CN210780687U - S-band solid-state power amplifier - Google Patents
S-band solid-state power amplifier Download PDFInfo
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- CN210780687U CN210780687U CN201922020127.0U CN201922020127U CN210780687U CN 210780687 U CN210780687 U CN 210780687U CN 201922020127 U CN201922020127 U CN 201922020127U CN 210780687 U CN210780687 U CN 210780687U
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Abstract
The utility model discloses an S-band solid-state power amplifier, which comprises a solid-state power amplifier module, an antenna module, a power supply module and a heat dissipation module; the solid-state power amplifier module comprises a preceding-stage power amplifier assembly, a power divider and a final-stage power amplifier assembly, wherein the final-stage power amplifier assembly is a single power amplifier assembly and comprises the power divider, a pushing-stage amplifier, a high-power amplifier, a temperature compensation attenuator and an isolator; the universal power supply module supplies power through the power supply module, is connected with the single power amplifier assembly and is used for supplying power to the single power amplifier assembly; and the universal measurement and control combined module and the universal power supply module are used for receiving the control signal input of the remote universal power supply module and realizing the state readback of the universal power supply module. The utility model discloses a general power module and general accuse survey combination module, the side has improved solid-state amplifier's job stabilization nature and reliability greatly.
Description
Technical Field
The utility model relates to a solid-state power amplifier of S wave band belongs to radar, radar simulator or electron countermeasure technical field.
Background
For a high-power radiation source, in order to obtain a power output of several kilowatts or even several tens of kilowatts, a power synthesis method is generally adopted to synthesize multiple paths of amplifier signals with lower power into a required high-power radiation signal, and the specific methods include two methods: firstly, a power synthesis technology based on a circuit or a waveguide is adopted, multi-channel signals are subjected to power synthesis by using a synthesis network of the circuit or the waveguide and then radiated out through an antenna, but the efficiency of power synthesis is reduced due to the power loss of the synthesis network; the second method is based on free space power synthesis technology, by adopting a space power synthesis antenna, multi-path power signals are directly radiated to a free space through an antenna unit, and by controlling the phase of each path of radiation of an amplifier, a high-power electromagnetic wave beam radiated directionally is directly synthesized in the free space. Is an effective way for generating high-power electromagnetic wave radiation.
An active array antenna is a space power synthesis technology, and utilizes a plurality of amplifier power outputs to transmit electromagnetic waves with the same frequency and phases conforming to a specific relation, so that the power of the electromagnetic waves are mutually superposed in the space transmission process, and high-energy-density electromagnetic beams are formed in a specific direction and a specific distance. Solid state power amplifier components are an important component of active array antennas. At present, the transmitter unit in the radar simulator device mainly comprises two kinds of traveling wave tube amplifiers and solid state amplifiers. The advantages of high reliability, high stability, long service life, wide working frequency band, rapid start-up, simple and safe operation, fault softening and the like of the solid-state amplifier transmitter gradually become the leading development direction of the transmitting unit in the radar system. But the reliability and stability of current solid state amplifier transmitters need to be further improved.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that overcome the not high defect of reliability and stability of solid-state amplifier transmitter among the prior art, provide a S wave band solid-state power amplifier.
In order to solve the technical problem, the utility model discloses a following technical scheme:
the utility model relates to a S wave band solid state power amplifier, including the base plate be provided with solid state power amplifier module, antenna module, power module, accuse survey composite module and thermal module on the base plate, solid state power amplifier module is connected with antenna module, power module and thermal module respectively, solid state power amplifier module includes preceding stage power divider, preceding stage power amplifier subassembly, back level power divider and last stage power amplifier subassembly, and S frequency channel radio frequency signal passes through preceding stage power divider inputs to preceding stage power amplifier subassembly, preceding stage power amplifier subassembly passes through back level power divider drive last stage power amplifier subassembly; the power supply module is respectively connected with the electric pre-stage power distributor, the pre-stage amplifier, the post-stage power distributor, the final-stage amplifier, the control and test combined module and the heat dissipation module; the antenna module comprises a monitoring antenna and a radiation antenna, the preceding-stage power amplifier component is connected with the monitoring antenna, and the final-stage power amplifier component is connected with the radiation antenna;
the final power amplifier component is a single power amplifier component and comprises a power distributor, a pushing-stage amplifier, a high-power amplifier, a temperature compensation attenuator and an isolator; the power divider is connected with a pushing stage amplifier through a temperature compensation attenuator, and an isolator is arranged between the pushing stage amplifier and the high-power amplifier; the single power amplifier component is connected with the power amplifier module and used for providing power for the single power amplifier component; and the control and measurement combined module is connected with the single power amplifier assembly and is used for receiving the control signal input of the remote universal power supply module and realizing the state readback of the universal power supply module.
