CN210791579U - Silicon rod squaring equipment and flaw-piece discharging device applied to same - Google Patents

Abstract

The application discloses silicon rod squaring equipment and a flaw-piece discharging device applied to the silicon rod squaring equipment, wherein the silicon rod squaring equipment comprises a silicon rod bearing table and a linear cutting device, the linear cutting device comprises a liftable linear cutting support and a linear cutting unit arranged on the linear cutting support, a cutting line segment is arranged in the linear cutting unit, and the cutting line segment penetrates through a silicon single crystal rod to form a cut silicon rod and a flaw-piece; the flaw-piece discharge device comprises: the flaw-piece lifting mechanism is used for lifting the flaw-piece so that the top end of the flaw-piece protrudes out of the cut silicon rod; and the clamping and transferring unit is arranged above the silicon rod bearing table and used for clamping the top end of the flaw-piece and then pulling up the flaw-piece to be separated from the cut silicon rod and transferring the flaw-piece to a flaw-piece unloading area. The flaw-piece that produces after this application can be timely silicon rod cutting is detached, has not only improved work efficiency but also avoided the risk that artifical transport brought.

Description

Silicon rod squaring equipment and flaw-piece discharging device applied to same

Technical Field

The application relates to the technical field of silicon rod processing, in particular to silicon rod squaring equipment and a flaw-piece discharging device applied to the silicon rod squaring equipment.

Background

At present, with the importance and the openness of the society on the utilization of green renewable energy sources, the field of photovoltaic solar power generation is more and more valued and developed. In the field of photovoltaic power generation, conventional crystalline silicon solar cells are fabricated on high quality silicon wafers that are cut by a multi-wire saw after pulling or casting a silicon ingot. At present, the multi-wire cutting technology has the characteristics of high production efficiency, low operation cost, high operation precision and the like, and is widely applied to silicon rod cutting production.

The silicon rod is generally subjected to squaring by adopting squaring equipment, and at the moment, a cutting mechanism feeds along the length direction of the silicon rod and cuts four planes which are parallel in pairs along the circumferential direction of the silicon rod; and after the evolution is finished, slicing the silicon rod after evolution along the length direction by adopting a multi-line slicing machine to obtain the required silicon wafer.

In the related silicon rod evolution operation, the silicon rod can form the flaw-piece after evolution and cutting, therefore, the formed flaw-piece needs to be unloaded firstly, most of the common flaw-piece unloading modes still have the flaw-piece separated from the cut silicon rod by manual operation of operators and move the cut silicon rod out of the silicon rod evolution equipment, so that the efficiency is low, and the flaw-piece collides with the cut silicon rod in the carrying process to increase the risk of damage of the cut silicon rod.

Disclosure of Invention

In view of the above-mentioned disadvantages of the related art, an object of the present application is to provide a silicon rod squaring apparatus and a flaw-piece discharging device applied to the same.

In order to achieve the above and other related objects, a first aspect of the present application discloses a flaw-piece discharging device applied to a silicon rod squaring apparatus, the silicon rod squaring apparatus includes a silicon rod carrying table and a wire cutting device, the silicon rod carrying table is used for carrying a vertically placed single crystal silicon rod, the wire cutting device includes a liftable wire cutting support and a wire cutting unit arranged on the wire cutting support, the wire cutting unit has a cutting wire segment therein, and the cutting wire segment penetrates through the single crystal silicon rod to form a cut silicon rod and a flaw-piece; the flaw-piece discharge device comprises: the flaw-piece lifting mechanism is used for lifting the flaw-piece so that the top end of the flaw-piece protrudes out of the cut silicon rod; and the clamping and transferring unit is arranged above the silicon rod bearing table and used for clamping the top end of the flaw-piece and then pulling up the flaw-piece to be separated from the cut silicon rod and transferring the flaw-piece to a flaw-piece unloading area.

In certain embodiments of the first aspect of the present application, the flaw-piece lifting mechanism includes a jacking member that is provided on the wire-electrode cutting support and is capable of telescopic movement, the jacking member is controlled to hold after the stretching movement the bottom of the flaw-piece is in order to jack the flaw-piece.

In certain embodiments of the first aspect of the present application, the flaw-piece lifting mechanism includes an adsorption member that is disposed on the wire-electrode cutting support and is capable of performing telescopic movement, the adsorption member is controlled to perform stretching movement and then abuts against the flaw-piece and adsorbs the flaw-piece to lift the flaw-piece.

In certain embodiments of the first aspect of the present application, the gripping transfer unit comprises: a moving mechanism providing at least one direction of movement; and the lifting and descending at least one clamping component flaw-piece clamping mechanism is connected with the moving mechanism and is driven to move in at least one direction.

In certain embodiments of the first aspect of the present application, the flaw-piece clamping mechanism comprises: a lifting drive structure; and the clamping assembly is arranged at the bottom of the lifting driving structure and is used for clamping or releasing the top end of the side skin.

In certain embodiments of the first aspect of the present application, the clamping assembly comprises: the cover body is used for covering the flaw-piece; the telescopic clamping piece is arranged inside the cover body; a clamping space for clamping the edge leather is formed between the clamping piece and the cover body.

In certain embodiments of the first aspect of the present application, the clamping assembly comprises: an arc-shaped plate; and a telescopic clamping piece, wherein a clamping space for clamping the edge skin is formed between the clamping piece and the arc-shaped plate.

In certain embodiments of the first aspect of the present application, the clamping member is a movable press block controlled by a cylinder, the movable press block being connected to the cylinder by a flipping arm.

In certain embodiments of the first aspect of the present application, the tilting arm has an installation portion and a first connection portion and a second connection portion respectively located at two opposite sides of the installation portion, wherein the first connection portion is connected to the piston rod of the cylinder, and the second connection portion is connected to the movable pressing block.

In certain embodiments of the first aspect of the present application, the movable press block is provided with a cushion for contacting the edging.

In certain embodiments of the first aspect of the present application, the flaw-piece discharging device applied to a silicon rod extracting apparatus further comprises: and the edge leather barrel is arranged in the edge leather unloading area.

In certain embodiments of the first aspect of the present application, the flaw-piece discharging device applied to a silicon rod extracting apparatus further comprises: and the flaw-piece conveying structure is arranged in the flaw-piece unloading area.

The application discloses in a second aspect, a silicon rod squaring device for squaring a silicon single crystal rod having a circular cross section, comprising: the silicon rod bearing table is used for bearing a vertically placed single crystal silicon rod; the wire cutting device is arranged above the at least two silicon rod bearing tables and comprises a plurality of cutting wheels and a cutting wire which is wound on the cutting wheels and provided with at least one cutting wire section; a flaw-piece discharge apparatus as described in the first aspect of the present application.

In conclusion, through the silicon rod squaring device and the flaw-piece discharging device applied to the silicon rod squaring device disclosed by the application, the flaw-piece generated after the silicon rod squaring device cuts the silicon rod can be timely removed through the clamping component, so that the working efficiency is improved, and the risk caused by manual carrying is avoided.

Drawings

Fig. 1 is a schematic view of the overall structure of a silicon rod squaring apparatus according to an embodiment of the present application.

Fig. 2 is a schematic view illustrating a worktable converting mechanism as a rotating mechanism in an embodiment of the silicon rod squaring apparatus according to the present application.

Fig. 3a is a schematic view showing a state where a stage switching mechanism is a translation mechanism in an embodiment of the silicon rod squaring apparatus according to the present application.

Fig. 3b is a schematic view illustrating another state of the worktable converting mechanism as a translating mechanism in one embodiment of the silicon rod squaring apparatus of the present application.

Fig. 4 is a schematic structural view of a silicon rod loading and unloading device in one embodiment of the silicon rod extracting apparatus according to the present application.

Fig. 5 is a top view of fig. 4.

Fig. 6 is a cross-sectional view of a first clamp of a silicon rod handling device in an embodiment of the silicon rod extracting apparatus of the present application.

Fig. 7 is a schematic view illustrating a first driving structure of the silicon rod squaring apparatus according to an embodiment of the present disclosure.

Fig. 8 is a schematic view illustrating a structure in which each cutting wheel set of the wire cutting device in one embodiment of the silicon rod squaring apparatus of the present application has a pair of cutting wheels.

Fig. 9 shows a schematic structure of a wire cutting device in an embodiment of the silicon rod squaring apparatus according to the present application, in which each cutting wheel set has two pairs of cutting wheels.

Fig. 10 is a side view of the structure of fig. 9.

Fig. 11 is a schematic view showing the winding of the guide wheel in the case that each cutting wheel set of the wire cutting device in one embodiment of the apparatus for squaring silicon rods of the present application has two pairs of cutting wheels.

Fig. 12 is a schematic structural view illustrating the cooperation between an automatic groove changing mechanism and a linear cutting device in an embodiment of the silicon rod squaring apparatus according to the present application.

Fig. 13 is a schematic cross-sectional view illustrating an automatic groove-changing mechanism in an embodiment of a silicon rod squaring apparatus according to the present application.

Fig. 14 is a partial enlarged view of a portion B of fig. 13.

Fig. 15a to 15d are schematic views showing the movement process structure of the automatic groove changing mechanism in an embodiment of the silicon rod squaring apparatus according to the present application.

Fig. 16 is a schematic view showing a configuration of a silicon rod squaring apparatus according to an embodiment of the present application, the silicon rod squaring apparatus including a silicon rod pressing device.

Fig. 17 is a schematic view illustrating a structure of a flaw-piece jacking mechanism in an embodiment of a silicon rod squaring apparatus according to the present application.

Fig. 18 is a schematic structural diagram of a flaw-piece lifting mechanism in one embodiment of the flaw-piece discharging device applied to the silicon rod squaring equipment.

Fig. 19 is a partially enlarged view of a portion a in fig. 2.

Fig. 20 is a schematic view showing an external structure of a flaw-piece clamping mechanism in an embodiment of the flaw-piece discharging device applied to a silicon rod squaring apparatus according to the present application.

Fig. 21 is a schematic cross-sectional view of a clamping assembly of the flaw-piece discharging device applied to a silicon rod squaring apparatus according to an embodiment of the present invention.

Detailed Description

The following description of the embodiments of the present application is provided for illustrative purposes, and other advantages and capabilities of the present application will become apparent to those skilled in the art from the present disclosure.

In the following description, reference is made to the accompanying drawings that describe several embodiments of the application. It is to be understood that other embodiments may be utilized and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present application is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Spatially relative terms, such as "upper," "lower," "left," "right," "lower," "below," "lower," "above," "upper," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature as illustrated in the figures.

Although the terms first, second, etc. may be used herein to describe various elements or parameters in some instances, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another element or parameter. For example, a first wire slot may be referred to as a second wire slot, and similarly, a second wire slot may be referred to as a first wire slot, without departing from the scope of the various described embodiments. The first and second wire slots are both described as one wire slot, but they are not the same wire slot unless the context clearly dictates otherwise. Similar situations also include a first guide rail and a second guide rail, or a first direction and a second direction.

Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

In the silicon rod evolution operation, the silicon rod can form the flaw-piece after the evolution cutting, therefore, need unload the flaw-piece that forms earlier, current flaw-piece uninstallation mode still mostly breaks away from the flaw-piece in the silicon rod that has been cut and removes it from silicon rod evolution equipment by operating personnel manual operation, not only inefficiency, and can make the flaw-piece collide and increase the risk of cut silicon rod damage with the silicon rod that has been cut in handling. Therefore, there is a need for a silicon rod squaring apparatus and a flaw-piece discharging device applied to the same, which can timely discharge flaw-pieces and improve the operation efficiency.

The silicon rod extracting apparatus and the flaw-piece discharging device applied to the silicon rod extracting apparatus according to the present invention will be described in detail below with reference to the embodiments and fig. 1 to 21.

Referring to fig. 1, a schematic view of an overall structure of a silicon rod squaring apparatus according to an embodiment of the present disclosure is shown, as shown in the figure, the silicon rod squaring apparatus further includes a base 20, the base 20 is a main component of the silicon rod squaring apparatus according to the present disclosure, and is configured to provide a squaring operation platform, and preferably, the base 20 has a larger volume and a larger weight so as to provide a larger installation surface and a stronger overall stability.

The at least two silicon rod bearing tables 21 are used for bearing vertically placed silicon rods, each silicon rod bearing table 21 is provided with a rotating mechanism 210, and the rotating mechanism 210 is used for driving the silicon rods placed on the silicon rod bearing tables 21 to rotate so as to adjust a surface to be cut. In an exemplary embodiment, the rotating mechanism 210 is configured as a rotating turntable located at the bottom of the silicon rod bearing platform 21, and the rotating turntable is controlled by a driving device (not shown), which may be, for example, a servo motor for driving the rotating turntable to rotate, but is not limited thereto. In an alternative embodiment, the rotating mechanism 210 may be of a lifting type, that is, a rotating turntable at the bottom of the silicon rod bearing table 21 is controlled to perform a telescopic action to drive the silicon rod bearing table 21 to perform a lifting motion, so as to adjust the height of the silicon rod to be cut on the silicon rod bearing table 21.

