CN210802765U - Heat balanced high temperature pressure transmitter - Google Patents
Heat balanced high temperature pressure transmitter Download PDFInfo
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- CN210802765U CN210802765U CN201921670434.7U CN201921670434U CN210802765U CN 210802765 U CN210802765 U CN 210802765U CN 201921670434 U CN201921670434 U CN 201921670434U CN 210802765 U CN210802765 U CN 210802765U
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- pressure guiding
- heat
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Abstract
The utility model discloses a high-temperature pressure transmitter with balanced heat, which comprises a nickel-plated copper shell, wherein the lower end of the nickel-plated copper shell is provided with a metal pressure guiding nozzle for guiding flow, the upper end of a flow guide channel of the metal pressure guiding nozzle is embedded with a metal mounting post, a heat insulation ceramic seat is arranged between the metal mounting post and the metal pressure guiding nozzle, the upper end of the metal mounting post is provided with a high-temperature resistant core, the upper end of the high-temperature resistant core is provided with a ceramic circuit board, a modified PP support is arranged between the high-temperature resistant core and the ceramic circuit board, the utility model adopts the ceramic heat insulation technology, the PP material support, the copper shell with strong heat conductivity and other technologies to reasonably set the heat insulation and the heat dissipation in the transmitter, so that the heat inside the transmitter is balanced, the normal work of the transmitter and a CMOS circuit thereof is effectively ensured, and the design in the applicable aspect of the temperature, simple and compact structure and easy manufacture.
Description
Technical Field
The utility model relates to a pressure sensing technical field especially relates to a balanced high temperature pressure transmitter of heat.
Background
The high-temperature pressure sensor in the military field of China has huge market demand and has wide application prospect in military equipment such as aerospace, rockets, missiles, airplanes, tanks, ships, war chariot and the like. At present, although the scale of a sensor field in China exceeds 7000 million yuan, most high-precision sensor products are assembled by using foreign core elements, so that the number of the sensor products with completely independent intellectual property rights in China is too small, and the difference between the whole level of the sensor industry and the foreign advanced level is large. In the high-temperature pressure transmitter in the prior art, a lot of improvements on heat dissipation result in complex structure and high manufacturing cost.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problems of complex heat dissipation structure and high manufacturing cost of the high-temperature pressure transmitter in China, and providing the high-temperature pressure transmitter with balanced heat.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a high-temperature pressure transmitter with balanced heat comprises a nickel-plated copper shell, a metal pressure guiding nozzle for guiding flow is arranged at the lower end of the nickel-plated copper shell, the upper end of the drainage channel of the metal pressure guiding nozzle is embedded with a metal mounting column, the inner wall of the drainage channel of the metal pressure guiding nozzle is provided with a step surface, the lower surface of the metal mounting column is matched with the step surface of the drainage channel of the metal pressure guiding nozzle, a high-temperature sealing ring is arranged between the lower surface of the metal mounting column and the step surface of the drainage channel of the metal pressure guiding nozzle, a T-shaped heat insulation ceramic seat is arranged between the outer wall of the lower end of the metal mounting column and the inner wall of the metal pressure guiding nozzle, the outer wall of the upper end of the metal mounting column is fixedly connected with the inner wall of the upper end of the metal pressure guiding nozzle, the upper surface of the metal mounting column is higher than the upper surface of the metal pressure guiding nozzle, and the top of the metal mounting column is provided with a pressure transmitting main body part.
Furthermore, the upper end of the metal mounting column is provided with a high-temperature-resistant core body, the upper end of the high-temperature-resistant core body is provided with a ceramic circuit board, and a modified PP support is arranged between the high-temperature-resistant core body and the ceramic circuit board.
Further, the thermal conductivity coefficient of the heat-insulating ceramic seat is 7.6W/MK.
Further, the thermal conductivity coefficient of the modified PP scaffold is 0.24W/MK.
Further, the thermal conductivity coefficient of the nickel-plated copper shell is 400W/MK.
