CN210725497U - Circuit board assembly and electronic equipment - Google Patents
Circuit board assembly and electronic equipment Download PDFInfo
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- CN210725497U CN210725497U CN201921942417.4U CN201921942417U CN210725497U CN 210725497 U CN210725497 U CN 210725497U CN 201921942417 U CN201921942417 U CN 201921942417U CN 210725497 U CN210725497 U CN 210725497U
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Abstract
The utility model provides a circuit board assembly, including mother board and at least one daughter board, at least one daughter board is followed the thickness direction of mother board sets up one side of mother board, circuit board assembly still includes bearing structure and switching structure, and every daughter board deviates from the mother board all is provided with on the surface of mother board the switching structure, the switching structure has the switching locating surface with the surface laminating of corresponding daughter board, bearing structure with the mother board orientation the fixed surface of daughter board is connected, every the switching structure that sets up on the daughter board all is connected with bearing structure. In this disclosure, the adapting structure and the supporting structure are respectively and fixedly connected with the surfaces of the daughter board and the mother board facing the same direction, so that the relative position accuracy between the surfaces of the daughter board and the mother board facing the same direction can be directly ensured, and further the relative position accuracy between the structures arranged on the two surfaces is ensured. The present disclosure also provides an electronic device.
Description
Technical Field
The present disclosure relates to the field of electronic devices, and in particular, to a circuit board assembly and an electronic device including the same.
Background
In order to improve the integration level of the communication device and increase the functions realized by the communication device, the design of a multilayer Printed Circuit Board (PCB) is adopted in many communication devices. However, in the existing communication device, the problem that when the multi-layer printed circuit board is inserted into the backplane matched with the multi-layer printed circuit board, individual or even several circuit board interfaces cannot be matched with the connection structure on the backplane often occurs, and the performance of the product is affected.
Therefore, how to provide a multilayer printed circuit board connection scheme capable of accurately controlling the relative position of the circuit board interfaces becomes a technical problem to be solved in the field.
SUMMERY OF THE UTILITY MODEL
The present disclosure is directed to a circuit board assembly capable of precisely controlling the relative position of circuit board interfaces.
In order to achieve the above object, as a first aspect of the present disclosure, a circuit board assembly is provided, where the circuit board assembly includes a motherboard and at least one daughter board, the at least one daughter board is disposed on one side of the motherboard along a thickness direction of the motherboard, the circuit board assembly further includes at least one supporting structure and at least one adapting structure, the adapting structure is disposed on a surface of each daughter board away from the motherboard, the adapting structure has an adapting positioning surface, the adapting positioning surface of the adapting structure is attached to a surface of the corresponding daughter board, the supporting structure faces the surface of the daughter board and is fixedly connected to the motherboard, and the adapting structure disposed on each daughter board is connected to the supporting structure, so as to fixedly connect each daughter board to the motherboard and maintain an interval between each daughter board and the motherboard.
Optionally, the support structure includes a support frame and at least one support column, the support frame is located between the motherboard and a daughter board adjacent to the motherboard, and the support frame is fixedly connected to the motherboard, and the support column is disposed on a side of the support frame facing the daughter board;
and at least one support hole penetrating through the daughter board adjacent to the mother board in the thickness direction is formed in the daughter board adjacent to the mother board, each support column corresponds to one support hole, and the support column penetrates through the corresponding support hole and is fixedly connected with the adapter structure.
Optionally, the supporting frame has a supporting and positioning surface, and the supporting and positioning surface is attached to a surface of the motherboard facing the daughter board.
Optionally, the support structure comprises a plurality of support rods;
a plurality of fixing holes penetrating through the daughter board in the thickness direction are formed on the daughter board connected with the mother board through the supporting rods, the plurality of fixing holes on any one daughter board are respectively arranged corresponding to the plurality of supporting rods one by one,
the end parts of the supporting rods are inserted into the corresponding fixing holes to be fixedly connected with the adapting structures on the corresponding sub-boards.
Optionally, the circuit board assembly further comprises main fastening members, wherein first main fastening holes are formed in portions of the support structures connected to the corresponding sub-boards, the axial direction of each first main fastening hole is consistent with the thickness direction of the corresponding sub-board, second main fastening holes penetrating through the transfer structures are formed in the transfer structures, the first main fastening holes correspond to the second main fastening holes one by one, and the first main fastening holes and the corresponding second main fastening holes are coaxially arranged,
the main fastening pieces are arranged in the first main fastening holes and the corresponding second main fastening holes so as to fixedly connect the support structure with the corresponding transfer structure.
