CN210757122U - Retaining ring - Google Patents
Retaining ring Download PDFInfo
- Publication number
- CN210757122U CN210757122U CN201921585844.1U CN201921585844U CN210757122U CN 210757122 U CN210757122 U CN 210757122U CN 201921585844 U CN201921585844 U CN 201921585844U CN 210757122 U CN210757122 U CN 210757122U
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- Prior art keywords
- annular portion
- retaining ring
- polishing
- substrate
- unit
- Prior art date
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- 239000007769 metal material Substances 0.000 claims abstract description 21
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract description 11
- 238000005498 polishing Methods 0.000 description 73
- 239000000758 substrate Substances 0.000 description 41
- 239000000126 substance Substances 0.000 description 16
- 238000004140 cleaning Methods 0.000 description 14
- 239000007788 liquid Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 10
- 239000000243 solution Substances 0.000 description 8
- 238000001035 drying Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000009966 trimming Methods 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a retaining ring, including first annular portion and second annular portion, first annular portion is made by metal material, second annular portion is made by non-metal material, the at least one side and the second annular portion of first annular portion are hugged closely fixedly.
Description
Technical Field
The utility model belongs to the technical field of the chemical mechanical polishing, particularly, relate to a retaining ring.
Background
Chemical mechanical polishing is an acceptable method for global polishing of substrates. The polishing method generally attracts a substrate to a lower portion of a carrier head, the bottom surface of the substrate having a deposition layer abuts against a rotating polishing pad, and the carrier head is driven by a driving part to rotate in the same direction as the polishing pad and to apply a downward load to the substrate; meanwhile, the polishing solution is supplied between the polishing pad and the substrate, and the substrate is thinned under the combined action of chemistry and machinery.
The lower portion of the carrier head is provided with a retaining ring, which plays an important role in substrate polishing. On one hand, it can prevent the substrate from flying out of the bottom of the carrier head during polishing; on the other hand, the bottom of the retaining ring is provided with a groove which can renew the polishing liquid between the substrate and the polishing pad; moreover, the retaining ring is pressed against the polishing pad to participate in the adjustment of the edge pressure of the substrate, which is beneficial to realizing the global planarization of the substrate.
Conventional retaining rings typically include a metal component and a non-metal component that are bonded together with an adhesive, the metal component being attached to the carrier head base and the non-metal portion abutting the rotating polishing pad. The gluing of metal parts with non-metal parts risks separation and the gluing process of the adhesive increases the manufacturing cost of the retaining ring, affecting the cost of the chemical mechanical polishing of the substrate.
Therefore, it is desirable to design a retaining ring to solve the technical problems in the prior art.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art to at least a certain extent. Therefore, the utility model discloses a retaining ring, including first annular portion and second annular portion, first annular portion is made by metal material, second annular portion is made by non-metallic material, the at least one side and the second annular portion of first annular portion are hugged closely fixedly.
Preferably, the inner side surface, the outer side surface, the bottom surface and/or the top surface of the first annular part are/is provided with a clamping structure.
Preferably, the inner side surface, the outer side surface, the bottom surface and/or the top surface of the first annular part are/is provided with nano-scale micropores.
Preferably, the snap-fit structure is a groove and/or a protrusion.
Preferably, the groove and the protrusion are spaced apart from each other on the inner side surface, the outer side surface, the bottom surface and/or the top surface of the first annular portion.
The application discloses retaining ring, its beneficial effect: the design is ingenious, the structure is stable, and the processing and manufacturing cost is low.