Furthermore, the single power amplifier assembly comprises a feed circuit board connected with the power module and a temperature detection board connected with the feed circuit board, and the temperature detection board is connected with the high-power amplifier.
Further, the temperature detection plate comprises a temperature detection chip LM 94022.
Furthermore, the monitoring antenna and the radiation antenna adopt microstrip dipole antennas.
Still further, the S-band solid-state power amplifier further comprises a housing, and the housing comprises a radio frequency input connector and a radio frequency output connector.
The power divider and the microstrip dipole antenna are assembled to the shell in a screw fixing mode.
Furthermore, a power amplifier carrying handle is arranged at the end part of the S-band solid-state power amplifier.
Furthermore, the heat dissipation module adopts a fan unit heat dissipation device, and the fan unit is arranged on the side surface of the shell.
Furthermore, the solid-state power amplifier comprises 2 preceding stage power amplifier components, 9 two-path power distributors, 2 four-path power distributors, 14 final stage power amplifier components, 7 universal power supply modules and 7 control and test combination modules, wherein 1 preceding stage power amplifier component drives 4 final stage power amplifier components through 1 power distributor, and the other 1 preceding stage power amplifier component drives 3 final stage power amplifier components and a load through 1 power distributor; each control and test combined module is connected with 1 final-stage power amplifier assembly through 1 universal power supply module.
The base plate is provided with a sliding groove, and the single power amplifier assembly is inserted into the sliding groove and fastened through screws during assembly. The utility model discloses the beneficial technological effect who gains:
the utility model discloses between the amplifiers at different levels, all adopt the isolator to connect, the effectual impedance match that improves between the amplifier also prevents the amplifier output impedance from being drawn the inclined to one side condition simultaneously, has improved the conversion efficiency of amplifier power at different levels, has also improved the reliability. The universal power supply module and the control and measurement combined module are adopted, so that the combination requirements of different systems are facilitated, the working efficiency is greatly improved, the module types are reduced, the design cost is saved by purchasing in a large amount, the maintainability and the replaceability are strong, and the design is flexible;
a temperature compensation attenuator is added at the input end of the boost-stage amplifier P1 of each stage, so that the link gain is effectively adjusted and controlled, and the circuit gain is ensured to be stable. Meanwhile, the fluctuation of the gain is not more than +/-2 dB within a wide temperature range of-55 ℃ to +60 ℃;
the utility model discloses a temperature detection board of subassembly is put in single fortune and the temperature protection design is carried out with the feed circuit board temperature detection board of being connected, when installation or radiator unit trouble appear, in time turn-offs power amplifier module power supply system, effectively improves power amplifier module's operational reliability.
The utility model discloses a mode of spout cooperation screw locking, but quick plug has simplified the flow of installation and dismantlement greatly, improves the installation effectiveness.