Optionally, the circuit board assembly further comprises a sub-board auxiliary fastening member, a first sub-board auxiliary fastening hole is formed at a portion of the sub-board corresponding to the adapting structure, a second sub-board auxiliary fastening hole corresponding to the first sub-board auxiliary fastening hole is formed at the adapting structure, and the second sub-board auxiliary fastening hole is coaxially arranged with the corresponding first sub-board auxiliary fastening hole,
the auxiliary fastening fastener is arranged in the auxiliary fastening hole of the first sub-board and the corresponding auxiliary fastening hole of the second sub-board so as to fixedly connect the adapter structure with the corresponding sub-board.
Optionally, the circuit board assembly further comprises a motherboard auxiliary fastening part, a first motherboard auxiliary fastening hole is arranged at a position on the motherboard corresponding to the support structure, a second motherboard auxiliary fastening hole corresponding to the first motherboard auxiliary fastening hole is arranged on the support structure, the first motherboard auxiliary fastening hole and the corresponding second motherboard auxiliary fastening hole are coaxially arranged,
the first auxiliary motherboard fastening hole and the second auxiliary motherboard fastening hole corresponding to the first auxiliary motherboard fastening hole are provided with the auxiliary motherboard fastening part to fixedly connect the support structure with the motherboard.
Optionally, the circuit board assembly includes a plurality of the support structures and a plurality of the adapting structures, the motherboard includes a motherboard edge area and a motherboard center area, the motherboard edge area is located at both sides of the motherboard center area, the daughter board includes a daughter board edge area and a daughter board center area, the daughter board edge area is located at both sides of the daughter board center area, the daughter board edge area is disposed opposite to the motherboard edge area, and the daughter board center area is disposed opposite to the motherboard center area;
at least one supporting structure is arranged in the edge area of each mother board, and at least one switching structure is arranged in the edge area of each sub board.
Optionally, each of the adapter structures corresponding to the daughter boards includes a plurality of adapter blocks, a portion of the support structure passes through the daughter board, and the adapter blocks are connected to the portion of the support structure passing through the daughter board in a one-to-one correspondence.
Optionally, at least two of the interposer blocks are connected to each other on the same daughter board.
Optionally, the circuit board assembly further includes at least one motherboard rear interface and at least one daughter board rear interface, the motherboard rear interface is disposed on a surface of the motherboard facing the daughter board, the daughter board rear interface is disposed on a surface of the daughter board facing away from the motherboard, and the motherboard rear interface and the daughter board rear interface are located on the same side.
Optionally, the circuit board assembly further includes a motherboard front interface and a daughter board front interface, the motherboard rear interface is disposed on a surface of the motherboard facing the daughter board, and the motherboard front interface and the motherboard rear interface are respectively disposed on two opposite sides of the motherboard; the daughter board rear interface is arranged on the surface of the daughter board, which is far away from the mother board, the daughter board front interface and the daughter board rear interface are respectively arranged on two opposite sides of the daughter board, and the daughter board front interface and the mother board front interface are positioned on the same side.
Optionally, at least one positioning notch is further formed on an edge of one side of the daughter board, where the daughter board rear interface is disposed.
As a second aspect of the present disclosure, an electronic device is provided, where the electronic device includes a circuit board assembly and a back plate, the circuit board assembly is detachably and fixedly connected to the back plate, and the circuit board assembly is the aforementioned circuit board assembly.
In the circuit board assembly and the electronic device provided by the disclosure, the adapting structure and the supporting structure are respectively and fixedly connected with the surfaces of the daughter board and the mother board facing the same direction, when in processing, only the surface flatness of the adapting positioning surface of the adapting structure needs to be ensured, after the adapting structure is fixedly connected with the supporting structure, the relative position precision between the surfaces of the daughter board and the mother board facing the same direction can be directly ensured, the influence of the thickness of the daughter board on the relative position precision between the two surfaces does not need to be considered, further the relative position precision between the structures arranged on the two surfaces (such as a mother board rear interface arranged on the mother board and a daughter board rear interface arranged on the daughter board) is ensured, and the generalization and standardization of the interfaces in the multilayer circuit board are realized.
Drawings
The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure without limiting the disclosure. In the drawings:
fig. 1 is a schematic diagram of one configuration of a circuit board assembly provided by an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a portion of an electronic device provided by an embodiment of the present disclosure;
FIG. 3 is a schematic diagram of another configuration of a circuit board assembly provided by embodiments of the present disclosure;
FIG. 4 is a cross-sectional view of the circuit board assembly of FIG. 3;
FIG. 5 is a partial view of the circuit board assembly of FIG. 4;
FIG. 6 is a schematic diagram of another configuration of a circuit board assembly provided by embodiments of the present disclosure;
FIG. 7 is a schematic diagram of another configuration of a circuit board assembly provided by an embodiment of the present disclosure;
FIG. 8 is a cross-sectional view of the circuit board assembly of FIG. 7;
FIG. 9 is a partial view of the circuit board assembly of FIG. 8;
fig. 10 is a schematic diagram of another configuration of a circuit board assembly provided by an embodiment of the present disclosure;
FIG. 11 is a schematic diagram of another configuration of a circuit board assembly provided by embodiments of the present disclosure;
FIG. 12 is a cross-sectional view of the circuit board assembly of FIG. 11;
fig. 13 is a schematic diagram of another configuration of a circuit board assembly provided by an embodiment of the present disclosure;
fig. 14 to 16 are schematic diagrams illustrating an assembling process of a circuit board assembly according to an embodiment of the present disclosure;
fig. 17 is a schematic diagram of another configuration of a circuit board assembly provided by an embodiment of the present disclosure;
FIG. 18 is a top view of the circuit board assembly of FIG. 11;
fig. 19 is a schematic view of a structure of a multilayer printed wiring board in the related art.
