CN210702229U - Electronic component pin bending mechanism - Google Patents
Electronic component pin bending mechanism Download PDFInfo
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- CN210702229U CN210702229U CN201921399867.3U CN201921399867U CN210702229U CN 210702229 U CN210702229 U CN 210702229U CN 201921399867 U CN201921399867 U CN 201921399867U CN 210702229 U CN210702229 U CN 210702229U
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Abstract
An electronic component pin bending mechanism comprises: the electronic component comprises a bearing component, a locking component and a rotating and pressing component, wherein the locking component is used for limiting a main body of the electronic component on the bearing component; the bearing component comprises a bearing plate; one side of the carrier plate is a pressure-bearing side, and the side of the carrier plate, which is back to the pressure-bearing side, is a shaft body side; the support plate is provided with a plurality of station grooves which are distributed along the pressure-bearing side of the support plate; a projection extends from the shaft side of the carrier plate; the rotating and pressing component comprises a rotating cover pivoted with the lug; the rotary cover is provided with a side pressure plate parallel to the pressure-bearing side edge of the support plate, and when the rotary cover rotates towards a preset direction, the side pressure plate is attached to the pressure-bearing side edge of the support plate; because the distance between each electronic element and the side edge of the pressure-bearing side and the angle of each pressing of the side pressure plate are kept consistent in each station groove, the bending point and the bending angle of the welding pin of the electronic element are kept uniform, and the bending effect is ensured.
Description
Technical Field
The utility model relates to an electronic component processing technology field especially relates to an electronic component pin mechanism of bending.
Background
In the production of electronic products, the soldering pins of some electronic components often need to be bent by 90 degrees to be better put into practical use. The welding pins are generally small rectangular blocks with the size of about 3mmx20mm, are mostly made of copper materials, are plated with zinc on the surface, and belong to parts easy to bend.
When electronic products are subjected to proofing or small-batch production, a manual operation mode is generally adopted to bend welding pins of electronic elements, however, the manual bending effect is not ideal, and bending points or bending angles of the welding pins of different electronic elements cannot be unified.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a pin bending mechanism for solving the problem that the bending points or bending angles of the soldering pins of different electronic components cannot be unified.
An electronic component pin bending mechanism comprises: the electronic component comprises a bearing component, a locking component and a rotating and pressing component, wherein the locking component is used for limiting a main body of an electronic component on the bearing component; the bearing assembly comprises a bearing plate; one side of the carrier plate is a pressure-bearing side, and one side of the carrier plate, which is back to the pressure-bearing side, is a shaft body side; the carrier plate is provided with a plurality of station grooves which are distributed along the pressure bearing side of the carrier plate in an arrayed manner; a projection extends from the side of the shaft of the carrier plate; the rotating and pressing assembly comprises a rotating cover pivoted with the lug; the rotary cover is provided with a side pressure plate parallel to the pressure-bearing side edge of the carrier plate, and when the rotary cover rotates towards a preset direction, the side pressure plate is attached to the pressure-bearing side edge of the carrier plate.
According to the electronic element pin bending mechanism, the station groove corresponds to the main body of the electronic element, after the main body of the electronic element is correspondingly placed in the station groove, the welding pins of the electronic element extend out of the pressure-bearing side edge of the support plate, meanwhile, the locking assembly limits the main body of the electronic element in the station groove, when the rotary cover rotates along the direction that the side pressing plate is close to the pressure-bearing side edge of the support plate, the welding pins of the electronic element are extruded by the side pressing plate to be bent, and because the distance between each placed electronic element and the pressure-bearing side edge and the angle of each downward pressing of the side pressing plate are kept consistent in each station groove, the bending point and the bending angle of the welding pins of the electronic element are kept unified, and the bending effect is guaranteed.
In one embodiment, the carrier assembly further comprises a forming plate connected with the carrier plate; the forming plate is arranged on the outer side of the pressure-bearing side of the carrier plate; therefore, the corresponding position on the welding pin of the electronic element can be bent by adjusting the width of the forming plate.
In one embodiment, the bearing assembly further comprises a base and a supporting plate arranged on the base; the support plate is arranged on the support plate; therefore, the welding pins of the electronic element are prevented from being blocked in the bending process.
In one embodiment, the pressure-transmitting assembly further comprises an operating handle connected with the pressure-transmitting cover; one end of the operating handle is connected with the rotating cover, and the other end of the operating handle extends towards the direction far away from the shaft body side of the carrier plate; thereby reducing the force for operating the turnover cover to turn over.