In order to better protect the silicon rod to be cut on the silicon rod bearing table, in an exemplary embodiment, a buffer pad is fixed on a bearing surface (the bearing surface is used for bearing the silicon rod to be cut) of each silicon rod bearing table 21, so that the buffer pad is positioned between the silicon rod bearing table 21 and the silicon rod to be cut when the silicon rod to be cut is placed.

In an embodiment, referring to fig. 1, the at least two silicon rod bearing platforms 21 are directly disposed on the base and sequentially arranged in the cutting area at intervals in a straight line manner, and after the at least two silicon rod bearing platforms 21 bear the silicon rods to be cut, centers of the silicon rods to be cut, which are borne, are located on the same straight line (as shown in fig. 1), it is easy to understand that the cutting area is an area where the silicon rod is cut by the squaring device, specifically, the cutting area is, for example, an area below the cutting device in the silicon rod squaring device.

In practical applications, in order to improve the working efficiency and enable the squaring apparatus to simultaneously perform the cutting operation and the loading and unloading operation, please refer to fig. 2, which is a schematic diagram showing that the worktable switching mechanism of the silicon rod squaring apparatus of the present application is a rotating mechanism in one embodiment, as shown in the figure, in another embodiment, the at least two silicon rod carrying tables 21 may be disposed on the silicon rod worktable 22, the silicon rod worktable 22 is provided with a worktable switching mechanism 220 for driving the silicon rod worktable 21 to perform a switching motion so as to switch the silicon rod carrying tables on the silicon rod worktable 21 between a loading and unloading area and a cutting area, it is easy to understand that the loading and unloading area is an area for loading and unloading the silicon rod squaring apparatus, specifically, for example, areas corresponding to two sides of the silicon rod worktable in the silicon rod squaring apparatus, and the cutting area is an area for performing the silicon rod cutting operation to be cut on the silicon rod squaring apparatus, specifically, for example, the region below the cutting device in the silicon rod squaring apparatus.

In this embodiment, silicon rod workstation 22 sets up on frame 20 and sets up to at least one, is provided with two at least silicon rod plummer 21 on each silicon rod workstation 22, and wherein at least one silicon rod plummer 21 on each silicon rod workstation 22 is located the cutting area, at least one silicon rod plummer 21 is located the loading and unloading district, the silicon rod plummer 21 that lies in the cutting area on each silicon rod workstation 22 order interval arrangement in proper order with the mode of a straight line in proper order, so, after each silicon rod plummer 21 that lies in the cutting area has supported and has waited to cut the silicon rod, the center that is waited to cut the silicon rod by these of bearing is located same straight line promptly. In an exemplary embodiment, referring to fig. 2, two silicon rod platforms 22 are disposed on the base, four silicon rod platforms 21 are disposed on each silicon rod platform 22, two of the silicon rod platforms 21 on each silicon rod platform 22 are located in the cutting area, another two silicon rod platforms 21 are located in the loading and unloading area, and the four silicon rod platforms 21 on the two silicon rod platforms 22 located in the cutting area are sequentially arranged in a straight line at intervals, but not limited thereto, and in other exemplary embodiments, the silicon rod platforms 22 may be disposed as one or more.

In an exemplary embodiment, referring to fig. 2, as shown, the table switching mechanism 220 is a rotating mechanism including a rotating shaft 2200 and a rotation driving unit (not shown). The rotating shaft 2200 is coupled to the silicon rod worktable 22, and a power output shaft of the rotation driving unit is coupled to the rotating shaft 2200 and is configured to drive the rotating shaft 2200 to rotate so as to drive the silicon rod worktable 22 to rotate. In the present embodiment, the rotating shaft 2200 is disposed at a central region of the bottom of the silicon rod table 22 and connected to the base 20, and the silicon rod bearing table 21 located at the cutting region and the silicon rod bearing table 21 located at the loading and unloading region are centrosymmetric with respect to the rotating shaft 2200, so that the silicon rod bearing table 21 located on the silicon rod table 22 can be switched between the cutting region and the loading and unloading region by driving the silicon rod table 22 to rotate. It should be noted that, in the embodiment where the worktable converting mechanism 220 is configured as a rotating mechanism, the material loading and unloading are performed on one side of the silicon rod squaring apparatus, in practical operation, to convert the silicon rod between the cutting area and the loading and unloading area, first, a rotation driving unit (for example, a common driving motor) drives the rotating shaft 2200 to drive the silicon rod worktable 22 to rotate (for example, rotate 180 °), so that the silicon rod carrying table 21 in situ in the cutting area is rotated to the loading and unloading area for unloading and loading new material, and the silicon rod carrying table 21 in situ in the loading and unloading area is converted to the cutting area for cutting, and such a cycle enables the silicon rod squaring apparatus of the present application to perform the cutting operation and the loading and unloading operation simultaneously, thereby improving the. In other embodiments, the rotating mechanism for driving the silicon rod worktable to rotate may also adopt other manners, for example, the rotating mechanism may also adopt a gear transmission manner, specifically, a transmission wheel is disposed at the bottom of the silicon rod worktable, a driving wheel engaged with the transmission wheel is disposed on the base 20, the driving wheel is controlled by a rotation driving motor, the driving motor drives the driving wheel to rotate to drive the driven wheel to rotate, so that the silicon rod worktable 22 rotates along with the driven wheel to drive the silicon rod carrying table 21 to switch between the loading area and the cutting area.

In another exemplary embodiment, referring to fig. 3a and 3b, fig. 3a is a schematic view illustrating a state of a stage switching mechanism as a translation mechanism in an embodiment of the silicon rod extracting apparatus of the present application; fig. 3b is a schematic view showing another state of the silicon rod squaring apparatus according to the present application, in which the table switching mechanism 220 is a translation mechanism including a translation guide 2201, a slider 2202, and a translation driving unit (not shown), according to an embodiment of the present application. The translation guide rail 2201 is laid on the machine base 20, the slider 2202 is arranged at the bottom of the silicon rod workbench 22 and is adapted to the translation guide rail 2201 to provide translation guidance for the silicon rod workbench 22, the translation driving unit is used for driving the silicon rod workbench 22 to move along the translation guide rail 2201 (in the direction of the arrow in fig. 3a and 3 b) so as to switch the silicon rod bearing platform 21 on the silicon rod workbench 22 between the cutting area and the loading and unloading area, and the translation driving unit adopts a cylinder assembly or a screw rod assembly driven by a motor. In the embodiment where the platform switching mechanism 220 is a translation mechanism, in actual operation, after the silicon rod carried by the silicon rod carrying platform 21 located in the cutting area on the silicon rod working platform is cut and the silicon rod carrying platform 21 located in one side of the loading and unloading area has carried the silicon rod to be cut (in the state shown in fig. 3 a), the translation driving unit drives the silicon rod working platform 22 to move forward along the direction of the slide rail X (in the direction of the arrow in fig. 3 a) so that the silicon rod carrying platform 21 located in the cutting area translates to the other side of the loading and unloading area for unloading and carrying the silicon rod to be cut, and simultaneously the silicon rod carrying platform 21 located in one side of the loading and unloading area carries the silicon rod to be cut and translates to the cutting area for cutting the silicon rod to be cut (in the state shown in fig. 3 b), and then the translation driving unit drives the silicon rod working platform 22 to move backward along the slide rail (in the direction of the arrow in fig. 3 b) so that the silicon rod carrying platform The silicon rod bearing table 21 of the silicon rod to be cut returns to the cutting area to be cut, meanwhile, the silicon rod bearing table 21 which finishes the cutting operation in the cutting area returns to the loading and unloading area on one side to continuously unload and load the silicon rod to be cut (the position is 4a in the figure), the silicon rod squaring equipment can simultaneously carry out cutting work and loading and unloading work in a reciprocating mode, and the working efficiency is remarkably improved. In other embodiments, the translation mechanism may also adopt a gear transmission manner, specifically, the translation mechanism includes a translation rack and a rotation gear driven by a motor and adapted to the translation rack, the translation rack is disposed at the bottom of the silicon rod worktable, and may be, for example, at least one rack having a certain length, in order to enable the silicon rod worktable to move stably, each rack is adapted with at least two rotation gears disposed at intervals, and the motor drives the rotation gear to rotate to drive the silicon rod worktable to move so as to enable the silicon rod carrying table on the silicon rod worktable to switch between the cutting area and the loading and unloading area.

What need supplement is, for the convenience is in order to carry out the loading and unloading operation to the silicon rod, this application silicon rod evolution equipment still includes silicon rod handling device, silicon rod handling device is adjacent to be located the silicon rod plummer, and further, silicon rod handling device sets up in one side or relative both sides of silicon rod workstation for on loading the silicon rod plummer that is located loading area to the silicon rod workstation that waits to cut that will be located in putting the district to the silicon rod plummer in loading area with will waiting to cut the silicon rod by the silicon rod workstation and send to the cutting district and cut, and will be transferred to putting the district in order to uninstall the silicon rod that has cut by the silicon rod workstation by the cutting district to the silicon rod that has cut that. In one embodiment, the silicon rod loading and unloading device is provided on one side of a silicon rod table, and the table switching mechanism of the silicon rod table is the rotating mechanism as described above, and the silicon rod is loaded and unloaded on one side of the silicon rod table; in another embodiment, the silicon rod loading and unloading device is provided on both sides of a silicon rod table, and in this case, the table switching mechanism of the silicon rod table is a translation mechanism as described above, and the silicon rod is loaded and unloaded on both sides of the silicon rod table. It is easy to understand that the placement area is an area adjacent to the silicon rod squaring apparatus and used for placing or storing the silicon rod to be cut and the cut silicon rod.

Referring to fig. 4 to 6, fig. 4 is a schematic structural view of a silicon rod loading and unloading device in an embodiment of a silicon rod extracting apparatus according to the present application; FIG. 5 is a top view of FIG. 4; fig. 6 is a cross-sectional view of a first clamp of a silicon rod handling device in an embodiment of the silicon rod squaring apparatus of the present application, wherein the silicon rod handling device 23 is disposed on a bottom mounting structure protruding from a machine base. The silicon rod unloading device 23 comprises a reversing carrier 230, a first clamp and a second clamp, wherein the reversing carrier 230 is used for reversing movement, the first clamp and the second clamp are arranged on the reversing carrier 230, and the first clamp and the second clamp arranged on the reversing carrier 230 can be switched between a material placing area and a loading and unloading area by driving the reversing carrier to perform reversing movement so as to transfer and clamp the cut silicon rod and the silicon rod to be cut.

The reversing vehicle 230 is disposed on the bottom mounting structure and can perform a reversing motion relative to the bottom mounting structure. In one embodiment, the direction-changing carrier 230 is moved in a direction-changing manner by a direction-changing mechanism. The reversing mechanism may include a rotating shaft and a reversing motor, with the reversing vehicle 230 being connected to the underlying bottom mounting structure by the rotating shaft. When the steering movement is performed, the reversing motor is started to drive the rotating shaft to rotate so as to drive the reversing carrier 230 to rotate to realize the reversing movement. The aforementioned rotation of the drive rotation shaft may be designed as a one-way rotation, which may be, for example, a clockwise rotation or a counterclockwise rotation, or as a two-way rotation, which may be, for example, a clockwise rotation and a counterclockwise rotation. In addition, the angle by which the driving rotation shaft is rotated may be set according to the actual configuration of the silicon rod handling apparatus 23, for example, the angle by which the driving rotation shaft is rotated may be according to the positional relationship between the placement area and the handling area, or the configuration of the reversing carrier 230, or the like. The reversing base of the reversing carrier 230 is connected to the rotating shaft at a central position, and generally, the reversing base may be in a disc structure, but not limited thereto, and may also be in a square disc or an oval disc. The first clamp is arranged in a first clamp area of the reversing carrier 230 and used for clamping a silicon rod to be cut, and the second clamp is arranged in a second clamp area of the reversing carrier 230 and used for clamping the cut silicon rod. In an embodiment, the first and second clamping areas may be set according to the actual device structure, for example, the first and second clamping areas are two oppositely disposed areas of the reversing carrier 230, and further, the first and second clamping areas may be different by 180 °, such that the placing area and the loading and unloading area are connected in a line (of course, it is also understood that the placing area and the loading and unloading area are connected in a line and are respectively disposed at two opposite sides of the reversing carrier 230, and therefore, the first clamping area for disposing the first clamp and the second clamping area for disposing the second clamp in the reversing carrier 230 may be different by 180 °), such that the first and second clamps may be interchanged after the reversing carrier 230 is rotated by 180 °. However, in practical applications, the setting relationship between the first clamp area and the second clamp area or the loading/unloading station and the working station is not required to be so critical, and the first clamp area and the second clamp area may also be different by 90 °, for example, or even the first clamp area and the second clamp area may be different by any position within a suitable range, as long as the first clamp area and the second clamp area are ensured not to generate unnecessary interference.

