CN110646132A - Small-size high-temperature pressure transmitter - Google Patents
Small-size high-temperature pressure transmitter Download PDFInfo
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- CN110646132A CN110646132A CN201910951311.9A CN201910951311A CN110646132A CN 110646132 A CN110646132 A CN 110646132A CN 201910951311 A CN201910951311 A CN 201910951311A CN 110646132 A CN110646132 A CN 110646132A
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- metal
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- plated copper
- guiding nozzle
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0681—Protection against excessive heat
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
- G01L7/02—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges
- G01L7/08—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a small-volume high-temperature pressure transmitter, which comprises a nickel-plated copper shell, wherein the lower end of the nickel-plated copper shell is provided with a metal pressure guiding nozzle for guiding flow, the upper end of a flow guiding channel of the metal pressure guiding nozzle is embedded with a metal mounting column, a heat-insulating ceramic seat is arranged between the metal mounting column and the metal pressure guiding nozzle, the upper end of the metal mounting column is provided with a high-temperature-resistant core, the upper end of the high-temperature-resistant core is provided with a ceramic circuit board, and a modified PP (polypropylene) bracket is arranged between the high-temperature-resistant core and the ceramic circuit board Easy to manufacture.
Description
Technical Field
The invention relates to the technical field of pressure sensing, in particular to a small-size high-temperature pressure transmitter.
Background
The high-temperature pressure sensor in the military field of China has huge market demand and has wide application prospect in military equipment such as aerospace, rockets, missiles, airplanes, tanks, ships, war chariot and the like. The development of the integrated high-temperature-resistant pressure sensor product is beneficial to the comprehensive upgrade of the pressure sensors used by the existing weaponry in China, particularly aerospace, tanks, chariot and engineering machinery, the improvement of the fighting capacity of the existing weaponry, the development of novel intelligent weapons and the improvement of the national defense modernization level in China.
In recent years, pressure sensors have been developed very rapidly in the world, and many high-performance pressure sensor products have been developed, for example, the american OMEGA company has developed high-performance film pressure sensors, the operating temperature of the products can reach 177 ℃, the measuring range can reach 140Mpa, and the long-term stability is good, and the high-temperature high-pressure film pressure sensors are widely applied to weapon equipment systems. The high-temperature pressure sensor product manufactured by Kulite in the United states has the working temperature of between 55 ℃ below zero and 480 ℃, and the sensor is widely applied to the military field; in recent years, high-performance film pressure sensors with high comprehensive precision and sensitivity, wide temperature application range, small volume, good long-term stability and low power consumption are developed in Japan and are widely applied to aerospace and weaponry systems. The research of high-performance film pressure sensors is developed in great numbers in countries such as the United kingdom and France.
At present, although the market scale of the sensors (including secondary instruments and meters) in China exceeds 7000 million yuan, most high-precision sensor products are assembled by using foreign core elements, so that the number of the sensor products with completely independent intellectual property rights in China is too small, and the difference between the whole level of the sensor industry and the foreign advanced level is large. The high-temperature pressure transmitter in the prior art is improved in heat dissipation, so that the structure is complex, a low-cost and simple integrated high-temperature-resistant pressure sensor product is developed, the comprehensive upgrade of the pressure sensor used by the traditional weaponry in China, particularly aerospace, tanks, chariot and engineering machinery is facilitated, the improvement of the fighting capacity of the traditional weaponry is facilitated, the development of novel intelligent weapons is facilitated, and the improvement of the national defense modernization level in China is facilitated.
Disclosure of Invention
The invention aims to solve the problems of complex heat dissipation structure and high manufacturing cost of a high-temperature pressure transmitter in China, and provides a small-size high-temperature pressure transmitter.
In order to achieve the purpose, the invention adopts the following technical scheme:
a small-size high-temperature pressure transmitter comprises a nickel-plated copper shell, wherein a metal pressure guiding nozzle for guiding flow is arranged at the lower end of the nickel-plated copper shell, a metal mounting column is embedded at the upper end of a flow guiding channel of the metal pressure guiding nozzle, a heat-insulating ceramic seat is arranged between the metal mounting column and the metal pressure guiding nozzle, a high-temperature-resistant core body is arranged at the upper end of the metal mounting column, a ceramic circuit board is arranged at the upper end of the high-temperature-resistant core body, and a modified PP support is arranged between the high-temperature-resistant core body and the ceramic circuit board;
a liquid cavity is arranged in the high-temperature resistant core body, an elastic body is arranged at the upper end of the liquid cavity, and the liquid cavity is communicated with a drainage channel of the metal pressure-inducing nozzle through a drainage hole in the middle of the metal mounting column; the elastic body is electrically connected with the ceramic circuit board, the output end of the ceramic circuit board is connected with a lead-out wire, the top of the nickel-plated copper shell is provided with a locking connector, and the lead-out wire extends out of a jack of the locking connector.
