CN210694763U - Circuit board heat dissipation mechanism - Google Patents
Circuit board heat dissipation mechanism Download PDFInfo
- Publication number
- CN210694763U CN210694763U CN201921952762.6U CN201921952762U CN210694763U CN 210694763 U CN210694763 U CN 210694763U CN 201921952762 U CN201921952762 U CN 201921952762U CN 210694763 U CN210694763 U CN 210694763U
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- Prior art keywords
- heat dissipation
- dissipation mechanism
- heat
- circuit board
- fan
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 103
- 230000007246 mechanism Effects 0.000 title claims abstract description 70
- 241000883990 Flabellum Species 0.000 claims description 12
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims 1
- 230000002349 favourable effect Effects 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 14
- 230000002411 adverse Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
The utility model discloses a circuit board heat dissipation mechanism, including heat dissipation mechanism's main part, the upper end surface of heat dissipation mechanism's main part is provided with the heat exchanger that looses, the inside of heat dissipation mechanism's main part is provided with the conducting strip, the upper end surface of conducting strip is provided with the pad that collects heat, the lower extreme surface of conducting strip is provided with down the pad that collects heat, the lower extreme surface of heat dissipation mechanism's main part is provided with the housing, the inside of housing is provided with the fin, the both sides of heat dissipation mechanism's main part all are provided with fastening device. Circuit board heat dissipation mechanism, be equipped with heat exchanger and fastening device that dispels the heat, can improve the heat-sinking capability of heat dissipation mechanism, discharge a large amount of heats on the circuit board to improve the life of circuit board, and can fix the circuit board better on heat dissipation mechanism, prevent not hard up, going on of being convenient for installation is favorable to people to use, brings better use prospect.
Description
Technical Field
The utility model relates to a circuit board heat dissipation mechanism field, in particular to circuit board heat dissipation mechanism.
Background
The circuit board plays a role of connecting elements in the electrical equipment, can also play a role of controlling circuits in the electrical equipment, can form an integrated circuit in the electrical equipment, and in order to prolong the service life of the circuit board, the circuit board heat dissipation mechanism is produced.
The existing heat dissipation mechanism has certain disadvantages when in use, firstly, the heat dissipation performance is poor, the heat dissipation efficiency is low, the service life of a circuit board cannot be prolonged to a large extent, certain adverse effects are caused, secondly, the circuit board cannot be clamped and fixed, the circuit board is prone to loosening, the heat dissipation effect is affected, certain adverse effects are caused, certain effects are caused to people in the using process, and therefore the circuit board heat dissipation mechanism is provided.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides circuit board heat dissipation mechanism can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the circuit board heat dissipation mechanism comprises a heat dissipation mechanism body, wherein a heat dissipation cover is arranged on the outer surface of the upper end of the heat dissipation mechanism body, a heat conducting fin is arranged inside the heat dissipation mechanism body, an upper heat collecting pad is arranged on the outer surface of the upper end of the heat conducting fin, a lower heat collecting pad is arranged on the outer surface of the lower end of the heat conducting fin, an outer housing is arranged on the outer surface of the lower end of the heat dissipation mechanism body, heat radiating fins are arranged inside the outer housing, and fastening mechanisms are arranged on two sides of the heat dissipation mechanism body.
The fan mainly plays a role in heat dissipation.
The bolt and the fastener mainly play the roles of fastening and fixing.
The heat conducting sheet mainly plays a role in heat conduction.
The radiating fins mainly play a role in radiating heat.
Preferably, the heat dissipation cover includes heat dissipation circle, fan and flabellum, the equal fixed mounting of both sides surface of heat dissipation cover has the fan, the front end surface of fan is provided with the flabellum, the front end surface of heat dissipation cover is provided with the heat dissipation circle.
Preferably, the fastening mechanism comprises bolts, a fixed rod, a fastener and a movable rod, the bolts are arranged on the outer surfaces of the two sides of the fastening mechanism, the movable rod is arranged on the outer surface of the rear end of the fastening mechanism, the fixed rod is arranged on the outer surface of one end of the movable rod, and the fastener is arranged on the outer surface of the front end of the fixed rod.
Preferably, be provided with the transmission shaft between fan and the flabellum, the front end surface of fan passes through the rear end surface swing joint of transmission shaft and flabellum, it pastes the layer to be provided with between heat dissipation cover and the heat dissipation mechanism main part, the lower extreme surface of heat dissipation cover is through pasting the upper end surface fixed connection of layer and heat dissipation mechanism main part.
Preferably, a thread groove is formed between the fixing rod and the fastener, and the outer surface of the front end of the fixing rod is fixedly connected with the outer surface of the front end of the fastener through the thread groove.
Preferably, a clamping groove is formed between the heat dissipation mechanism main body and the heat dissipation fins, and the inner surface of the lower end of the heat dissipation mechanism main body is fixedly connected with the outer surface of the upper end of each heat dissipation fin through the clamping groove.