The first clamp further comprises a first clamp mount 231 and at least two first clamping members 232, wherein the at least two first clamping members 232 are arranged at a distance with respect to the first clamp mount 231 for clamping the silicon rod to be cut. In one embodiment, the silicon rod to be cut on the silicon rod support platform is vertically disposed, and therefore, the at least two first clamping members 232 are vertically spaced from the first clamp mounting member 231, that is, the at least two first clamping members 232 are vertically disposed.

In a specific implementation manner, any one of the first clamping members 232 further includes: the first clamping arm mounting seat 2320 and the at least two first clamping arms 2321, wherein the first clamping arm mounting seat 2320 is disposed on the first clamp mounting member 231, and the at least two first clamping arms 2321 are movably disposed on the first clamping arm mounting seat 2320. In view of the circular cross-section of the silicon rod to be cut, in an alternative embodiment, the first clamping member 232 is a circular workpiece fixture as a whole, the first clamping arms 2321 constituting the first clamping member 232 are two symmetrically designed, the single first clamping arm 2321 is designed to have an arc-shaped clamping surface, preferably, the arc-shaped clamping surface of the single first clamping arm 2321 exceeds a quarter of an arc, and thus, the arc-shaped clamping surface of the first clamping member 232 composed of the two first clamping arms 2321 exceeds a half of an arc. Certainly, still can additionally add the blotter on the arc clamping face in first arm lock 2321 for avoid waiting to cut the damage on silicon rod surface at the centre gripping in-process that causes of silicon rod, play the good effect of the protection silicon rod of waiting to cut. In general, when the first clamping arms 2321 of the first clamping member 232 are in a clamped state, the center of the clamping space formed by the two first clamping arms 2321 coincides with the center of the silicon rod to be cut. Therefore, when the first clamping member 232 is used for clamping the silicon rod to be cut vertically placed in the placement area, the two first clamping arms 2321 in the first clamping member 232 are contracted and abutted against the silicon rod to be cut by the arc-shaped clamping surfaces in the first clamping arms 2321. In the process that the first clamping arms 2321 contract and clamp the silicon rod to be cut, the silicon rod to be cut is pushed by the two first clamping arms 2321 at two sides and moves towards the central area of the clamping space until the silicon rod to be cut is clamped by the two first clamping arms 2321 in the first clamping member 232, and at the moment, the center of the silicon rod to be cut can be located at the center of the clamping space of the first clamping member 232.

In order to enable the at least two first clamping arms 2321 of the first clamping member 232 to smoothly and stably clamp single-wafer silicon rods with different dimensions, the first clamping member 232 further includes a first clamping arm driving mechanism for driving the at least two first clamping arms 134 to open and close.

Referring to fig. 6, in an implementation, as shown in the figure, the first clamp arm driving mechanism further includes: a first opening and closing gear 2322, a first gear driving member 2323, and a first driving source 2324. The first opening and closing gears 2322 are disposed on the corresponding first clamping arms 2321. The first gear driving member 2323 has a tooth pattern engaged with the first opening and closing gear 2322 on the first clamping arm 2321. The first driving source 2324 is connected to the first gear driving member 2323 for driving the first gear driving member 2323 to move. In one implementation, the first gear driving component 2323 is a first rack, the first rack is located between the two first clamping arms 2321, two outer side surfaces of the first clamping arms 2321 facing two sides in the first rack are respectively provided with a toothed pattern corresponding to the engagement of the first opening and closing gear 2322 on the two first clamping arms 2321, and the first driving source 2324 may be, for example, a driving motor or an air cylinder. Thus, according to the above implementation manner, in practical applications, when the first clamping arm 2321 needs to be clamped, the first rack serving as the first gear driving member 2323 is driven by the driving motor or the cylinder serving as the first driving source 2324 to move upward, the first rack drives the first opening and closing gear 2322 engaged at two sides to perform an outward rotation, and the first opening and closing gear 2322 drives the first clamping arm 2321 (the first opening and closing gear 2322 is connected with the first clamping arm 2321 through the rotating shaft) to perform a downward movement so as to be switched from a released state to a clamped state in the outward rotation process; on the contrary, when the first clamping arm 2321 needs to be loosened, the driving motor (or the air cylinder) serving as the first driving source 2324 drives the first rack serving as the first gear driving member 2323 to move downward, the first rack drives the first opening and closing gear 2322 engaged with the two sides to perform an internal rotation, and the first opening and closing gear 2322 drives the first clamping arm 2321 (the first opening and closing gear 2322 is connected with the first clamping arm 2321 through the rotating shaft) to perform an upward movement in the internal rotation process so as to be turned into a loosened state from a clamped state. Of course, the above is only an embodiment, and is not intended to limit the operation state of the first clamping member 232, and actually, the above-mentioned "up", "outward rotation", "downward", "inward rotation", "upward", and "loose" and "clamped" state changes may be changed according to the structure and operation manner of the first clamping arm 2321 and the structure of the first clamping arm driving mechanism.

As known to those skilled in the art, the silicon rod to be cut is formed by cutting an original long silicon rod, and the size difference between the silicon rods to be cut is bound to be different, and since the first clamp is used for clamping the silicon rod to be cut in a standing state, the influence of the size difference is mainly reflected in the carelessness that the length difference of the silicon rod to be cut on whether the first clamping member 232 in the first clamp can clamp the silicon rod to be cut correspondingly.

In order to reduce or even eliminate the risk that the first clamping member 232 may not be able to clamp the silicon rod to be cut, the first clamp may have different designs.

In one implementation, the first clamp is a fixed clamp, that is, as many first clamps 232 as possible are vertically and fixedly disposed on the reversing carrier 230, and the distance between two adjacent first clamps 232 in the first clamps 232 is as small as possible, so that the first clamps can cover silicon rods to be cut with various specifications and lengths. For example, if the length of the silicon rod to be cut is long, more first clamping members 232 on the reversing carrier 230 are used for clamping; if the length of the silicon rod to be cut is short, fewer first clamping members 232 on the reversing carrier 230 are used to participate in clamping, for example, a plurality of first clamping members 232 located below participate in clamping, while those first clamping members 232 located above and higher than the silicon rod to be cut do not participate.

In other implementations, the first clamp is a movable clamp, that is, the first clamp 232 is movably disposed in a vertical manner in the first clamp area of the reversing carrier 230, and since the first clamp is designed to be movable, the number of the first clamps 232 can be greatly reduced, and generally two or three clamps can be satisfied. Therefore, the silicon rods to be cut with various specifications and lengths can be covered by the movable clamping piece. For example, if the length of the silicon rod to be cut is long, the movably arranged first clamping members 232 are moved, and the clamping distance between the two first clamping members 232 is prolonged; if the length of the silicon rod to be cut is short, the movably arranged first clamping pieces 232 are moved, and the clamping distance between the two first clamping pieces 232 is shortened. In an implementation manner that the first clamp employs a movable clamp, in order to facilitate smooth and stable up-and-down movement of the movable clamp for adjusting the position, the first clamp mounting part 231 in the first clamp may be utilized to play a role in guiding the movably disposed first clamp 232. Specifically, the guide post structure as the first clamp mounting member 231 includes two guide posts vertically arranged and parallel to each other, and the movable block structure as the first clamp arm mounting seat 2320 is provided therein with two through holes or two clips corresponding to the two guide posts in the guide post structure. If a through hole is adopted, the movable block is sleeved on the guide post and can slide along the guide post. If a clamp is adopted, the movable block is clamped on the guide post and can slide along the guide post, wherein in practical application, the clamp can be clamped on at least one half part of the guide post.

To achieve the movement of the first clamping member 232, the movably designed first clamping member 232 may be provided with a first guiding driving mechanism. The movably designed first clamp 232 can be driven up and down along the first clamp mount 231 by a first guide drive mechanism. In one implementation, the first guidance drive mechanism may, for example, comprise: the first guide screw 2325 is vertically disposed, one end of the first guide screw 2325 is connected to the first clamping arm mounting seat 2320, the other end of the first guide screw 2325 is connected to the first guide motor 2326, and the first guide motor 2326 may be disposed on the top of the reversing carrier 230, but not limited thereto.

In an alternative embodiment, both first clamping members 232 are of a movable design, so that in practical applications, the clamping distance between the two first clamping members 232 of the movable design can be adjusted by moving them. Since the first clamping members 232 are movably designed, at least one first clamping member 232 of the two first clamping members 232 is provided with a first guiding and driving mechanism for driving the two first clamping members 232 to move along the first clamp mounting member 231. In contrast to the former alternative embodiment, in this alternative embodiment, since both the first clamping members 232 of the first clamp are movable, there is a case where the first guide driving mechanism is provided on one of the first clamping members 232 or the first guide driving mechanism is provided on both the first clamping members 232.

Taking the first guiding driving mechanism provided in the upper first clamping member 232 of the two first clamping members 232 as an example, in this case, first, the first clamping arm mount 2320 of the two first clamping members 232 and the first clamp mount 231 are movably connected, that is, the first clamping arm mount 2320 and the first clamping arm 2321 thereon in any one first clamping member 232 move up and down along the first clamp mount 231, and in addition, the provided first guiding driving mechanism includes a first guiding lead screw 2325 and a first guiding motor 2326, wherein one end of the first guiding lead screw 2325 is connected to the first clamping arm mount 2320 of the upper first clamping member 232, the other end of the first guiding lead screw 2325 is connected to the first guiding motor 2326, and the first guiding motor 2326 can be provided on the top of the reversing carrier 230. In this way, when the position of the upper first clamping member 232 needs to be adjusted, the first guide motor 2326 drives the first guide lead screw 2325 to rotate, and the first guide lead screw 2325 drives the first clamping member 232 to move up and down along the first clamp mounting member 2311310 during the rotation process, for example: the first guide motor 2326 drives the first guide lead screw 2325 to rotate clockwise, and then drives the upper first clamping member 232 to move upwards along the first clamp mounting member 231 to be away from the lower first clamping member 232, so as to increase the clamping distance between the two first clamping members 232; the first guiding motor 2326 drives the first guiding screw 2325 to rotate reversely, and then drives the upper first clamping member 232 to move downward along the first clamp mounting member 231 to approach the lower first clamping member 232, so as to reduce the clamping distance between the two first clamping members 232. So, through the first holder 232 of the movable design of control, the centre gripping interval between two first holders 232 can be adjusted to effectively centre gripping the silicon rod 101 of waiting to cut of different specification length.

In fact, under the condition that the two first clamping members 232 are both designed to be movable, the first guiding driving mechanism can be used for not only adjusting the clamping distance between the two first clamping members 232 to effectively clamp the silicon rod 101 to be cut with different specifications and lengths, but also achieving the purpose of lifting the clamped silicon rod 101 to be cut, and after the two first clamping members 232 effectively clamp the silicon rod 101 to be cut, the silicon rod 101 to be cut is lifted by driving the first clamping members 232 to move up and down. Specifically, still taking the example that the upper first clamping member 232 is provided with the first guiding driving mechanism, first, the upper first clamping member 232 moves up and down along the first clamp mounting member 231 through the first guiding driving mechanism to adjust the clamping distance with the lower first clamping member 232; then, the first clamping arm driving mechanism in each first clamping member 232 is used for driving the corresponding two first clamping arms 2321 to perform clamping action so as to smoothly and stably clamp the silicon rod 101 to be cut; subsequently, the first clamping member 232 at the upper part is driven by the first guiding driving mechanism to move upwards along the first clamp mounting member 231, at the moment, due to the action of friction force, the clamped silicon rod 101 to be cut and the first clamping member 232 at the lower part move upwards together with the same, wherein the action of friction force between the first clamping member 232 at the upper part and the silicon rod 101 to be cut is utilized when the clamped silicon rod 101 to be cut moves upwards, and the action of friction force between the silicon rod 101 to be cut and the first clamping member 232 at the lower part is utilized when the first clamping member 232 moves upwards, so that the effect of lifting the silicon rod 101 to be cut is realized. The first clamping member 232 above drives the silicon rod to be cut 101 and the first clamping member 232 below to move downwards under the driving of the first guiding and driving mechanism, which is also the same process, so as to realize the effect of descending the silicon rod to be cut 101, and the description is omitted here.

In other variations, for example, the first guide driving mechanism is disposed on the lower first clamping member 232 of the two first clamping members 232, and the structure, the disposing manner and the driving operation of the first guide driving mechanism are similar to those of the above first clamping member 232, for example, the lower first clamping member 232 moves up and down along the first clamp mounting member 231 under the driving of the first guide driving mechanism to adjust the clamping distance between the lower first clamping member 232 and the upper first clamping member 232, and the lower first clamping member 232 drives the silicon rod 101 to be cut and the upper first clamping member 232 to move up and down along the first clamp mounting member 231 under the driving of the first guide driving mechanism. For another example, the two first clamping members 232 are both provided with the first guiding driving mechanism, and the setting mode and the driving working mode of the first guiding driving mechanism and the movement mode of the two first clamping members 232 are not described herein again.