Description of the reference numerals
10: mother board 20: sub-board
21: positioning notch 30: support structure
31: the support frame 32: support column
33: the support bar 40: switching structure
41: the transfer block 51: main fastener
52: daughter board auxiliary fastener 53: auxiliary fastener for mother board
61: motherboard rear interface 62: sub-board rear interface
63: motherboard front interface 64: front interface of daughter board
70: the connector 80: cladding plate
90: the back plate 91: motherboard connector
92: daughter board connection port 100: panel board
Detailed Description
The following detailed description of specific embodiments of the present disclosure is provided in connection with the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present disclosure, are given by way of illustration and explanation only, not limitation.
After the inventor of the present disclosure researches the structure of the existing multi-layer printed circuit board, it is found that the reason that the relative position between the circuit board interfaces of the different layers of printed circuit boards is low accurately is as follows:
in the related art multi-layer printed wiring board structure, as shown in fig. 19, adjacent two layers of printed wiring boards are a mother board 10 and a daughter board 20, respectively, and both surfaces of the mother board 10 and the daughter board 20 facing each other are connected together by a connector 1 (e.g., a nut stud).
To ensure slot compatibility and scalability of the printed wiring board, the circuit board interfaces on each layer of the printed wiring board (e.g., the motherboard rear interface 61 on the motherboard 10 and the daughter board rear interface 62 on the daughter board 20) are located on the same side of the printed wiring board. Therefore, when the motherboard 10 and the daughter board 20 are connected by the conventional connection method, the connector 1 can only ensure the accuracy of the distance (h) between the motherboard rear interface 61 of the motherboard 10 and the surface of the daughter board 20 on which the daughter board rear interface 62 is not provided, the distance between the motherboard rear interface 61 and the daughter board rear interface 62 is also affected by the thickness (d) of the daughter board 20, the thickness control process of the printed circuit board has high cost, and it is difficult to accurately position the motherboard rear interface 61 and the daughter board rear interface 62 by controlling the thickness of the daughter board 20.
To solve the above technical problem, as one aspect of the present disclosure, there is provided a circuit board assembly, as shown in fig. 1, including a mother board 10 and at least one daughter board 20, the at least one daughter board 20 being disposed at one side of the mother board 10 in a thickness direction of the mother board 10. Wherein the circuit board assembly further comprises at least one support structure 30 and at least one relay structure 40.
The surface of each daughter board 20, which faces away from the motherboard 10, is provided with an adapting structure 40 having an adapting positioning surface a, and the adapting positioning surface a of the adapting structure 40 is attached to the surface of the corresponding daughter board 20.
The support structure 30 is fixedly connected to a surface of the motherboard 10 facing the daughter boards 20, and the adapting structure 40 provided on each daughter board 20 is connected to the support structure 30 to fixedly connect each daughter board 20 to the motherboard 10 and maintain a space between each daughter board 20 and the motherboard 10.
Also, in the circuit board assembly provided by the present disclosure, the relay structure 40 and the support structure 30 are fixedly connected to surfaces (upper surfaces in fig. 1) of the daughter board 20 and the motherboard 10, respectively, which face in the same direction. During processing, only the surface flatness of the adapting positioning surface a of the adapting structure 40 needs to be ensured, after the adapting structure 40 is fixedly connected with the supporting structure 30, the relative position accuracy between the surfaces of the daughter board 20 and the motherboard 10 facing the same direction can be directly ensured, the influence of the thickness of the daughter board 20 on the relative position accuracy between the two surfaces does not need to be considered, the relative position accuracy between the structures arranged on the two surfaces (for example, the motherboard rear interface 61 arranged on the motherboard 10 and the daughter board rear interface 62 arranged on the daughter board 20) is further ensured, and the generalization and standardization of the interfaces in the multilayer circuit board are realized.
Also, the finish machining of the positioning surface of the rolling connection structure 40 may also reduce the production cost, compared to a scheme of precisely controlling the thickness uniformity of the mother board 10 and the daughter board 20 to achieve precise alignment between the daughter board 20 and the mother board 10.