Drawings
Fig. 1 is a schematic block diagram of a circuit of a single power amplifier module according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the power amplifier according to the embodiment of the present invention;
fig. 3 is a front view of the internal layout of the single power amplifier module according to the embodiment of the present invention;
fig. 4 is a back view of the single power amplifier module according to the embodiment of the present invention;
fig. 5 is a front view of the power amplifier according to the embodiment of the present invention;
fig. 6 is a view of the whole power amplifier structure-side view according to the embodiment of the present invention;
fig. 7 is a top view of the power amplifier according to the embodiment of the present invention;
fig. 8 is a back view of the power amplifier according to the embodiment of the present invention;
the labels in the figure are:
1. a feed circuit board; 2. a four-way power divider; 3. a push-stage amplifier; 4. an isolator; 5. a final amplifier; 6. a microstrip line 1; 7. a power supply connector; 8. a radio frequency input connector; 9. A microstrip line 2; 10. a power amplifier housing; 11. a temperature detection plate; 12. a radio frequency output connector; 13. A back wiring groove; 14. a power line pressing block; 15. monitoring the antenna backplane; 16. a power amplifier carrying handle; 17. the power amplifier is provided with a fixed handle; 18. a side panel; 19. a fan unit; 20. monitoring an antenna; 21. a radiating antenna; 22. a top panel;
23. a fan power supply interface; 24. two-way power divider; 25. a final-stage power amplifier component; 26. four-way power divider.
Detailed Description
The present invention will be further described with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
EXAMPLE 1
As shown in fig. 2, fig. 2 is a schematic diagram of the power amplifier according to the embodiment of the present invention; an S-band solid-state power amplifier comprises a substrate (not shown), wherein a solid-state power amplifier module, an antenna module, a power supply module, a control and test combined module and a heat dissipation module are arranged on the substrate, the solid-state power amplifier module is respectively connected with the antenna module, the power supply module and the heat dissipation module, the solid-state power amplifier module comprises a front-stage power divider, a front-stage power amplifier assembly, a rear-stage power divider 2 and a final-stage power amplifier assembly, and an S-band radio-frequency signal is input to the front-stage power amplifier assembly through the front-stage power divider; the front-stage power amplifier component drives the final-stage power amplifier component through the rear-stage power divider 2; the power module is respectively connected to the preceding stage power distributor, the preceding stage amplifier, the following stage power distributor 2 and the final stage amplifier 5 (also called final stage power amplifier assembly in the utility model), the control and measurement combined module and the heat dissipation module; the antenna module comprises a monitoring antenna and a transmitting antenna, the preceding stage power amplification component is connected with the monitoring antenna, and the final stage power amplification component is connected with the radiating antenna;
the final power amplifier component is a single power amplifier component (as shown in fig. 1 and fig. 2), and comprises a power divider 2, a push stage amplifier 3, a high-power amplifier, a temperature compensation attenuator and an isolator 4; the power divider 2 is connected with a pushing stage amplifier 3 through a temperature compensation attenuator, and an isolator 4 is arranged between the pushing stage amplifier 3 and the high-power amplifier; the S-band solid-state power amplifier also comprises a universal control and test combined module and a universal power supply module, wherein the universal power supply module is connected with the single power amplifier component and is used for providing power for the single power amplifier component; the universal measurement and control combined module is connected with the single power amplifier assembly and used for receiving the input of a remote control signal and reading back the state of the single power amplifier assembly.
The utility model discloses carry out gain and power rational distribution at different levels of circuit, power adopts "pushing away greatly for a short time", avoids the principle of "pushing away greatly" greatly, the example: the push stage amplifier 3P1, selecting a low power 15W amplifier, can just push the final amplifier P2, 200W, thus avoiding the situation that P2 burns out because P1 is selected too big. In addition, the total gain of the push-stage amplifier 3P1 and the final-stage amplifier 5P2 is selected not to exceed the isolation between the rf output and the rf output of the whole assembly, and is generally preferably 40 dB.
The amplifiers of all levels are connected by the isolator 4, so that the impedance matching between the amplifiers is effectively improved, the condition that the output impedance of the amplifiers is biased is prevented, the power conversion efficiency of the amplifiers of all levels is improved, and the reliability is also improved.
Fig. 1 shows that a temperature compensation attenuator is added at the input end of each stage of the push-stage amplifier 3P1, so that the link gain is effectively adjusted and controlled, and the circuit gain is ensured to be stable. Meanwhile, the fluctuation of the gain is not more than +/-2 dB within a wide temperature range of-55 ℃ to +60 ℃.