Drawings
The advantages of the invention will become clearer and more easily understood from the detailed description given with reference to the following drawings, which are given by way of illustration only and do not limit the scope of protection of the invention, wherein:
figure 1 is a top view of a chemical mechanical polishing apparatus according to the present invention;
fig. 2 is a schematic structural view of a polishing unit according to the present invention;
FIG. 3 is a schematic structural view of a carrier head according to the present invention;
fig. 4 is an exploded view of an embodiment of a retaining ring according to the present invention;
FIG. 5 is a cross-sectional view of the corresponding retaining ring of FIG. 4;
fig. 6 is an exploded view of a further embodiment of a retaining ring according to the present invention;
FIG. 7 is a cross-sectional view of the corresponding retaining ring of FIG. 6;
fig. 8 is an exploded view of another embodiment of a retaining ring according to the present invention;
FIG. 9 is a cross-sectional view of the corresponding retaining ring of FIG. 8;
fig. 10 is a schematic view of a first ring portion according to the present invention;
fig. 11 is an exploded view of a further embodiment of a retaining ring according to the present invention;
FIG. 12 is a cross-sectional view of the corresponding retaining ring of FIG. 11;
fig. 13 is an exploded view of a further embodiment of a retaining ring according to the present invention;
FIG. 14 is a cross-sectional view of the corresponding retaining ring of FIG. 13;
fig. 15 and 16 are flow charts of the manufacturing process of the retaining ring according to the present invention.
Wherein the numerical references have the following meanings:
1-a front-end module;
2-a polishing unit; 2A-1 st polishing unit; 2B-2 nd polishing unit; 2C-No. 3 polishing unit; 2D-4 th polishing unit;
3-a cleaning unit;
4-a control unit;
10-a polishing disk;
20-a polishing pad;
30-a wafer carrier;
31-a carrier head; 32-an upper pneumatic assembly;
311-a substrate; 312-a retaining ring; 3121-a first annular portion; 31211-groove; 31212-bumps; 3122-a second annular portion;
40-a trimming device; 41-trimming arm; 42-trimming the head;
50-polishing liquid supply device.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention and are provided to illustrate the concepts of the present invention; the description is intended to be illustrative and exemplary and should not be taken to limit the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions which make any obvious replacement or modification of the embodiments described herein.
The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of the respective portions and the mutual relationships thereof. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to identify the same elements in the drawings in order to clearly illustrate the structure of the various elements of the embodiments of the invention.
Fig. 1 is a plan view of an overall structure of a chemical mechanical polishing apparatus, the chemical mechanical polishing apparatus includes a front end module 1, a polishing unit 2, a cleaning unit 3, and a control unit 4, the front end module 1, the polishing unit 2, and the cleaning unit 3 are independently provided, and the control unit 4 controls a substrate processing operation.
The Front end module 1 is provided with two or more Front loading units in which substrate cassettes for storing substrates such as a plurality of semiconductor wafers are placed, the Front loading units being arranged in the width direction of the chemical mechanical polishing equipment, and an open cassette (SMIF) or a Standard Manufacturing Interface (SMIF) or a Front Opening Unified Pod (FOUP) being mountable on the Front loading units. Here, the SMIF and the FOUP are sealed containers in which substrate cassettes are housed and which can maintain an environment independent from an external space by being covered with a partition plate.
A traveling mechanism is disposed in the front end module 1 along the front loading section, and a transport robot movable in the substrate cassette arrangement direction is disposed in the traveling mechanism. The transport robot can access the substrate cassette mounted on the front loading unit by moving on the traveling mechanism. The transfer robot has upper and lower hands, and returns the substrate after processing to the substrate cassette using the upper hand and transfers the substrate before processing from the substrate cassette using the lower hand. The front end module 1 is an area where the cleanest state is set for chemical mechanical polishing, and thus, the inside of the front end module 1 is always maintained at a higher pressure than both the polishing unit 2 and the cleaning unit 3 to prevent air flow of other areas from entering the front end module 1. The front end module 1 is provided with a filter fan unit having a clean air filter such as a HEPA filter, an ULPA filter, or a chemical filter, and constantly blows out clean air from which particles are removed.
The polishing unit 2 is an area for performing chemical mechanical polishing on the surface of the substrate, and comprises a 1 st polishing unit 2A, a 2 nd polishing unit 2B, a 3 rd polishing unit 2C and a 4 th polishing unit 2D, wherein the 1 st polishing unit 2A, the 2 nd polishing unit 2B, the 3 rd polishing unit 2C and the 4 th polishing unit 2D are arranged along the length direction of the chemical mechanical polishing device.