In the case that the first clamping member 232 movably disposed moves up and down along the first clamp mounting member 231 to be adapted to silicon rods to be cut of different specification lengths for clamping, in addition to the movable structural design of the first clamping member 232, the first clamping member 232 needs to be provided with the first guiding driving mechanism, and the like, it is necessary to know the specification length of the silicon rod to be cut which needs to be clamped currently. In view of this, the workpiece transfer apparatus in the present application may further include a height detector (not shown in the drawings) for detecting a height of the silicon rod to be cut, which is placed vertically, so that the movably disposed first clamping member 232 is moved upward or downward and a moving distance is determined according to the subsequent movement along the first clamp mounting member 231.

Since the second clamp is disposed in the second clamp region and is used for clamping the sliced silicon rod, and the cross section of the sliced silicon rod is rectangular in the present application, the second clamp has the same structure as the first clamp, and includes the second clamp mounting member 233 and at least two second clamping members 234, and any one of the second clamping members 234 further includes: second arm lock mount 2340 and at least two second arm lock 2341, wherein, second arm lock mount 2340 is located on second anchor clamps installed part 233, and at least two second arm lock 2341 are the activity and locate on second arm lock mount 2340. The difference is that the second clamping member of the second clamp is a square workpiece clamp as a whole, specifically, the second clamping arms 2341 constituting the second clamping member 234 are two symmetrically designed, and a single second clamping arm 2341 is designed to have a single straight clamping surface (see fig. 4 and 5), and further description of other structures of the second clamp is omitted here.

Referring to fig. 2, as shown in the figure, the wire-cutting device is disposed above the at least two silicon rod bearing tables 21 and is used for cutting a silicon rod to be cut, in an embodiment, the wire-cutting device includes a wire-cutting support 241 and a wire-cutting unit 25 disposed on the wire-cutting support 241, and the wire-cutting unit 25 is supported above the at least two silicon rod bearing tables 21 by the wire-cutting support 241.

In one embodiment, the wire cutting support 241 straddles two opposite support pillars 240 fixed on the base 20, the wire cutting support 241 is used for placing the wire cutting unit 25 and is driven by a first driving mechanism to ascend and descend to perform cutting operation, in order to provide ascending and descending direction guidance for the wire cutting unit 25, lifting guide rails 242 are arranged at two opposite sides of the two support pillars, a sliding block (not given a reference numeral) matched with the lifting guide rails 242 is arranged on the wire cutting support 241, and the first driving mechanism drives the wire cutting support 241 to drive the wire cutting unit 25 to ascend and descend along the lifting guide rails 242 to perform cutting operation of the silicon rod to be cut.

In one embodiment, the first drive mechanism is provided as a cylinder assembly or a lead screw assembly. Referring to fig. 7, which is a schematic view illustrating a first driving mechanism of the silicon rod squaring apparatus according to an embodiment of the present invention, as shown in the figure, the first driving mechanism is configured as a lead screw assembly, the lead screw assembly includes a lead screw 243 and a motor 244, one end of the lead screw 243 is connected to the wire cutting support 241, and the other end of the lead screw 243 is connected to the motor 244 and is driven by the motor 244 to move the wire cutting support 241 to ascend and descend. But is not limited thereto and in other embodiments the first drive mechanism may also be a cylinder assembly.

Referring to fig. 2, as shown in the drawing, the wire cutting unit 25 includes a plurality of cutting wheel sets 251 corresponding to the number of the silicon rod loading platforms 21, each cutting wheel set 251 includes one pair of cutting wheels or two pairs of cutting wheels, a cutting line segment is formed between two cutting wheels of any pair of cutting wheels, a transition wheel 252 is disposed between two adjacent cutting wheel sets 251, and a line slot of the transition wheel 252 is in the same plane as a line slot of the cutting wheels of the cutting wheel set 251. In order to perform the cutting operation of a plurality of silicon rods to be cut simultaneously, in this embodiment, the number of the plurality of cutting wheel sets 251 is the same as that of the silicon rod bearing tables 21 located in the cutting region and corresponds to each other one by one, so that each cutting wheel set 251 cuts the silicon rod to be cut on the silicon rod bearing table 21 corresponding to the cutting wheel set 251 in the cutting operation.

In view of the complicated space layout of the cutting wheels of the conventional wire cutting device, a large number of transition wheels are required to reverse the cutting wires, so that the winding is complicated, the space occupied by the open device is large, and the manufacturing cost is high, in one embodiment, as shown in fig. 2, the plurality of cutting wheel sets 251 are arranged on the wire cutting support 241 in a linearly distributed manner.

In one case, each cutting wheel set comprises a pair of cutting wheels, the pair of cutting wheels in each cutting wheel set is sequentially arranged on the same side of the wire cutting support, only one transition wheel is arranged between the pair of cutting wheels in two adjacent cutting wheel sets to guide the cutting wire so that a cutting wire segment is formed between the two cutting wheels in each pair of cutting wheels, and the wire groove of the transition wheel and the wire groove of the cutting wheel in the adjacent cutting wheel set are positioned in the same plane, so that the cutting wire segments between the two cutting wheels of each cutting wheel set are positioned on the same straight line, and preferably, the length of each formed cutting wire segment is slightly greater than the diameter of the cross-sectional circle to be cut.

Referring to fig. 8, a schematic view of a wire cutting device having a pair of cutting wheels in each cutting wheel set of the silicon rod cutting apparatus in an embodiment of the present invention is shown, and a wire cutting unit including four cutting wheel sets is illustrated for winding, wherein the four cutting wheel sets are respectively a first cutting wheel set 251a, a second cutting wheel set 251b, a third cutting wheel set 251c and a fourth cutting wheel set 251d, a first transition wheel 252a is disposed between the first cutting wheel set 251a and the second cutting wheel set 251b, a second transition wheel 252b is disposed between the second cutting wheel set 251b and the third cutting wheel set 251c, a third transition wheel 252c is disposed between the third cutting wheel set 251c and the fourth cutting wheel set 251d, and a single continuous cutting wire is sequentially wound around the pair of cutting wheels of the first cutting wheel set 251a, so as to form a first cutting line segment L10 on the pair of cutting wheels 251a of the first cutting wheel set 251a, then, the cutting wire is guided by the first transition wheel 252a and then sequentially wound around a pair of cutting wheels of the second cutting wheel set 251b, a second cutting wire segment L20 is formed on the pair of cutting wheels of the second cutting wheel set 251b, the cutting wire is guided by the second transition wheel 252b and then sequentially wound around a pair of cutting wheels of the third cutting wheel set 251c, a third cutting wire segment L30 is formed on the pair of cutting wheels of the third cutting wheel set 251c, and finally, the cutting wire is guided by the third transition wheel 252c and sequentially wound around a pair of cutting wheels of the fourth cutting wheel set 251d, so that a fourth cutting wire segment L40 is formed and then the cutting wire is led out. In this case, the wire cutting unit performs one-time pressing cutting, and can simultaneously complete cutting of one axial section of four silicon rods to be cut, and in one-time squaring operation, the cutting process of the four axial sections needs to be executed, and when one axial section is cut, the silicon rod bearing table 21 needs to be rotated (rotated by 90 degrees each time) by the rotating mechanism 210 of the silicon rod bearing table 21 to adjust the to-be-cut surface of the silicon rod to be cut.

Under another situation, each cutting wheel set comprises two pairs of cutting wheels, the two pairs of cutting wheels in each cutting wheel set are respectively and sequentially arranged on two opposite sides of the wire cutting support, a guide wheel set is further arranged on the wire cutting support to reverse the cutting lines so as to guide the cutting lines from the cutting wheels on one side of the wire cutting support to the cutting wheels on the other side of the wire cutting support, a transition wheel set is arranged between two adjacent cutting wheel sets to guide the cutting lines, each transition wheel set comprises two transition wheels, one transition wheel guides one pair of cutting wheels in the two adjacent cutting wheel sets, the other transition wheel guides the other pair of cutting wheels in the two adjacent cutting wheel sets, so that a cutting line segment is formed between the two cutting wheels in any pair of cutting wheels, and the line grooves of the transition wheels positioned on the same side and the line grooves of the cutting wheels are positioned in the same plane so that the cutting line segments between the two cutting wheels positioned on the same side in the plurality of cutting wheel sets In the same line, the length of each cutting line segment formed is preferably slightly greater than the diameter of the cross-sectional circle of the silicon rod to be cut.

Referring to fig. 9 to 11, fig. 9 is a schematic view of a wire cutting device in an embodiment of a silicon rod extracting apparatus according to the present application, wherein each cutting wheel set has two pairs of cutting wheels; fig. 10 is a schematic side view of fig. 9, fig. 11 is a schematic side view of a wire-cutting device of the silicon rod-cutting apparatus according to an embodiment of the present invention, in which each cutting wheel set of the wire-cutting device has two pairs of cutting wheels, and fig. 11 is a schematic side view of a wire-winding guide wheel, and the wire-winding guide wheel is illustrated by illustrating that the wire-cutting device includes four cutting wheel sets, i.e., a first cutting wheel set 251a, a second cutting wheel set 251b, a third cutting wheel set 251c and a fourth cutting wheel set 251d, a first transition wheel set is disposed between the first cutting wheel set 251a and the second cutting wheel set 251b, a second transition wheel set is disposed between the second cutting wheel set 251b and the third cutting wheel set 251c, a third transition wheel set is disposed between the third cutting wheel set 251c and the fourth cutting wheel set 251d, and a guide wheel set 253 is disposed between two sides of the wire-cutting support to change the direction of the cutting wire from the cutting wheel on the On the cutting wheel on the other side of the cutting support 241. The cutting wire is wound from one side of the wire cutting support, sequentially around the pair of cutting wheels 251a 'of the first cutting wheel set 251a to form a first cutting wire segment L11 on the pair of cutting wheels 251 a' of the first cutting wheel set 251a, then guided through the transition wheel 252a 'of the first transition wheel set to form a second cutting wire segment L21 on the pair of cutting wheels 251 b' of the second cutting wheel set 251b, then guided through the transition wheel 252b 'of the second transition wheel set to sequentially wind the pair of cutting wheels 251 c' of the third cutting wheel set 251c, a third cutting wire segment L31 on the pair of cutting wheels 251c 'of the third cutting wheel set 251c, and finally guided through the transition wheel 252 c' of the third transition wheel set to wind the pair of cutting wheels 251d 'of the fourth cutting wheel set 251 d' After forming the fourth cutting line segment L41, the cutting line sequentially passes through the guiding wheels 253a, 253b, 253c of the guiding wheel set 253, the guiding wheels 253c guide the cutting line from the other pair of cutting wheels 251d ″ of the guiding wheel set 251d 'on the other side of the guiding wheel set 251d on the pair of cutting wheels 251 d' of the fourth cutting wheel set 251d on one side of the wire cutting support 241, after forming the fifth cutting line segment L42 on the other pair of cutting wheels 251d ″ of the fourth cutting wheel set 251d, the cutting line is sequentially wound around the other pair of cutting wheels 251c ″ of the third cutting wheel set 251c after guiding the cutting line through the other pair of transition wheels 252c ″ of the third transition wheel set, and after forming the sixth cutting line segment L32 on the other pair of cutting wheels 251c ″ of the third cutting wheel set 251c, the cutting line is sequentially wound around the other pair of cutting wheels 251b ″ of the second cutting wheel set 251b after guiding the cutting line segment L251 b ″ of the second transition wheels 252b ″ of the second transition wheel set, after forming a seventh cutting line segment L22 on the other pair of cutting wheels 251b ″ of the second cutting wheel set 251b, then, the cutting wire is guided around the other transition wheel 252a "" of the first transition wheel set and then sequentially wound around the other pair of cutting wheels 251a "" of the first cutting wheel set 251a, after forming an eighth cutting line segment L12 on another pair of cutting wheels 251a ″ of the first cutting wheel set 251a, the first cutting line segment L11 and the eighth cutting line segment L12 are two cutting line segments of the first cutting wheel set, the second cutting line segment L21 and the seventh cutting line segment L22 are two cutting line segments of the second cutting wheel set, the third cutting line segment L31 and the sixth cutting line segment L32 are two cutting line segments of the third cutting wheel set, the fourth cutting line segment L41 and the fifth cutting line segment L42 are two cutting line segments of the fourth cutting wheel set, and the two cutting line segments of each cutting wheel set are used for cutting two parallel axis cut surfaces of the silicon rod to be cut. Under the condition, the linear cutting unit performs one-time pressing cutting, can simultaneously complete the cutting of two parallel shaft sections of four silicon rods to be cut, needs to execute the flow of the two parallel shaft sections twice in one-time squaring operation, and rotates (rotates by 90 degrees) the silicon rod bearing table through the rotating mechanism of the silicon rod bearing table after completing the cutting of the two parallel shaft sections once so as to adjust the sections to be cut of the silicon rods to be cut. It should be noted that, in order to ensure that the silicon rod after being cut is entirely rectangular, the horizontal distance between the wire grooves of the two pairs of cutting wheel sets of the cutting wheel sets is less than or equal to the side length of the inscribed square of the cross-sectional circle of the silicon rod to be cut, so as to ensure that the intersection point of the cutting lines when the wire cutting unit performs horizontal axis cutting on the silicon rod twice is located in the cross-sectional circle of the silicon rod to be cut (including the condition that the intersection point is located on the circumference of the cross-sectional circle).