The utility model discloses reduce complete machine module quantity, shorten the power amplifier link and constitute, reduce complete machine power amplifier link for preceding stage power amplifier subassembly and final stage power amplifier subassembly, do so and practiced thrift the cost greatly, simultaneously, realize the independent assortment of different power magnitude of power amplifiers according to the system index, for example, we can adopt 1 preceding stage subassembly and 3-8 final stage power amplifier subassembly to make up, also can adopt 2 preceding stage power amplifier subassemblies and 8-16 power amplifier combinations, improved flexibility and system realizability.
The power amplifier complete machine of the embodiment is a schematic diagram, see fig. 2, and comprises 2 front stage power amplifier components, 9 two-way power dividers 24, 2 four-way power dividers 2, 14 final stage power amplifier components 5, 7 universal power supplies, 7 universal control and test combination modules, and a heat dissipation module.
Fig. 2 shows that the preceding-stage power splitter is a two-way power splitter, the two-way power splitter is connected to two preceding-stage power amplifier components (i.e., the preceding-stage amplifier modules in the figure), each preceding-stage amplifier module is connected to four-way power splitter modules, each-way power splitter module is connected to four two-way power splitters, and each two-way power splitter is connected to one final-stage amplifier module.
The front-stage power amplifier component adopts a gallium arsenide amplifier with good linearity, the dynamic characteristic of the whole power amplifier can be realized, and the power stability is 0.2dB under the condition that the dynamic is greater than 30 dB.
The utility model discloses the circuit function of well general accuse survey combination module is optimized, can accomplish that one-component switching on and shutting down is long-range controllable, and one-component adds electric detection and instruction, single track overcurrent detection and fault protection instruction, one-component temperature detection and fault protection instruction, one-component overvoltage and undervoltage detection and fault indication. The reliable and safe work of the power amplifier is ensured by detecting the state of the amplifier in real time.
On the basis of the above embodiment, in order to further improve the operational reliability of the single power amplifier component, as an optional implementation manner in the specific embodiment, the single power amplifier component includes a feed circuit board 1 connected to the power supply module and a temperature detection board 11 connected to the feed circuit board 1, and the temperature detection board 11 is connected to the high-power amplifier.
Further, the temperature detection plate 11 includes a temperature detection chip LM 94022.
The temperature detection plate and the over-temperature protection design are carried out on each stage of amplification link through the temperature detection plate, the temperature is detected through the wide temperature range detection chip LM94022, structural heat distribution is pre-analyzed through simulation software, the over-temperature threshold is set, the normal working temperature is +68 ℃, and the over-temperature threshold is set at +75 ℃. Therefore, the temperature of the power amplifier assembly can be detected in real time, data are read back, and when the power amplifier assembly is installed or the heat dissipation assembly fails, the power supply system of the power amplifier assembly is turned off in time, so that the working reliability of the power amplifier assembly is effectively improved.
The power-on state and the current state of each push-stage amplifier 3P1 and the final-stage amplifier 5P2 are detected in real time, and when a fault occurs, a power supply system of a power amplification component is turned off in time, so that a power amplification tube is protected, and the reliability is improved.
The monitoring antenna 20 is arranged on the monitoring antenna back plate 15; the monitoring antenna 20 and the radiation antenna 21 adopt microstrip dipole antennas, namely microstrip lines (6 and 9) shown in the figure, and the microstrip dipole antennas have the characteristics of small volume, light weight, low manufacturing cost and easiness in large-scale integration.
Example 3
The utility model discloses in the aspect of the structural layout, adopt the design of modularization, when reducing weight and volume, be favorable to batch production and random backup. In specific implementation, the S-band solid-state power amplifier further includes a power amplifier housing, and the power amplifier housing is provided with a radio frequency input connector 8, a radio frequency output connector 12, and a power connector 7 (as shown in fig. 3).
The back of the power amplifier shell is provided with a back wiring groove 13 for wiring of a power supply from the back wiring groove, and a power line pressing block 14 is further arranged, so that the layout in the shell is simple, and the maintenance and part replacement are facilitated.