Furthermore, the raw material of the heat-insulating ceramic seat comprises silicon dioxide, and the heat conductivity coefficient of the heat-insulating ceramic seat is not more than 7.6W/MK.
Further, the thermal conductivity coefficient of the modified PP scaffold is not more than 0.24W/MK.
Further, the shell of the nickel-plated copper shell has a thermal conductivity not less than 400W/MK.
Furthermore, the inner wall of the drainage channel of the metal pressure guiding nozzle is provided with a step surface, the lower surface of the metal mounting column is matched with the step surface of the drainage channel of the metal pressure guiding nozzle, and a high-temperature sealing ring is arranged between the lower surface of the metal mounting column and the step surface of the drainage channel of the metal pressure guiding nozzle.
Furthermore, the upper end of the metal pressure guiding nozzle extends into the nickel-plated copper shell, a protruding ring body is arranged on the inner wall of the nickel-plated copper shell, a groove for accommodating the protruding ring body is formed in the outer wall of the upper end of the metal pressure guiding nozzle, and the metal pressure guiding nozzle is connected with the nickel-plated copper shell in a clamped mode.
Furthermore, the top surface of the metal mounting column is higher than the top surface of the metal pressure guiding nozzle, and the high-temperature-resistant core body is fixedly arranged on the top surface of the metal mounting column.
Furthermore, the cross sectional areas of the nickel-plated copper shell and the metal pressure guiding nozzle are both less than phi 20mm2And the integral length formed by the nickel-plated copper shell and the metal pressure guiding nozzle is less than 40 mm.
Furthermore, the lower end of the metal pressure guiding nozzle exposed outside the nickel-plated copper shell is provided with an external thread.
The invention has the beneficial effects that:
1. according to the invention, the heat insulation ceramic seat is additionally arranged between the metal pressure leading nozzle and the metal mounting column, the heat insulation ceramic seat is high temperature resistant and can prevent heat from being conducted to the high temperature resistant core body, the modified PP support supports the ceramic circuit board, and the heat on the elastic body is rarely transmitted to the ceramic circuit board; through the design, although the medium temperature reaches 225 ℃ or 250 ℃, the temperature of the high-temperature resistant core body does not exceed 120 ℃, the temperature of the ceramic circuit board and the temperature of the device do not exceed 80 ℃, and the normal work of the transmitter and the CMOS circuit thereof can be effectively ensured.
2. The upper shell of the whole transmitter adopts a nickel-plated copper shell, the heat conductivity coefficient of the shell is 400W/MK, the heat dissipation capacity is extremely high, heat gathered around the high-temperature-resistant core body and the ceramic circuit board is timely conducted to the air, and the heat is effectively dissipated.
3. Because the ceramic heat insulation technology, the PP material bracket, the copper shell with strong heat conductivity and the like are adopted, the working temperature range of the CMOS signal processing circuit is controlled between minus 20 ℃ and 80 ℃, and the design of the circuit in the aspect of high and low environment application is not needed, so that the whole high-temperature pressure transmitter has small volume, simple and compact structure and easy manufacture.
Drawings
Fig. 1 is a schematic structural diagram of a small-volume high-temperature pressure transmitter according to the present invention.
In the figure: 1. a nickel-plated copper housing; 2. modifying a PP scaffold; 3. an outgoing line; 4. locking the connector; 5. a ceramic circuit board; 6. a high temperature resistant core; 7. a metal mounting post; 8. a thermally insulating ceramic mount; 9. a metal pressure-leading nozzle; 10. a high-temperature sealing ring; 11. an elastomer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1, the small-size high-temperature pressure transmitter comprises a nickel-plated copper shell 1, wherein a metal pressure guiding nozzle 9 for guiding flow is arranged at the lower end of the nickel-plated copper shell 1, the upper end of the metal pressure guiding nozzle 9 extends into the nickel-plated copper shell 1, a protruding ring body is arranged on the inner wall of the nickel-plated copper shell 1, a groove for accommodating the protruding ring body is arranged on the outer wall of the upper end of the metal pressure guiding nozzle 9, and the metal pressure guiding nozzle 9 is clamped with the nickel-plated copper shell 1; the lower end of the metal pressure leading nozzle 9 exposed outside the nickel-plated copper shell 1 is provided with an external thread for connecting a carrier of the high-temperature liquid to be detected.
Further, the inside of metal pressure guiding nozzle 9 sets up the drainage channel of high-temperature liquid, metal erection column 7 is inlayed to the drainage channel upper end of metal pressure guiding nozzle 9, and the drainage channel inner wall of metal pressure guiding nozzle 9 sets up the step face, the lower surface of metal erection column 7 cooperatees with the step face of metal pressure guiding nozzle 9 drainage channel, set up high temperature seal ring 10 between the lower surface of metal erection column 7 and the step face of metal pressure guiding nozzle 9 drainage channel, prevent that high temperature material from getting into the joint gap between metal erection column 7 and the metal pressure guiding nozzle 9.