Compared with the prior art, the utility model discloses following beneficial effect has: this circuit board heat dissipation mechanism, heat exchanger through the setting, can be with the heat discharge part that gives off on the circuit board through the heat dissipation circle on the heat exchanger, then discharge the heat through the flabellum on the fan, can play dual radiating effect, thereby improve the radiating effect of heat dissipation mechanism main part, increase the life of circuit board, be favorable to people to use, fastening device through the setting, can be when the circuit board is installed, adjust the position of movable rod on the dead lever, fix the position of pulling out through the fastener, then with fastening device card at the avris of circuit board, then fix it through the bolt, can play the screens, fixed effect, prevent that the circuit board is not hard up, be favorable to people to use, whole circuit board heat dissipation mechanism simple structure, and convenient for operation, the effect of use is better for the traditional mode.
Drawings
Fig. 1 is the overall structure schematic diagram of the circuit board heat dissipation mechanism of the present invention.
Fig. 2 is a schematic structural view of the heat dissipation cover 2 in fig. 1 of the circuit board heat dissipation mechanism of the present invention.
Fig. 3 is a schematic diagram of the internal structure of the fastening mechanism 3 in fig. 1 of the circuit board heat dissipation mechanism of the present invention.
Description of the reference numerals
1. A heat dissipation mechanism main body; 2. a heat dissipation cover; 201. a heat dissipation ring; 202. a fan; 203. a fan blade; 3. a fastening mechanism; 301. a bolt; 302. fixing the rod; 303. a fastener; 304. a movable rod; 4. an upper heat collecting pad; 5. a heat conductive sheet; 6. a lower heat collecting pad; 7. a heat sink; 8. an outer casing.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1-3, the circuit board heat dissipation mechanism includes a heat dissipation mechanism body 1, a heat dissipation cover 2 is disposed on an upper outer surface of the heat dissipation mechanism body 1, a heat conducting fin 5 is disposed inside the heat dissipation mechanism body 1, an upper heat collecting pad 4 is disposed on an upper outer surface of the heat conducting fin 5, a lower heat collecting pad 6 is disposed on a lower outer surface of the heat conducting fin 5, an outer cover 8 is disposed on a lower outer surface of the heat dissipation mechanism body 1, a heat dissipation fin 7 is disposed inside the outer cover 8, and fastening mechanisms 3 are disposed on two sides of the heat dissipation mechanism body 1.
Further, the heat exchanger 2 includes heat dissipation ring 201, fan 202 and flabellum 203, the equal fixed mounting of both sides surface of heat exchanger 2 has fan 202, the front end surface of fan 202 is provided with flabellum 203, the front end surface of heat exchanger 2 is provided with heat dissipation ring 201, can be with the heat discharge part that gives off on the circuit board through heat dissipation ring 201 on the heat exchanger 2, then discharge the heat through flabellum 203 on the fan 202, can play dual radiating effect, thereby improve the radiating effect of heat dissipation mechanism main part 1, increase the life of circuit board, be favorable to people to use.
Further, fastening device 3 includes bolt 301, dead lever 302, fastener 303 and movable rod 304, fastening device 3's both sides surface all is provided with bolt 301, fastening device 3's rear end surface is provided with movable rod 304, the one end surface of movable rod 304 is provided with dead lever 302, the front end surface of dead lever 302 is provided with fastener 303, can be in the circuit board installation, adjust the position of movable rod 304 on dead lever 302, fix the position of pulling out through fastener 303, then block fastening device 3 at the avris of circuit board, then fix it through bolt 301, can play the screens, fixed effect, prevent that the circuit board is not hard up, be favorable to people to use.
Furthermore, be provided with the transmission shaft between fan 202 and the flabellum 203, the front end surface of fan 202 passes through the rear end surface swing joint of transmission shaft and flabellum 203, be provided with between heat exchanger 2 and the heat dissipation mechanism main part 1 and paste the layer, the lower extreme surface of heat exchanger 2 is connected through pasting the upper end surface fixed connection of layer and heat dissipation mechanism main part 1, can discharge the heat on the circuit board, improves radiating efficiency, increases the life of circuit board.
Further, a thread groove is formed between the fixed rod 302 and the fastener 303, and the outer surface of the front end of the fixed rod 302 is fixedly connected with the outer surface of the front end of the fastener 303 through the thread groove, so that the position of the movable rod 304 can be adjusted and fixed.
Furthermore, a clamping groove is formed between the heat dissipation mechanism main body 1 and the heat dissipation fins 7, and the inner surface of the lower end of the heat dissipation mechanism main body 1 is fixedly connected with the outer surface of the upper ends of the heat dissipation fins 7 through the clamping groove, so that the heat dissipation fins 7 can be conveniently installed.
