CN210747329U - Semiconductor type cooling vest - Google Patents

Semiconductor type cooling vest Download PDF

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Publication number
CN210747329U
CN210747329U CN201921366280.2U CN201921366280U CN210747329U CN 210747329 U CN210747329 U CN 210747329U CN 201921366280 U CN201921366280 U CN 201921366280U CN 210747329 U CN210747329 U CN 210747329U
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China
Prior art keywords
water tank
cooling
semiconductor
vest
motor
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CN201921366280.2U
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Chinese (zh)
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吕华杉
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Lautex Jiaxing Mechanical Equipment Co ltd
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Lautex Jiaxing Mechanical Equipment Co ltd
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Priority to CN201921366280.2U priority Critical patent/CN210747329U/en
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Abstract

The utility model provides a semiconductor formula cooling undershirt belongs to mechanical technical field, and it has solved the poor problem of current cooling undershirt result of use. This semiconductor formula cooling undershirt includes: the vest is internally provided with cooling pipelines in a surrounding way; refrigerating plant is located the undershirt front of a garment, and refrigerating plant includes water tank, radiator and is located the semiconductor refrigeration ware between water tank and the radiator, and the cooling circuit both ends all with water tank UNICOM, install the centrifugal pump in the water tank, wear to be equipped with the motor in the radiator, and the motor both ends are provided with the motor shaft respectively, have linked firmly the fan on one of them motor shaft, and another motor shaft runs through and stretches into the water tank behind the semiconductor refrigeration ware and links firmly with the impeller of centrifugal pump. The utility model has the characteristics of portable.