In order to further reduce the manufacturing cost, the area of the adapter positioning surface a is smaller than the surface area of the sub-board 20 attached to the adapter positioning surface a. In addition to the advantage of easy processing, the area of the adapter positioning surface a is smaller than that of the surface of the daughter board 20 to which the adapter positioning surface a is attached, so that the adapter structure 40 can be prevented from affecting the arrangement of electronic components on the daughter board 20, and the performance of the circuit board assembly can be improved.
In the present disclosure, "the support structure 30 is connected to the adapter structure 40 provided on each daughter board 20" means that different adapter structures 40 may be connected to the same support structure 30, or may be connected to different support structures 30.
The present disclosure does not specifically limit how the support structure 30 and the relay structure 40 are fixedly connected, the motherboard 10 and the support structure 30 are fixedly connected, and the daughter boards 20 and the relay structure 40 are fixedly connected, as long as the space between each daughter board 20 and the motherboard 10 can be maintained. For example, the above structures may be fixedly connected by a connecting member, such as a fit between a screw member and a screw member (e.g., a bolt and a nut), a fit between a screw member and a threaded hole (e.g., a screw and a threaded hole), and the like.
In the present disclosure, the number of the sub-plates 20 is not particularly limited. One circuit board assembly may include one sub board 20, and may include a plurality of sub boards 20. When the circuit board assembly includes a plurality of sub-boards 20, the plurality of sub-boards 20 are located on the same side of the mother board 10, and a space is also formed between the plurality of sub-boards 20.
The present disclosure does not specifically limit the circuit board type of the motherboard 10 and the daughter board 20, and for example, the motherboard 10 and the daughter board 20 may be a printed wiring board.
In the present disclosure, the specific structure and the specific number of the supporting structures are not particularly limited. In the embodiment shown in fig. 3 to 6, the support structure 30 includes a support frame 31 and at least one support column 32, the support frame 31 is fixed between the motherboard 10 and the daughter board 20 adjacent to the motherboard 10, the support frame 31 is fixedly connected to the motherboard 10, and the support column 32 is disposed on a side of the support frame 31 facing the daughter board 20.
At least one supporting hole penetrating the daughter board 20 in the thickness direction is formed on the daughter board 20 adjacent to the mother board 10, and each supporting column 32 has a corresponding supporting hole, and the supporting column 32 passes through the corresponding supporting hole and is fixedly connected to the adapting structure 40.
In this preferred embodiment, the support structure 30 includes support columns. The support posts 32 are fixedly coupled to the interposer fabric 40 through the support holes of the daughter board 20, so that the interposer fabric 40 does not have to be coupled around the edge of the daughter board 20, reducing the width of the circuit board assembly. Moreover, the supporting structure 30 comprises the supporting frame 31, and the supporting frames 31 are used for connecting the plurality of supporting columns 32 together, so that the overall strength of the supporting structure 30 is improved, and the circuit board assembly can bear larger force during plugging, pulling, assembling and disassembling.
The cross-sectional shape of the support column 32 is not particularly limited by the present disclosure, for example, the cross-sectional shape of the support column 32 may be circular, oval, rectangular, or the like. Optionally, the cross-sectional dimension of the support holes is larger than the cross-sectional dimension of the support posts 32, thereby facilitating assembly.
In order to further reduce the processing cost, the supporting frame 31 may optionally have a supporting and positioning surface B, as shown in fig. 5, which is attached to the surface of the motherboard 10 facing the daughter board 20.
When the circuit board assembly is processed to obtain each component part, the surface precision of the supporting and positioning surface B is ensured, then the relative position precision between the supporting and positioning surface B and the transferring and positioning surface A is ensured, the assembly precision of the circuit board assembly can be ensured, the thickness uniformity of the mother board 10 and the thickness uniformity of the daughter board 20 do not need to be strictly controlled, and therefore the overall processing cost of the circuit board assembly can be reduced.
In order to reduce the overall weight of the circuit board assembly, as shown in fig. 3 to 6, a plurality of hollowed-out portions are optionally formed on the supporting frame 31, and the hollowed-out portions penetrate through the supporting frame 31 in the thickness direction.
In addition to being connected by a support structure 30 comprising support shelves 31 and support posts 32, the motherboard 10 and daughterboard 20 may be connected by a support structure 30 comprising a plurality of support posts 33. In other words, the support structure 30 may further include a plurality of support bars 33.
How to connect the motherboard 10 and the daughter board 20 by the support bar 33 is described below with reference to fig. 1, 2, 7, and 8 to 13.
A plurality of fixing holes penetrating the daughter board 20 in the thickness direction are formed in the daughter board 20 connected to the mother board 10 through the support rods 33, and the plurality of fixing holes of any one daughter board 20 are respectively provided in one-to-one correspondence with the plurality of support rods 33.
The ends of the support rods 33 are inserted into the corresponding fixing holes to be fixedly connected with the adapting structures 40 on the corresponding sub-board 20.