The washing unit 3 includes a washing module and a drying module. The cleaning module comprises a driving assembly and a cleaning assembly, wherein the driving assembly drives the substrate to rotate, and the cleaning assembly swings around an axis vertical to the surface of the substrate to eject fluid to the surface of the substrate. For example, when the substrate surface is cleaned by spraying deionized water or chemicals onto the substrate surface by the cleaning assembly, the substrate is rotated, particles on the substrate surface can be removed by the action of centrifugal force, compared with the existing brush and megasonic cleaning mode, the mode of cleaning the substrate surface by using liquid has less damage, and other elements are not required to be in contact with the substrate, so that the substrate surface is not polluted secondarily due to the fact that the consumable materials become dirty after the service life of the consumable materials. The drying module is arranged side by side with the cleaning module, wherein the drying module is used for drying the substrate, removing the liquid on the surface of the substrate, and avoiding the liquid drop attached to the surface of the substrate from generating water stain on the surface of the substrate in the process of naturally drying the liquid drop, thereby ensuring the cleaning effect of the substrate. In some embodiments, the cleaning module may also be a brush and/or megasonic cleaning option, which is located outside the polishing unit 2 alongside the drying module.
Since the 1 st polishing unit 2A, the 2 nd polishing unit 2B, the 3 rd polishing unit 2C, and the 4 th polishing unit 2D have the same structure as each other, the 1 st polishing unit 2A will be explained below. Fig. 2 is a perspective view of a polishing unit 2A of fig. 1, the polishing unit 2A including a polishing disk 10, a polishing pad 20, a wafer carrier 30, a dressing device 40, and a polishing liquid supply device 50; the polishing pad 20 is disposed on the upper surface of the polishing disk 10 and rotates therewith along the axis Ax 1; a horizontally movable wafer carrier 30 disposed above the polishing pad 20, and having a lower surface holding a wafer W to be polished; the dressing device 40 comprises a dressing arm 41 and a dressing head 42, wherein the dressing arm 41 drives the rotating dressing head 42 to swing so as to dress the surface of the polishing pad 20 to a state suitable for polishing; the polishing liquid supply device 50 distributes the polishing liquid on the surface of the polishing pad 20; during the polishing operation, the wafer carrier 30 presses the surface of the wafer W to be polished against the surface of the polishing pad 20, and the polishing liquid is distributed between the polishing pad 20 and the wafer W, so as to remove the surface material of the wafer under the action of the chemical mechanical process. The wafer carrier 30 includes a carrier head 31 and an upper pneumatic assembly 32 (UPA), wherein the carrier head 31 is coupled to the upper pneumatic assembly 32 by a connection assembly (not shown).
Fig. 3 is a schematic structural diagram of the carrier head 31, in which the carrier head 31 includes a base 311 and a retaining ring 312 disposed at the bottom of the base 311, an elastic film is disposed inside the base 311, the elastic film and the base form independent chambers to hold a substrate to be polished, the retaining ring 312 is disposed outside the elastic film, and a gap is disposed between the elastic film and the inner side of the retaining ring 312.
The retaining ring 312 of the present invention is illustrated in the exploded view, as shown in fig. 4, and includes a first annular portion 3121 and a second annular portion 3122, which are integrally formed. Fig. 5 is a sectional view of the retaining ring, in which the first annular portion 3121 is integrally wrapped by the second annular portion 3122, the first annular portion 3121 is made of a metal material, the second annular portion 3122 is made of a non-metal material, the bottom surface and the side surface of the first annular portion 3121 are closely adhered to the second annular portion 3122, the side surface of the first annular portion 3121 is provided with a groove 31211, and the bottom surface of the first annular portion 3121 is provided with a projection 31212 to increase the contact area between the first annular portion 3121 and the second annular portion 3122. As a variation of this embodiment, the lateral surface and the bottom surface of the first annular portion 3121 may be provided with a plurality of grooves 31211 and/or protrusions 31212 to increase the degree of coupling of the first annular portion 3121 with the second annular portion 3122.
As an embodiment of the utility model, the bottom surface and the side of first annular portion 3121 all are provided with the nanometer micropore, and the non-metallic material who constitutes second annular portion 3122 is in the molten state, and its direct injection is to the forming die in for the non-metallic material of molten state directly gets into the nanometer micropore, has effectively guaranteed the joint strength of first annular portion 3121 with second annular portion 3122.
The top surface of the first annular portion 3121 is provided with a threaded hole (not shown) through which the retaining ring is fixedly coupled to the base of the carrier head. In some embodiments, the first annular portion 3121 can be made of a metal such as stainless steel, titanium alloy, or aluminum alloy, and the second annular portion 3122 can be made of a non-metallic material such as PPS, PEEK, polycarbonate, polyurethane, or PET. Preferably, the second annular portion 3122 is made of a non-metallic material such as PPS, PEEK, etc., which is an inert material, has no influence on the chemical mechanical polishing process, and has sufficient elasticity to prevent the substrate edge from being chipped or cracked.
As an embodiment of the utility model, the bottom surface of second annular portion 3122 is provided with a plurality of circulation grooves, the setting is link up by medial surface to the lateral surface of second annular portion 3122 to the circulation groove, and the polishing solution that chemical mechanical polishing used gets into between base plate and the polishing pad through the circulation groove, and the polishing solution after the polishing was used is via the circulation groove outflow again, and the polishing solution realizes self-renewal through the circulation groove of second annular portion 3122 to guarantee that chemical mechanical polishing's smooth and easy goes on.
Fig. 6 is an exploded view of another embodiment of the retaining ring 312 of the present invention, in which the first annular portion 3121 is made of a metal material, the second annular portion 3122 is made of a non-metal material, and the side surface and the bottom surface of the first annular portion 3121 are closely attached to the second annular portion 3122 and integrated by nano-molding. Fig. 7 is a sectional view of the retaining ring, in which the first annular portion 3121 has a side surface having a tapered shape on which a plurality of nano-pores are formed, and a non-metallic material in a molten state enters the nano-pores of the first annular portion 3121, thereby securing a bonding strength of the first annular portion 3121 and the second annular portion 3122.
Fig. 8 is an exploded view of an embodiment of the retaining ring 312 of the present invention, in which the side, bottom and top surfaces of the first annular portion 3121 are closely attached to the second annular portion 3122 and integrated by nano-molding. Fig. 9 is a sectional view of the retaining ring, and the bottom surface and the top surface of the first annular portion 3121 are provided with a roughened structure to prevent the first annular portion 3121 from being separated from the second annular portion 3122, i.e., to allow the non-metallic material in a molten and/or semi-molten state to be directly bonded to the metal support structure of the retaining ring to mold a desired retaining ring. As shown in fig. 10, which is a schematic structural diagram of the first annular portion 3121, the bottom surface and the top surface of the first annular portion 3121 are provided with roughened structures in which recesses and protrusions are arranged at intervals. The cross-sectional shape of the recesses and protrusions of the roughened structure is rectangular, and it is understood that the cross-sectional shape may be other shapes, such as circular, oval and/or triangular.
Fig. 11 is an exploded view of an embodiment of the retaining ring 312 of the present invention, in which the first annular portion 3121 is made of a metal material, the second annular portion 3122 is made of a non-metal material, and the inner side surface and the bottom surface of the first annular portion 3121 are closely attached to the second annular portion 3122 and integrated by nano-molding. Fig. 12 is a cross-sectional view of the retaining ring, the inner side surface and the bottom surface of the first annular portion 3121 are provided with nano-scale micro-holes, and the non-metallic material in a molten state directly enters the nano-scale micro-holes, so that the first annular portion 3121 and the second annular portion 3122 are tightly combined without using an adhesive, thereby saving an adhesion process and reducing the manufacturing cost of the retaining ring.
