CN210723308U - Novel ultra-wideband 3dB bridge - Google Patents
Novel ultra-wideband 3dB bridge Download PDFInfo
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- CN210723308U CN210723308U CN201922344963.4U CN201922344963U CN210723308U CN 210723308 U CN210723308 U CN 210723308U CN 201922344963 U CN201922344963 U CN 201922344963U CN 210723308 U CN210723308 U CN 210723308U
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Abstract
The utility model discloses a novel ultra wide band 3dB electrical bridge, which comprises a micro-strip medium substrate (1), a first signal transmission line (3) and a second signal transmission line (7) which are arranged inside the micro-strip medium substrate (1); the upper surface and the lower surface of the microstrip medium substrate (1) are both provided with at least one multistage air medium impedance transformation groove (2). The utility model changes the design idea of a signal transmission path combining a lossy medium and an air medium, and optimizes the loss of devices to the maximum extent while expanding the ultra-wideband frequency multiplication design, thereby having various electrical properties; although the utility model discloses a design also has longer transmission line, nevertheless combines air dielectric just to compensate the loss that long transmission line brought, fine all kinds of broadband of being applied to, ultra wide band microwave radio frequency system, the product compatibility is good, has more the advantage in market competition.
Description
Technical Field
The utility model relates to a microwave device technical field specifically indicates a novel ultra wide band 3dB electric bridge.
Background
With the development of the communication industry, the requirements of microwave and millimeter wave devices are increasing day by day, and a 3dB bridge is used as a key device for power synthesis, power distribution, power detection and ultra-wideband power amplifier matching protection and is widely applied to various power amplifier systems, broadband test sources and detection systems. Along with the upgrading and upgrading of products, the corresponding matched 3dB bridge component also has to meet the upgrading requirement of the system, so that the requirements of bridges such as broadband and ultra-wideband come true.
FIG. 1 is a PCB structure of a conventional 3dB bridge of 2-4GHz and 2-8GHz, FIG. 2 is a performance test curve diagram of a conventional 3dB bridge of 2-4GHz, and FIG. 3 is a performance test curve diagram of a conventional 3dB bridge of 2-8 GHz. Reference numerals 1 and 2 in fig. 1 are signal transmission lines of the top layer and the bottom layer, respectively, and 3 is a PCB substrate (lossy medium), and it can be seen easily from fig. 1 that the PCB design of the left fig. 3dB structure is simple, but as can be seen from the test curve of fig. 2, the whole passband frequency of the 2-4GHz 3dB bridge is not wide, and is in a range of about 2 octaves. Although the 2-8GHz adopts the 8.34dB structural design, the design of 4 octaves can be realized, the transmission line path of signals is longer, the loss and the phase influence on the device performance are larger due to the reasons of processing precision and the like, the realization of wider octaves is also more difficult, and the corresponding performance influence is also larger.
From the above, it can be seen that the design of the conventional 3dB bridge is only limited to the bandwidth of 2 octaves, and cannot satisfy a wider frequency band, which greatly affects the environmental application of the 3dB bridge. Although the right diagram of fig. 1 can satisfy 4 octaves, the signal transmission line of this design is long, and both have a large influence on the performance of the device itself under the condition of lossy medium. With the current trend of high-speed development of the communication industry, a large number of 3dB bridges and devices are required in each system, and the design directly limits the performance of the system and the compatibility of the broadband system.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome above-mentioned defect, provide a loss is littleer, the wideer novel ultra wide band 3dB electric bridge of frequency range.
The purpose of the utility model is realized through the following technical scheme: a novel ultra-wideband 3dB bridge comprises a microstrip medium substrate, a first signal transmission line and a second signal transmission line, wherein the first signal transmission line and the second signal transmission line are arranged in the microstrip medium substrate; the first signal transmission line and the second signal transmission line are symmetrically arranged relative to the center of the microstrip dielectric substrate, and the first signal transmission line is positioned above the second signal transmission line; the upper surface and the lower surface of the microstrip medium substrate are both provided with at least one multistage air medium impedance transformation groove.
Furthermore, the multistage air dielectric impedance transformation groove comprises a plurality of grooves which are symmetrically arranged by taking a vertical line where an intersection point of projections of the first signal transmission line and the second signal transmission line in the vertical direction is located as a center.
The microstrip medium substrate comprises a PCB substrate and a metal layer coated on the outer side of the PCB substrate; the first signal transmission line and the second signal transmission line are buried in the PCB substrate, and the multi-stage air dielectric impedance transformation groove is formed in the metal layer.
The grooves forming the multi-stage air dielectric impedance transformation groove are communicated with each other, and the depths of the grooves are different.
The microstrip medium substrate is provided with a coupling port, a through port, an isolation port and an input port; one end of the first signal transmission line is connected with the coupling port, and the other end of the first signal transmission line is connected with the isolation port; one end of the second signal transmission line is connected with the through port, and the other end of the second signal transmission line is connected with the input port.
The first signal transmission line and the second signal transmission line are strip transmission lines.
The first signal transmission line and the second signal transmission line are both horizontally arranged, and the vertical distance between the first signal transmission line and the second signal transmission line is 0.1-0.5 mm.
Compared with the prior art, the utility model, have following advantage and beneficial effect: the utility model changes the design idea of a signal transmission path combining a lossy medium and an air medium, and optimizes the loss of devices to the maximum extent while expanding the ultra-wideband frequency multiplication design, thereby having various electrical properties; although the utility model discloses a design also has longer transmission line, nevertheless combines air dielectric just to compensate the loss that long transmission line brought, fine all kinds of broadband of being applied to, ultra wide band microwave radio frequency system, the product compatibility is good, has more the advantage in market competition.
Drawings
Fig. 1 is a block diagram of a conventional 3dB bridge.
FIG. 2 is a graph of a conventional 3dB bridge performance test at 2-4 GHz.
FIG. 3 is a graph of a conventional 3dB bridge performance test at 2-8 GHz.
Fig. 4 is a top view of the present invention at 2-4 GHz.
Fig. 5 is a side view of the present invention at 2-4 GHz.
Fig. 6 is a top view of the present invention at 2-8 GHz.
Fig. 7 is a graph of performance test at 2-4GHz of the present invention.
Fig. 8 is a graph of performance test at 2-8GHz of the present invention.
In the drawings: the antenna comprises a microstrip dielectric substrate 1, a multistage air dielectric impedance transformation slot 2, a first signal transmission line 3, a coupling port 4, a through port 5, an isolation port 6, a second signal transmission line 7, an input port 8, a PCB substrate 9 and a metal layer 10.
Detailed Description
The present invention will be described in further detail with reference to examples, but the embodiments of the present invention are not limited thereto.
Examples
As shown in fig. 4, 5 and 6, the utility model discloses a novel ultra wide band 3dB electric bridge, its key device as power synthesis, power distribution, power detection and ultra wide band power amplifier matching protection mainly used all kinds of power amplifier systems, broadband test source among the detecting system. Like traditional 3dB electric bridge, the utility model discloses an ultra wide band 3dB electric bridge is including microstrip medium base plate 1, and microstrip medium base plate 1 is as the carrier, and it includes PCB base plate 9 and the cladding at the metal level 10 in the PCB base plate 9 outside.
In order to realize signal transmission, the PCB substrate 9 has a first signal transmission line 3 and a second signal transmission line 7 embedded therein. In particular, when the arrangement is made, the projections of the first signal transmission line 3 and the second signal transmission line 7 in the vertical direction are arranged symmetrically with respect to the center of the PCB substrate 9.
In addition, the first signal transmission line 3 is located above the second signal transmission line 7, and both the first signal transmission line 3 and the second signal transmission line 7 are horizontally arranged, that is, the first signal transmission line 3 and the second signal transmission line 7 are not on the same horizontal plane. The vertical spacing between the first signal transmission line 3 and the second signal transmission line 7 ranges from 0.1 mm to 0.5mm, and the spacing between the first signal transmission line 3 and the second signal transmission line 7 is set to 0.2mm in the embodiment; the vertical spacing between the first signal transmission line 3 and the second signal transmission line 7 may be specifically set according to the thickness of the PCB substrate 9 or the octave that the 3dB bridge needs to achieve.