In one embodiment, referring to fig. 2, as shown in the figure, the wire cutting device further includes a take-up drum 255 and a pay-off drum 254 disposed on the base 20, wherein the take-up drum 255 and the pay-off drum 254 are used for taking up and paying off the cutting wire in the squaring operation.

The wire cutting device can be used for cutting the silicon rod to be cut to form the cut silicon rod and the flaw-piece. After the wire cutting device is used for a long time, the wire grooves wound with cutting wires in the cutting wheels can be abraded, and the cutting effect is influenced. Therefore, a plurality of wire grooves are distributed on the cutting wheel of the general wire cutting device, the groove replacement operation is needed, the cutting line is changed to be wound around other wire grooves of the cutting wheel, and at the moment, the moving distance of the cutting wheel is needed to be adjusted according to the groove distance between the other wire grooves and the current wire groove.

In view of this, the silicon rod squaring apparatus further comprises an automatic groove changing mechanism. Referring to fig. 12 and 13, fig. 12 is a schematic structural view illustrating a matching structure of an automatic groove changing mechanism and a linear cutting device in an embodiment of a silicon rod squaring apparatus according to the present application; fig. 13 is a schematic cross-sectional view of an automatic groove-changing mechanism in an embodiment of a silicon rod squaring apparatus of the present application, as shown in the figure, in the embodiment, the automatic groove-changing mechanism 29 includes a cutting wheel 290, a groove-changing cylinder 292 and a positioning member 291, the cutting wheel includes a first wire groove and a second wire groove for winding a cutting line, the groove-changing cylinder is linked with the cutting wheel 290 for driving the cutting wheel 290 to move along an axial direction thereof so as to move the cutting line from the one wire groove to another adjacent wire groove, the groove-changing cylinder 292 includes a cylinder body and a first guide rail 293 and a second guide rail 294 which are opened on the cylinder body and are mutually communicated, a fall between the first guide rail 293 and the second guide rail 294 corresponds to a groove distance between the first wire groove and the second wire groove, the positioning member 291 is relatively slidably disposed in the first guide rail 293 or the second guide rail 294, for sliding within the first guide rail 293 or the second guide rail 294 when the groove changing drum 292 moves axially, so as to drive the groove changing drum 292 to rotate, so as to force the cutting line on the cutting wheel 290 to switch from the first line groove to the second line groove.

Referring to fig. 12, 13 and 14, fig. 14 is a partial enlarged view of a portion B of fig. 13, and the automatic slot changing mechanism will be described in detail below by taking an example in which the cutting wheel includes two wire slots.

The cutting wheel 290 includes a first and a second wire groove (not shown) for winding a cutting wire. In one embodiment, the cutting wheel 290 includes a first slot on which the cutting wire is initially wound, and a second slot adjacent to the first slot and located at the rear side of the first slot, with the direction of the arrow shown in fig. 13 as front and the direction opposite to the arrow as rear.

The groove changing cylinder 292 is linked with the cutting wheel 290 and used for driving the cutting wheel 290 to move along the axial direction of the cutting wheel 290 so as to move the cutting line from one wire groove to another adjacent wire groove, the groove changing cylinder 292 comprises a cylinder body, and a first guide rail 293 and a second guide rail 294 which are arranged on the cylinder body and are communicated with each other, and the fall between the first guide rail 293 and the second guide rail 294 corresponds to the groove distance between the first wire groove and the second wire groove.

The positioning member 291 is disposed in the first guide rail 293 or the second guide rail 294 in a relatively slidable manner, and is configured to slide in the first guide rail 293 or the second guide rail 294 to drive the groove changing drum 292 to rotate when the groove changing drum 292 moves in the axial direction, so as to force the cutting line on the cutting wheel 290 to be switched from the first line groove to the second line groove.

In one embodiment, the slot changing cylinder 292 is disposed on the wire cutting support 241 of the cutting frame 24, a positioning shaft (not shown) is disposed at a front end of the slot changing cylinder 292, the cutting wheel 290 is rotatably disposed on the positioning shaft through a bearing, and the axial movement of the slot changing cylinder 292 drives the cutting wheel 290 to move axially to move the cutting wire from the first wire slot to the second wire slot.

In one embodiment, the groove changing cylinder 292 is driven by a driving device 295 to move in a telescopic manner along the axial direction thereof, the driving device 295 includes a cylinder assembly or a screw rod assembly driven by a motor, in this embodiment, the driving device 295 is configured as a cylinder assembly, the cylinder assembly includes a cylinder and a telescopic rod driven by the cylinder to extend and retract, and the rear end of the groove changing cylinder 292 is disposed on the telescopic rod through a bearing, so that the groove changing cylinder 292 can be pushed by the cylinder assembly to move along the axial direction thereof and can be forced to rotate. However, the driving device 295 may also be a screw assembly driven by a motor, in other embodiments, the rear end of the slotted cylinder 292 is disposed on the screw assembly through a bearing, and the motor drives the screw assembly to extend or retract so that the slotted cylinder 292 moves along the axial direction thereof and can be forced to rotate at the same time.

In order to realize automatic slot changing, the moving distance of the cutting wheel 290 is adjusted to be the slot pitch between the first slot and the second slot each time, so the fall height H between the first guide rail 293 and the second guide rail 294 corresponds to the slot pitch between the first slot and the second slot, in an embodiment, the first guide rail 293 has a first falling end 2930, the first falling end 2930 has a first distance from the first slot, the second guide rail 294 has a second falling end 2940, the second falling end 2940 has a second distance from the second slot, and the first distance is equal to the second distance. As such, the fall H between the first guide rail 293 and the second guide rail 294 is equal to the slot distance between the first line slot and the second line slot.

In order to facilitate the relative sliding of the positioning element 291 from the first seating end 2930 of the first guide rail 293 to the second seating end 2940 of the second guide rail 294 for automatic slot changing, in an embodiment, a transition end 296 is disposed between the first seating end 2930 and the second seating end 2940.

To further facilitate rapid sliding movement of the positioning member 291 from the first drop end 2930 to the transition end 296 and from the transition end 296 to the second drop end 2940, an upstream segment 297 is provided between the first drop end 2930 and the transition end 296 to provide an upstream path for the positioning member 291, and a downstream segment 298 is provided between the transition end 296 and the second drop end 2940 to provide a downstream path for the positioning member 291. In one embodiment, the upper segment 297 is contracted from the first landing end to the transition end, and the lower segment 298 is contracted from the transition end to the second landing end.

Preferably, in order to guide the positioning member 291 to slide rapidly and accurately through the transition end 296, the transition end 296 has a first channel 2960 communicating with the ascending segment 297, the transition end 296 has a second channel 2961 communicating with the descending segment 297, and the width of the first channel 2960 is smaller than that of the second channel 2961.

To avoid the positioning member 291 sliding back at the transition end 296, the positioning member 291 cannot slide smoothly along the first channel 2960 of the transition end 296 toward the second channel 2961 of the transition end 296 to enter the descending segment 298, and then moves from the first channel 2960 of the transition end 296 to the ascending segment 297 to return to the first falling end 2930, so that automatic groove replacement cannot be achieved. In one embodiment, the transition end 296 is located in the second channel 2961 near the vertex of the cutting wheel 290, that is, the horizontal distance between the first channel 2961 and the cutting wheel 290 is greater than the horizontal distance between the second channel 2961 and the cutting wheel 290, so that the operation state of the positioning element 291 sliding from the first channel 2960 to the second channel 2961 is an upward slope, and when the slotted cylinder 292 moves backwards along the axial direction thereof, the positioning element 291 sliding from the first channel 2960 to the second channel 2961 simultaneously rotates the slotted cylinder 292 to realize the switching of the positioning element from the first guide rail 293 to the second guide rail 294. Similarly, to avoid the positioning member 291 from sliding smoothly to the ascending section 297 at the first landing end 2920, the projection of the first landing end 2930 away from the vertex of the cutting wheel 290 is located in the ascending section 297.

The positioning member 291 is fixedly connected to a fixing seat 299, and the fixing seat 299 is connected to a wire cutting support 241 of a wire cutting device of the multi-station cutting apparatus, so as to dispose the positioning member 291 in the first guide rail 293 or the second guide rail 294. In an embodiment, the fixing base 299 is configured to be sleeved with a cover body of the groove changing cylinder 292, one end of the positioning element 299 is fixed on a cylinder wall of the groove changing cylinder 292, the other end of the positioning element 299 extends into the first guide rail 293 or the second guide rail 294, and when the groove changing cylinder 292 is driven to move along an axial direction thereof, the positioning element 291 slides in the first guide rail 293 or the second guide rail 294. However, the fixing seat 299 is not limited to this, in other embodiments, the fixing seat 299 may also be configured as a fixing rod disposed in the slot changing cylinder 292, one end of the positioning element 291 is connected to an outer wall of the fixing rod, and the other end of the positioning element 291 extends into the first guide rail 293 or the second guide rail 294, and when the slot changing cylinder 292 is driven to move along the axial direction thereof, the positioning element 291 slides in the first guide rail 293 or the second guide rail 294.

Referring to fig. 15a to 15d, fig. 15a to 15d are schematic diagrams illustrating the structure of the movement process of the automatic groove changing mechanism in an embodiment of the silicon rod squaring apparatus of the present application, as shown in the drawings, the cutting line is initially located in the first groove of the cutting wheel 290, and correspondingly, the positioning element 291 is located at the first drop end 2930 (shown in fig. 15 a) of the first guide rail 293, when the automatic groove changing mechanism performs groove changing, the groove changing cylinder 292 is first driven to move backward along the axial direction thereof (arrow direction in fig. 15 a) so that the positioning element 291 enters the first drop end 2930 to move upward from the ascending section 297 to the first channel 2960 (shown in fig. 15 b) of the transition end, and then the groove changing cylinder 292 is driven to continue to move backward along the axial direction thereof so that the positioning element 291 cooperates with the transition end 296 to force the groove changing cylinder to rotate (arrow direction in fig. 15 b), so that the positioning element 291 slides from the first channel 2960 of the transition end to the second channel 2961 (shown in fig. 15 b) 15 c) and finally, the slotted cylinder 292 is driven to move forward along the axial direction thereof (as shown by the arrow in fig. 15 c) so that the positioning member 291 slides down to the second drop end 2940 (as shown in fig. 15 d) from the second passage 2961 at the transition end into the descending segment 298, thereby the slotted cylinder 292 is moved forward along the axial direction thereof by the distance between the first and second wire slots, so that the cutting wire is switched from the first wire slot to the second wire slot.

It should be noted that, in the above embodiment, the cutting wheel includes two wire slots, which are a first wire slot and a second wire slot, respectively, and the slot changing cylinder is provided with two guide rails, which are a first guide rail and a second guide rail, respectively, but the number of the wire slots included in the cutting wheel and the number of the guide rails provided in the slot changing cylinder are not limited thereto.

In other embodiments, the cutting wheel includes three wire slots, and for example, the cutting wheel includes a third wire slot besides the first wire slot and the second wire slot in the above embodiments, and the third wire slot is disposed adjacent to the rear side of the second wire slot.

The number of the guide rails arranged on the groove changing drum is consistent with that of the wire grooves, and is set to be three, for example, the groove changing drum is provided with a third guide rail besides the first guide rail and the second guide rail in the above embodiment, the third guide rail is communicated with the second guide rail, and the fall between the third guide rail and the second guide rail corresponds to the groove distance between the second wire groove and the third wire groove, that is, the third guide rail has a third fall end, the third fall end has a third distance with the third wire groove, and the third distance is equal to the second distance.

In order to facilitate guiding the positioning element to relatively slide from the second falling end of the second guide rail to the third falling end of the third guide rail so as to switch the cutting line from the second line slot to the third line slot, in the embodiment, a transition end is also arranged between the second falling end and the third falling end, similarly, an ascending section is arranged between the second falling end and the transition end, the ascending section has a side wall with a first gradient, a descending section is arranged between the transition end and the third falling end, and the descending section has a side wall with a second gradient.

In order to guide the positioning piece to rapidly and accurately slide through the transition end, the transition end is provided with a first channel communicated with the ascending section and a second channel communicated with the descending section, and the width of the first channel is smaller than that of the second channel.

