CN210709627U - Jacking assembly suitable for chip mounter - Google Patents
Jacking assembly suitable for chip mounter Download PDFInfo
- Publication number
- CN210709627U CN210709627U CN201920840132.3U CN201920840132U CN210709627U CN 210709627 U CN210709627 U CN 210709627U CN 201920840132 U CN201920840132 U CN 201920840132U CN 210709627 U CN210709627 U CN 210709627U
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- China
- Prior art keywords
- jacking
- plate
- shaped support
- mounting
- chip mounter
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a jacking subassembly suitable for chip mounter includes the mounting plate who sets up on external organism, mounting plate's below is equipped with the jacking cylinder, the expansion end of jacking cylinder passes the through-hole of seting up on the mounting plate, the expansion end tip of jacking cylinder is equipped with the jacking board. The glass to be pasted with the adhesive tape is lifted through the mounting bottom plate, the jacking cylinder and the jacking plate, and the purposes of automatically lifting the glass, avoiding the contact of the glass and external equipment and ensuring the stability of the glass in the process of pasting the adhesive tape are achieved.
Description
Technical Field
The utility model relates to a tape dispenser auxiliary assembly field, concretely relates to jacking subassembly suitable for chip mounter.
Background
In the prior art, an important part of a tape pasting machine in the production process of a solar module is mainly used for carrying out a tape pasting process on glass in the solar module. In the traditional tape pasting process, glass is easy to touch peripheral equipment in the placing process, so that the glass is damaged, and the product quality is influenced.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information constitutes prior art already known to a person skilled in the art.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a jacking subassembly suitable for chip mounter to reach the steady purpose that realizes carrying out automatic promotion and assurance rubberizing tape technology to glass.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
the utility model provides a jacking subassembly suitable for chip mounter includes the mounting plate who sets up on external organism, mounting plate's below is equipped with the jacking cylinder, the expansion end of jacking cylinder passes the through-hole of seting up on the mounting plate, the expansion end tip of jacking cylinder is equipped with the jacking board.
The utility model discloses a mounting plate, jacking cylinder and jacking board realize treating the glass of rubberizing area and promote, reach the realization and carry out the automatic steady purpose that promotes, avoid glass and external equipment to take place to contact and guarantee glass in the rubberizing area technology to glass.
Preferably, telescopic rods are arranged at two ends of the jacking plate, each telescopic rod comprises a fixed part and a movable part, the fixed parts are arranged below the mounting bottom plate, the end parts of the fixed parts are movably connected with the mounting bottom plate, and the movable parts extend out of the fixed parts and are fixedly connected with the jacking plate. The telescopic rods arranged at the two ends of the jacking plate are used for ensuring the stability of the jacking plate in the lifting process, and the stability of the glass when being placed is also ensured.
Preferably, the four corners of the mounting base plate are provided with Z-shaped support frames for mounting the whole jacking assembly, the horizontal part of the bottom of each Z-shaped support frame is arranged on the mounting base plate, the horizontal part of the top of the mounting base plate extends out towards the outer side of the mounting base plate, and the horizontal parts of the bottom and the top of each Z-shaped support frame are consistent with the direction of the jacking plate.
Preferably, the mounting base plate is provided with a moving groove for the Z-shaped support frame to move, and the Z-shaped support frame is arranged on the moving groove through a screw hole arranged on the Z-shaped support frame and a screw matched with the screw hole. The movable groove and the Z-shaped support frame are utilized to realize the installation of the whole assembly, the distance between the Z-shaped support frames can be conveniently adjusted according to different tape sticking machines, and the installation adaptability is improved.
Preferably, the end part of the bottom horizontal part of the Z-shaped support frame is hinged with an inclined rod, the end part of the inclined rod is hinged with the side wall of the jacking plate, and the middle part of the inclined rod is provided with a section of spring. The inclined rod is utilized to share the bearing of the jacking plate, and the stability of glass placement is ensured.
The utility model has the advantages of as follows:
1. the utility model discloses a mounting plate, jacking cylinder and jacking board realize treating the glass of rubberizing area and promote, reach the realization and carry out the automatic steady purpose that promotes, avoid glass and external equipment to take place to contact and guarantee glass in the rubberizing area technology to glass.
2. The utility model discloses utilize the telescopic link that sets up at the jacking board both ends to guarantee the stability that the jacking board promoted the in-process, also guaranteed the stability when glass placed.
3. The utility model discloses utilize shifting chute and Z type support frame to realize the installation to whole subassembly, also be convenient for to the distance between the different tape sticking machine adjustment Z type support frames, improve the adaptability of installation.
4. The utility model discloses utilize the down tube to realize sharing the bearing of jacking board, guarantee the ann steady that glass placed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
Fig. 1 is a schematic structural diagram of a jacking assembly suitable for a chip mounter, which is disclosed in an embodiment of the present invention;
the corresponding part names indicated by the numbers and letters in the drawings:
1. mounting bottom plate 2, jacking cylinder 3, through hole 4, jacking plate 5, telescopic link 6, Z type support frame
7. A moving groove 8, an inclined rod 9 and a spring.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
The utility model provides a jacking subassembly suitable for chip mounter, its theory of operation realize treating the glass of rubberizing area through mounting plate, jacking cylinder and jacking board and promote, reach the realization and carry out automatic promotion, avoid glass and external equipment to take place to contact and guarantee the steady purpose of glass in the rubberizing area technology to glass.
The present invention will be described in further detail with reference to examples and embodiments.
