CN210789693U - Semi-automatic laser cutting system - Google Patents
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- CN210789693U CN210789693U CN201921172034.3U CN201921172034U CN210789693U CN 210789693 U CN210789693 U CN 210789693U CN 201921172034 U CN201921172034 U CN 201921172034U CN 210789693 U CN210789693 U CN 210789693U
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Abstract
The utility model belongs to the technical field of laser processing, in particular to a semi-automatic laser cutting system, which transfers glass products to be processed to a rotary material taking device, the rotary material taking device rotationally moves the glass products to be processed to a laser processing station, and the glass products which are processed on the laser processing station are rotationally moved and placed on a splitting device at the same time; removing leftover bits and pieces left on the processed glass product by using the splitting device; and transferring the glass product with the leftover materials removed to an feeding positioning table for taking away. Simple structure, convenient operation utilizes rotatory switching's last unloading mode to join in marriage laser cutting glass, and the beat lost time is few, and production efficiency is high, and the cutting is of high quality, and is little to the destruction degree of product, can guarantee the bulk strength of cell-phone display screen, guarantees the product percent of pass.
Description
Technical Field
The utility model belongs to the technical field of laser beam machining, concretely relates to semi-automatization laser cutting system.
Background
The traditional grinding process is low in production efficiency, dust chips can be generated in the machining process, a cooling cleaning solution needs to be added, and the grinding head belongs to a consumable product, so that pollution can be generated, and the cost performance is low. Because the laser cutting dust debris is less, the surface is smooth and the subsequent treatment process is less, the laser cutting industrial application is brought forward in the field of hard materials such as glass.
The laser cutting industry application starts in the last 70 th century, is used in the fields of non-penetrating grooves, embedded blades and the like of hardwood board cutting in the early period, and is widely applied to the field of various metal and non-metal cutting along with the development of industrial technology. The glass belongs to a brittle material with high hardness and high melting point, the general processing method cannot meet the process requirements, and the surface quality of the glass can be greatly improved by cutting the glass by adopting a laser precision cutting technology.
The existing laser processing equipment is still in a single machine trial production stage, manual loading and unloading are carried out, the production efficiency is relatively low, the labor cost is high, and in order to improve the production efficiency and save the labor cost, the semi-automatic laser cutting equipment for the display panel of the mobile phone is developed, and the production capacity is improved by using a more advanced manufacturing process.
Disclosure of Invention
The utility model aims at overcoming the problem that the nozzle blocks up and the cleaning efficiency is low among the prior art.
Therefore, the utility model provides a semi-automatization laser cutting system, include: the device comprises a feeding positioning table, a feeding module, a laser processing unit, a splitting device and a rotary material taking device;
the feeding positioning table is used for fixing and positioning a glass product to be processed;
the rotary material taking device is used for grabbing the glass product to be processed, rotationally moving the glass product to the laser processing station, and rotationally moving the processed glass product processed on the laser processing station on the splitting device;
the splitting device is used for removing residual leftover materials on the processed glass products;
the feeding module is used for transferring the glass product to be processed to the feeding position of the rotary material taking device, or transferring the glass product with the leftover materials removed to the feeding positioning table for taking away.
Preferably, the system further comprises a waste-collecting bin located below the splitting device.
Preferably, the system still includes the horizontal support module, the horizontal support module includes supporting baseplate, marble base, marble stand, the ground is arranged in to the marble base, the supporting baseplate reaches the marble stand is installed respectively the both ends of marble base, last material loading locating platform, pay-off module, lobe of a leaf device and the rotatory extracting device of installing of supporting baseplate, install the laser beam machining unit on the marble stand.
Preferably, the rotary material taking device comprises a rotary material taking gantry, the rotary material taking gantry is provided with a pair of spring sucker groups which can rotate 180 degrees and exchange positions, and the spring sucker groups are used for sucking or putting down the glass product to be processed or the processed glass product.
Preferably, the spring sucker set comprises at least two spring suckers.