It should be noted that, when the daughter board 20 (which may be referred to as a target daughter board for convenience of description) connected to the motherboard 10 through the support bar 33 is not the daughter board 20 adjacent to the motherboard 10, the support bar 33 also needs to pass through the daughter board between the target daughter board and the motherboard 10. In other words, the daughter board 20 between the target daughter board and the mother board 10 should be provided with a relief hole allowing the support bar 33 to pass through.
For example, in the embodiment shown in fig. 11 and 12, the uppermost daughter board 20 is a target daughter board, and a layer of daughter boards 20 is provided between the target daughter board and the motherboard 10.
When the adapter structure 40 on the target daughter board is fixedly connected to the motherboard 10 through the support rod 33, a relief hole penetrating through the daughter board 20 needs to be formed on the middle daughter board 20 to allow the support rod 33 to pass through the middle daughter board 20 to reach the target daughter board.
In the preferred embodiment, the support structure 30 includes the support bar 33, and the support bar 33 is fixedly connected with the adapting structure 40 through the fixing hole of the sub-board 20, so that the adapting structure 40 does not need to be connected around the edge of the sub-board 20, and the width of the circuit board assembly is reduced. The support rod 33 is small in size, and the overall weight of the circuit board assembly can be reduced.
The cross-sectional shape of the support rod 33 is not particularly limited by the present disclosure, and for example, the cross-sectional shape of the support rod 33 may be circular, oval, rectangular, or the like.
Alternatively, the cross-sectional size of the fixing hole is larger than that of the support rod 33.
In the present disclosure, there is no particular limitation on how the support structure 30 is connected to the adapting structure 40. Optionally, the circuit board assembly further comprises a primary fastener 51. Portions of the support structures 30 connected to the respective sub-boards 20 are formed with first main fastening holes having an axial direction coinciding with a thickness direction of the sub-boards 20. The second main fastening holes penetrating through the transfer structure are formed in the transfer structure 40, the first main fastening holes correspond to the second main fastening holes one by one, and the first main fastening holes and the corresponding second main fastening holes are coaxially arranged. The first and corresponding second main fastening holes have main fasteners 51 disposed therein to fixedly connect the support structure 30 with the corresponding adapting structure 40.
In the present disclosure, the main fastening member 51 may be a bolt or a screw, but the main fastening member 51 may also be a pin. Optionally, the primary fasteners 51 are bolts or screws.
In the present disclosure, the axial length of the first main fastening hole is not particularly limited. In the embodiment shown in fig. 4, the support structure 30 includes a support bracket 31 and a support pillar 32, the first main fastening hole is formed on the support pillar 32, and an axial length of the first main fastening hole may be the same as a height of the support pillar 32. In this embodiment, the first main fastening hole is a threaded hole and the second main fastening hole is an unthreaded hole.
In the embodiment shown in fig. 8, the first main fastening hole is a hole penetrating the support rod 33, i.e., the support rod 33 is formed as a hollow tube. An internal thread is formed on the hole wall of the first main fastening hole, and the second main fastening hole is a unthreaded hole.
In the present disclosure, there is no particular limitation on how the patch fastening structures 40 are connected to the corresponding daughter boards 20. As an optional embodiment, the circuit board assembly further includes a sub-board auxiliary fastening hole 52, a first sub-board auxiliary fastening hole is formed in a portion of the sub-board 20 corresponding to the adapting structure 40, a second sub-board auxiliary fastening hole corresponding to the first sub-board auxiliary fastening hole is formed in the adapting structure 40, and the first sub-board auxiliary fastening hole and the corresponding second sub-board auxiliary fastening hole are coaxially arranged.
The first sub-board auxiliary fastening holes and the corresponding second sub-board auxiliary fastening holes are provided therein with sub-board auxiliary fastening members 52 to fixedly connect the relay structures 40 with the corresponding sub-boards 20.
In the present disclosure, the daughter board auxiliary fasteners 52 may be bolts or screws, but the daughter board auxiliary fasteners 52 may also be pins. Optionally, the daughter board secondary fasteners 52 are bolts or screws.
At least one of the first sub-board auxiliary fastening holes and the corresponding second sub-board auxiliary fastening holes is a threaded hole.
In the present disclosure, there is no particular limitation on how the support structure 30 is fixedly connected to the motherboard 10. Optionally, the circuit board assembly further includes a motherboard auxiliary fastening member 53, a first motherboard auxiliary fastening hole is provided at a position on the motherboard 10 corresponding to the support structure 30, a second motherboard auxiliary fastening hole corresponding to the first motherboard auxiliary fastening hole is provided on the support structure 30, and the first motherboard auxiliary fastening hole and the corresponding second motherboard auxiliary fastening hole are coaxially provided.
A motherboard auxiliary fastening part 53 is provided in the first motherboard auxiliary fastening hole and the second motherboard auxiliary fastening hole corresponding to the first motherboard auxiliary fastening hole to fixedly connect the support structure 30 with the motherboard 10.