As shown in fig. 1, a jacking subassembly suitable for chip mounter includes the mounting plate 1 that sets up on the external organism, mounting plate's below is equipped with jacking cylinder 2, the expansion end of jacking cylinder passes through the through-hole 3 of seting up on the mounting plate, the expansion end tip of jacking cylinder is equipped with jacking board 4, jacking board's both ends are equipped with telescopic link 5, the telescopic link includes fixed part and movable part, the fixed part sets up mounting plate's below, the tip of fixed part with mounting plate swing joint, the movable part stretch out from the fixed part and with jacking board fixed connection.
The four corners of the mounting bottom plate are provided with Z-shaped support frames 6 for mounting the whole jacking assembly, the horizontal part of the bottom of each Z-shaped support frame is arranged on the mounting bottom plate, the horizontal part of the top of the mounting bottom plate extends out of the outer side of the mounting bottom plate, and the directions of the horizontal part of the bottom of each Z-shaped support frame and the horizontal part of the top of each Z-shaped support frame are consistent with the directions of the jacking plates; the mounting bottom plate is provided with a moving groove 7 for the Z-shaped support frame to move, and the Z-shaped support frame is arranged on the moving groove through a screw hole arranged on the Z-shaped support frame and a screw matched with the screw hole (not shown).
The end part of the bottom horizontal part of the Z-shaped support frame is hinged with an inclined rod 8, the end part of the inclined rod is hinged with the side wall of the jacking plate, and the middle part of the inclined rod is provided with a section of spring 9.
The utility model discloses a concrete application steps as follows: as shown in fig. 1 again, in the in-service use process, when the glass plate is conveyed to the jacking assembly by the conveying assembly, the jacking cylinders 2 arranged at two ends of the glass plate are opened to lift the jacking plate 4 until the glass plate is jacked to a proper position, in the whole process, the stability of the jacking plate 4 is realized by using the telescopic rods, in the whole lifting and supporting process, the lifting plate 4 is shared by the inclined rods 8 and the springs 9 in the middle of the inclined rods, and meanwhile, the jacking plate is buffered in the jacking process, so that the direct action on the jacking cylinders is avoided, and the service life of the equipment is prolonged.
In this way, the utility model provides a jacking subassembly suitable for chip mounter realizes treating the glass of rubberizing area through mounting plate, jacking cylinder and jacking board and promotes, reaches the realization and carries out automatic promotion, avoids glass and external equipment to take place the steady purpose of contact and glass in the assurance rubberizing area technology to glass.
What has been described above is only the preferred embodiment of the jacking assembly suitable for chip mounter disclosed in the present invention, and it should be noted that, for those skilled in the art, without departing from the inventive concept, a plurality of deformations and improvements can be made, and these all belong to the protection scope of the present invention.
Claims (5)
1. The utility model provides a jacking subassembly suitable for chip mounter, its characterized in that includes the mounting plate who sets up on external organism, mounting plate's below is equipped with the jacking cylinder, the expansion end of jacking cylinder passes the through-hole of seting up on the mounting plate, the expansion end tip of jacking cylinder is equipped with the jacking board.
2. The jacking assembly suitable for the chip mounter according to claim 1, wherein the two ends of the jacking plate are provided with telescopic rods, each telescopic rod comprises a fixed portion and a movable portion, the fixed portion is disposed below the mounting base plate, the end portion of the fixed portion is movably connected with the mounting base plate, and the movable portion extends out of the fixed portion and is fixedly connected with the jacking plate.
3. The jacking assembly suitable for the chip mounter according to claim 1, wherein Z-shaped support frames for mounting the whole jacking assembly are arranged at four corners of the mounting base plate, a horizontal portion of a bottom of each Z-shaped support frame is arranged on the mounting base plate, a horizontal portion of a top of the mounting base plate extends out of an outer side of the mounting base plate, and the horizontal portions of the bottom and the top of each Z-shaped support frame are in the same direction as the direction of the jacking plate.
4. The jacking assembly suitable for the chip mounter according to claim 3, wherein a moving groove for the Z-shaped support frame to move is formed in the mounting base plate, and the Z-shaped support frame is arranged on the moving groove through a screw hole formed in the Z-shaped support frame and a screw matched with the screw hole.
5. The jacking assembly suitable for the chip mounter according to claim 3, wherein an end portion of the bottom horizontal portion of the Z-shaped supporting frame is hinged to a diagonal rod, an end portion of the diagonal rod is hinged to a side wall of the jacking plate, and a section of spring is arranged in the middle of the diagonal rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920840132.3U CN210709627U (en) | 2019-06-04 | 2019-06-04 | Jacking assembly suitable for chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920840132.3U CN210709627U (en) | 2019-06-04 | 2019-06-04 | Jacking assembly suitable for chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210709627U true CN210709627U (en) | 2020-06-09 |
Family
ID=70931461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920840132.3U Expired - Fee Related CN210709627U (en) | 2019-06-04 | 2019-06-04 | Jacking assembly suitable for chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210709627U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114476286A (en) * | 2020-10-26 | 2022-05-13 | 力成科技股份有限公司 | Jacking assembly |
-
2019
- 2019-06-04 CN CN201920840132.3U patent/CN210709627U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114476286A (en) * | 2020-10-26 | 2022-05-13 | 力成科技股份有限公司 | Jacking assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: No.2 workshop, No.777, Kangyuan Road, Xiangcheng Economic Development Zone, Suzhou, Jiangsu 215100 Patentee after: SUZHOU FUQUN INTELLIGENT TECHNOLOGY Co.,Ltd. Address before: 215100 No. 777 Kangyuan Road, Xiangcheng Economic Development Zone, Yancheng City, Jiangsu Province Patentee before: SUZHOU FUQUN INTELLIGENT TECHNOLOGY Co.,Ltd. |
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| CP02 | Change in the address of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200609 Termination date: 20210604 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |