CN210701406U

CN210701406U - Improved pipeline cleaning device of silicon wafer cleaning line

Info

Publication number: CN210701406U
Application number: CN201921642180.8U
Authority: CN
Inventors: 李伟; 戴磊; 王波波; 吴斌华; 夏康; 蓝希旺
Original assignee: Zhonggan New Energy Co ltd
Current assignee: Zhonggan New Energy Co ltd
Priority date: 2019-09-29
Filing date: 2019-09-29
Publication date: 2020-06-09
Anticipated expiration: 2029-09-29

Abstract

The utility model relates to a silicon chip processing technology field just discloses silicon chip cleaning line's pipeline improves belt cleaning device, including wasing the pond, the below fixed mounting who washs the pond has the drainage basin, the upper compression roller has been cup jointed in the inner chamber top activity of wasing the pond, the lower compression roller has been cup jointed in the below activity of wasing the pond, the chamber top fixed mounting who washs the pond has the collector pipe, the preceding fixed mounting of drainage basin has the water tank. The utility model discloses a water pump sends into the water sword of fixed mounting on the collector pipe with the water in the water tank through flow pipe and distributive pipe in, clear up the upper surface of silicon chip through the delivery port, water after wasing the silicon chip upper surface falls into the inner chamber of wasing the pond, the top surface of lower compression roller is less than the two sides of controlling of wasing the pond, the bottom that makes the silicon chip of placing on the compression roller down soaks in the clear water, clear up the bottom surface of silicon chip, the scope that sprays has been guaranteed to the apopore of seting up on the water sword, the cleaning performance has been guaranteed.

Description

Improved pipeline cleaning device of silicon wafer cleaning line

Technical Field

The utility model relates to a silicon chip processing technology field specifically is pipeline improvement belt cleaning device of silicon chip cleaning line.

Background

In general, after a silicon wafer is formed by cutting a silicon material, since the surface of the silicon wafer is contaminated with silicon material chips, cutting liquid, and the like, it is necessary to clean the cut silicon wafer by a silicon wafer cleaning apparatus and then perform a drying process.

The silicon wafer cleaning line usually uses acid cleaning and multiple times of cleaning, most of the existing silicon wafer cleaning is to place the silicon wafer in cleaning liquid for soaking, the static soaking cleaning efficiency is low, the silicon wafer cannot be cleaned completely, and after the silicon wafer soaking cleaning is completed, the silicon wafer is not convenient to take out from soaking liquid, the spraying range of the spraying cleaning equipment is small, the silicon wafer which cannot be uniformly sprayed causes abnormal process quality.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a pipeline improvement belt cleaning device of silicon chip cleaning line possesses even and sprays the washing to the silicon chip, increases and sprays the scope, has guaranteed the advantage of cleaning performance, has solved the problem that proposes among the above-mentioned background art.

The utility model provides a following technical scheme: the improved pipeline cleaning device for the silicon wafer cleaning line comprises a cleaning pool, wherein a drainage pool is fixedly arranged below the cleaning pool, an upper compression roller is movably sleeved above an inner cavity of the cleaning pool, a lower compression roller is movably sleeved below the cleaning pool, a water collecting pipe is fixedly arranged above a cavity of the cleaning pool, a water tank is fixedly arranged in front of the drainage pool, a water pump is fixedly arranged above the water tank in front of the drainage pool, a water inlet pipe is fixedly arranged below the water pump, a water feeding pipe is fixedly arranged above the water pump, a water dividing pipe is fixedly arranged at the other end of the water feeding pipe, a water knife is fixedly arranged on the right side of the water collecting pipe, a water outlet hole is fixedly arranged at the other end of the water knife, a support plate is fixedly arranged on the surface of the water feeding pipe, a belt wheel I is fixedly sleeved at the front end of the lower compression roller, a rack I is fixedly, the utility model discloses a washing machine, including frame I, belt wheel II, frame II, gear, water drainage pool, rack II, rack I, belt wheel II, water drainage pool, rack II, rack I, belt wheel II, water drainage pool, rack II, rack I, rack II, rack.

