CN210781493U - Flexible circuit board and electronic device - Google Patents

Abstract

The utility model provides a flexible circuit board and electron device. The flexible circuit board comprises a first covering layer, a metal foil layer and a second covering layer which are sequentially stacked, the metal foil layer is connected with the first covering layer and the second covering layer through an adhesive layer, the first covering layer is provided with a first through hole, the second covering layer is provided with a second through hole, the flexible circuit board further comprises a first pad and a second pad which are connected with the metal foil layer and are spaced from each other, the first pad is contained in the first through hole and connected with the metal foil layer, and the second pad is contained in the second through hole and connected with the metal foil layer. The utility model provides a flexible circuit board simple structure, good reliability.

Description

Flexible circuit board and electronic device

[ technical field ] A method for producing a semiconductor device

The utility model relates to an acoustoelectric field especially relates to a flexible circuit board and have electronic device of this kind of flexible circuit board.

[ background of the invention ]

With the development of electronic technology, in order to meet the requirements of multifunction and high sound quality of various sound equipment and information communication equipment, higher requirements are put forward on the acoustic performance of the flexible circuit board.

In the related technology, the conductive structure of the flexible circuit board is made of double-layer copper foils, the two layers of copper foils are used for metallizing the hole walls in a BVH or TH (0.1mm or other sizes) mode to form interlayer conduction, and the BVH or TH needs to use large-scale special processing equipment, so that the processing efficiency is low; the via hole between layers has low reliability and is easy to generate hole breakage or plating layer explosion to cause defects such as open circuit between layers and the like; the pure copper layer in the traditional FCCL has low tensile strength (less than or equal to 400MPa), and cracks are easy to occur under high-frequency large-amplitude vibration, so that open-circuit failure is caused.

Therefore, there is a need to provide a new flexible circuit board to solve the above technical problems.

[ Utility model ] content

An object of the utility model is to provide a flexible circuit board of simple structure, good reliability.

In order to achieve the above object, the utility model provides a flexible circuit board, including first overburden, metal foil layer and the second overburden of range upon range of setting in proper order, the metal foil layer with first overburden reaches the second overburden passes through the glue film and connects, first overburden is equipped with first perforation, the second overburden is equipped with the second through hole, flexible circuit board still include with metal foil layer connects and first pad and the second pad of mutual interval, first pad accept in first perforation and with metal foil layer connects, the second pad accept in the second through hole and with metal foil layer connects.

Preferably, the tensile strength of the metal foil layer is greater than or equal to 800 MPa.

Preferably, the metal foil layer is selected from stainless steel foil or titanium copper foil, wherein the content of Ti in the titanium copper foil is 0.5% -5%.

Preferably, the metal foil layer includes an upper surface and a lower surface opposite to the upper surface, the first cover layer covers the upper surface, and the second cover layer covers the lower surface.

Preferably, the first cover layer and the second cover layer are polyimide films.

Preferably, the adhesive layer is an acrylic hot melt adhesive.

Preferably, the first pad and the second pad are tin pads.

The utility model also provides an electron device who contains above-mentioned flexible circuit board.

Compared with the prior art, the utility model provides an among the flexible circuit board, adopt individual layer metal foil layer to make the conducting layer to paste the overburden at metal foil layer both sides, preparation simple process has avoided adopting double-deck copper foil and has realized electrically conductive structure through the metallization via hole among the correlation technique simultaneously, has promoted flexible circuit board's tensile strength has prolonged life.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:

fig. 1 is a schematic perspective view of a flexible circuit board according to the present invention;

FIG. 2 is a schematic diagram of a partial structural hierarchy of the flexible circuit board shown in FIG. 1;

fig. 3 is a schematic view of a layered structure of the flexible circuit board shown in fig. 1.

[ detailed description ] embodiments

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 to fig. 3, the present invention provides a flexible circuit board 100, wherein the flexible circuit board 100 can be used as a conductive interface of electronic devices such as a speaker, a receiver, and a vibration motor. The flexible circuit board 100 includes a first cover layer 1, a metal foil layer 2, and a second cover layer 3, which are sequentially stacked.

The metal foil layer 2 is sandwiched between the first cover layer 1 and the second cover layer 3, plays a role in electric conduction, has a low surface oxygen characteristic, can be attached to various substrates such as metal and insulating materials, and has a wide temperature use range.

The utility model provides an in flexible circuit board 100, adopt individual layer metal foil layer 2 to make the conducting layer, avoided adopting double-deck copper foil and realizing electrically conductive structure through the metallization via hole among the correlation technique, promoted flexible circuit board 100's tensile strength has prolonged life, and simple structure practices thrift the cost simultaneously. Moreover, the overall thickness of the flexible circuit board 100 is reduced, and the use requirement of miniaturization of electronic devices in the mobile terminal can be met.