Preferably, the feeding positioning table comprises an X-axis positioning column group and a Y-axis positioning column group, the X-axis positioning column group and the Y-axis positioning group are close to the center to position and fix the glass product, or the X-axis positioning column group and the Y-axis positioning group are far away from the center to loosen the glass product.
Preferably, the X-axis positioning column set comprises two X-axis positioning columns oppositely arranged along an X-axis, and the two X-axis positioning columns are respectively connected with the X-axis screw rod in a reverse screwing manner;
the Y-axis positioning column set comprises two Y-axis positioning columns which are oppositely arranged along a Y axis, and the two Y-axis positioning columns are respectively connected with the Y-axis direction screw in a reverse screwing mode.
Preferably, the laser processing unit comprises a CCD vision module, a picosecond laser and a cutting head, the CCD vision module is used for identifying the position of the glass product to be processed, the picosecond laser emits laser to the cutting head, and the cutting head is aligned to the corner position of the glass product to be processed for cutting.
Preferably, the splitting device comprises a splitting ejector pin, and the splitting ejector pin is used for pressing off leftover materials at corresponding positions after laser cutting.
The utility model has the advantages that: the semi-automatic laser cutting system provided by the utility model transfers the glass product to be processed to the rotary material taking device, the rotary material taking device rotates and moves the glass product to be processed to the laser processing station, and the glass product processed on the laser processing station is placed on the splinter device in a rotating and moving way; removing leftover bits and pieces left on the processed glass product by using the splitting device; and transferring the glass product with the leftover materials removed to an feeding positioning table for taking away. Simple structure, convenient operation utilizes rotatory switching's last unloading mode to join in marriage laser cutting glass, and the beat lost time is few, and production efficiency is high, and the cutting is of high quality, and is little to the destruction degree of product, can guarantee the bulk strength of cell-phone display screen, guarantees the product percent of pass.
The present invention will be described in further detail with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic system structure diagram of a semi-automatic laser cutting system of the present invention;
fig. 2 is a schematic structural diagram of a laser processing unit of the semi-automatic laser cutting system of the present invention;
fig. 3 is a schematic structural diagram of a feeding positioning table of the semi-automatic laser cutting system of the present invention;
fig. 4 is a schematic structural diagram of a splitting device of the semi-automatic laser cutting system of the present invention;
fig. 5 is a schematic structural view of a rotary material taking device of the semi-automatic laser cutting system of the present invention;
fig. 6 is a schematic diagram of a processed glass product of the semi-automatic laser cutting system of the present invention.
Description of reference numerals: the device comprises a laser processing unit 1, a feeding positioning table 2, a feeding module 3, a splitting device 4, a rotary material taking device 5, a waste material collecting box 6, a supporting bottom plate 7, a marble base 11, a marble upright post 12, a marble light path plate 13, an XY-axis linear motor 14, a processing platform 15, a picosecond laser 16, a light path module 17, a cutting head 18, a CCD vision system 19, a feeding adsorption plate 21, a Y-axis positioning post 22, an X-axis positioning post 23, a stepping motor 24, a processed glass product 25, a splitting base 41, a splitting upright post 42, a splitting cross beam 43, a splitting sliding plate 44, a splitting cylinder 45, a splitting ejector pin 46, a rotary material taking gantry 51, a lifting cylinder fixing plate 52, a linear bearing 53, a lifting cylinder 54, a servo motor 55, a hollow rotary platform 56, a sucking disc supporting rod 57, an unprocessed glass product 58, a spring sucking disc 59, a laser cutting seam 251 and corner waste material 252.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of the present invention, "a plurality" means two or more unless otherwise specified.
The utility model provides a semi-automatization laser cutting system, include: the device comprises a feeding positioning table, a feeding module, a laser processing unit, a splitting device and a rotary material taking device;
the feeding positioning table is used for fixing and positioning a glass product to be processed;
the rotary material taking device is used for grabbing the glass product to be processed, rotationally moving the glass product to the laser processing station, and rotationally moving the processed glass product processed on the laser processing station on the splitting device;
the splitting device is used for removing residual leftover materials on the processed glass products;
the feeding module is used for transferring the glass product to be processed to the feeding position of the rotary material taking device, or transferring the glass product with the leftover materials removed to the feeding positioning table for taking away.
