023263216.7U CN213991058U (en) | 2020-12-30 | 2020-12-30 | Inorganic carbon film ceramic heating substrate |
Applications Claiming Priority (1)
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CN202023263216.7U CN213991058U (en) | 2020-12-30 | 2020-12-30 | Inorganic carbon film ceramic heating substrate |
Publications (1)
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CN213991058U true CN213991058U (en) | 2021-08-17 |
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CN202023263216.7U Active CN213991058U (en) | 2020-12-30 | 2020-12-30 | Inorganic carbon film ceramic heating substrate |
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2020
- 2020-12-30 CN CN202023263216.7U patent/CN213991058U/en active Active
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