In the present disclosure, the auxiliary fastener 53 to the motherboard may be a bolt or a screw, but the auxiliary fastener 52 to the motherboard may also be a pin. Optionally, the motherboard auxiliary fasteners 53 are bolts or screws.
At least one of the first motherboard auxiliary fastening hole and a second motherboard auxiliary fastening hole corresponding to the first motherboard auxiliary fastening hole is a threaded hole.
In order to improve the performance of the circuit board assembly, optionally, as shown in fig. 6, the circuit board assembly includes a plurality of support structures 30 and a plurality of transition structures 40, the motherboard 10 includes a motherboard edge area E1 and a motherboard center area C1, the motherboard edge area E1 is located on both sides of the motherboard center area C1, the daughter board 20 includes a daughter board edge area E2 and a daughter board center area C2, the daughter board edge area E2 is located on both sides of the daughter board center area C2, the daughter board edge area E2 is disposed opposite to the motherboard edge area E1, and the daughter board center area C2 is disposed opposite to the motherboard center area C1.
Each mother board edge region E1 is provided with at least one support structure 30 (i.e. each mother board edge region E1 is provided with a support shelf 31) and each child board edge region E2 is provided with at least one adapter structure 40.
It should be noted that, the central area is an area where electronic components are disposed on the motherboard 10 and the daughter board 20, and in the present disclosure, the plurality of support frames 31 of the support structure 30 are respectively disposed on the edge areas C2 of the circuit board, so that the support structure 30 is prevented from affecting the electronic components on the motherboard 10 and the daughter board 20, and the performance of the circuit board assembly is improved.
In order to improve performance of the circuit board assembly, optionally, the circuit board assembly includes a plurality of support structures 30 and a plurality of transition structures 40, the motherboard 10 includes a motherboard edge area E1 and a motherboard center area C1, the motherboard edge area E1 is located on two sides of the motherboard center area C1, the daughter board 20 includes a daughter board edge area E2 and a daughter board center area C2, the daughter board edge area E2 is located on two sides of the daughter board center area C2, the daughter board edge area E2 is disposed opposite to the motherboard edge area E1, and the daughter board center area C2 is disposed opposite to the motherboard center area C1.
Each mother board edge region E1 is provided with at least one support structure 30 (i.e. each mother board edge region E1 is provided with a plurality of support bars 33) and each daughter board edge region E2 is provided with at least one adapter structure 40.
The support bars 33 are disposed at the edge region C2 of the circuit board in the present disclosure, thereby preventing the support structure 30 from affecting the electronic components on the motherboard 10 and the daughter board 20, and improving the performance of the circuit board assembly.
To reduce the overall weight of the circuit board assembly, optionally, as shown in fig. 7 to 13, the corresponding adapting structure 40 of each sub-board 20 includes a plurality of adapting blocks 41, a portion of the supporting structure 30 penetrates through the sub-board 20, and the adapting blocks 41 are connected with the portion of the supporting structure 30 penetrating through the sub-board 20 in a one-to-one correspondence.
Alternatively, as shown in fig. 3 to 6, at least two of the transfer blocks 41 are connected to each other on the same daughter board. Preferably, the via blocks 41 located in the same daughter board edge area E2 on the same daughter board 20 are connected to each other. In the embodiment shown in fig. 3 to 6, the adapting blocks 41 in the edge area E2 of the same daughter board 20 are connected to each other, so as to ensure the consistency of the adapting positioning surfaces a of the adapting blocks 41 and improve the positioning accuracy of the surface of the daughter board 20.
Optionally, the circuit board assembly further includes a motherboard front interface 63 and a daughter board front interface 64, the motherboard rear interface 61 is disposed on a surface of the motherboard 10 facing the daughter board 20, and the motherboard front interface 63 and the motherboard rear interface 61 are respectively disposed on two opposite side edges of the motherboard 10; the daughter board rear interface 62 is disposed on a surface of the daughter board 20 away from the motherboard 10, and the daughter board front interface 64 and the daughter board rear interface 62 are respectively disposed on two opposite side edges of the daughter board 20.
In order to improve the flexibility of the daughter board 20 and achieve flexible plug-in of the daughter board 20, as shown in fig. 17, at least one positioning notch 21 is further formed on an edge of one side of the daughter board 20 where the daughter board rear interface 62 is disposed, and the positioning notch 21 extends toward a direction opposite to the side where the daughter board rear interface 62 is located.
Optionally, as shown in fig. 1, the circuit board assembly further includes a connector 70, the connector 70 electrically connects the daughter board 20 and the motherboard 10, and the connector 70 is located in an area defined by the support structure 30 and the interposer structure 40.