Therefore, as shown in fig. 1 to 6, a semi-automatic laser cutting system includes a laser processing unit 1 and a loading and unloading unit 2, wherein the loading and unloading unit 2 is provided with a supporting bottom plate 7, a feeding module 3, a loading positioning table 2, a splitting device 4, a rotary material taking device 5, and the like. The laser processing unit 1 is provided with a marble base 11, a marble upright post 12, a marble light path plate 13, an XY-axis linear motor 14, a processing platform 15, a CCD visual system 19, a picosecond laser 16, a light path module 17 and a cutting head 18; the supporting bottom plate 7 is connected with the marble bottom plate 11, the feeding module 3 and the splitting device 4 are installed on the supporting bottom plate 7, the feeding positioning table 2 is fixed on the feeding module 3, four glass products are manually placed on the upper surface of the feeding positioning table 2 at the same time, and the feeding positioning table 2 automatically clamps and adsorbs the glass products and then transfers the glass products to the lower part of the rotary material taking device 5 after pressing a starting button; the rotary material taking device 5 is installed on the marble base 11, a marble upright post 12 and an XY-axis linear motor 14 are further installed on the marble base 11, a marble light path plate 13 is fixed on the marble upright post 12, and a picosecond laser 16, a CCD (charge coupled device) vision system 19, a light path module 17 and a cutting head 18 are installed on the marble light path plate 13; a processing platform 15 is fixed on the XY-axis linear motor 14, and a glass product is adsorbed on the upper surface of the processing platform 15; the rotary material taking device 5 simultaneously sucks four glass products, rotates 180 degrees, then places the glass products on the processing platform 15 for adsorption, the processing platform 15 transfers the glass products to the position below the CCD vision system 19 by the XY-axis linear motor 14 after adsorbing the glass products, and a laser cutting system consisting of the second laser 16, the light path module 17 and the cutting head 18 on the marble light path plate 13 processes the glass products after the positioning is finished, so that a laser cutting seam 251 is formed; after the processing is finished, the XY-axis linear motor 14 transfers the glass product adsorbed on the processing platform 15 to the position below the rotary material taking device 5, the rotary material taking device 5 simultaneously sucks the processed glass product 25 after the processing and the unprocessed glass product 58 which is newly sent for discharging by rotating 180 degrees (four glass products are processed at each time), and the unprocessed glass product 58 is continuously processed; after the processed glass product 25 is clamped and positioned on the feeding positioning table 2, the processed glass product is transferred to the lower part of the splitting device 4 by the feeding module 3, a splitting ejector pin 46 on the splitting device 4 is pressed downwards, and a small glass corner on a corresponding position after laser cutting is pressed off; and after the splitting is finished, the feeding module 3 transfers the feeding positioning table 2 loaded with the processed glass product 25 to a feeding port, and after manual blanking, new materials are fed, so that the laser processing of a round of glass product is finished.
Preferably, the system further comprises a waste collecting box which is positioned below the splitting device. As shown in fig. 1, a waste collecting box 6 is provided below the breaking device 4 for collecting the broken glass waste.
The system further comprises a horizontal supporting module, the horizontal supporting module comprises a supporting bottom plate, a marble base and marble stand columns, the marble base is arranged on the foundation, the supporting bottom plate and the marble stand columns are respectively arranged at two ends of the marble base, a loading positioning table, a feeding module, a splitting device and a rotary material taking device are arranged on the supporting bottom plate, and a laser processing unit is arranged on the marble stand columns. As shown in fig. 1, the marble base 11, the marble pillar 12, and the marble optical circuit board 13 serve to horizontally position the entire system, thereby improving the processing accuracy.