In one embodiment, the bearing assembly further comprises a middle shaft penetrating through the lug and the rotating cover; the middle shaft is arranged in parallel with the edge of the pressure-bearing side of the carrier plate; therefore, the pivoting between the rotary cover and the convex block can be conveniently realized.
In one embodiment, the locking assembly comprises a prepressing plate sleeved on the middle shaft and a spring piece arranged between the prepressing plate and the rotating cover; the bottom side of the prepressing plate corresponds to the station groove on the carrier plate; therefore, when the welding pins are bent by the side pressing plates, the main body of the electronic element is prevented from being turned out from the station groove.
In one embodiment, the locking assembly further comprises an adjusting member in threaded connection with the pre-press plate; a strip-shaped groove is formed in the rotary cover; the strip-shaped groove extends along the direction vertical to the middle shaft; the width of the strip-shaped groove corresponds to the outer diameter of the main body of the adjusting piece; the adjusting piece is arranged in the strip-shaped groove in a penetrating mode, and the end head of the adjusting piece is located on the outer side of the rotary cover; thereby adjusting the pressure generated on the carrier plate when the prepressing plate starts to contact with the carrier plate and the angle of the rotating cover when the prepressing plate starts to contact with the carrier plate.
In one embodiment, a lower limiting groove is arranged on one side of the prepressing plate opposite to the rotating cover, and an upper limiting groove is arranged on the inner side of the rotating cover; the lower limiting groove and the upper limiting groove are correspondingly arranged; one end of the spring piece is accommodated in the lower limiting groove, and the other end of the spring piece is accommodated in the upper limiting groove; thereby fix a position the spring part through lower spacing groove and last spacing groove, avoid the spring part to take place the offset at flexible in-process.
In one embodiment, the lug on the carrier plate is positioned at the inner side of the rotating cover; two ends of the middle shaft respectively extend out of the rotating cover; an annular groove is arranged on the middle shaft at the outer side of the rotary cover; thereby facilitating the positioning of the middle shaft.
In one embodiment, the station slot is rectangular, and the carrier plate is provided with corner slots at the corners of the station slot; thereby making the station slot adaptable to the electronic component with partial machining error.
Drawings
Fig. 1 is a schematic perspective view of an electronic component pin bending mechanism according to an embodiment of the present invention;
fig. 2 is a schematic perspective view of the electronic component pin bending mechanism shown in fig. 1 at another angle;
fig. 3 is a schematic perspective view of the electronic component pin bending mechanism shown in fig. 1 after the rotating-pressing assembly is turned over;
fig. 4 is a schematic perspective view of the electronic component pin bending mechanism shown in fig. 3 at another angle;
FIG. 5 is an exploded view of the pin bending mechanism of the electronic device shown in FIG. 1;
fig. 6 is an exploded view of the electronic component pin bending mechanism shown in fig. 1 at another angle.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully below. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1 to 6, an electronic device pin bending mechanism 100 according to an embodiment of the present invention is used for bending an electronic device pin. The electronic component pin bending mechanism 100 includes a carrier assembly 20, a locking assembly 30 for limiting a main body 801 of an electronic component on the carrier assembly 20, and a pressure rotating assembly 40 pivoted to the carrier assembly 20; the carrier assembly 20 includes a carrier plate 21; one side of the carrier plate 21 is a pressure-bearing side 211, and one side of the carrier plate 21, which faces away from the pressure-bearing side 211, is a shaft body side 212; the carrier plate 21 is provided with a plurality of station slots 213, and the station slots 213 are distributed along the pressure-bearing side 211 of the carrier plate 21; a projection 214 extends from the shaft body side 212 of the carrier plate 21; the rotating and pressing assembly 40 includes a rotating cover 41 pivotally connected to the protrusion 214; the rotating cover 41 is provided with a side pressure plate 411 parallel to the edge of the pressure-receiving side 211 of the carrier plate 21, and when the rotating cover 41 is rotated in a predetermined direction, the side pressure plate 411 is brought into contact with the edge of the pressure-receiving side 211 of the carrier plate 21.
After the main body 801 of the electronic component is correspondingly placed in the station slot 213 through the station slot 213, the soldering pins 802 of the electronic component extend out of the edge of the pressure-bearing side 211 of the carrier plate 21, and the locking assembly 30 limits the main body 801 of the electronic component in the station slot 213, so that when the rotary cover 41 rotates in the direction that the side pressing plate 411 is close to the edge of the pressure-bearing side 211 of the carrier plate 21, the soldering pins 802 of the electronic component are pressed by the side pressing plate 411 to be bent, and because the distance between each placed electronic component and the edge of the pressure-bearing side 211 and the angle of each pressing of the side pressing plate 411 in each station slot 213 are kept consistent, the bending points and the bending angles of the soldering pins 802 of the electronic component are kept uniform, and the bending effect is guaranteed.