Optionally, as shown in fig. 6, 10, and 13, the circuit board assembly further includes a cladding plate 80, the cladding plate 80 includes a bottom cladding plate 80 and a side cladding plate 80, the bottom cladding plate 80 and the side cladding plate 80 are connected to each other, a cladding included angle is formed between the bottom cladding plate 80 and the side cladding plate 80, the bottom cladding plate 80 is disposed on a side of the motherboard 10 away from the daughter board 20, and the side cladding plate 80 is disposed on a side of a corresponding edge of the motherboard 10 and the daughter board 20.
To facilitate understanding by those skilled in the art, the present disclosure also provides a specific embodiment of assembling the above-described circuit board assembly:
as shown in fig. 14, first, the motherboard 10 is fixedly connected to the support structure 30. As shown in fig. 15, the daughter board 20 is then fixedly connected to the interposer fabric 40. Finally, the support structure 30 is fixedly connected to the adapting structure 40, as shown in fig. 16, so that the circuit board assembly is assembled. The circuit board assembly provided by the disclosure is easy to assemble, has large integral strength of the structure, and is suitable for backboard connection schemes with various strengths.
As a second aspect of the present disclosure, an electronic device is provided, as shown in fig. 2, the electronic device includes the circuit board assembly and a back plate 90, the circuit board assembly is detachably and fixedly connected with the back plate 90, and the circuit board assembly is the circuit board assembly described above.
In the electronic device provided by the present disclosure, the adapting structure 40 and the supporting structure 30 are respectively and fixedly connected with the surfaces of the daughter board 20 and the motherboard 10 facing to the same direction, and then after the adapting structure 40 is fixedly connected with the supporting structure 30, the relative position accuracy between the surfaces of the daughter board 20 and the motherboard 10 facing to the same direction can be directly ensured. It is not necessary to consider that the thickness of the daughter board 20 or the motherboard 10 affects the relative positional accuracy between the two surfaces, and the relative positional accuracy between the structures (e.g., the motherboard rear interface 61 and the daughter board rear interface 62) provided on the two surfaces is ensured.
Optionally, as shown in fig. 2, the circuit board assembly further includes at least one motherboard rear interface 61 and at least one daughter board rear interface 62, and the backplane 90 further includes at least one motherboard connector 91 and at least one daughter board connector 92, where the motherboard connector 91 is connected to the motherboard rear interface 61 on the motherboard 10 in a one-to-one correspondence, and the daughter board connector 92 is connected to the daughter board rear interface 62 on the daughter board 20 in a one-to-one correspondence.
Optionally, as shown in fig. 2, the circuit board assembly further includes a motherboard front interface 63 and a daughter board front interface 64, the electronic device further includes a panel 100, and both the motherboard front interface 63 and the daughter board front interface 64 are connected to the panel 100, and the above circuit board assembly structure provided by the present disclosure can also ensure the relative position accuracy between the motherboard front interface 63 on the motherboard 10 and the daughter board front interface 64 on the daughter board 20.
It is to be understood that the above embodiments are merely exemplary embodiments that are employed to illustrate the principles of the present disclosure, and that the present disclosure is not limited thereto. It will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the disclosure, and these are to be considered as the scope of the disclosure.
Claims (14)
1. The utility model provides a circuit board assembly, circuit board assembly includes mother board and at least one daughter board, at least one daughter board is followed the thickness direction of mother board sets up one side of mother board, its characterized in that, circuit board assembly still includes at least one bearing structure and at least one switching structure, and every daughter board deviates from the mother board all is provided with on the surface of mother board switching structure, switching structure has switching locating surface, just switching structure's switching locating surface and the laminating of corresponding daughter board surface, bearing structure with the mother board orientation the fixed surface of daughter board is connected, every switching structure that sets up on the daughter board all is connected with bearing structure.
2. The circuit board assembly according to claim 1, wherein the support structure comprises a support frame and at least one support pillar, the support frame is located between the motherboard and a daughter board adjacent to the motherboard, and the support frame is fixedly connected with the motherboard, and the support pillar is disposed on a side of the support frame facing the daughter board;
and at least one support hole penetrating through the daughter board adjacent to the mother board in the thickness direction is formed in the daughter board adjacent to the mother board, each support column corresponds to one support hole, and the support column penetrates through the corresponding support hole and is fixedly connected with the adapter structure.
3. The circuit board assembly of claim 2, wherein the support bracket has a support positioning surface that conforms to a surface of the motherboard facing the daughter board.
4. The circuit board assembly of claim 1, wherein the support structure comprises a plurality of support rods;
a plurality of fixing holes penetrating through the daughter board in the thickness direction are formed on the daughter board connected with the mother board through the supporting rods, the plurality of fixing holes on any one daughter board are respectively arranged corresponding to the plurality of supporting rods one by one,
the end parts of the supporting rods are inserted into the corresponding fixing holes to be fixedly connected with the adapting structures on the corresponding sub-boards.