In order to avoid the situation that the positioning element slides back at the transition end, namely, the positioning element cannot smoothly slide to the second channel of the transition end along the first channel of the transition end to enter the descending section, and enters the ascending section from the first channel of the transition end to return to the second positioning end, the cutting line cannot be moved from the second line slot to the third line slot. In an embodiment, the transition end is located in the second channel near the vertex of the cutting wheel, that is, the horizontal distance between the first channel and the cutting wheel is greater than the horizontal distance between the second channel and the cutting wheel, so that the positioning element slides from the first channel to the second channel in an upward slope state, and when the slot changing drum moves backwards along the axial direction of the slot changing drum, the positioning element slides from the first channel of the transition end to the second channel and simultaneously drives the slot changing drum to rotate so as to realize the switching of the positioning element from the second guide rail to the third guide rail. Similarly, in order to avoid the situation that the positioning element cannot smoothly slide to the transition end at the second drop end, the projection of the second drop end far away from the vertex of the cutting wheel is positioned in the first channel.

However, the number of the slots on the cutting groove is not limited to 4, 5, and so on, in an actual implementation, the cutting wheel may further include a plurality of slots, and the slot changing drum may further include a plurality of mutually communicated guide rails whose number is consistent with that of the slots, and of course, as the number of the guide rails increases, the diameter of the slot changing drum needs to be increased, which is not described herein again.

Generally, the silicon rod to be cut has a relatively large self weight, and can be vertically placed on the silicon rod bearing table stably through the self weight, but in the subsequent silicon rod cutting operation, the silicon rod to be cut is subjected to the pulling action of the cutting line in the linear cutting unit, so that the risks of disturbance, dislocation, even overturning and the like are caused. In order to avoid the occurrence of the above various risks, a silicon rod pressing device capable of doing lifting motion is further arranged above the silicon rod bearing table in the cutting area, the silicon rod pressing device is erected on the lifting guide rail and located above the linear cutting device, namely, the silicon rod pressing device and the linear cutting device share the same lifting guide rail, and the silicon rod pressing device is used for pressing the top of the silicon rod to be cut when the silicon rod to be cut on the silicon rod bearing table in the cutting area is cut by the linear cutting device.

Referring to fig. 16, which is a schematic structural view illustrating a silicon rod pressing device in an embodiment of the silicon rod squaring apparatus according to the present application, as shown in the figure, the silicon rod pressing device 26 includes a pressing support 260 and a pressing unit 261 disposed on the pressing support and corresponding to the silicon rod support 21 located in the cutting region. A sliding block 262 matched with the lifting guide rail 242 is fixed on the pressing support 260, the pressing support 260 is arranged on the supporting column 240 of the cutting machine frame 24 in a liftable mode through the matching of the sliding block 262 and the lifting guide rail 242 and is located above the linear cutting device, and the pressing unit 261 is arranged on the pressing support 260 and can lift along with the pressing support 260 to release or press the silicon rod to be cut on the silicon rod bearing table 21 in the cutting area.

Influenced by the manufacturing process, the height of the silicon rods to be cut on the silicon rod bearing table 21 in the cutting area is not completely consistent, and the pressing units 261 descend along with the pressing support 260, so that each pressing unit 261 cannot be pressed tightly on the silicon rod to be cut borne by the corresponding silicon rod bearing table 21. In view of this, the pressing unit 261 includes a pressing block 2610 and a driving structure driving the pressing block to perform an elevating movement. In one embodiment, the driving mechanism is provided as a cylinder assembly, the cylinder assembly comprises a cylinder 2611 and an expansion member 2612 connected with the cylinder, the briquetting 2610 is arranged at the bottom of the expansion member 2612 (i.e. the expansion member 2612 faces to the surface of the silicon rod carrying table 21 positioned at the cutting area), and the cylinder 2611 drives the expansion member 2612 to carry out lifting motion to release or press the silicon rod to be cut positioned on the silicon rod carrying table 21 at the cutting area.

Since the silicon rod bearing table 21 has the rotating mechanism 210, the silicon rod to be cut positioned thereon can be driven to rotate to adjust the surface to be cut. In order to cooperate with the rotation mechanism 210 of the silicon rod carrier 21, in one embodiment, the press piece 2610 is connected with the drive mechanism by a rotation shaft (not shown). Specifically, a bearing (not shown) is arranged at the bottom of the telescopic member 2612 of the cylinder assembly, the pressing block 2610 is provided with a rotating shaft matched with the bearing, the pressing block 2610 is rotatably arranged on the bearing of the telescopic member 2612 through the rotating shaft, so that the silicon rod bearing platform 21 drives the silicon rod to be cut to rotate when the silicon rod to be cut is pressed by the pressing block 2610, and the pressing block 2610 can also be matched with the silicon rod to be cut to rotate.

In order to better protect the silicon rod to be cut, a buffer pad (not shown) may be disposed between the pressing block 2610 and the silicon rod to be cut, and the buffer pad is fixed to a pressing surface of the pressing block 2610 (the pressing surface is the lower surface of the pressing block).

In order to simplify the structure of the silicon rod squaring apparatus of the present application and reduce the manufacturing cost of the apparatus, in one embodiment, the silicon rod pressing device 26 is attached to the wire cutting support 241 for mounting the wire cutting unit by its own weight and is moved up and down along the lifting guide 242. The first driving mechanism drives the wire cutting support 241 to drive the wire cutting unit 25 to descend along the lifting guide rail 242, the silicon rod pressing device 26 is attached to the wire cutting support 241 and also descends along the lifting guide rail 242 to the top of the silicon rod to be cut borne by the silicon rod bearing table 21 located in the cutting area, the driving structure in the pressing unit 261 drives the pressing block 2610 to press the corresponding silicon rod to be cut, and the wire cutting support 241 is driven by the first driving mechanism to drive the wire cutting unit 25 to descend to cut the silicon rod to be cut. In order to prevent the silicon rod pressing device 26 from further descending along the wire cutting support 241 to damage the silicon rod to be cut, a guide rail locking unit 263 is disposed on the pressing support 260 of the silicon rod pressing device 26, and the guide rail locking unit 263 is used to position the silicon rod pressing device 26 at a predetermined position on the lifting guide rail 242, for example, the predetermined position is that the pressing unit 261 in the silicon rod pressing device 26 is located 0-5 cm above the silicon rod to be cut corresponding to the pressing unit 261, but with this as a limit, only the pressing unit 261 needs to be located above the silicon rod to be cut corresponding to the pressing unit 261, and when the pressing block 2610 in the pressing unit 261 is driven to descend, the pressing unit can press the top surface of the silicon rod to be cut corresponding to the pressing unit.

In one embodiment, the rail locking unit 263 adopts a pneumatic rail locking device, and specifically, the pneumatic rail locking device in this embodiment includes a locking clamp block which is matched with the lifting rail 242 and an air cylinder which drives the locking clamp block to act, the locking clamp block is arranged on the pressing bracket 260 in the silicon rod pressing device 26, when the silicon rod pressing device 26 and the wire cutting support 241 are lowered to a predetermined position, the air cylinder drives the locking clamp block on the pressing bracket to clamp the lifting rail 242 to position the silicon rod pressing device 26 at the predetermined position, the pressing unit 261 in the silicon rod pressing device 26 presses the corresponding silicon rod to be cut, the wire cutting support 241 is continuously driven by the driving mechanism to drive the wire cutting unit 25 to descend to complete the cutting of the silicon rod to be cut, after the cutting operation of the silicon rod to be cut is completed, when the wire cutting support 241 is driven by the first driving mechanism to move the wire cutting unit 25 to the position where the silicon rod pressing device 26 is positioned, the air cylinder drives the locking clamp blocks on the pressing bracket 260 to loosen the lifting guide rail 242 so that the silicon rod pressing device 26 continuously rises while being attached to the wire cutting support 241.

In another embodiment, the silicon rod pressing device 26 is mounted on the lifting rail 242 and is driven by a second driving mechanism to move up and down along the lifting rail 242, and the second driving mechanism is configured as a cylinder assembly or a screw rod assembly driven by a motor. In practical application, the first driving mechanism drives the wire cutting support 241 to descend along with the wire cutting unit 25, when the second driving mechanism drives the silicon rod pressing device 26 to descend to a preset position, the second driving mechanism stops driving the silicon rod pressing device 26 to enable the silicon rod pressing device 26 to be positioned at the preset position to press the silicon rod to be cut, the first driving mechanism continues to drive the wire cutting support 241 to descend along with the wire cutting unit 25 to complete cutting of the silicon rod to be cut, after the cutting operation of the silicon rod to be cut is completed, the first driving mechanism drives the wire cutting support 241 to ascend along with the wire cutting unit 25, and the second driving mechanism drives the silicon rod pressing device 26 to ascend.

In addition, in order to realize complete cutting of the silicon rod to be cut and avoid damage of the cutting line due to blockage, in one embodiment, the silicon rod bearing platform is a table structure with a circular section or a rectangular section, and the size of a bearing surface in contact with the silicon rod in the table structure is larger than the section of an already-cut silicon rod formed after cutting the silicon rod to be cut by a cutting method, so that the table structure is provided with a cutting groove for the cutting line to enter, and particularly, the table structure is provided with four cutting grooves for the cutting line to enter. Therefore, when the linear cutting device descends along with the linear cutting support, the cutting line section formed in the cutting device performs cutting on the silicon rod to be cut borne by the silicon rod bearing platform positioned in the cutting area, when the cutting line section reaches the bottom of the silicon rod to be cut, the cutting line section can descend without hindrance until penetrating through the silicon rod to be cut, complete cutting of the silicon rod to be cut is achieved, and the structure of the silicon rod bearing platform is not limited by the cutting line section.

In other embodiments, the silicon rod support platform is a table structure with a rectangular cross section, and the size of a support surface of the table structure contacting with the silicon rod is slightly smaller than the cross section of the cut silicon rod formed after the cutting of the silicon rod to be cut. Therefore, the wire cutting unit in the wire cutting device descends along with the cutting rack relative to the base, the cutting line section formed in the cutting unit performs cutting on the silicon rod to be cut borne by the silicon rod bearing platform in the cutting area, when the cutting line section reaches the bottom of the silicon rod to be cut, the cutting line section can descend without obstruction until penetrating through the silicon rod to be cut, and the silicon rod to be cut is completely cut.

As described above, the silicon rod bearing table is a table structure with a rectangular cross section, and the size of the bearing surface in the table structure, which is in contact with the silicon rod, is slightly smaller than the cross section of the cut silicon rod formed after the cutting of the silicon rod to be cut, so that the cutting line segment in the linear cutting unit can perform the cutting of the silicon rod to be cut, which is borne by the silicon rod bearing table located in the cutting area, without hindrance. However, such a design also brings with it a problem: after the silicon rod to be cut on the silicon rod bearing table in the cutting area completes the cutting operation, the flaw-piece formed after cutting may have the risk of falling or overturning and the like because of no corresponding support. Therefore, this application silicon rod evolution equipment still includes the flaw-piece and pushes up support mechanism for push up and wait to cut the flaw-piece that the silicon rod formed after evolution cutting is carried out.

The disclosed flaw-piece jacking mechanism of this application locates the periphery of silicon rod plummer, and the wire cutting device carries the silicon rod of treating that the silicon rod plummer in cutting area bears and carries out the cutting back once, can form the flaw-piece on the side of being cut. Therefore, in practical application, a flaw-piece jacking mechanism is correspondingly arranged on each of four sides of the periphery of the silicon rod bearing table with the rectangular-section table-board structure to jack a corresponding flaw-piece. Through the flaw-piece jacking mechanism disclosed in the application, the flaw-piece formed after the cutting operation of the silicon rod to be cut is carried out by the warp cutting device can be jacked, the relative displacement between the flaw-piece and the cut silicon rod is avoided, the situation that the cutting line segment in the linear cutting device collapses when penetrating out the silicon rod to be cut is prevented, the flaw-piece can be prevented from dropping, overturning and the like, and the cut silicon rod is damaged due to the fact that the flaw-piece touches and the like.

In one embodiment, referring to fig. 17, which is a schematic structural view of a flaw-piece jacking mechanism in one embodiment of the silicon rod extracting apparatus of the present application, as shown in the figure, the flaw-piece jacking mechanism 27 includes a supporting member including a base 270 connected to one side surface of the silicon rod supporting table 21 and a jacking portion 271 extending upward from the base. In this embodiment, the base 270 is configured as a flat plate structure adapted to a side surface of the silicon rod carrying table 21, but not limited thereto, the base 270 may also be configured as a curved plate structure or other special-shaped structures, the top support portions 271 are configured as two top pillars located at two sides of the base 270, the extending height of the top pillars is consistent with the height of the carrying surface of the silicon rod carrying table 21, and in practice, the top support portions 271 may also be top plates or top rods extending upward from the base 270. When the linear cutting device performs cutting on the silicon rod to be cut on the silicon rod bearing table 21, the corresponding flaw piece can be supported by the supporting piece, so that the situation that the cutting line segment in the linear cutting device is broken when penetrating out of the silicon rod to be cut is effectively prevented, and the flaw piece can be prevented from falling and overturning.