Carefully, the top surface of two sides is higher than the top surface of distributive pipe around wasing the pond, the right side of wasing the pond is higher than the top surface of holding down roller, the left side of wasing the pond is higher than the top surface of holding down roller, and the top surface of wasing the pond left side is less than the top surface of wasing the pond right side.

And carefully selecting, wherein the height value of the left side of the drainage pool is equal to the height value of the left side of the cleaning pool, and the length value of the drainage pool in the horizontal direction is equal to the length value of the cleaning pool in the horizontal direction.

And the centers of the water feeding pipe, the water distribution pipe, the water collecting pipe and the lower pressing roller are positioned on the same straight line, and the length value of the upper pressing roller is equal to that of the lower pressing roller in the cleaning pool.

Carefully, the water sword is installed four on the collector pipe altogether, and the interval value between every water sword equals, the contained angle of water sword and horizontal direction is forty-five degrees.

And carefully selecting, wherein the length value of the baffle is half of the length value of the left surface of the cleaning pool, and the length value of the rack is equal to that of the baffle.

Compared with the prior art, the utility model discloses possess following beneficial effect:

1. the utility model discloses a water pump sends into the water sword of fixed mounting on the collector pipe with the water in the water tank through flow pipe and distributive pipe in, clear up the upper surface of silicon chip through the delivery port, water after wasing the silicon chip upper surface falls into the inner chamber of wasing the pond, the top surface of lower compression roller is less than the two sides of controlling of wasing the pond, the bottom that makes the silicon chip of placing on the compression roller down soaks in the clear water, clear up the bottom surface of silicon chip, the scope that sprays has been guaranteed to the apopore of seting up on the water sword, the cleaning performance has been guaranteed.

2. The utility model discloses a set up a plurality of collector pipes, carry out multichannel clear water to the silicon chip and wash, guaranteed abluent effect, through the left side installation baffle at wasing the pond, two drive gear and rack meshes of motor, make the baffle realize the back-and-forth movement, wash the clear water in the pond and place a period back, will wash the clear water in the pond and emit through opening the baffle, make the device be in clean state, change the cleaning performance that the water in wasing the pond can improve the device simultaneously.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the structure of the present invention;

FIG. 3 is a schematic view of the utility model showing the water outlet hole;

FIG. 4 is a schematic view of the water jet scalpel of the present invention;

fig. 5 is a schematic view of the structure of the present invention.

In the figure: 1. a cleaning tank; 2. a drainage basin; 3. an upper compression roller; 4. a lower pressing roller; 5. a water tank; 6. a water pump; 7. a water inlet pipe; 8. a water supply pipe; 9. a water diversion pipe; 10. a water collection pipe; 11. water jet; 12. a water outlet hole; 13. a support plate; 14. a first belt wheel; 15. a first machine frame; 16. a first motor; 17. a second belt wheel; 18. a belt; 19. a baffle plate; 20. a second frame; 21. a second motor; 22. a gear; 23. a rack.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, an improved cleaning device for a pipeline of a silicon wafer cleaning line comprises a cleaning tank 1, wherein the top surfaces of the front and back surfaces of the cleaning tank 1 are higher than the top surface of a water diversion pipe 9, the right surface of the cleaning tank 1 is higher than the top surface of a lower compression roller 4, the left surface of the cleaning tank 1 is higher than the top surface of the lower compression roller 4, the top surface of the left surface of the cleaning tank 1 is lower than the top surface of the right surface of the cleaning tank 1, so that the liquid level of clean water in the cleaning tank 1 is above the top surface of the lower compression roller 4, the clean water in the cleaning tank 1 flows out through the left surface of the cleaning tank 1, a drainage tank 2 is fixedly arranged below the cleaning tank 1, the height value of the left surface of the drainage tank 2 is equal to the height value of the left surface of the cleaning tank 1, the length value of the drainage tank 2 in the horizontal direction is equal to the length value of the cleaning tank 1 in the horizontal direction, the cleaned silicon wafer is convenient to take out, a lower, an upper compression roller 3 is movably sleeved above an inner cavity of a cleaning pool 1, a lower compression roller 4 is movably sleeved below the cleaning pool 1, a water collecting pipe 10 is fixedly arranged above the cavity of the cleaning pool 1, a water tank 5 is fixedly arranged in front of a water discharging pool 2, a water pump 6 is fixedly arranged in front of the water discharging pool 2 and above the water tank 5, clear water is pressurized, water sprayed out of a water outlet hole 12 is guaranteed to have certain pressure, the cleaning effect is improved, a water inlet pipe 7 is fixedly arranged below the water pump 6, a water feeding pipe 8 is fixedly arranged above the water pump 6, the water feeding pipe 8, a water dividing pipe 9, the centers of the water collecting pipe 10 and the lower compression roller 4 are positioned on the same straight line, the length value of the upper compression roller 3 is equal to that of the lower compression roller 4 in the inner cavity of the cleaning pool 1, a plurality of water collecting pipes 10 are arranged, the upper compression roller 3 and the lower compression roller 4 carry out multi-channel clear water treatment on a silicon wafer, the right side of the water collecting pipe 10 is fixedly provided with four water knives 11, the water knives 11 are arranged on the water collecting pipe 10, the distance value between every two water knives 11 is equal, the included angle between each water knife 11 and the horizontal direction is forty-five degrees, the other end of each water knife 11 is fixedly provided with a water outlet 12, the spraying range of the plurality of water outlets 12 is increased, a water pump 6 sends water in a water tank 5 into the water knives 11 fixedly arranged on the water collecting pipe 10 through a water supply pipe 8 and a water distribution pipe 9, the water is sprayed onto the upper surfaces of the silicon wafers through the water outlets 12 to clean the upper surfaces of the silicon wafers, the surface of the water supply pipe 8 is fixedly provided with a supporting plate 13, the front end of the lower pressure roller 4 is fixedly sleeved with a belt wheel I14, the front side of the cleaning pool 1 is fixedly provided with a rack I15, the upper side of the rack I15 is fixedly provided with a motor I16, the output end of the motor I16 is fixedly sleeved with a, the belt 18 drives the belt wheel II 17 and the belt wheel I14 which are fixedly sleeved at the output end of the motor I16 to rotate, the lower pressing roller 4 rotates in the cleaning pool 1 to drive the silicon wafer to move leftwards, the right side of the cleaning pool 1 is connected with the baffle plate 19 in a sliding mode, the length value of the baffle plate 19 is half of the length value of the left side of the cleaning pool 1, the length value of the rack 23 is equal to that of the baffle plate 19, the front side of the drainage pool 2 is fixedly provided with the frame II 20, the motor II 21 is fixedly arranged above the frame II 20, the output end of the motor II 21 is fixedly sleeved with the gear 22, the left side of the baffle plate 19 is fixedly provided with the rack 23, the motor II 21 drives the gear 22 to be meshed with the rack 23, the baffle plate 19 is enabled to move forwards and backwards, clean water in the cleaning pool 1 is placed for a period of time, the clean water in the cleaning.