The structural layout of the single component, see fig. 3 and 4, is optimized as follows:
in fig. 3 and 4, the four-way power divider 22, the microstrip line 16, and the microstrip line 2(9) are all assembled to the housing by welding in the previous design process, and the piece-driving stage amplifier 3 and the final stage amplifier 5 are all made into pad blocks.
In order to solve the inconvenient problem of maintaining the dismantlement of current solid-state amplifier, the utility model discloses in the embodiment all parts in the subassembly can be disassembled rapidly and the dismouting, have improved maintainability, practice thrift maintenance time, have saved the cost of labor.
The structural layout of the whole power amplifier is shown in fig. 5-8, and the following optimization is carried out:
structurally, the locking device is changed into a mode that the sliding groove is matched with the screw for locking, so that the locking device can be quickly inserted and pulled out, the processes of installation and disassembly are greatly simplified, and the installation efficiency is improved; the original design is that the power amplifier assembly is fixed to the power amplifier case in a locking strip mode, and due to the fact that the assembly difficulty often occurs in the structural tolerance problem, the secondary machining condition is optimized and then the sliding groove mode is adopted, polytetrafluoroethylene pads are filled in the sliding groove, and the assembly can be conveniently and quickly plugged and fixed.
Structurally, a power amplifier carrying handle 16 is designed at the end part of the single power amplifier assembly, and the power amplifier carrying handle is convenient for manual installation and disassembly and can be used as an upper-layer fixing mechanism;
in technical indexes, the 14 assemblies output 56 paths of ports, and the peak power output by each path of port is greater than 200 watts, so that a stable and reliable high-power source is provided for realizing high-power space synthesis power.
A heat dissipation module: the power amplifier consists of 8 special direct current fans and 7 radiators, can timely emit heat of a system of approximately 1500 watts, and ensures that the power amplifier stably works at the high temperature of +55 ℃.
The utility model discloses an adaptation radar simulator system is to the requirement of solid-state high-power radiation source, on a large amount of engineering application bases, optimizes, has the miniaturization, high reliability, low cost, and the universalization can quick maintenance's advantage.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be considered as the protection scope of the present invention.
Claims (10)
1. An S-band solid-state power amplifier is characterized by comprising a substrate, wherein a solid-state power amplifier module, an antenna module, a power supply module, a control and measurement combined module and a heat dissipation module are arranged on the substrate, the solid-state power amplifier module is respectively connected with the antenna module, the power supply module and the heat dissipation module, the solid-state power amplifier module comprises a front-stage power distributor, a front-stage power amplifier assembly, a rear-stage power distributor and a final-stage power amplifier assembly, an S-band radio-frequency signal is input to the front-stage power amplifier assembly through the front-stage power distributor, and the front-stage power amplifier assembly drives the final-stage power amplifier assembly through the; the power supply module is respectively connected with the electric pre-stage power distributor, the pre-stage amplifier, the post-stage power distributor, the final-stage amplifier, the control and test combined module and the heat dissipation module; the antenna module comprises a monitoring antenna and a radiation antenna, the preceding-stage power amplifier component is connected with the monitoring antenna, and the final-stage power amplifier component is connected with the radiation antenna;
the final power amplifier component is a single power amplifier component and comprises a power distributor, a pushing-stage amplifier, a high-power amplifier, a temperature compensation attenuator and an isolator; the power divider is connected with a pushing stage amplifier through a temperature compensation attenuator, and an isolator is arranged between the pushing stage amplifier and the high-power amplifier; the single power amplifier component is connected with the power amplifier module and used for providing power for the single power amplifier component; and the control and measurement combined module is connected with the single power amplifier assembly and is used for receiving the input of a remote control signal and realizing the state readback of the single power amplifier assembly.
2. The S-band solid state power amplifier of claim 1, wherein the single power amplifier assembly comprises a feeding circuit board connected to the power module and a temperature sensing board connected to the feeding circuit board, the temperature sensing board being connected to the high power amplifier.