Fig. 13 is an exploded view of an embodiment of the retaining ring 312 of the present invention, in which the first annular portion 3121 is made of a metal material, the second annular portion 3122 is made of a non-metal material, and the bottom surface of the first annular portion 3121 and the second annular portion 3122 are closely attached and integrated by nano-molding. Fig. 14 is a sectional view of the retaining ring, in which the bottom surface of the first ring body portion 10 is provided with the protrusions 31212, the top surface of the corresponding second ring portion 3122 is provided with the depression structure of the catching protrusions 31212, and the bottom surface of the first ring portion 3121 is provided with nano-scale micro-holes to increase the coupling of the first ring portion 3121 and the second ring portion 3122 and prevent the second ring portion 3122 from falling off from the first ring portion 3121.
Fig. 15 is a flow chart illustrating the manufacturing process of the retaining ring 312 according to the present invention, and step S11 is a step of manufacturing the first annular portion 3121; step S12 is to pre-treat the first annular portion 3121, specifically, remove the embroidery layer on the surface of the first annular portion 3121 by means of sand blasting, shot blasting, grinding, etc., and clean and dry the first annular portion 3121; step S13 is to form nano-scale micro-holes on the side, bottom or top surface of the first annular portion 3121; step S14 is to manufacture the second annular portion 3122 to be integrated with the first annular portion 3121, specifically, the nonmetal constituting the second annular portion 3122 is in a molten state and flows into the nano-pores of the first annular portion 3121, which effectively increases the degree of integration of the two.
Fig. 16 is a flow chart illustrating the manufacturing process of another embodiment of the retaining ring 312 of the present invention, and step S21 is to manufacture the first annular portion 3121 such that the side surface, the top surface and/or the bottom surface of the first annular portion 3121 has a snap-fit structure; step S22 is to pre-treat the first annular portion 3121, specifically, remove the embroidery layer on the surface of the first annular portion 3121 by means of sand blasting, shot blasting, grinding, etc., and clean and dry the first annular portion 3121; step S23 is a snap-fit structure in which the second annular portion 3122 is integrally formed with the first annular portion 3121, and the nonmetal constituting the second annular portion 3122 is in a molten state and flows into the first annular portion 3121, so that the degree of bonding between the two portions is effectively increased.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (5)
1. A retaining ring is characterized by comprising a first annular part and a second annular part, wherein the first annular part is made of a metal material, the second annular part is made of a non-metal material, and at least one surface of the first annular part is tightly attached and fixed with the second annular part.
2. The retaining ring of claim 1, wherein the inner side, outer side, bottom surface and/or top surface of the first annular portion is provided with a snap-fit structure.
3. The retaining ring of claim 1, wherein the inner side, outer side, bottom surface, and/or top surface of the first annular portion is provided with nano-scale micro-holes.
4. The retaining ring of claim 2, wherein the snap-fit structure is a groove and/or a protrusion.
5. The retaining ring of claim 4, wherein the grooves and protrusions are spaced apart on an inner side, an outer side, a bottom, and/or a top of the first annular portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921585844.1U CN210757122U (en) | 2019-09-23 | 2019-09-23 | Retaining ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921585844.1U CN210757122U (en) | 2019-09-23 | 2019-09-23 | Retaining ring |
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| Publication Number | Publication Date |
|---|---|
| CN210757122U true CN210757122U (en) | 2020-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921585844.1U Active CN210757122U (en) | 2019-09-23 | 2019-09-23 | Retaining ring |
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| CN (1) | CN210757122U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112536713A (en) * | 2019-09-23 | 2021-03-23 | 清华大学 | Retaining ring |
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2019
- 2019-09-23 CN CN201921585844.1U patent/CN210757122U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112536713A (en) * | 2019-09-23 | 2021-03-23 | 清华大学 | Retaining ring |
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