5. The circuit board assembly according to any one of claims 1 to 4, further comprising main fastening holes, wherein first main fastening holes are formed at portions of the support structure connected to the corresponding sub-boards, an axial direction of the first main fastening holes coincides with a thickness direction of the sub-boards, second main fastening holes penetrating the transition structure are formed at the transition structure, the first main fastening holes correspond to the second main fastening holes one by one, and the first main fastening holes are coaxially arranged with the corresponding second main fastening holes,
the main fastening pieces are arranged in the first main fastening holes and the corresponding second main fastening holes so as to fixedly connect the support structure with the corresponding transfer structure.
6. The circuit board assembly according to any one of claims 1 to 4, further comprising a sub-board auxiliary fastening hole, wherein a portion of the sub-board corresponding to the adapting structure is formed with a first sub-board auxiliary fastening hole, the adapting structure is formed with a second sub-board auxiliary fastening hole corresponding to the first sub-board auxiliary fastening hole, and the second sub-board auxiliary fastening hole is coaxially disposed with the corresponding first sub-board auxiliary fastening hole,
the auxiliary fastening fastener is arranged in the auxiliary fastening hole of the first sub-board and the corresponding auxiliary fastening hole of the second sub-board so as to fixedly connect the adapter structure with the corresponding sub-board.
7. The circuit board assembly according to any one of claims 1 to 4, further comprising a motherboard auxiliary fastening member, wherein a first motherboard auxiliary fastening hole is provided on the motherboard at a position corresponding to the support structure, a second motherboard auxiliary fastening hole corresponding to the first motherboard auxiliary fastening hole is provided on the support structure, the first motherboard auxiliary fastening hole is coaxially provided with the corresponding second motherboard auxiliary fastening hole,
the first auxiliary motherboard fastening hole and the second auxiliary motherboard fastening hole corresponding to the first auxiliary motherboard fastening hole are provided with the auxiliary motherboard fastening part to fixedly connect the support structure with the motherboard.
8. The circuit board assembly according to any one of claims 1 to 4, wherein the circuit board assembly comprises a plurality of the support structures and a plurality of the transition structures, the motherboard comprises a motherboard edge area and a motherboard center area, the motherboard edge area is located on both sides of the motherboard center area, the daughter board comprises a daughter board edge area and a daughter board center area, the daughter board edge area is located on both sides of the daughter board center area, the daughter board edge area is disposed opposite to the motherboard edge area, and the daughter board center area is disposed opposite to the motherboard center area;
at least one supporting structure is arranged in the edge area of each mother board, and at least one switching structure is arranged in the edge area of each sub board.
9. The circuit board assembly of any one of claims 1-4, wherein the corresponding interposer structure of each daughter board includes a plurality of interposer blocks, a portion of the support structure passes through the daughter board, and the interposer blocks are connected to the portion of the support structure passing through the daughter board in a one-to-one correspondence.
10. The circuit board assembly of claim 9, wherein at least two of said interposer bumps are interconnected on the same daughter board.
11. The circuit board assembly according to any one of claims 1 to 4, further comprising at least one motherboard rear interface and at least one daughter board rear interface, wherein the motherboard rear interface is disposed on a surface of the motherboard facing the daughter board, the daughter board rear interface is disposed on a surface of the daughter board facing away from the motherboard, and the motherboard rear interface and the daughter board rear interface are located on the same side.
12. The circuit board assembly of claim 11, further comprising a motherboard front interface and a daughterboard front interface, wherein the motherboard rear interface is disposed on a surface of the motherboard facing the daughterboard, and the motherboard front interface and the motherboard rear interface are disposed on opposite sides of the motherboard, respectively; the daughter board rear interface is arranged on the surface of the daughter board, which is far away from the mother board, the daughter board front interface and the daughter board rear interface are respectively arranged on two opposite sides of the daughter board, and the daughter board front interface and the mother board front interface are positioned on the same side.
13. The circuit board assembly of claim 12, wherein the edge of the daughter board on the side where the daughter board rear interface is disposed further defines at least one positioning notch.
14. An electronic device comprising a circuit board assembly and a back plate, wherein the circuit board assembly is detachably and fixedly connected with the back plate, and the circuit board assembly is the circuit board assembly according to any one of claims 1 to 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921942417.4U CN210725497U (en) | 2019-11-11 | 2019-11-11 | Circuit board assembly and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921942417.4U CN210725497U (en) | 2019-11-11 | 2019-11-11 | Circuit board assembly and electronic equipment |
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| CN210725497U true CN210725497U (en) | 2020-06-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111682331A (en) * | 2020-08-17 | 2020-09-18 | 深圳微步信息股份有限公司 | Multifunctional extended circuit board module and mobile terminal |
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2019
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111682331A (en) * | 2020-08-17 | 2020-09-18 | 深圳微步信息股份有限公司 | Multifunctional extended circuit board module and mobile terminal |
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