Preferably, the rotary material taking device comprises a rotary material taking gantry, the rotary material taking gantry is provided with a pair of spring sucker groups which can rotate 180 degrees and exchange positions, and the spring sucker groups are used for sucking or putting down the glass products to be processed or the processed glass products. Therefore, as shown in fig. 1 and 5, when the rotary material taking device 5 starts to work, the lifting cylinder 54 and the linear bearing 53 fixed on the lifting cylinder fixing plate 52 drive the spring sucker 59 fixed on the sucker supporting rod 57 to press downwards until the upper surface of the processed glass product 25 is adsorbed, so as to suck up the four products at the same time, the servo motor 55 drives the hollow rotary platform 56 to rotate the four products by 180 degrees, and the lifting cylinder 54 presses downwards to place the processed glass product 25 on the processing platform 15 for adsorption.
Preferably, the spring sucker set comprises at least two spring suckers. It can be seen that each spring chuck set includes four spring chucks as shown in fig. 5, so that four glass products are processed per set at a time.
Preferably, the feeding positioning table comprises an X-axis positioning column group and a Y-axis positioning column group, the X-axis positioning column group and the Y-axis positioning group are close to the center to position and fix the glass product, or the X-axis positioning column group and the Y-axis positioning group are far away from the center to loosen the glass product. The X-axis positioning column group comprises two X-axis positioning columns which are oppositely arranged along an X axis, and the two X-axis positioning columns are respectively connected with the X-axis screw in a reverse screwing manner; the Y-axis positioning column set comprises two Y-axis positioning columns which are oppositely arranged along a Y axis, and the two Y-axis positioning columns are respectively connected with the Y-axis direction screw in a reverse screwing mode.
Therefore, as shown in fig. 3, the X-axis positioning column 23 and the Y-axis positioning column 22 on the feeding positioning table 2 are driven by the stepping motor 24 to move inward at the same time, and after the processed glass product 25 is pushed to automatically return to the correct position, the feeding adsorption plate 21 is adsorbed to firmly adsorb the product, and the X-axis positioning column 23 and the Y-axis positioning column 22 are reset. The specific principle is as follows: step motor 24 includes the driving motor of X axle direction, driving motor's output shaft passes through the worm gear transmission, threaded connection has two screw thread blocks along X axle direction front and back on the worm, two screw thread block helices are opposite, and every screw thread block is connected with an X axle reference column 23, and when step motor 24 rotation drive worm is rotatory, the worm is rotatory alright make an axle draw close alright treating glass product 25 to appointed place along X axle direction as X axle or the epaxial X axle reference column 23 of Y draws close to the center. Similarly, the working principle of the Y-axis positioning column 22 is the same. The X-axis positioning post 23 and the Y-axis positioning post 22 are moved together to move the processed glass product 25 to a designated position for the next process.
According to the preferable scheme, the laser processing unit comprises a CCD vision module, a picosecond laser and a cutting head, the CCD vision module is used for identifying the position of the glass product to be processed, the picosecond laser emits laser to the cutting head, and the cutting head is aligned to the corner position of the glass product to be processed for cutting. As shown in fig. 1, 2 and 6, the picosecond laser 16, the CCD vision system 19, the optical path module 17 and the cutting head 18 are mounted on the marble optical path plate 13; a processing platform 15 is fixed on the XY-axis linear motor 14, and a glass product is adsorbed on the upper surface of the processing platform 15; the rotary material taking device 5 sucks four glass products at the same time, rotates 180 degrees and then places the glass products on the processing platform 15 for adsorption, the processing platform 15 transfers the glass products to the position below the CCD vision system 19 by the XY-axis linear motor 14 after adsorbing the glass products, and the marble light path plate 13 is used for processing the glass products by a laser cutting system consisting of the second laser 16, the light path module 17 and the cutting head 18 after positioning is completed, so that a laser cutting seam 251 is formed.
According to the preferable scheme, the splitting device comprises a splitting ejector pin, and the splitting ejector pin is used for pressing off leftover materials at the corresponding position after laser cutting. As shown in fig. 4, the splinter thimble 46 of the splinter device 4 is pressed down to press off the C-corner scrap 252 at the corresponding position after laser cutting, and the scrap collecting box 6 is provided below the splinter device 4 to collect the splinted glass scrap.