Further, a heat insulation ceramic seat 8 is arranged between the metal mounting column 7 and the metal pressure guiding nozzle 9, the main component of the heat insulation ceramic seat 8 is silicon dioxide, the heat conductivity coefficient of the silicon dioxide is 7.6W/MK, the high temperature resistance is realized, the heat transfer from the metal pressure guiding nozzle 9 to the metal mounting column 7 can be reduced, the heat transfer to the high temperature resistant core body 6 is blocked, and the sensitivity and the stability of the elastomer 11 at the upper end of the high temperature resistant core body 6 are kept.
Further, the upper end of metal erection column 7 sets up high temperature resistant core 6, the inside of high temperature resistant core 6 sets up the sap cavity, the upper end of sap cavity sets up elastomer 11, and elastomer 11 is used for feeling the pressure of high temperature liquid, the sap cavity is through the drainage hole in the middle of the metal erection column 7 and the drainage channel intercommunication of metal induced pressure mouth 9, and the metal induced pressure mouth 9 that the high temperature substance that awaits measuring passes through extrudes elastomer 11 in getting into the sap cavity of high temperature resistant core 6.
Further, ceramic circuit board 5 is arranged at the upper end of high temperature resistant core body 6, elastomer 11 and ceramic circuit board 5 electric connection set up conditioning element combination on ceramic circuit board 5, conditioning element combination is the common component combination that pressure sensor pressure signal was conditioned into standard signal among the prior art, ceramic circuit board 5's output is even lead-out wire 3, and this sensor output signal of telecommunication is transmitted away to lead-out wire 3.
The modified PP support 2 is arranged between the high-temperature resistant core body 6 and the ceramic circuit board 5, the modified PP support 2 is used for supporting the ceramic circuit board 5, the modified PP support 2 is made of polypropylene, and the heat conductivity coefficient of the polypropylene is 0.24W/MK, so that heat on the elastic body 11 is transmitted to the ceramic circuit board 5 to a very small extent.
The top of the nickel-plated copper shell 1 is provided with a locking connector 4, and the leading-out wire 3 extends out of a jack of the locking connector 4.
Furthermore, the heat conductivity coefficient of the shell of the nickel-plated copper shell 1 is 400W/MK, so that the heat dissipation capacity is extremely high, the top surface of the metal mounting column 7 is higher than that of the metal pressure guiding nozzle 9, the high-temperature resistant core body 6 is fixedly arranged on the top surface of the metal mounting column 7, and the heat gathered around the high-temperature resistant core body 6 and the ceramic circuit board 5 is timely conducted to the air by the nickel-plated copper shell 1 to be effectively dissipated.
It is worth to say that the cross-sectional areas of the nickel-plated copper shell 1 and the metal pressure guiding nozzle 9 are both less than phi 20mm2The integral length formed by the nickel-plated copper shell 1 and the metal pressure guiding nozzle 9 is less than 40mm, and the volume is small. Because the ceramic heat insulation technology, the PP material bracket, the copper shell with strong heat conductivity and the like are adopted, the working temperature range of the CMOS signal processing circuit is controlled between minus 20 ℃ and 80 ℃, and the design of the circuit in the aspect of high and low environment application is not needed, so that the whole high-temperature pressure transmitter has small volume, simple and compact structure and easy manufacture.
The use method and the principle are as follows: the metal pressure guiding nozzle 9 is screwed on a carrier of high-temperature liquid to be detected, the high-temperature liquid enters a liquid cavity of the high-temperature resistant core body 6 through a drainage hole in the middle of the metal pressure guiding nozzle 9 and the metal mounting column 7 under high pressure and extrudes the elastic body 11, a conditioning circuit on the ceramic circuit board 5 conditions an electric signal generated by deformation of the elastic body 11 into a standard signal and transmits the signal out through the outgoing line 3, so that the pressure transmitting function is realized, in the process, the heat insulation ceramic seat 8 is high-temperature resistant and can prevent heat from being transmitted to the high-temperature resistant core body 6, the modified PP support 2 supports the ceramic circuit board 5, and the heat on the elastic body 11 is transmitted to the ceramic circuit board 5 very little; through the design, although the medium temperature reaches 225 ℃ or 250 ℃, the temperature of the high-temperature resistant core 6 does not exceed 120 ℃, and the temperature of the ceramic circuit board 5 and devices does not exceed 80 ℃, so that the normal work of the transmitter and a CMOS circuit thereof can be effectively ensured.