Furthermore, the upper end of the metal pressure guiding nozzle extends into the nickel-plated copper shell, a protruding ring body is arranged on the inner wall of the nickel-plated copper shell, a groove for accommodating the protruding ring body is formed in the outer wall of the upper end of the metal pressure guiding nozzle, and the metal pressure guiding nozzle is connected with the nickel-plated copper shell in a clamped mode.
Furthermore, the lower end of the metal pressure guiding nozzle exposed outside the nickel-plated copper shell is provided with an external thread.
The utility model has the advantages that: in the utility model, a heat insulation ceramic seat is added between the metal pressure leading nozzle and the metal mounting column, the heat insulation ceramic seat is high temperature resistant and can block heat from being conducted to the high temperature resistant core body, the modified PP bracket supports the ceramic circuit board, and the heat on the elastomer is extremely rarely conducted to the transmission ceramic circuit board; the copper shell of nickel plating, its coefficient of heat conductivity is high, has extremely strong heat-sinking capability, in time conducts the air with the heat of gathering around high temperature resistant core and ceramic circuit board, the utility model provides a structure can carry out reasonable setting to thermal-insulated and heat dissipation in the changer for the inside heat of changer is balanced, effectively guarantees changer and CMOS circuit and normally works, need not to carry out too much temperature environment to this circuit and is suitable for the design in the aspect, simple structure is compact, easily manufacturing.
Drawings
Fig. 1 is a schematic structural diagram of the heat balanced high-temperature pressure transmitter according to the present invention.
In the figure: 1. a nickel-plated copper housing; 2. modifying a PP scaffold; 3. an outgoing line; 4. locking the connector; 5. A ceramic circuit board; 6. a high temperature resistant core; 7. a metal mounting post; 8. a thermally insulating ceramic mount; 9. a metal pressure-leading nozzle; 10. a high-temperature sealing ring; 11. an elastomer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1, the high-temperature pressure transmitter with balanced heat comprises a nickel-plated copper shell 1, wherein a metal pressure guiding nozzle 9 for guiding flow is arranged at the lower end of the nickel-plated copper shell 1, the upper end of the metal pressure guiding nozzle 9 extends into the nickel-plated copper shell 1, a protruding ring body is arranged on the inner wall of the nickel-plated copper shell 1, a groove for accommodating the protruding ring body is arranged on the outer wall of the upper end of the metal pressure guiding nozzle 9, and the metal pressure guiding nozzle 9 is clamped with the nickel-plated copper shell 1; the lower end of the metal pressure leading nozzle 9 exposed outside the nickel-plated copper shell 1 is provided with an external thread for connecting a carrier of the high-temperature liquid to be detected.
Further, the inside of metal pressure guiding nozzle 9 sets up the drainage channel of high-temperature liquid, metal erection column 7 is inlayed to the drainage channel upper end of metal pressure guiding nozzle 9, and the drainage channel inner wall of metal pressure guiding nozzle 9 sets up the step face, the lower surface of metal erection column 7 cooperatees with the step face of metal pressure guiding nozzle 9 drainage channel, set up high temperature seal ring 10 between the lower surface of metal erection column 7 and the step face of metal pressure guiding nozzle 9 drainage channel, prevent that high temperature material from getting into the joint gap between metal erection column 7 and the metal pressure guiding nozzle 9.
Furthermore, a T-shaped heat insulation ceramic seat 8 is arranged between the outer wall of the lower end of the metal mounting column 7 and the inner wall of the metal pressure guiding nozzle 9, the main component of the heat insulation ceramic seat 8 is silicon dioxide, the heat conductivity coefficient of the silicon dioxide is 7.6W/MK, the high temperature resistance is realized, the heat transfer from the metal pressure guiding nozzle 9 to the metal mounting column 7 can be reduced, the heat transfer to the high temperature resistant core body 6 is blocked, and the sensitivity and the stability of the elastomer 11 at the upper end of the high temperature resistant core body 6 are kept.