In another embodiment, the flaw-piece jacking mechanism includes a movable support member and a locking control member. In this embodiment, the movable supporting member includes a movable base connected to one side surface of the silicon rod supporting table, a supporting portion extending upward from the movable base, and a power generation structure for providing the supporting portion to move up and down. In one embodiment, the movable base may be, for example, a planar plate structure adapted to a side surface of the silicon rod support table, but is not limited thereto, and the movable base may also be, for example, a curved plate structure or other special-shaped structure. The top support part is at least two top rods extending upwards from the movable base, but not limited to this, and the top support part may also be a top plate or a top pillar extending upwards from the movable base, for example. The power generating structure comprises two support legs arranged on the movable base and two springs respectively sleeved on the two support legs, but not limited thereto, and the power generating structure can also adopt structures such as a torsion spring, an elastic sheet and the like. The support legs and the connected ejector rods can move up and down relative to the silicon rod bearing table by utilizing the elasticity of the springs. In this embodiment, the locking control member is used for controlling the movable supporting member in a locking state when the movable supporting member abuts against the bottom of the silicon rod to be cut. In an initial state, the ejector rod is exposed on the bearing surface of the silicon rod bearing platform under the action of the support legs and the springs, when a silicon rod to be cut is placed, the ejector rod overcomes the elasticity of the springs to move downwards after being pressed by the silicon rod to be cut until the silicon rod to be cut is completely placed on the bearing surface of the silicon rod bearing platform, at the moment, the electromagnetic lock serving as the locking control piece is electrified, and the electromagnetic lock tightly adsorbs the movable base in the movable bearing piece through strong magnetic force generated by an electromagnetic generating principle, so that the ejector rod is controlled in a locking state. When the linear cutting device performs cutting and squaring on the silicon rod to be cut, which is borne by the silicon rod bearing platform corresponding to the cutting area in the silicon rod conversion device, the movable bearing piece in the locking state can support the corresponding flaw-piece, so that the situation that the cutting wire net in the linear cutting unit is broken when penetrating out the silicon rod to be cut can be effectively prevented, and the flaw-piece can be prevented from falling, overturning and the like.

According to the aforesaid can know, treat that the cutting silicon rod can form the flaw-piece after the evolution cutting, in order not to hinder the rising of wire cutting device, need in time to unload to the flaw-piece, to the unloading of flaw-piece, general flaw-piece unloading mode still mostly breaks away from the flaw-piece in the silicon rod of evolution and remove it from silicon rod evolution equipment by operating personnel manual operation, and is not only inefficient, and can make the flaw-piece collide and increase the risk that the silicon rod of evolution harmed with the silicon rod of evolution in handling. In view of this, the silicon rod squaring device of the present application further includes a flaw-piece discharging device for discharging a flaw-piece formed after the silicon rod to be cut is squared and cut by the wire cutting device.

Referring to fig. 18, which is a schematic structural view illustrating a flaw-piece lifting mechanism in an embodiment of the present invention applied to a silicon rod extracting apparatus, the flaw-piece discharging apparatus 28 includes a flaw-piece lifting mechanism 280 for lifting the flaw-piece to make the top end of the flaw-piece 10 protrude from the cut silicon rod. The flaw-piece lifting mechanism 280 comprises a jacking part 2800 arranged on the wire cutting support 241, the jacking part 2800 is driven by a telescopic part 2801 to do telescopic movement, and the jacking part 2800 is controlled to do stretching movement and then support the bottom of the flaw-piece 10 to jack the flaw-piece 10.

In an embodiment, jacking piece 2800 includes support plate and bearing board, support plate certainly the bottom of bearing board upwards extends, and furtherly, support plate more can be with the arc of the arc surface looks adaptation of flaw-piece 10, works as support plate supports when leaning on in flaw-piece 10, can fully contact with the arc surface of flaw-piece 10, support plate and the position of flaw-piece 10 contact for the rounding off design or in support plate will have the internal surface that contacts with flaw-piece 10 to add the blotter. The supporting plate is used for supporting the bottom of the flaw-piece 10, and further, the supporting plate can be an arched plate matched with the bottom surface of the flaw-piece 10. In other embodiments, the chord edge of the arched plate as a support plate may be additionally provided with a projection to increase the contact area with the bottom surface of the flaw-piece 10.

In an embodiment, the telescopic member 2801 may be, for example, an air cylinder with a telescopic rod, wherein the telescopic rod may be connected to the supporting plate in the lifting member 2800 through a connecting structure, and the air cylinder may drive the telescopic rod to drive the lifting member 2800 to perform telescopic motion. Here, the telescopic motion of the jacking member 2800 includes a contraction motion of the jacking member 2800 and an extension motion of the jacking member, where the contraction motion of the jacking member 2800 specifically means that the cylinder drives the telescopic rod to contract to drive the jacking member 2800 to be away from the flaw-piece 10, and the extension motion of the jacking member 2800 specifically means that the cylinder drives the telescopic rod to extend to drive the jacking member 2800 to be close to the flaw-piece 10. Of course, the telescopic component 2801 may also be implemented in other ways, for example, the telescopic component 2801 may also be, for example, a servo motor with a lead screw, where the lead screw is connected to the jacking component, and the lead screw is driven by the servo motor to rotate to drive the connected jacking component 2800 to perform telescopic motion, for example, the lead screw is driven to rotate forward to drive the jacking component 2800 to perform telescopic motion and to rotate backward to drive the jacking component 2800 to perform telescopic motion, or the lead screw is driven to rotate forward to drive the jacking component 2800 to perform telescopic motion and to rotate backward to drive the jacking component 2800 to perform telescopic motion.

In practical application, in an initial state, the telescopic rod drives the jacking member 2800 to be in a contracted state, the wire-cutting unit 25 is driven to descend along with the wire-cutting support 241 so that the cutting line formed by each cutting line segment in the wire-cutting unit 25 performs squaring cutting on the silicon rod to be cut in the cutting area until the cutting line segment penetrates through the silicon rod to be cut, one-time complete cutting of the silicon rod to be cut is completed and the flaw-piece 10 is formed, at this time, the flaw-piece lifting mechanism 280 has descended to the bottom along with the wire-cutting support 241, the cylinder drives the telescopic rod to extend so as to drive the jacking member 2800 to be close to the flaw-piece 10 until the abutting plate in the jacking member 2800 is in contact with the flaw-piece 10 and abuts against the flaw-piece 10, subsequently, the wire-cutting unit 25 is driven to ascend along with the wire-cutting support 241, the flaw-piece lifting mechanism 280 ascends along with the wire-cutting support, make the top protrusion of flaw-piece 10 in waiting to cut the silicon rod, when the top of flaw-piece 10 satisfies the settlement condition in waiting to cut the silicon rod bulge relatively, then steerable wire-electrode cutting support 241 stops rising, so, the top of flaw-piece can be regarded as the position of exerting oneself of snatching, make the flaw-piece snatched and unload, then, the cylinder drive telescopic link shrink with drive jacking piece 2800 get back to initial condition the time control wire cutting support 241 drives wire-electrode cutting unit 25 and flaw-piece hoist mechanism 280 and continues to rise to waiting to cut the silicon rod top in order to carry out next cutting operation.

In other embodiments, the lifting mechanism may include an absorbing member and a telescopic member for driving the absorbing member to perform telescopic movement, and the absorbing member is controlled by the telescopic member to abut against the hem and absorb the hem. The adsorption piece further comprises an abutting plate and an adsorption element. The abutting plate can be an arc-shaped plate matched with the arc-shaped surface of the edge leather, and can be fully contacted with the arc-shaped surface of the edge leather when the abutting plate abuts against the edge leather. The suction element may be, for example, a vacuum cup, and a plurality of vacuum cups may be arranged on a contact surface of the abutment plate to be in contact with the flaw-piece. The telescopic component can be, for example, an air cylinder with a telescopic rod or a servo motor with a screw rod, taking the air cylinder with a telescopic rod as an example, the telescopic rod can be connected with the abutting plate in the jacking piece through a connecting structure, the air cylinder can drive the telescopic rod to contract to drive the abutting plate to be away from the flaw-piece, and the air cylinder can drive the telescopic rod to extend to drive the abutting plate to be close to the flaw-piece and to be adsorbed to the flaw-piece by the adsorbing element after the abutting plate is contacted with the flaw-piece. Subsequently, the wire cutting support is driven to rise, the flaw-piece lifting mechanism and the wire cutting device rise along with the wire cutting support, and the flaw-piece lifting mechanism can drive the flaw-piece to move upwards relative to the silicon rod subjected to the cutting operation by utilizing the adsorption force, so that the top end of the flaw-piece protrudes out of the silicon rod subjected to the cutting operation.

It should be noted that, because this application silicon rod evolution equipment is provided with a plurality of cutting wheelsets and cuts a plurality of silicon rods that wait to cut simultaneously, so be provided with a plurality of flaw-piece hoist mechanisms and carry out the flaw-piece simultaneously to a plurality of silicon rods that have carried out the cutting operation and unload corresponding to a plurality of cutting wheelsets on the on-line cutting support. Under the condition that every cutting wheelset is provided with a pair of cutting wheel, the cutting formation flaw-piece is pushed down to every cutting device, is equipped with a flaw-piece hoist mechanism in order in time to unload the flaw-piece that forms in the cutting operation above a pair of cutting wheel that corresponds to every cutting wheelset on the wire-electrode cutting support. Under the condition that every cutting wheelset is provided with two pairs of cutting wheels, the linear cutting device pushes down once and cuts and forms two flaw-pieces, respectively is equipped with a flaw-piece hoist mechanism in order in time to unload the flaw-piece that forms in the cutting operation in the top that corresponds to two pairs of cutting wheels of every cutting wheelset on the wire-electrode cutting support.

The flaw-piece discharging device 28 further comprises a clamping and transferring unit 281 arranged above the silicon rod bearing table 21 in the cutting area and used for clamping the top end of the flaw-piece and lifting the flaw-piece to separate from the cut silicon rod and transfer the flaw-piece to the flaw-piece discharging area.

Referring to fig. 2, as shown in the figure, the clamping and transferring unit 281 comprises a moving mechanism 283 providing at least one direction of movement and a flaw-piece clamping mechanism 284, wherein the flaw-piece clamping mechanism 284 is connected with the moving mechanism 283 and is driven to move in at least one direction.

In one embodiment, a supporting plate 282 for supporting a clamping and transferring unit 281 is spanned at the top end of the two supporting columns 240 arranged opposite to each other on the cutter frame 24, and the clamping and transferring unit 281 is arranged on the supporting plate 282 and corresponds to the upper side of the silicon rod carrying platform in the cutting area.

In one embodiment, the edge skin clamping mechanisms 284 may be provided in a plurality in one-to-one correspondence with the silicon rod carriers located at the cutting region. In order to simplify the mechanism, reduce the manufacturing cost, and reduce the energy consumption for operation, in the embodiment, two adjacent bark clamp mechanisms 284 share one moving mechanism 283 that provides at least one direction of movement.

In an embodiment, referring to fig. 2 and 19, fig. 19 is a partial enlarged view of a portion a in fig. 2, as shown, the moving mechanism 283 for moving in at least one direction is an X-direction moving mechanism, the X-direction moving mechanism includes an X-direction guide rail 2830, an X-direction slider 2831 and an X-direction driving source 2832, wherein the X-direction guide rail 2830 is laid on the supporting plate 282, the X-direction slider 2831 is adapted to the X-direction guide rail 2830, a mounting seat 2833 is provided on the X-direction slider 2831, two edge skin clamping mechanisms 284 are respectively located at left and right sides of the mounting seat 2833, and the X-direction driving source 2832 may be, for example, an X-direction telescopic cylinder assembly or an X-direction motor. In order to enable the movement of the flaw-piece clamping mechanism 284 in the X direction smoothly, a dual-rail design is adopted in the present embodiment, that is, two X-guide rails 2830 are adopted, and the two X-guide rails 2830 are arranged in parallel in the X direction. Thus, the two flaw-piece clamping mechanisms 284 mounted on the mount 2833 of the X-slider 2831 are driven by the X-drive source 2832 to move in the X direction along the X-guide rails 2830. In practical applications, the moving direction of the moving mechanism 283 is not limited to this, and in other embodiments, the moving mechanism may further include a Y-direction moving mechanism, and may further include a Z-direction moving mechanism.

Referring to fig. 20, fig. 20 is a schematic diagram illustrating an external structure of a flaw-piece clamping mechanism in an embodiment of the flaw-piece discharging device applied to a silicon rod extracting apparatus according to the present application, and as shown in the figure, the flaw-piece clamping mechanism 284 includes a lifting driving mechanism 2841 and a clamping assembly disposed at a bottom of the lifting driving mechanism. In an embodiment, the lifting driving mechanism 2841 is used for driving the clamping assembly to perform a lifting motion, and the lifting driving mechanism 2841 may be, for example, a lifting cylinder with a lifting rod, the lifting rod is connected to the clamping assembly, and the lifting cylinder is used to control the lifting rod to extend and retract to drive the clamping assembly to perform a lifting motion, but not limited thereto. For example, the lifting driving structure can also be a screw rod assembly driven by a motor, the screw rod assembly is connected with the clamping assembly, and the motor is used for driving the screw rod assembly to lift so as to drive the clamping assembly to do lifting motion.