The specific workflow is as follows with reference to fig. 1 to 6:
(1) manually placing 4 pieces of processed glass products 25 to be cut on four stations of a feeding adsorption plate 21 of a feeding positioning table 2 respectively, and pressing a start button;
(2) the X-axis positioning column 23 and the Y-axis positioning column 22 on the feeding positioning table 2 are driven by the stepping motor 24 to move inwards at the same time, after the processed glass product 25 is pushed to automatically return to the right position, the feeding adsorption plate 21 is adsorbed to firmly adsorb the product, and the X-axis positioning column 23 and the Y-axis positioning column 22 are reset. The specific principle is as follows: step motor 24 includes the driving motor of X axle direction, driving motor's output shaft passes through the worm gear transmission, threaded connection has two screw thread blocks along X axle direction front and back on the worm, two screw thread block helices are opposite, and every screw thread block is connected with an X axle reference column 23, and when step motor 24 rotation drive worm is rotatory, the worm is rotatory alright make an axle draw close alright treating glass product 25 to appointed place along X axle direction as X axle or the epaxial X axle reference column 23 of Y draws close to the center. Similarly, the working principle of the Y-axis positioning column 22 is the same. The X-axis positioning post 23 and the Y-axis positioning post 22 are moved together to move the processed glass product 25 to a designated position for the next process.
(3) The feeding module 3 transplants the processed glass products 25 on the feeding positioning table 2 to the lower part of the rotary material taking device 5;
(4) the rotary material taking device 5 starts to work, the lifting cylinder 54 and the linear bearing 53 which are fixed on the lifting cylinder fixing plate 52 drive the spring sucker 59 which is fixed on the sucker supporting rod 57 to press downwards until the upper surface of the processed glass product 25 is adsorbed, the four products are sucked up at the same time, the servo motor 55 drives the hollow rotating platform 56 to rotate the four products by 180 degrees, and the lifting cylinder 54 presses downwards to place the processed glass product 25 on the processing platform 15 for adsorption;
(5) the processing platform 15 moves to the position below the CCD vision module 19 to start to grab the mark and position; meanwhile, the feeding positioning table 2 returns to the feeding port to continue to feed new materials manually;
(6) after the positioning is finished, a laser cutting system consisting of a marble light path plate 13 epithelial second laser 16, a light path module 17 and a cutting head 18 processes a glass product according to a drawing; meanwhile, after the unprocessed glass products 58 which are fed are positioned and adsorbed, the feeding module 3 drives the feeding positioning table 2 to be transplanted below the rotary material taking device 5 to wait;
(7) after the processing is finished, the XY-axis linear motor 14 transfers the product adsorbed on the processing platform 15 to the lower part of the rotary material taking device 5;
(8) the rotary material taking device 5 sucks the processed glass product 25 after being processed and the unprocessed glass product 58 which is newly sent for processing simultaneously to rotate for 180 degrees, and exchanges for material discharging;
(9) the new unprocessed glass product 58 continues to be processed, and meanwhile, the processed glass product 25 after being processed is clamped and positioned on the feeding positioning table 2 and then is transferred to the lower part of the splitting device 4 by the feeding module 3;
(10) a splinter thimble 46 on the splinter device 4 is pressed downwards to press off the C-angle waste 252 on the corresponding position after laser cutting, and a waste collecting box 6 is arranged below the splinter device 4 and used for collecting the splinted glass waste;
(11) after the splintering is finished, the feeding module 3 transfers the feeding positioning table 2 loaded with the processed glass product 25 to a feeding port;
(12) and (4) continuously feeding new materials after manual blanking, so as to finish the laser processing of a round of glass products.
The utility model has the advantages that: the semi-automatic laser cutting system provided by the utility model transfers the glass product to be processed to the rotary material taking device, the rotary material taking device rotates and moves the glass product to be processed to the laser processing station, and the glass product processed on the laser processing station is placed on the splinter device in a rotating and moving way; removing leftover bits and pieces left on the processed glass product by using the splitting device; and transferring the glass product with the leftover materials removed to an feeding positioning table for taking away. Simple structure, convenient operation utilizes rotatory switching's last unloading mode to join in marriage laser cutting glass, and the beat lost time is few, and production efficiency is high, and the cutting is of high quality, and is little to the destruction degree of product, can guarantee the bulk strength of cell-phone display screen, guarantees the product percent of pass.