3. An S-band solid state power amplifier according to claim 2, wherein the temperature detection board comprises a temperature detection chip LM 94022.
4. An S-band solid state power amplifier as claimed in claim 1 wherein the monitoring and radiating antennas are microstrip dipole antennas.
5. The S-band solid state power amplifier of claim 1, further comprising a power amplifier housing, wherein the power amplifier housing has a radio frequency input connector and a radio frequency output connector.
6. The S-band solid-state power amplifier of claim 5, wherein the power divider and the microstrip dipole antenna are assembled to the power amplifier housing by means of screws.
7. The S-band solid-state power amplifier of claim 5, wherein the heat dissipation module is a fan unit heat dissipation device, and the fan unit is disposed on a side surface of the power amplifier housing.
8. The S-band solid state power amplifier of claim 1, wherein a power amplifier carrying handle is disposed at an end of the S-band solid state power amplifier.
9. The solid-state power amplifier according to claim 1, wherein the solid-state power amplifier comprises 2 pre-stage power amplifier components, 9 two-stage power dividers, 2 four-stage power dividers, 14 final-stage power amplifier components, 7 general power modules and 7 testing and controlling combined modules, wherein 1 pre-stage power amplifier component drives 4 final-stage power amplifier components through 1 power divider, and the other 1 pre-stage power amplifier component drives 3 final-stage power amplifier components and a load through 1 power divider; each control and test combined module is connected with 1 final-stage power amplifier assembly through 1 universal power supply module.
10. The S-band solid state power amplifier of claim 1, wherein a sliding slot is disposed on the substrate, and the single power amplifier module is inserted into the sliding slot and fastened by screws during assembly.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201922020127.0U CN210780687U (en) | 2019-11-21 | 2019-11-21 | S-band solid-state power amplifier |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201922020127.0U CN210780687U (en) | 2019-11-21 | 2019-11-21 | S-band solid-state power amplifier |
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| CN210780687U true CN210780687U (en) | 2020-06-16 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112422091A (en) * | 2020-11-18 | 2021-02-26 | 成都菲斯洛克电子技术有限公司 | Miniaturized multifunctional MHz anti-interference continuous wave power amplifier module |
| CN112462340A (en) * | 2020-11-16 | 2021-03-09 | 南京长峰航天电子科技有限公司 | Novel S-frequency-band solid-state transmitting array surface |
| CN112751579A (en) * | 2021-01-15 | 2021-05-04 | 南京正銮电子科技有限公司 | Solid-state transmitter |
| CN113225033A (en) * | 2021-05-13 | 2021-08-06 | 南京宁镭电子科技有限公司 | Power amplifier extension with bootstrap circuit |
| CN117081525A (en) * | 2023-10-17 | 2023-11-17 | 南京纳特通信电子有限公司 | Solid-state power amplifier array system |
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2019
- 2019-11-21 CN CN201922020127.0U patent/CN210780687U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112462340A (en) * | 2020-11-16 | 2021-03-09 | 南京长峰航天电子科技有限公司 | Novel S-frequency-band solid-state transmitting array surface |
| CN112422091A (en) * | 2020-11-18 | 2021-02-26 | 成都菲斯洛克电子技术有限公司 | Miniaturized multifunctional MHz anti-interference continuous wave power amplifier module |
| CN112751579A (en) * | 2021-01-15 | 2021-05-04 | 南京正銮电子科技有限公司 | Solid-state transmitter |
| CN112751579B (en) * | 2021-01-15 | 2022-03-15 | 南京正銮电子科技有限公司 | Solid-state transmitter |
| CN113225033A (en) * | 2021-05-13 | 2021-08-06 | 南京宁镭电子科技有限公司 | Power amplifier extension with bootstrap circuit |
| CN117081525A (en) * | 2023-10-17 | 2023-11-17 | 南京纳特通信电子有限公司 | Solid-state power amplifier array system |
| CN117081525B (en) * | 2023-10-17 | 2024-01-23 | 南京纳特通信电子有限公司 | Solid-state power amplifier array system |
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