The utility model discloses a first signal transmission line 3 and second signal transmission line 7 are impedance gradual change strip transmission line, and first signal transmission line 3 and second signal transmission line 7 are the centre narrow and the impedance gradual change strip transmission line that both sides widen gradually promptly, and its structure is the same with the signal transmission line of traditional 3dB electric bridge, no longer does detailed description.
And a multi-stage air dielectric impedance transformation groove 2 arranged on the upper surface and the lower surface of the microstrip dielectric substrate 1.
As shown in fig. 4, the microstrip dielectric substrate 1 is provided with a coupling port 4, an isolation port 6, a through port 5, and an input port 8. One end of the first signal transmission line 3 is connected with the coupling port 4, and the other end of the first signal transmission line is connected with the isolation port 6; the second signal transmission line 7 is connected at one end to the through port 5 and at the other end to the input port 8. When the device is used, the coupling port 4, the through port 5, the isolation port 6 and the input port 8 are connected with connectors, and are connected with an external electric device through the connectors.
In order to realize the functions of the present invention, as shown in fig. 4 and 5, the upper surface and the lower surface of the microstrip medium substrate 1 are provided with a plurality of stages of air medium impedance transformation grooves 2, that is, the metal layers on the upper surface and the lower surface of the microstrip medium substrate 1 are both provided with a plurality of stages of air medium impedance transformation grooves 2, the number of the plurality of stages of air medium impedance transformation grooves 2 is at least set to one, and the number of the plurality of stages of air medium impedance transformation grooves 2 is set according to the actual situation; specifically, the number of the multi-stage air dielectric impedance transformation grooves 2 is the same as the number of intersection points of the projections of the first signal transmission line 3 and the second signal transmission line 7 in the vertical direction, and the positions thereof correspond to the positions of the intersection points of the projections of the first signal transmission line 3 and the second signal transmission line 7 in the vertical direction.
Specifically, the multi-stage air dielectric impedance transformation groove 2 includes a plurality of grooves symmetrically arranged with a vertical line where an intersection point of projections of the first signal transmission line 3 and the second signal transmission line 7 in the vertical direction is located as a center, the number of the grooves may be specifically set according to an octave to be reached by the 3dB bridge, and the number of the grooves on each multi-stage air dielectric impedance transformation groove 2 is set to 9 in this embodiment.
In addition, the grooves forming the multi-stage air dielectric impedance transformation groove 2 are communicated with each other, the depths of the grooves are different, namely, the grooves are in a step shape, and the depth of the grooves can be set according to the thickness of the metal layer or the whole microstrip dielectric substrate 1.
Owing to set up multistage air dielectric impedance transformation groove 2, the utility model discloses a 3dB electric bridge has realized the design of the signal transmission route that lossy medium and air medium combined together, because among the signal transmission process, the air dielectric loss is minimum, consequently the utility model discloses in the design of extension ultra wide band doubling of frequency, each electrical property has been left to furthest's optimization device, though novel design also has longer transmission line, nevertheless combines air medium just to compensate the loss that long transmission line brought, fine all kinds of broadband of being applied to, ultra wide band microwave radio frequency system, product compatibility is good, has more the advantage in market competition. The utility model discloses a 3dB electric bridge is holistic to produce the processing implementation mode and is the same basically with traditional 3dB electric bridge, and the processing technology of the multistage air dielectric impedance transformation groove 2 that the surface was processed during its production is simple, and whole processing cost increases less than 5%, but the market benefit and the technical innovation that bring can't be estimated.
The following performance to the ultra wide band 3dB electric bridge of this application tests, and the test result is shown as figure 7, the utility model discloses the 8GHz loss at 8GHz is littleer than traditional 3 dB's 8GHz loss, but operating frequency's scope is several times than traditional wide, uses extensively. As shown in fig. 8, since the wider bandwidth of 40GHz is compatible, the loss is not increased much compared with the frequency of 8GHz in the conventional technology, which represents the advantage of design in combination with air medium, and the compatibility of the latter, the application of the broadband radio frequency system is not compared in the conventional technology.