Referring to fig. 5, the station slot 213 is rectangular, and the carrier 21 has a corner slot 215 at the corner of the station slot 213; because the main body 801 of part of the electronic element is rectangular, and the rectangular station slot 213 is attached to the edge of the main body 801 of the electronic element, the angle error caused by the deviation of the main body 801 of the electronic element when the welding pins 802 are bent is avoided; the provision of the corner groove 215 avoids the problem of the body 801 of the electronic component being unable to be placed in the station groove 213 due to an error in the sharp corner.
Referring to fig. 4 and 5, the supporting assembly 20 further includes a base 23 and a supporting plate 24 disposed on the base 23; the carrier plate 21 is arranged on the support plate 24; after the base 23 is placed, the support plate 24 lifts the carrier plate 21, and when the soldering pins 802 of the electronic component are bent, the carrier plate 21 is far away from the placing surface through the support plate 24, so that the soldering pins 802 of the electronic component are prevented from contacting the placing surface.
The bearing assembly 20 further includes a central shaft 25 passing through the protrusion 214 and the rotating cover 41; the central axis 25 is arranged parallel to the edge of the pressure-bearing side 211 of the carrier plate 21; the projection 214 on the carrier plate 21 is positioned at the inner side of the rotating cover 41; two ends of the middle shaft 25 respectively extend out of the rotating cover 41; the middle shaft 25 at the outer side of the rotating cover 41 is provided with an annular groove 251; specifically, a snap spring (not shown) is sleeved on the annular groove 251.
Referring to fig. 3 and 4, the locking assembly 30 includes a pre-pressing plate 31 sleeved on the central shaft 25, and a spring member 32 disposed between the pre-pressing plate 31 and the rotating cover 41; the bottom side of the pre-pressing plate 31 corresponds to the station groove 213 on the carrier plate 21; when the rotating cover 41 rotates, the pre-pressing plate 31 is pushed by the spring member 32 to turn over in advance, before the side pressing plate 411 contacts the soldering pins 802, the pre-pressing plate 31 is pressed on the carrier plate 21, so that the main body 801 of the electronic component is limited in the station slot 213 by the pre-pressing plate 31; in other embodiments, the prepress plate 31 may also be fixed to the carrier plate 21 by means of fasteners.
Referring to fig. 5, a lower limiting groove 311 is formed on the side of the pre-pressing plate 31 opposite to the rotating cover 41; one end of the spring member 32 is received in the lower limit groove 311.
Referring to fig. 1, the locking assembly 30 further includes an adjusting member 33 threadedly coupled to the pre-press plate 31.
A strip-shaped groove 412 is arranged on the rotating cover 41; the strip-shaped groove 412 extends in a direction perpendicular to the central axis 25; the width of the strip-shaped groove 412 corresponds to the outer diameter of the main body 801 of the adjuster 33; the adjusting piece 33 is arranged in the strip-shaped groove 412 in a penetrating manner, and the end head of the adjusting piece 33 is positioned on the outer side of the rotating cover 41; specifically, the adjusting member 33 is a screw, and the spring member 32 is a compression spring; by the rotation of the adjusting member 33, the amount of compression of the spring member 32 can be adjusted because the end of the adjusting member 33 is located outside the rotating cover 41, so that the pressure on the carrier plate 21 generated when the pre-pressing plate 31 starts to contact the carrier plate 21 and the angle at which the rotating cover 41 starts to contact can be adjusted; in addition, when the rotating cover 41 is turned over and separated from the carrier plate 21, the rotating cover 41 is rotated by the adjusting member 33 to separate the pre-pressing plate 31 from the carrier plate, so as to facilitate the removal of the electronic component.
Referring to fig. 6, an upper limiting groove 413 is formed inside the rotating cover 41; the lower limiting groove 311 and the upper limiting groove 413 are correspondingly arranged; the other end of the spring member 32 is received in the upper limit groove 413.
Referring to fig. 5, the rotating pressing assembly 40 further includes an operating handle 42 connected to the rotating cover 41; one end of the operating handle 42 is connected with the rotating cover 41, and the other end of the operating handle 42 extends in the direction away from the shaft body side 212 of the carrier plate 21; when the operating handle 42 is held by hand and the rotating cover 41 is turned over, the force for turning over the rotating cover 41 to bend the soldering pins 802 is reduced under the lever principle.