The utility model discloses theory of operation and use flow: when in use, the circuit board can be arranged on the heat dissipation cover 2, in order to improve the heat dissipation efficiency, the heat dissipated from the circuit board can be discharged to a part through the heat dissipation ring 201 on the heat dissipation cover 2, then the heat is discharged through the fan blades 203 on the fan 202, and the double heat dissipation effect can be achieved, so that the heat dissipation effect of the heat dissipation mechanism main body 1 is improved, the service life of the circuit board is prolonged, then the heat is absorbed to a part through the upper heat collection pad 4, the heat is conducted to the lower heat collection pad 6 through the heat conducting fins 5, and then the heat is discharged through the heat dissipation fins 7, the accumulation of the heat on the circuit board can be reduced, in order to prevent the circuit board from loosening in the installation process, the position of the movable rod 304 on the fixed rod 302 can be adjusted in the installation of the circuit board, the pulled position is fixed through the fastener 303, and then the, then fix it through bolt 301, can play screens, fixed effect, prevent that the circuit board is not hard up, be favorable to people to use.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a circuit board heat dissipation mechanism, includes heat dissipation mechanism main part (1), its characterized in that: the heat dissipation mechanism is characterized in that a heat dissipation cover (2) is arranged on the outer surface of the upper end of the heat dissipation mechanism body (1), a heat conducting sheet (5) is arranged inside the heat dissipation mechanism body (1), an upper heat collecting pad (4) is arranged on the outer surface of the upper end of the heat conducting sheet (5), a lower heat collecting pad (6) is arranged on the outer surface of the lower end of the heat conducting sheet (5), an outer housing (8) is arranged on the outer surface of the lower end of the heat dissipation mechanism body (1), cooling fins (7) are arranged inside the outer housing (8), and fastening mechanisms (3) are arranged on two sides of the heat dissipation mechanism body (.
2. The circuit board heat dissipation mechanism of claim 1, wherein: the heat dissipation cover (2) comprises a heat dissipation ring (201), a fan (202) and fan blades (203), the fans (202) are fixedly mounted on the outer surfaces of the two sides of the heat dissipation cover (2), the fan blades (203) are arranged on the outer surface of the front end of each fan (202), and the heat dissipation ring (201) is arranged on the outer surface of the front end of the heat dissipation cover (2).
3. The circuit board heat dissipation mechanism of claim 1, wherein: fastening device (3) include bolt (301), dead lever (302), fastener (303) and movable rod (304), the both sides surface of fastening device (3) all is provided with bolt (301), the rear end surface of fastening device (3) is provided with movable rod (304), the one end surface of movable rod (304) is provided with dead lever (302), the front end surface of dead lever (302) is provided with fastener (303).
4. The heat dissipating mechanism of a circuit board of claim 2, wherein: be provided with the transmission shaft between fan (202) and flabellum (203), the rear end surface swing joint of front end surface through transmission shaft and flabellum (203) of fan (202), be provided with between heat dissipation cover (2) and the heat dissipation mechanism main part (1) and paste the layer, the lower extreme surface of heat dissipation cover (2) is through pasting the upper end surface fixed connection of layer and heat dissipation mechanism main part (1).
5. A circuit board heat dissipating mechanism according to claim 3, wherein: a thread groove is formed between the fixing rod (302) and the fastener (303), and the outer surface of the front end of the fixing rod (302) is fixedly connected with the outer surface of the front end of the fastener (303) through the thread groove.
6. The circuit board heat dissipation mechanism of claim 1, wherein: a clamping groove is formed between the heat dissipation mechanism main body (1) and the heat dissipation fins (7), and the inner surface of the lower end of the heat dissipation mechanism main body (1) is fixedly connected with the outer surface of the upper end of each heat dissipation fin (7) through the clamping groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921952762.6U CN210694763U (en) | 2019-11-13 | 2019-11-13 | Circuit board heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921952762.6U CN210694763U (en) | 2019-11-13 | 2019-11-13 | Circuit board heat dissipation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210694763U true CN210694763U (en) | 2020-06-05 |
Family
ID=70903991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921952762.6U Active CN210694763U (en) | 2019-11-13 | 2019-11-13 | Circuit board heat dissipation mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210694763U (en) |
-
2019
- 2019-11-13 CN CN201921952762.6U patent/CN210694763U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240513 Address after: Room 4-6, Building B3, Lunan Big Data Center, 2666 Changbaishan Road, Xingcheng Street, High-tech Zone, Zaozhuang City, Shandong Province, 277000 Patentee after: Shandong Feishida Intelligent Technology Development Co.,Ltd. Country or region after: China Address before: 516000 No. 30, qiuyeyuan Road, Longxi street, BOLUO County, Huizhou City, Guangdong Province Patentee before: Huizhou yongshenglong Electronic Technology Co.,Ltd. Country or region before: China |