CN210778155U - Subminiature chip common mode inductor - Google Patents
Subminiature chip common mode inductor Download PDFInfo
- Publication number
- CN210778155U CN210778155U CN201922304828.7U CN201922304828U CN210778155U CN 210778155 U CN210778155 U CN 210778155U CN 201922304828 U CN201922304828 U CN 201922304828U CN 210778155 U CN210778155 U CN 210778155U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- board
- common mode
- subminiature
- heating panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 41
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 241001233242 Lontra Species 0.000 claims abstract description 9
- 238000007493 shaping process Methods 0.000 claims abstract description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 238000004804 winding Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 239000011093 chipboard Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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Abstract
The utility model discloses a subminiature paster common mode inductance, including paster board, heating panel and heat dissipation otter board, paster board upside shaping has the heating panel, the shaping has the heat dissipation seam on the heating panel, paster board center is provided with the heat dissipation otter board. Has the advantages that: the utility model discloses a heating panel, heat dissipation seam and the heat dissipation otter board that sets up for the heat that the inductance during operation produced dispels the heat through heating panel and heat dissipation seam, improves the radiating effect, guarantees the work efficiency of inductance.
Description
Technical Field
The utility model relates to an inductance field, concretely relates to subminiature paster common mode inductance.
Background
Generally, the inductor in an electronic circuit is an air core coil or a coil with a magnetic core, and can only pass a small current and bear a low voltage; the power inductor also has a hollow coil and a magnetic core, and is mainly characterized in that the power inductor can bear dozens of amperes, hundreds of amperes, thousands of amperes or even tens of thousands of amperes due to winding by using a thick conducting wire. The power surface mounted inductor is divided into a magnetic cover and a non-magnetic cover and mainly comprises a magnetic core and a copper wire. The filter and oscillation functions in the circuit.
When the conventional chip common-mode inductor is used, the heat dissipation of the inductor is realized through the chip plate, the heat dissipation effect is general, and the working efficiency of the inductor is influenced, so that the conventional problem is solved by the subminiature chip common-mode inductor.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
In order to overcome the defects of the prior art, the ultra-small patch common mode inductor is provided, and the problem that when the conventional patch common mode inductor is used, the heat dissipation of the inductor is carried out through a patch plate, the heat dissipation effect is general, and the working efficiency of the inductor is influenced is solved.
(II) technical scheme
The utility model discloses a following technical scheme realizes: the utility model provides a subminiature paster common mode inductance, including paster board, heating panel and heat dissipation otter board, paster board upside shaping has the heating panel, the shaping has the heat dissipation seam on the heating panel, paster board center is provided with the heat dissipation otter board.
Further, the paster board downside is provided with the fixed block, the fixed block lower extreme is provided with the wiring end, the shaping has the wiring groove on the wiring end, be provided with the magnetic core between the fixed block, the winding of the magnetic core outside is connected with the coil, the wiring end with be provided with the lead wire between the coil.
By adopting the technical scheme, the lead wire can connect the wiring terminal and the coil.
Further, the heat dissipation screen plate is connected with the patch plate through a clamping groove, the fixed block is connected with the patch plate through a screw, and the fixed block is connected with the magnetic core through a clamping groove.
By adopting the technical scheme, the heat dissipation screen plate can enable heat generated by the coil to be transmitted to the heat dissipation plate in time, and further the heat dissipation effect of the inductor is greatly improved.
Further, the terminal and the coil are connected through the lead wire, the lead wire is welded with the terminal, and the lead wire is welded with the coil.
By adopting the technical scheme, the inductor can be connected to the circuit board through the terminal.
Furthermore, the wiring end is connected with the fixing block through a clamping groove.
By adopting the technical scheme, the fixing block can fix the magnetic core.
(III) advantageous effects
Compared with the prior art, the utility model, following beneficial effect has:
for solving current paster common mode inductance when using, the heat dissipation of inductance is dispelled the heat through the paster board, and the radiating effect is general, influences the work efficiency's of inductance problem, the utility model discloses a heating panel, heat dissipation seam and the heat dissipation otter board that sets up for the heat that the inductance during operation produced dispels the heat through heating panel and heat dissipation seam, improves the radiating effect, guarantees the work efficiency of inductance.
Drawings
Fig. 1 is a front view of the subminiature chip common mode inductor of the present invention;
fig. 2 is a bottom view of the subminiature chip common mode inductor according to the present invention;
fig. 3 is a left side view of the subminiature chip common mode inductor of the present invention.