The 3dB electric bridge adopts the conventional or traditional design can not satisfy the intensity requirement and the performance of signal because the central zone needs stronger coupling factor, so the utility model discloses an ultra wide band 3dB electric bridge adopts the coupling factor of multistage air dielectric's impedance transformation reinforcing middle zone signal to realize reaching the purpose of 3dB coupling, simultaneously because the dielectric loss of air can be ignored, so furthest's reduction the device loss, solved traditional design can not realize the ultra wide band and though can realize certain broadband (be less than 10 octaves) but the problem of loss increase.
As described above, the present invention can be implemented well.
Claims (7)
1. A novel ultra-wideband 3dB bridge comprises a micro-strip medium substrate (1), a first signal transmission line (3) and a second signal transmission line (7) which are arranged in the micro-strip medium substrate (1); the first signal transmission line (3) and the second signal transmission line (7) are symmetrically arranged relative to the center of the microstrip dielectric substrate (1), and the first signal transmission line (3) is positioned above the second signal transmission line (7); the microstrip dielectric substrate is characterized in that the upper surface and the lower surface of the microstrip dielectric substrate (1) are both provided with at least one multistage air dielectric impedance transformation groove (2).
2. The novel ultra-wideband 3dB bridge according to claim 1, wherein the multi-level air dielectric impedance transformation slot (2) comprises a plurality of grooves symmetrically arranged with respect to each other with respect to a vertical line at which an intersection point of projections of the first signal transmission line (3) and the second signal transmission line (7) in a vertical direction is located.
3. The novel ultra-wideband 3dB bridge according to claim 2, characterized in that the microstrip dielectric substrate (1) comprises a PCB substrate (9), a metal layer (10) coated outside the PCB substrate (9); the first signal transmission line (3) and the second signal transmission line (7) are buried in the PCB substrate (9), and the multistage air dielectric impedance transformation groove (2) is formed in the metal layer (10).
4. The novel ultra-wideband 3dB bridge as claimed in claim 2, wherein the grooves forming the multi-level air dielectric impedance transformation slot (2) are interconnected and have different depths.
5. The novel ultra-wideband 3dB bridge according to any one of claims 1-4, characterized in that the microstrip dielectric substrate (1) is provided with a coupling port (4), a through port (5), an isolation port (6) and an input port (8); one end of the first signal transmission line (3) is connected with the coupling port (4), and the other end of the first signal transmission line is connected with the isolation port (6); one end of the second signal transmission line (7) is connected with the through port (5), and the other end of the second signal transmission line is connected with the input port (8).
6. A new ultra wide band 3dB bridge according to any of claims 1-4, characterized in that the first signal transmission line (3) and the second signal transmission line (7) are strip transmission lines.
7. A novel ultra-wideband 3dB bridge according to any of claims 1-4, characterized in that the first signal transmission line (3) and the second signal transmission line (7) are both horizontally disposed, and the vertical spacing between the first signal transmission line (3) and the second signal transmission line (7) is in the range of 0.1-0.5 mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201922344963.4U CN210723308U (en) | 2019-12-24 | 2019-12-24 | Novel ultra-wideband 3dB bridge |
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| CN201922344963.4U CN210723308U (en) | 2019-12-24 | 2019-12-24 | Novel ultra-wideband 3dB bridge |
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| CN210723308U true CN210723308U (en) | 2020-06-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114678674A (en) * | 2022-04-26 | 2022-06-28 | 成都威频科技有限公司 | Hybrid-order cascaded broadband high-power bridge |
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2019
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114678674A (en) * | 2022-04-26 | 2022-06-28 | 成都威频科技有限公司 | Hybrid-order cascaded broadband high-power bridge |
| CN114678674B (en) * | 2022-04-26 | 2023-06-30 | 成都威频科技有限公司 | Mixed-order cascading broadband high-power bridge |
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