The working principle is as follows: when the silicon wafer cleaning device is used, a silicon wafer is placed above the lower pressing roller 4 from the right side of the device, the belt pulley II 17 and the belt pulley I14 fixedly sleeved and connected at the output end of the motor I16 are driven to rotate through the belt 18, the lower pressing roller 4 rotates in the cleaning pool 1 to drive the silicon wafer to move leftwards, the upper pressing roller 3 clamps the silicon wafer to ensure the position of the silicon wafer, the water pump 6 sends water in the water tank 5 into the water knife 11 fixedly arranged on the water collecting pipe 10 through the water sending pipe 8 and the water dividing pipe 9, the water is sprayed to the upper surface of the silicon wafer through the water outlet hole 12 to clean the upper surface of the silicon wafer, cleaned clean water falls into an inner cavity of the cleaning pool 1, the top surface of the lower pressing roller 4 is lower than the left surface and the right surface of the cleaning pool 1, the bottom of the silicon wafer placed on the lower pressing roller 4 is soaked in the clean water to clean the bottom surface of the silicon wafer, clear water in the cleaning pool 1 is placed for a period of time, and clear water in the cleaning pool 1 is discharged by opening the baffle 19, falls into the inner cavity of the drainage pool 2 and is discharged through the drainage pool 2.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Simultaneously in the utility model discloses an in the drawing, fill the pattern and just do not do any other injecions for distinguishing the picture layer.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Pipeline improvement belt cleaning device of silicon chip cleaning line, including wasing pond (1), its characterized in that: the automatic water-saving washing machine is characterized in that a drainage pool (2) is fixedly arranged below the washing pool (1), an upper compression roller (3) is sleeved above an inner cavity of the washing pool (1) in a movable manner, a lower compression roller (4) is sleeved below the washing pool (1) in a movable manner, a water collecting pipe (10) is fixedly arranged above a cavity of the washing pool (1), a water tank (5) is fixedly arranged in front of the drainage pool (2), a water pump (6) is fixedly arranged above the water tank (5) in front of the drainage pool (2), a water inlet pipe (7) is fixedly arranged below the water pump (6), a water supply pipe (8) is fixedly arranged above the water pump (6), a water dividing pipe (9) is fixedly arranged at the other end of the water supply pipe (8), a water knife (11) is fixedly arranged at the right side of the water collecting pipe (10), a water outlet hole (12) is fixedly arranged at the, a support plate (13) is fixedly arranged on the surface of the water feeding pipe (8), a first belt wheel (14) is fixedly sleeved at the front end of the lower pressing roller (4), a first rack (15) is fixedly arranged in front of the cleaning pool (1), a first motor (16) is fixedly arranged above the first rack (15), the output end of the first motor (16) is fixedly sleeved with a second belt wheel (17), the surfaces of the first belt wheel (14) and the second belt wheel (17) are movably connected with a belt (18), a baffle plate (19) is connected to the right side of the cleaning pool (1) in a sliding manner, a second rack (20) is fixedly arranged in front of the drainage pool (2), the upper portion of the second rack (20) is fixedly provided with a second motor (21), the output end of the second motor (21) is fixedly sleeved with a gear (22), and the left surface of the baffle (19) is fixedly provided with a rack (23).

2. The improved cleaning device for the pipeline of the silicon wafer cleaning line according to claim 1, wherein: the top surface of two sides is higher than the top surface of distributive pipe (9) around wasing pond (1), the right side of wasing pond (1) is higher than the top surface of lower compression roller (4), the left side of wasing pond (1) is higher than the top surface of lower compression roller (4), and the top surface of wasing pond (1) left side is less than the top surface of wasing pond (1) right side.

3. The improved cleaning device for the pipeline of the silicon wafer cleaning line according to claim 1, wherein: the height value of the left side of the drainage pool (2) is equal to the height value of the left side of the cleaning pool (1), and the length value of the drainage pool (2) in the horizontal direction is equal to the length value of the cleaning pool (1) in the horizontal direction.

4. The improved cleaning device for the pipeline of the silicon wafer cleaning line according to claim 1, wherein: the center of the water feeding pipe (8), the water distribution pipe (9), the water collection pipe (10) and the lower compression roller (4) is positioned on the same straight line, and the length value of the upper compression roller (3) is equal to that of the lower compression roller (4) in the inner cavity of the cleaning pool (1).

5. The improved cleaning device for the pipeline of the silicon wafer cleaning line according to claim 1, wherein: the water jet cutter is characterized in that the water jet cutters (11) are arranged on the water collecting pipe (10) in four, the distance value between each water jet cutter (11) is equal, and the included angle between each water jet cutter (11) and the horizontal direction is forty-five degrees.

6. The improved cleaning device for the pipeline of the silicon wafer cleaning line according to claim 1, wherein: the length value of the baffle (19) is half of the length value of the left surface of the cleaning pool (1), and the length value of the rack (23) is equal to the length value of the baffle (19).