In the embodiment, the station groove corresponds to the main body of the electronic element, after the main body of the electronic element is correspondingly placed in the station groove, the welding pins of the electronic element extend out of the pressure-bearing side edge of the support plate, meanwhile, the main body of the electronic element is limited in the station groove by the locking assembly, when the rotary cover rotates along the direction that the side pressing plate is close to the pressure-bearing side edge of the support plate, the welding pins of the electronic element are extruded by the side pressing plate to be bent, and because the distance between each placed electronic element and the pressure-bearing side edge and the angle of each pressing of the side pressing plate are kept consistent in each station groove, the bending points and the bending angles of the welding pins of the electronic element are kept unified, and the bending effect is ensured.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The utility model provides an electronic component pin mechanism of bending which characterized in that includes: the electronic component comprises a bearing component, a locking component and a rotating and pressing component, wherein the locking component is used for limiting a main body of an electronic component on the bearing component; the bearing assembly comprises a bearing plate; one side of the carrier plate is a pressure-bearing side, and one side of the carrier plate, which is back to the pressure-bearing side, is a shaft body side; the carrier plate is provided with a plurality of station grooves which are distributed along the pressure bearing side of the carrier plate in an arrayed manner; a projection extends from the side of the shaft of the carrier plate; the rotating and pressing assembly comprises a rotating cover pivoted with the lug; the rotary cover is provided with a side pressure plate parallel to the pressure-bearing side edge of the carrier plate, and when the rotary cover rotates towards a preset direction, the side pressure plate is attached to the pressure-bearing side edge of the carrier plate.
2. The pin bending mechanism for electronic components according to claim 1, wherein the carrier assembly further comprises a molding plate connected to the carrier plate; the forming plate is arranged on the outer side of the pressure-bearing side of the carrier plate.
3. The electronic component pin bending mechanism according to claim 1, wherein the carrier assembly further comprises a base and a support plate disposed on the base; the support plate is arranged on the support plate.
4. The pin bending mechanism for electronic components of claim 3, wherein the pressure-transferring assembly further comprises an operating handle connected to the pressure-transferring cover; one end of the operating handle is connected with the rotating cover, and the other end of the operating handle extends towards the direction far away from the shaft body side of the carrier plate.
5. The pin bending mechanism for electronic components according to claim 1, wherein the carrier assembly further comprises a central shaft penetrating through the protrusion and the rotary cover; the middle shaft is arranged in parallel with the edge of the pressure-bearing side of the carrier plate.
6. The pin bending mechanism according to claim 5, wherein the locking assembly comprises a pre-pressing plate sleeved on the central shaft, and a spring member disposed between the pre-pressing plate and the rotating cover; the bottom side of the prepressing plate corresponds to the station groove on the carrier plate.
7. The electronic component pin bending mechanism according to claim 6, wherein the locking assembly further comprises an adjusting member in threaded connection with the pre-pressing plate; a strip-shaped groove is formed in the rotary cover; the strip-shaped groove extends along the direction vertical to the middle shaft; the width of the strip-shaped groove corresponds to the outer diameter of the main body of the adjusting piece; the adjusting piece is arranged in the strip-shaped groove in a penetrating mode, and the end of the adjusting piece is located on the outer side of the rotary cover.
8. The pin bending mechanism for electronic components according to claim 7, wherein a lower limiting groove is formed in a side of the pre-pressing plate opposite to the rotating cover, and an upper limiting groove is formed in an inner side of the rotating cover; the lower limiting groove and the upper limiting groove are correspondingly arranged; one end of the spring piece is accommodated in the lower limiting groove, and the other end of the spring piece is accommodated in the upper limiting groove.
9. The pin bending mechanism for electronic components according to claim 5, wherein the protrusion on the carrier is located inside the rotary cover; two ends of the middle shaft respectively extend out of the rotating cover; an annular groove is arranged on the middle shaft at the outer side of the rotary cover.
10. The pin bending mechanism for electronic components according to claim 1, wherein the station slot is rectangular, and the carrier plate is provided with corner slots at corners of the station slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921399867.3U CN210702229U (en) | 2019-08-26 | 2019-08-26 | Electronic component pin bending mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921399867.3U CN210702229U (en) | 2019-08-26 | 2019-08-26 | Electronic component pin bending mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210702229U true CN210702229U (en) | 2020-06-09 |
Family
ID=70939278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921399867.3U Active CN210702229U (en) | 2019-08-26 | 2019-08-26 | Electronic component pin bending mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210702229U (en) |
-
2019
- 2019-08-26 CN CN201921399867.3U patent/CN210702229U/en active Active
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| GR01 | Patent grant |