Description

Semiconductor type cooling vest
Technical Field
The utility model belongs to the technical field of machinery, a semiconductor formula cooling undershirt is related to.
Background
Under the high temperature environment, the physiological functions of human body, especially the functions of thermoregulation, water and salt metabolism, blood circulation and the like are abnormally changed, a great amount of sweating can aggravate the burden of cardiovascular, the high temperature exceeds the tolerance of the human body, the working efficiency is slightly reduced, the judgment is influenced, and sunstroke can be caused seriously. For personnel working in high-temperature, high-heat and high-humidity environments without air conditioners or other refrigeration equipment, a portable refrigeration device is necessary, and the temperature of the personnel is reduced through the portable refrigeration device, so that troubles caused by heat are avoided.
Cooling vests have appeared on the market, which can reduce the temperature of human body by directly wearing on the body, not only have light load and do not influence the movement, but also are suitable for the people who work and move in the field environment. The cooling vest comprises a vest and a refrigerating system, wherein pipelines are fully distributed in the front and the back of the vest to facilitate circulation of cooling liquid, and the cooling liquid circulates in the pipelines through the refrigerating system, so that the vest generates a refrigerating effect.
However, the refrigeration system in the existing cooling vest is more traditional, the number of attached components is relatively large, the structure is not compact enough, the burden when a person wears the cooling vest is relatively heavy, and the cooling vest is not suitable for being worn by workers in severe environments.
To sum up, for solving the structural not enough of current cooling undershirt, the utility model designs a compact structure, portable's semiconductor formula cooling undershirt.
Disclosure of Invention
The utility model provides a semiconductor cooling vest with compact structure and convenient carrying, which solves the problems existing in the prior art.
The purpose of the utility model can be realized by the following technical proposal: a semiconductor cooling vest, comprising:
the vest is internally provided with cooling pipelines in a surrounding way;
refrigerating plant is located the undershirt front of a garment, refrigerating plant includes water tank, radiator and is located the semiconductor refrigeration ware between water tank and the radiator, and the cooling line both ends all with water tank UNICOM, install the centrifugal pump in the water tank, wear to be equipped with the motor in the radiator, the motor both ends are provided with the motor shaft respectively, have linked firmly the fan on one of them motor shaft, another motor shaft runs through behind the semiconductor refrigeration ware and stretches into the water tank and link firmly with the impeller of centrifugal pump.
As a further improvement of the scheme, the middle part of the semiconductor refrigerator is provided with a through hole for the motor shaft to pass through, and one end of the through hole, which is close to the water tank, is provided with a sealing ring.
As a further improvement of the present disclosure, the fan is located in the heat sink, and a plurality of rows of heat dissipation fins are uniformly distributed around the fan.
As a further improvement of the scheme, an input pipe and an output pipe are installed at the top of the water tank, two ends of the cooling pipeline are respectively communicated with the input pipe and the output pipe, the input pipe is communicated with the water tank, and the output pipe extends into the water tank and is communicated with the centrifugal pump.
As a further improvement of the scheme, the controller is further installed at the bottom of the water tank, and the motor and the semiconductor refrigerator are respectively connected with the controller.
Compared with the prior art, the cooling vest has compact structure, the fan and the centrifugal pump are simultaneously controlled to work through the arrangement of the double-shaft motor, the installation of parts is reduced, the overall weight of the cooling vest is reduced, and the cooling vest is lighter; the water tank, the semiconductor refrigerator and the radiator are arranged in parallel, so that the whole structure is more compact, and the occupied space is reduced; through the combination setting of fan and radiator, further improve radiating efficiency, excellent in use effect.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural diagram of the refrigerating apparatus of the present invention.
Fig. 3 is a partial sectional view of fig. 2.
Fig. 4 is a schematic view of the structure of fig. 2 from another view angle.
In the figure, 10, a vest; 11. a cooling pipeline; 20. a refrigeration device; 21. a water tank; 211. an input pipe 212, an output pipe; 22. a semiconductor refrigerator; 221. a through hole; 222. a seal ring; 23. a heat sink; 231. a heat sink; 24. a centrifugal pump; 241. an impeller; 25. a motor; 251. a motor shaft; 26. a fan; 27. and a controller.
Detailed Description
The technical solution of the present invention will be further explained with reference to the following embodiments and accompanying drawings.
As shown in fig. 1 to 4, the semiconductor type cooling vest includes:
the vest 10 is internally provided with a cooling pipeline 11 in a surrounding way;
the refrigerating device 20 is positioned at the front of the vest 10, the refrigerating device 20 comprises a water tank 21, a radiator 23 and a semiconductor refrigerator 22 positioned between the water tank 21 and the radiator 23, two ends of a cooling pipeline 11 are communicated with the water tank 21, a centrifugal pump 24 is installed in the water tank 21, a motor 25 penetrates through the radiator 23, two ends of the motor 25 are respectively provided with motor shafts 251, one of the motor shafts 251 is fixedly connected with a fan 26, and the other motor shaft 251 penetrates through the semiconductor refrigerator 22 and then extends into the water tank 21 and is fixedly connected with an impeller 241 of the centrifugal pump 24.
The refrigerating system in the existing cooling vest is more traditional, the number of attached components is relatively large, the structure is not compact enough, the burden when a person wears the cooling vest is relatively heavy, and the cooling vest is not beneficial to wearing by workers in severe environment.
Therefore, the utility model provides a semiconductor type cooling vest, which controls the fan 26 and the centrifugal pump 24 to work simultaneously through the arrangement of the double-shaft motor 25, reduces the installation of parts, lightens the whole weight of the cooling vest and is more portable; the water tank 21, the semiconductor refrigerator 22 and the radiator 23 are arranged in parallel, so that the whole structure is more compact, and the occupied space is reduced.
Specifically, in this embodiment, it is preferable to drive centrifugal pump 24 through motor 25 and work, and the cooling liquid in water tank 21 is outwards pumped to cooling pipeline 11, and the realization is to the cooling of human body, and the continuous circulation of liquid in cooling pipeline 11 flows, and in the backward flow reached water tank 21, semiconductor refrigerator 22 refrigerates water tank 21, and the heat of the liquid of backward flow is passed through semiconductor refrigerator 22 and is transmitted to radiator 23 and dispel the heat, keeps liquid in water tank 21 in certain low temperature range to realize cryogenic function.
Preferably, a through hole 221 for the motor shaft 251 to pass through is formed in the middle of the semiconductor cooler 22, and a sealing ring 222 is disposed at one end of the through hole 221 close to the water tank 21.
The through hole 221 is provided to facilitate the motor shaft 251 to penetrate through the semiconductor refrigerator 22 and then enter the water tank 21 to drive the centrifugal pump 24 to work, and in order to prevent the liquid in the water tank 21 from leaking outwards, a sealing ring 222 is preferably provided on one side of the through hole 221 close to the water tank 21 to ensure the normal operation of the refrigeration device 20. The through hole 221 may be sealed by other methods besides the sealing ring 222, which is not limited herein.
Further, the fan 26 is disposed in the heat sink 23, and a plurality of rows of fins 231 are uniformly distributed around the fan 26. The heat sink 23 transfers heat through the heat dissipating fins 231, and it is preferable that a fan 26 is mounted on the motor 25 to accelerate heat dissipation, improve heat dissipation efficiency, and provide a good use effect.
Preferably, the top of the water tank 21 is provided with an input pipe 211 and an output pipe 212, two ends of the cooling pipeline 11 are respectively communicated with the input pipe 211 and the output pipe 212, the input pipe 211 is communicated with the water tank 21, and the output pipe 212 extends into the water tank 21 and is communicated with the centrifugal pump 24.
In this embodiment, the input pipe 211 and the output pipe 212 are preferably arranged to be communicated with the cooling pipeline 11, when the centrifugal pump 24 works, the cooling liquid in the water tank 21 is pumped to the cooling pipeline 11 through the output pipe 212, and the cooling liquid flows through the cooling pipeline 11 and then flows back to the water tank 21.
Further, a controller 27 is installed at the bottom of the water tank 21, and the motor 25 and the semiconductor refrigerator 22 are respectively connected to the controller 27.
The refrigerating device 20 further comprises a controller 27, the controller 27 is located below the water tank 21, the semiconductor refrigerator 22 and the radiator 23, when in operation, the controller 27 controls the motor 25 and the semiconductor refrigerator 22 to work, and meanwhile, a temperature control system is further installed in the controller 27, so that the temperature range of the whole cooling vest is controlled, and the safety of a user is ensured.
It is worth mentioning that in practical operation, by inputting voltage to semiconductor refrigerator 22 in reverse direction, semiconductor refrigerator 22 can also perform heating function, at this time, the cooling vest can heat the user, and vest 10 can be applied to the occasion needing heating for use, and is convenient to use.
The semiconductor type cooling vest has a compact structure, the fan 26 and the centrifugal pump 24 are controlled to work simultaneously through the arrangement of the double-shaft motor 25, the installation of parts is reduced, the overall weight of the cooling vest is reduced, and the cooling vest is lighter; the water tank 21, the semiconductor refrigerator 22 and the radiator 23 are arranged in parallel, so that the whole structure is more compact, and the occupied space is reduced; the fan 26 and the radiator 23 are combined, so that the radiating efficiency is further improved, and the using effect is good.
The preferred embodiments of the present invention are described herein, but the scope of the present invention is not limited thereto. Modifications or additions to or replacement by similar means to those skilled in the art to which the invention pertains to the specific embodiments described herein are intended to be covered by the scope of the invention.

Claims (5)

1. A semiconductor cooling vest, comprising:
the vest is internally provided with cooling pipelines in a surrounding way;
refrigerating plant is located the undershirt front of a garment, refrigerating plant includes water tank, radiator and is located the semiconductor refrigeration ware between water tank and the radiator, and the cooling line both ends all with water tank UNICOM, install the centrifugal pump in the water tank, wear to be equipped with the motor in the radiator, the motor both ends are provided with the motor shaft respectively, have linked firmly the fan on one of them motor shaft, another motor shaft runs through behind the semiconductor refrigeration ware and stretches into the water tank and link firmly with the impeller of centrifugal pump.
2. The semiconductor cooling vest of claim 1, wherein the semiconductor refrigerator has a through hole in the middle for the motor shaft to pass through, and a sealing ring is disposed at one end of the through hole close to the water tank.
3. The semiconductor cooling vest of claim 1 or 2, wherein the fan is located within the heat sink and a plurality of rows of fins are evenly distributed around the fan.
4. The semiconductor type cooling vest of claim 1 or 2, wherein the inlet pipe and the outlet pipe are mounted on the top of the water tank, the two ends of the cooling pipeline are respectively communicated with the inlet pipe and the outlet pipe, the inlet pipe is communicated with the water tank, and the outlet pipe extends into the water tank and is communicated with the centrifugal pump.
5. The semiconductor cooling vest of claim 1 or 2, wherein the controller is mounted on the bottom of the water tank, and the motor and the semiconductor refrigerator are respectively connected to the controller.
CN201921366280.2U 2019-08-21 2019-08-21 Semiconductor type cooling vest Active CN210747329U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921366280.2U CN210747329U (en) 2019-08-21 2019-08-21 Semiconductor type cooling vest

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921366280.2U CN210747329U (en) 2019-08-21 2019-08-21 Semiconductor type cooling vest

Publications (1)

Publication Number Publication Date
CN210747329U true CN210747329U (en) 2020-06-16

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ID=71031963

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921366280.2U Active CN210747329U (en) 2019-08-21 2019-08-21 Semiconductor type cooling vest

Country Status (1)

Country Link
CN (1) CN210747329U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113907463A (en) * 2021-07-08 2022-01-11 中国地质大学(北京) Liquid cooling device and liquid cooling clothes system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113907463A (en) * 2021-07-08 2022-01-11 中国地质大学(北京) Liquid cooling device and liquid cooling clothes system
CN113907463B (en) * 2021-07-08 2022-09-06 中国地质大学(北京) Liquid cooling device and liquid cooling clothes system

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