The pressure measuring range of the pressure transmitter is 0-100MPa, the temperature range of the working medium is-55-250 ℃, the output signal is 0.5-4.5V or other standard signals, and the accuracy is less than or equal to 0.2 percent FS.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (9)
1. The small-size high-temperature pressure transmitter is characterized by comprising a nickel-plated copper shell (1), wherein a metal pressure guiding nozzle (9) for guiding flow is arranged at the lower end of the nickel-plated copper shell (1), a metal mounting column (7) is embedded at the upper end of a flow guiding channel of the metal pressure guiding nozzle (9), a heat insulation ceramic seat (8) is arranged between the metal mounting column (7) and the metal pressure guiding nozzle (9), a high-temperature-resistant core body (6) is arranged at the upper end of the metal mounting column (7), a ceramic circuit board (5) is arranged at the upper end of the high-temperature-resistant core body (6), and a modified PP support (2) is arranged between the high-temperature-resistant core body (6) and the ceramic circuit board (5);
a liquid cavity is arranged in the high-temperature resistant core body (6), an elastic body (11) is arranged at the upper end of the liquid cavity, and the liquid cavity is communicated with a drainage channel of the metal pressure guiding nozzle (9) through a drainage hole in the middle of the metal mounting column (7); elastomer (11) and ceramic circuit board (5) electric connection, the output of ceramic circuit board (5) is even lead-out wire (3), nickel-plated copper shell (1) top sets up locking connector (4), lead-out wire (3) stretch out from the jack of locking connector (4).
2. A low-volume high-temperature pressure transmitter as claimed in claim 1, wherein the material of the insulating ceramic holder (8) includes silicon dioxide, and the thermal conductivity of the insulating ceramic holder (8) is not more than 7.6W/MK.
3. A low volume high temperature pressure transmitter as claimed in claim 1, characterized in that the modified PP support (2) has a thermal conductivity of not more than 0.24W/MK.
4. A low volume high temperature pressure transmitter as claimed in claim 1, wherein the thermal conductivity of the housing of the nickel plated copper housing (1) is not less than 400W/MK.
5. The small-volume high-temperature pressure transmitter as claimed in claim 1, wherein a step surface is arranged on the inner wall of the drainage channel of the metal pressure guiding nozzle (9), the lower surface of the metal mounting column (7) is matched with the step surface of the drainage channel of the metal pressure guiding nozzle (9), and a high-temperature sealing ring (10) is arranged between the lower surface of the metal mounting column (7) and the step surface of the drainage channel of the metal pressure guiding nozzle (9).
6. The small-volume high-temperature pressure transmitter as claimed in claim 1, wherein the upper end of the metal pressure guiding nozzle (9) extends into the nickel-plated copper shell (1), the inner wall of the nickel-plated copper shell (1) is provided with a protruding ring body, the outer wall of the upper end of the metal pressure guiding nozzle (9) is provided with a groove for accommodating the protruding ring body, and the metal pressure guiding nozzle (9) is clamped with the nickel-plated copper shell (1).
7. A small-sized high-temperature pressure transmitter as claimed in claim 1, wherein the top surface of the metal mounting post (7) is higher than the top surface of the metal pressure guiding nozzle (9), and the high-temperature resistant core (6) is fixedly arranged on the top surface of the metal mounting post (7).
8. A small volume high temperature pressure transmitter as claimed in claim 1, characterized in that the cross-sectional area of the nickel plated copper housing (1) and the metal pressure nozzle (9) are both less than Φ 20mm2And the integral length formed by the nickel-plated copper shell (1) and the metal pressure guiding nozzle (9) is less than 40 mm.
9. A small volume high temperature pressure transmitter as claimed in claim 1, characterized in that the lower end of the metal pressure guiding nozzle (9) exposed outside the nickel-plated copper housing (1) is provided with an external thread.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910951311.9A CN110646132A (en) | 2019-10-08 | 2019-10-08 | Small-size high-temperature pressure transmitter |
| RU2020113931A RU2735900C1 (en) | 2019-10-08 | 2020-04-20 | Small-size heat-resistant pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910951311.9A CN110646132A (en) | 2019-10-08 | 2019-10-08 | Small-size high-temperature pressure transmitter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110646132A true CN110646132A (en) | 2020-01-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910951311.9A Pending CN110646132A (en) | 2019-10-08 | 2019-10-08 | Small-size high-temperature pressure transmitter |
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| Country | Link |
|---|---|
| CN (1) | CN110646132A (en) |
| RU (1) | RU2735900C1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113899493A (en) * | 2021-11-02 | 2022-01-07 | 西安交通大学苏州研究院 | Pressure sensor applied to ultralow temperature environment |
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| RU2735900C1 (en) | 2020-11-09 |
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Application publication date: 20200103 |