Further, the outer wall of the upper end of metal erection column 7 and the upper end inner wall fixed connection of metal induced pressure mouth 9, the upper surface of metal erection column 7 is higher than the upper surface of metal induced pressure mouth 9, the top of metal erection column 7 sets up pressure transmission main part, pressure transmission main part includes high temperature resistant core 6, the inside of high temperature resistant core 6 sets up the liquid chamber, the upper end of liquid chamber sets up elastomer 11, and elastomer 11 is used for feeling the pressure of high-temperature liquid, the liquid chamber passes through the drainage hole in the middle of the metal erection column 7 and the drainage channel intercommunication of metal induced pressure mouth 9, and the metal induced pressure mouth 9 that the high temperature substance that awaits measuring passes through gets into extrusion elastomer 11 in the liquid chamber of high temperature resistant core 6.
Further, ceramic circuit board 5 is arranged at the upper end of high temperature resistant core body 6, elastomer 11 and ceramic circuit board 5 electric connection set up conditioning element combination on ceramic circuit board 5, conditioning element combination is the common component combination that pressure sensor pressure signal was conditioned into standard signal among the prior art, ceramic circuit board 5's output is even lead-out wire 3, and this sensor output signal of telecommunication is transmitted away to lead-out wire 3.
The modified PP support 2 is arranged between the high-temperature resistant core body 6 and the ceramic circuit board 5, the modified PP support 2 is used for supporting the ceramic circuit board 5, the modified PP support 2 is made of polypropylene, and the heat conductivity coefficient of the polypropylene is 0.24W/MK, so that heat on the elastic body 11 is transmitted to the ceramic circuit board 5 to a very small extent.
The top of the nickel-plated copper shell 1 is provided with a locking connector 4, and the leading-out wire 3 extends out of a jack of the locking connector 4.
Furthermore, the heat conductivity coefficient of the shell of the nickel-plated copper shell 1 is 400W/MK, so that the heat dissipation capacity is extremely high, the top surface of the metal mounting column 7 is higher than that of the metal pressure guiding nozzle 9, the high-temperature resistant core body 6 is fixedly arranged on the top surface of the metal mounting column 7, and the heat gathered around the high-temperature resistant core body 6 and the ceramic circuit board 5 is timely conducted to the air by the nickel-plated copper shell 1 to be effectively dissipated.
It is worth to be noted that the cross section diameters of the nickel-plated copper shell 1 and the metal pressure guiding nozzle 9 are both smaller than phi 20mm, and the integral length formed by the nickel-plated copper shell 1 and the metal pressure guiding nozzle 9 is smaller than 40mm, and the volume is small. Because the ceramic heat insulation technology, the PP material bracket, the copper shell with strong heat conductivity and the like are adopted, the working temperature range of the CMOS signal processing circuit is controlled between minus 20 ℃ and 80 ℃, and the design of the circuit in the aspect of high and low environment application is not needed, so that the whole high-temperature pressure transmitter has small volume, simple and compact structure and easy manufacture.
The use method and the principle are as follows: the metal pressure guiding nozzle 9 is screwed on a carrier of high-temperature liquid to be detected, the high-temperature liquid enters a liquid cavity of the high-temperature resistant core body 6 through a drainage hole in the middle of the metal pressure guiding nozzle 9 and the metal mounting column 7 under high pressure and extrudes the elastic body 11, a conditioning circuit on the ceramic circuit board 5 conditions an electric signal generated by deformation of the elastic body 11 into a standard signal and transmits the signal out through the outgoing line 3, so that the pressure transmitting function is realized, in the process, the heat insulation ceramic seat 8 is high-temperature resistant and can prevent heat from being transmitted to the high-temperature resistant core body 6, the modified PP support 2 supports the ceramic circuit board 5, and the heat on the elastic body 11 is transmitted to the ceramic circuit board 5 very little; through this kind of design, although the medium temperature reaches 225 ℃ or 250 ℃, but the temperature of high temperature resistant core 6 can not exceed 120 ℃, ceramic circuit board 5 and the temperature of device can not exceed 80 ℃, this can effectively guarantee transmitter and its CMOS circuit normal work, whole transmitter upper portion shell adopts nickel-plated copper shell 1, its coefficient of heat conductivity is 400W MK, has extremely strong heat-sinking capability, in time conducting the air with the heat of gathering around high temperature resistant core 6 and ceramic circuit board 5, effective heat dissipation, the utility model provides a structure can carry out reasonable setting to thermal-insulated and the heat dissipation in the transmitter for the inside heat of transmitter is balanced.