The reference numerals are explained below:
1. a fixed block; 2. a magnetic core; 3. a coil; 4. a patch board; 5. a terminal; 6. a wiring slot; 7. a heat dissipation screen plate; 8. a heat dissipation plate; 9. heat dissipation seams; 10. and (7) leading wires.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1-3, the subminiature chip common mode inductor of the present embodiment includes a chip board 4, a heat dissipation plate 8 and a heat dissipation mesh plate 7, a fixing block 1 is disposed on a lower side of the chip board 4, a connection terminal 5 is disposed at a lower end of the fixing block 1, a connection slot 6 is formed in the connection terminal 5, a magnetic core 2 is disposed between the fixing block 1, a coil 3 is wound and connected outside the magnetic core 2, a lead 10 is disposed between the connection terminal 5 and the coil 3, the heat dissipation mesh plate 7 is connected to the chip board 4 through a clamping slot, the fixing block 1 is connected to the chip board 4 through a screw, the fixing block 1 is connected to the magnetic core 2 through a clamping slot, the connection terminal 5 is connected to the coil 3 through the lead 10, the lead 10.
As shown in fig. 1-3, in this embodiment, a heat dissipation plate 8 is formed on the upper side of the chip board 4, a heat dissipation slit 9 is formed on the heat dissipation plate 8, a heat dissipation screen 7 is disposed in the center of the chip board 4, and heat generated by the inductor during operation is dissipated through the heat dissipation plate 8 and the heat dissipation slit 9 by the heat dissipation plate 8, the heat dissipation slit 9, and the heat dissipation effect is improved, and the work efficiency of the inductor is ensured.
The specific implementation process of this embodiment is as follows: when using, on being connected to the circuit board with fixed block 1 through wiring groove 6 of wiring end 5 downside, coil 3 transmits the heat that produces at the during operation for heating panel 8 through heat dissipation otter board 7 to carry out the heat through heating panel 8 and give off, improve the radiating effect of device, guarantee the work efficiency of inductance.
The above-described embodiments are merely illustrative of the preferred embodiments of the present invention and are not intended to limit the spirit and scope of the present invention. Without departing from the design concept of the present invention, various modifications and improvements made by the technical solution of the present invention by those skilled in the art should fall into the protection scope of the present invention, and the technical contents claimed by the present invention have been fully recorded in the claims.
Claims (5)
1. Subminiature paster common mode inductance, its characterized in that: including paster board (4), heating panel (8) and heat dissipation otter board (7), paster board (4) upside shaping has heating panel (8), the shaping has heat dissipation seam (9) on heating panel (8), paster board (4) center is provided with heat dissipation otter board (7).
2. The subminiature patch common mode inductor of claim 1, wherein: the utility model discloses a wire connection structure, including paster board (4), fixed block (1) lower extreme are provided with wiring end (5), the shaping has wiring groove (6) on wiring end (5), be provided with magnetic core (2) between fixed block (1), magnetic core (2) outside winding is connected with coil (3), wiring end (5) with be provided with lead wire (10) between coil (3).
3. The subminiature patch common mode inductor of claim 2, wherein: the heat dissipation screen plate (7) is connected with the patch plate (4) through a clamping groove, the fixing block (1) is connected with the patch plate (4) through a screw, and the fixing block (1) is connected with the magnetic core (2) through the clamping groove.
4. The subminiature patch common mode inductor of claim 3, wherein: the terminal (5) is connected with the coil (3) through the lead (10), the lead (10) is welded with the terminal (5), and the lead (10) is welded with the coil (3).
5. The subminiature patch common mode inductor of claim 4, wherein: the wiring end (5) is connected with the fixing block (1) through a clamping groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922304828.7U CN210778155U (en) | 2019-12-20 | 2019-12-20 | Subminiature chip common mode inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922304828.7U CN210778155U (en) | 2019-12-20 | 2019-12-20 | Subminiature chip common mode inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210778155U true CN210778155U (en) | 2020-06-16 |
Family
ID=71049623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922304828.7U Expired - Fee Related CN210778155U (en) | 2019-12-20 | 2019-12-20 | Subminiature chip common mode inductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210778155U (en) |
-
2019
- 2019-12-20 CN CN201922304828.7U patent/CN210778155U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200616 |