The above illustration is merely an illustration of the present invention, and does not limit the scope of the present invention, and all designs identical or similar to the present invention are within the scope of the present invention.
Claims (9)
1. A semi-automated laser cutting system, comprising: the device comprises a feeding positioning table, a feeding module, a laser processing unit, a splitting device and a rotary material taking device;
the feeding positioning table is used for fixing and positioning a glass product to be processed;
the rotary material taking device is used for grabbing the glass product to be processed, rotationally moving the glass product to the laser processing station, and rotationally moving the processed glass product processed on the laser processing station on the splitting device;
the splitting device is used for removing residual leftover materials on the processed glass products;
the feeding module is used for transferring the glass product to be processed to the feeding position of the rotary material taking device, or transferring the glass product with the leftover materials removed to the feeding positioning table for taking away.
2. The semi-automated laser cutting system of claim 1, wherein: the system also includes a waste collection box located below the cleaving device.
3. The semi-automated laser cutting system of claim 1, wherein: the system still includes the horizontal support module, the horizontal support module includes supporting baseplate, marble base, marble stand, on the ground was arranged in to the marble base, the supporting baseplate reached the marble stand is installed respectively the both ends of marble base, last material loading locating platform, the pay-off module, lobe of a leaf device and the rotatory extracting device of installing of supporting baseplate, install the laser beam machining unit on the marble stand.
4. The semi-automated laser cutting system of claim 1, wherein: the rotary material taking device comprises a rotary material taking gantry, the rotary material taking gantry is provided with a pair of spring sucker groups which can rotate 180 degrees and exchange positions, and the spring sucker groups are used for sucking or putting down the glass products to be processed or the processed glass products.
5. The semi-automated laser cutting system of claim 4, wherein: the spring sucker group comprises at least two spring suckers.
6. The semi-automated laser cutting system of claim 1, wherein: the feeding positioning table comprises an X-axis positioning column group and a Y-axis positioning column group, the X-axis positioning column group and the Y-axis positioning group are close to the center to position and fix the glass product, or the X-axis positioning column group and the Y-axis positioning group are far away from the center to loosen the glass product.
7. The semi-automated laser cutting system of claim 6, wherein: the X-axis positioning column group comprises two X-axis positioning columns which are oppositely arranged along an X axis, and the two X-axis positioning columns are respectively connected with the X-axis screw in a reverse screwing manner;
the Y-axis positioning column set comprises two Y-axis positioning columns which are oppositely arranged along a Y axis, and the two Y-axis positioning columns are respectively connected with the Y-axis direction screw in a reverse screwing mode.
8. The semi-automated laser cutting system of claim 1, wherein: the laser processing unit comprises a CCD vision module, a picosecond laser and a cutting head, the CCD vision module is used for identifying the position of the glass product to be processed, the picosecond laser emits laser to the cutting head, and the cutting head is aligned to the corner position of the glass product to be processed for cutting.
9. The semi-automated laser cutting system of claim 1, wherein: the splitting device comprises a splitting ejector pin, and the splitting ejector pin is used for pressing off leftover materials at the corresponding position after laser cutting.
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| CN201921172034.3U CN210789693U (en) | 2019-07-24 | 2019-07-24 | Semi-automatic laser cutting system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110421272A (en) * | 2019-07-24 | 2019-11-08 | 武汉先河激光技术有限公司 | A kind of semi-automation laser cutting system and method |
| CN114309996A (en) * | 2022-03-10 | 2022-04-12 | 广东创兴精密制造股份有限公司 | Processing system with feeding, cutting and sorting functions |
-
2019
- 2019-07-24 CN CN201921172034.3U patent/CN210789693U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110421272A (en) * | 2019-07-24 | 2019-11-08 | 武汉先河激光技术有限公司 | A kind of semi-automation laser cutting system and method |
| CN114309996A (en) * | 2022-03-10 | 2022-04-12 | 广东创兴精密制造股份有限公司 | Processing system with feeding, cutting and sorting functions |
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