Furthermore, the tensile strength of the metal foil layer 2 is greater than or equal to 800MPa, so that the use requirement of the flexible circuit board 100 on high vibration life in different use environments can be met, the flexible circuit board is not easy to break, and the good conductivity of the flexible circuit board 100 is maintained. Preferably, the metal foil layer 2 is selected from a stainless steel foil or a titanium copper foil, wherein the titanium copper foil has a Ti content of 0.5% to 5%.

Specifically, the metal foil layer 2 includes an upper surface 21 and a lower surface 22 disposed opposite to the upper surface 21.

The first cover layer 1 covers the upper surface 21, the second cover layer 3 covers the lower surface 22, and the metal foil layer 2 is connected with the first cover layer 1 and the second cover layer 3 through a glue layer 4.

Preferably, first overburden 1 reaches second overburden 2 is the polyimide film, has outstanding high temperature resistant, resistant radiation, chemical corrosion resistance and electrical insulation performance, can effectively protect metal foil layer 2 avoids external scratch to damage, can completely cut off the air simultaneously, avoids metal foil layer 2 oxidation is rusted.

The glue layer 4 is an acrylic acid hot melt adhesive, the bonding force is strong, the connection of the flexible circuit board 100 is firm, the durability is good, and the service life of the flexible circuit board 100 can be prolonged.

Furthermore, the first cover layer 1 is provided with a first through hole 10, the second cover layer 3 is provided with a second through hole 30, and the flexible circuit board 100 further includes a first pad 5 accommodated in the first through hole 10 and connected to the metal foil layer 2, and a second pad 6 accommodated in the second through hole 30 and connected to the metal foil layer 2.

The first pad 5 and the second pad 6 are used for inputting and outputting current, specifically, in this embodiment, the first pad 5 is connected to an electrical device, and the second pad 6 is connected to a power supply device.

The first bonding pad 5 and the second bonding pad 63 are made of soluble metal materials and fixedly connected with the metal foil layer 2 in a high-temperature electroplating or printing mode, and preferably, the first bonding pad 5 and the second bonding pad 6 are made of metal tin.

Specifically, the flexible circuit board 10 has a simple manufacturing process, and the process flow is as follows:

providing a metal foil layer 2, a first covering layer 1 and a second covering layer 3, etching a first through hole 10 in the first covering layer 1, and etching a second through hole 30 in the second covering layer 3;

providing a glue layer, and respectively attaching the first covering layer 1 and the second covering layer 3 to two surfaces of the metal foil layer 2 and pressing;

electroplating and printing a circuit at the position of the first through hole 10 and the second through hole 30 corresponding to the metal foil layer 2;

and filling high-temperature soluble metal liquid into the first through hole 10 and the second through hole 30, and cooling to obtain a first bonding pad 5 and a second bonding pad 6, thereby completing the manufacture of the flexible circuit board 100.

Compared with the prior art, the utility model provides an in the flexible circuit board 100, adopt individual layer metal foil layer 2 to make the conducting layer to paste the overlay at 2 two sides of metal foil layer, preparation simple process has avoided adopting double-deck copper foil and has realized electrically conductive structure through the metallization via hole among the correlation technique simultaneously, has promoted flexible circuit board 100's tensile strength has prolonged life.

The above embodiments of the present invention are only described, and it should be noted that, for those skilled in the art, modifications can be made without departing from the inventive concept, but these all fall into the protection scope of the present invention.

Claims (8)

1. The utility model provides a flexible circuit board, its characterized in that, including first overburden, metal foil layer and the second overburden that stacks gradually the setting, the metal foil layer with first overburden reaches the second overburden passes through the glue film and connects, first overburden is equipped with first through-hole, the second overburden is equipped with the second through-hole, flexible circuit board still include with metal foil layer connects and first pad and the second pad of mutual interval, first pad accept in first through-hole and with the metal foil layer is connected, the second pad accept in the second through-hole and with the metal foil layer is connected.

2. The flexible circuit board of claim 1, wherein the metal foil layer has a tensile strength greater than or equal to 800 MPa.

3. The flexible circuit board of claim 2, wherein the metal foil layer is selected from a stainless steel foil or a titanium copper foil.

4. The flexible circuit board of claim 1, wherein the metal foil layer includes an upper surface and a lower surface disposed opposite the upper surface, the first coverlay covering the upper surface, and the second coverlay covering the lower surface.

5. The flexible circuit board of claim 1, wherein the first and second coverlays are polyimide films.

6. The flexible circuit board of claim 1, wherein the adhesive layer is an acrylic hot melt adhesive.

7. The flexible circuit board of claim 1, wherein the first and second pads are tin pads.

8. An electronic device comprising the flexible circuit board according to any one of claims 1 to 7.

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