Referring to fig. 21, a schematic cross-sectional view of a clamping assembly of the present invention applied to a flaw-piece discharging device of a silicon rod extracting apparatus in an embodiment is shown, where the clamping assembly includes a cover body 2842 and a retractable clamping member, the retractable clamping member is disposed inside the cover body 2842, and a clamping space 2843 for clamping the flaw-piece is formed between the clamping member and the cover body 2842. In an embodiment, the cover 2842 is used for covering the edge leather, the size of the cover 2842 can be covered into a circle with a size slightly larger than the cross section of the silicon rod to be cut, and the cover 2842 is configured as a closed or non-closed circular cover, but not limited thereto.

The structure of the clamping assembly is not limited to this, and in other embodiments, the clamping assembly includes an arc-shaped plate and a retractable clamping member, and a clamping space for clamping the flaw-piece is formed between the clamping member and the arc-shaped plate.

As shown in fig. 21, the clamping member is a movable pressing piece 2844 controlled by a cylinder 2845, and the movable pressing piece 2844 is connected with the cylinder 2845 through a turning arm 2846. In one embodiment, the tilting arm 2846 has a mounting portion and a first connecting portion and a second connecting portion respectively located at two opposite sides of the mounting portion, wherein the first connecting portion is connected to the piston rod 2848 of the cylinder 2845, and the second connecting portion is connected to the movable pressing piece 2844.

In one embodiment, a base 2847 for carrying the clamping member is disposed inside the cover 2842, the base 2847 carries the clamping member and protrudes into the recessed area between the cut silicon rod and the flaw-piece, the cylinder 2845 is fixed on the side wall of the base 2847 and has a piston rod 2848, the mounting portion of the flipping arm 2846 is hinged to a support 2849 fixed at the bottom of the base 2847 so that the flipping arm 2846 can rotate up and down with the mounting portion as the axis, the movable pressing block 2844 is fixedly connected to the second connecting portion of the flipping arm 2846, the first connecting portion of the flipping arm 2846 is hinged to the piston rod 2848 of the cylinder, the cylinder 2845 pushes the piston rod 2848 to extend and retract to drive the first connecting portion of the flipping arm 2846 to descend or ascend with the support 2849 as the center point, so that the second connecting portion of the flipping arm 2846 ascends or descends with the support 2849 as the center point, and the movable pressing block 2844 connected to the second connecting portion of the flipping arm is far away from or close to the cover 2842, adjusting the clamping space 2843 between it and the housing 2842. Specifically, referring to fig. 21, in the initial state where the second connection portion of the invert arm 2846 is higher than the first connection portion thereof, the movable press piece 2844 is away from the cover 2842. When the flaw-piece needs to be clamped, the air cylinder 2845 drives the piston rod 2848 to retract so that the first connecting portion of the lifting and pulling overturning arm 2846 ascends by taking the supporting seat 2849 as a central point, the second connecting portion of the overturning arm 2846 descends by taking the supporting seat 2849 as a central point to drive the movable pressing block 2844 to be close to the cover body 2842 (as shown in an arrow direction in fig. 21), and a clamping space 2843 between the movable pressing block 2844 and the cover body 2842 is reduced to clamp the flaw-piece. When the flaw-piece needs to be released, the air cylinder 2845 drives the piston rod 2848 to extend so as to drive the first connecting part of the turning arm 2846 to descend by taking the supporting seat 2849 as a central point, the second connecting part of the turning arm 2846 to ascend by taking the supporting seat 2849 as a central point so as to drive the movable pressing block 2844 to be far away from the cover body 2842, and then the movable pressing block 2844 returns to an initial state, so that the clamping space 2843 between the movable pressing block 2844 and the cover body 2842 is enlarged so as to release the flaw-. To avoid the movable weight 2844 from contacting the flaw-piece during long-term clamping, causing wear and damage to each other, in one embodiment, the movable weight 2844 is provided with a cushion for contacting the flaw-piece.

It should be noted that, as mentioned above, the wire-cutting unit 24 includes a plurality of cutting wheel sets 251, and in some embodiments, each cutting wheel set 251 includes a pair of cutting wheels, and the cutting operation performed on the silicon rod to be cut by using the pair of cutting wheels requires four uniaxial surface cutting steps, in this embodiment, the number of the clamping members is set to be one. The first uniaxial face cutting is executed to form a flaw-piece, the flaw-piece is clamped by a clamping piece and is transferred to the moving mechanism through the lifting driving structure 2841 and the X direction, the cutting surface of the silicon rod to be cut is adjusted (for example, the silicon rod is rotated by 90 degrees), the second uniaxial face cutting is executed to form the flaw-piece again, the flaw-piece is clamped by the clamping piece again and is transferred to the moving mechanism through the lifting driving structure 2841 and the X direction, and the flaw-piece formed by the third uniaxial face cutting and the fourth uniaxial face cutting is transferred in the mode, so that the repeated description is omitted. In other embodiments, each cutting wheel set 251 comprises two pairs of cutting wheels, and the cutting operation of the silicon rod to be cut by the two pairs of cutting wheels needs to perform two times of cutting on two parallel axial surfaces. The first cutting of two parallel shaft surfaces is executed to form two side skins, the two side skins formed on corresponding positions are clamped by the two clamping pieces and are transferred to the moving mechanism through the lifting driving structure 2841 and the X, then the cutting surfaces of the silicon rods to be cut are adjusted (for example, rotated by 90 degrees), the second cutting of the two parallel shaft surfaces is executed, the two side skins are formed again, the two side skins formed on corresponding positions are clamped by the two clamping pieces again and are transferred to the moving mechanism through the lifting driving structure 2841 and the X.

In an embodiment, the flaw-piece discharging device comprises a flaw-piece conveying structure, the flaw-piece conveying structure is arranged in the flaw-piece unloading area and used for conveying the flaw-pieces conveyed by the clamping and transferring unit, and in an implementation mode, the flaw-piece conveying structure can be a conveying belt, for example. It is easy to understand that the flaw-piece unloading area is an area for unloading the flaw-piece in the silicon rod squaring device, and specifically, the flaw-piece unloading area is an area corresponding to the lower side of the silicon rod squaring device after the clamping and transferring unit transports the flaw-piece away from the cutting area. In actual operation, transfer the flaw-piece to the flaw-piece uninstallation district by the centre gripping transfer unit by the cutting district, the centre gripping subassembly in the centre gripping transfer unit loosens in order to release the flaw-piece to the conveyer belt as flaw-piece transport structure on, by the conveyer belt is carried out the flaw-piece.

In another embodiment, the flaw-piece discharging device comprises a flaw-piece barrel, and the flaw-piece barrel is arranged in the flaw-piece discharging area. The barrel opening of the side leather barrel can be designed to be large or be a horn opening, so that the side leather can be conveniently placed in the barrel without obstacles, and the height of the barrel arm of the side leather barrel is also high, so that the placed side leather can be prevented from overturning and the like. So, by the centre gripping transfer unit moves the flaw-piece by the cutting district to a flaw-piece section of thick bamboo, then can be followed the flaw-piece by operating personnel take out in the flaw-piece section of thick bamboo.

Of course, the discharging of the flaw-piece formed after the cutting of the silicon rod to be cut is not limited thereto. For example, in other embodiments, the flaw-piece discharge device may include both a flaw-piece drum and a flaw-piece conveying structure, wherein the flaw-piece conveying structure may be, for example, a conveyor belt, and the flaw-piece drum is disposed adjacent to the starting end of the conveyor belt (e.g., the flaw-piece drum is located beside or directly above the starting end of the conveyor belt, etc.). The barrel opening of the side leather barrel can be designed to be large or be a horn opening, so that the side leather can be conveniently placed in the barrel without obstacles, and the height of the barrel arm of the side leather barrel is also high, so that the placed side leather cannot overturn and the like. In practical application, the edge leather tube can be in a turnover design, and each edge leather in the edge leather tube can be smoothly transferred to the conveying belt by turning over the edge leather tube. For example, the bottom of the edge leather tube is provided with a turnover driving mechanism, and the turnover driving mechanism may include a turnover plate, a rotating shaft, and a turnover driving source (e.g., a turnover motor or a turnover cylinder). So, by the centre gripping is transported the unit and is transferred the flaw-piece by cutting district extremely back in the flaw-piece section of thick bamboo, the flaw-piece in the upset drive section of thick bamboo of flaw-piece section of thick bamboo is shifted to on the conveyer belt, by the conveyer belt is carried away the flaw-piece.

Through the silicon rod evolution equipment that this application disclosed and be applied to the flaw-piece discharge apparatus of silicon rod evolution equipment can be timely unload away from the flaw-piece that produces behind the silicon rod evolution equipment cutting silicon rod through the centre gripping subassembly, not only improved work efficiency but also avoided the risk that artifical transport brought.

The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.

Claims (13)

1. The flaw-piece discharging device is applied to silicon rod squaring equipment and is characterized in that the silicon rod squaring equipment comprises a silicon rod bearing table and a wire cutting device, the silicon rod bearing table is used for bearing a vertically placed single crystal silicon rod, the wire cutting device comprises a liftable wire cutting support and a wire cutting unit arranged on the wire cutting support, a cutting wire section is arranged in the wire cutting unit, and the cutting wire section penetrates through the single crystal silicon rod to form a cut silicon rod and a flaw-piece; the flaw-piece discharge device comprises:

the flaw-piece lifting mechanism is used for lifting the flaw-piece so that the top end of the flaw-piece protrudes out of the cut silicon rod; and

and the clamping and transferring unit is arranged above the silicon rod bearing table and used for clamping the top end of the flaw-piece and then pulling up the flaw-piece to separate from the cut silicon rod and transfer the flaw-piece to a flaw-piece unloading area.

2. The flaw-piece discharging device applied to a silicon rod squaring device as recited in claim 1, wherein the flaw-piece lifting mechanism comprises a lifting member which is arranged on the wire cutting support and can move telescopically, and the lifting member is controlled to move in an extending manner to support the bottom of the flaw-piece so as to lift the flaw-piece.

3. The flaw-piece discharging device applied to a silicon rod squaring device according to claim 1, wherein the flaw-piece lifting mechanism comprises an adsorption member which is arranged on the wire-cutting support and can move in an extensible and retractable manner, and the adsorption member is controlled to move in an extending manner to abut against the flaw-piece and adsorb the flaw-piece so as to lift the flaw-piece.

4. The flaw-piece discharging device applied to a silicon rod squaring device according to claim 1, wherein the clamping transfer unit comprises:

a moving mechanism providing at least one direction of movement; and

and the lifting and descending at least one clamping assembly flaw-piece clamping mechanism is connected with the moving mechanism and is driven to move in at least one direction.

5. The flaw-piece discharging device applied to a silicon rod squaring device according to claim 4, wherein the flaw-piece clamping mechanism comprises:

a lifting drive structure; and

and the clamping assembly is arranged at the bottom of the lifting driving structure and used for clamping or releasing the top end of the flaw-piece.

6. The flaw-piece discharging device applied to a silicon rod squaring device according to claim 5, wherein the clamping assembly comprises:

the cover body is used for covering the flaw-piece; and

the telescopic clamping piece is arranged inside the cover body; a clamping space for clamping the edge leather is formed between the clamping piece and the cover body.

7. The flaw-piece discharging device applied to a silicon rod squaring device according to claim 5, wherein the clamping assembly comprises:

an arc-shaped plate; and

the telescopic holder, the holder with form between the arc and supply the centre gripping space of kerb.

8. The flaw-piece discharging device applied to the silicon rod squaring device as recited in any one of claims 6 to 7, wherein the clamping member is a movable pressing block controlled by a cylinder, and the movable pressing block is connected with the cylinder through a turning arm.

9. The flaw-piece discharging device applied to silicon rod squaring equipment according to claim 8, wherein the overturning arm is provided with a mounting part and a first connecting part and a second connecting part which are respectively arranged at two opposite sides of the mounting part, wherein the first connecting part is connected with a piston rod of the air cylinder, and the second connecting part is connected with the movable pressing block.

10. The flaw-piece discharging device applied to a silicon rod squaring device according to claim 8, wherein the movable pressing block is provided with a cushion pad for contacting with the flaw-piece.

11. The flaw-piece discharging device applied to the silicon rod squaring equipment according to claim 1, further comprising: and the edge leather barrel is arranged in the edge leather unloading area.

12. The flaw-piece discharging device applied to the silicon rod squaring equipment according to claim 1, further comprising: and the flaw-piece conveying structure is arranged in the flaw-piece unloading area.

13. A silicon rod squaring apparatus for squaring a silicon single crystal rod having a circular cross section, comprising:

the silicon rod bearing table is used for bearing a vertically placed single crystal silicon rod; and

the wire cutting device is arranged above the at least two silicon rod bearing tables and comprises a plurality of cutting wheels and a cutting wire wound on the cutting wheels to form at least one cutting wire section;

a flaw-piece discharge apparatus as claimed in any one of claims 1 to 12.

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