The pressure measuring range of the pressure transmitter in the utility model is 0-100MPa, the temperature range of the working medium is-55-250 ℃, the output signal is 0.5-4.5V or other standard signals, and the accuracy is less than or equal to 0.2% FS.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (7)
1. The high-temperature pressure transmitter with balanced heat is characterized by comprising a nickel-plated copper shell (1), wherein a metal pressure guiding nozzle (9) used for guiding flow is arranged at the lower end of the nickel-plated copper shell (1), a metal mounting column (7) is embedded at the upper end of a drainage channel of the metal pressure guiding nozzle (9), a step surface is arranged on the inner wall of the drainage channel of the metal pressure guiding nozzle (9), the lower surface of the metal mounting column (7) is matched with the step surface of the drainage channel of the metal pressure guiding nozzle (9), a high-temperature sealing ring (10) is arranged between the lower surface of the metal mounting column (7) and the step surface of the drainage channel of the metal pressure guiding nozzle (9), a T-shaped heat-insulating ceramic seat (8) is arranged between the outer wall of the lower end of the metal mounting column (7) and the inner wall of the metal pressure guiding nozzle (9), the outer wall of the metal mounting column (7) is fixedly connected with the inner wall of the upper end of the, the upper surface of the metal mounting column (7) is higher than the upper surface of the metal pressure guiding nozzle (9), and the top of the metal mounting column (7) is provided with a pressure transmitting main body part.
2. The heat balanced high temperature pressure transmitter according to claim 1, characterized in that the upper end of the metal mounting post (7) is provided with a high temperature resistant core (6), the upper end of the high temperature resistant core (6) is provided with a ceramic circuit board (5), and a modified PP support (2) is arranged between the high temperature resistant core (6) and the ceramic circuit board (5).
3. A thermally equalized high-temperature pressure transmitter according to claim 1, characterized in that the thermal conductivity of the insulating ceramic seat (8) is 7.6W/MK.
4. A thermally equalized high-temperature pressure transmitter according to claim 2, characterized in that the modified PP support (2) has a thermal conductivity of 0.24W/MK.
5. A thermally equalized high-temperature pressure transmitter according to claim 1, characterized in that the thermal conductivity of the housing of the nickel-plated copper housing (1) is 400W/MK.
6. The high-temperature pressure transmitter with balanced heat according to claim 1, wherein the upper end of the metal pressure guiding nozzle (9) extends into the nickel-plated copper shell (1), the inner wall of the nickel-plated copper shell (1) is provided with a protruding ring body, the outer wall of the upper end of the metal pressure guiding nozzle (9) is provided with a groove for accommodating the protruding ring body, and the metal pressure guiding nozzle (9) is clamped with the nickel-plated copper shell (1).
7. A heat equalized high-temperature pressure transmitter according to claim 1, characterized in that the lower end of the metal pressure guiding nozzle (9) exposed outside the nickel-plated copper housing (1) is externally threaded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921670434.7U CN210802765U (en) | 2019-10-08 | 2019-10-08 | Heat balanced high temperature pressure transmitter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921670434.7U CN210802765U (en) | 2019-10-08 | 2019-10-08 | Heat balanced high temperature pressure transmitter |
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| CN210802765U true CN210802765U (en) | 2020-06-19 |
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| CN201921670434.7U Active CN210802765U (en) | 2019-10-08 | 2019-10-08 | Heat balanced high temperature pressure transmitter |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113899493A (en) * | 2021-11-02 | 2022-01-07 | 西安交通大学苏州研究院 | Pressure sensor applied to ultralow temperature environment |
-
2019
- 2019-10-08 CN CN201921670434.7U patent/CN210802765U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113899493A (en) * | 2021-11-02 | 2022-01-07 | 西安交通大学苏州研究院 | Pressure sensor applied to ultralow temperature environment |
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