CN210694707U - Shielding heat abstractor and unmanned aerial vehicle - Google Patents

Abstract

The utility model provides a shielding heat abstractor and unmanned aerial vehicle, this shielding heat abstractor include shield cover, fin group and spacing portion. The shielding cover is used for carrying out electromagnetic shielding on the first circuit board arranged on the first side of the shielding cover and is provided with an accommodating space for accommodating the electrical elements of the first circuit board; the fin group is arranged on the surface of the second side of the shielding cover and comprises a first radiating fin and a second radiating fin, and the length extending direction of the first radiating fin is different from that of the second radiating fin so as to change the airflow direction from the first radiating fin, thereby accelerating the flow velocity of the airflow and accelerating the radiating speed; the surface of the second side of the shielding cover is also provided with a limiting part for limiting a second circuit board arranged on the second side of the shielding cover; the shielding cover, the fin group and the limiting part are integrally arranged. This shielding heat abstractor and unmanned aerial vehicle can improve the transportation of second circuit board or the reliability in the use.

Description

Shielding heat abstractor and unmanned aerial vehicle

Technical Field

The utility model relates to an aircraft technical field especially relates to a shielding heat abstractor and unmanned aerial vehicle.

Background

The drone usually has a circuit board on which inertial navigation electrical components are located. This circuit board generally is fixed in unmanned aerial vehicle's frame through having soft or elastic shock attenuation ball, and at unmanned aerial vehicle transportation or flight in-process, this circuit board takes place to rock easily, causes the easy damage of important electrical components on the circuit board, has reduced the reliability of circuit board.

SUMMERY OF THE UTILITY MODEL

The utility model provides a shielding heat abstractor and unmanned aerial vehicle aims at reducing or avoiding the circuit board to take place to rock at shielding heat abstractor transportation or removal in-process to avoid the important electrical components on the electric circuit board because of rocking the problem of taking place to damage, improved the reliability of circuit board.

The utility model provides a shielding heat abstractor, include:

the shielding cover is used for electromagnetically shielding the first circuit board arranged on the first side of the shielding cover and is provided with an accommodating space for accommodating electrical elements of the first circuit board;

the fin group is arranged on the surface of the second side of the shielding case and comprises a first radiating fin and a second radiating fin, and the length extending direction of the first radiating fin is different from that of the second radiating fin so as to change the airflow direction from the first radiating fin, so that the flow velocity of the airflow is accelerated to accelerate the radiating speed;

the surface of the second side of the shielding cover is also provided with a limiting part for limiting a second circuit board arranged on the second side of the shielding cover; the shielding cover, the fin group and the limiting part are integrally arranged.

The utility model also provides an unmanned aerial vehicle, include:

a frame;

the first circuit board is arranged on the rack;

the second circuit board is arranged on the rack;

the shielding heat dissipation device is arranged on the rack and positioned between the first circuit board and the second circuit board.

The embodiment of the utility model provides a shielding heat abstractor and unmanned aerial vehicle, through set up fin group in the shield cover keep away from the one side of first circuit board on the surface, the shield cover can carry out the electromagnetic shield to the electrical components on the first circuit board, fin group can conduct shield cover surface and heat on every side, spacing portion can carry on spacingly to installing in the second circuit board of the one side that the shield cover kept away from the first circuit board, thereby compromise the electromagnetic shield, the radiating effect with to the second circuit board spacing, avoid the second circuit board to take place to rock and cause the easy problem of damaging of important electrical components on the second circuit board at shielding heat abstractor transportation or flight in-process, the reliability of second circuit board use and transportation has been improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without any creative effort.

Fig. 1 is a schematic view of an angle structure of a shielding heat dissipation device according to an embodiment of the present invention;

FIG. 2 is a schematic view of the heat sink shielding device of FIG. 1 at another angle;

fig. 3 is a schematic structural diagram of a first circuit board according to an embodiment of the present invention;

FIG. 4 is an enlarged partial schematic view of the shielded heat sink of FIG. 2 at A;

fig. 5 is a schematic view of a partial structure of an unmanned aerial vehicle according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of an unmanned aerial vehicle according to an embodiment of the present invention.

Description of reference numerals:

10. a shielding heat sink;

100. a shield case; 110. a plate body; 111. a first side; 112. a second side; 113. a first surface; 114. a second surface; 120. a boundary portion; 130. a spacer section; 140. an accommodating space; 141. a shielded region; 141a, a first shielding region; 141b, a second shielding region; 141c, a third shielding region;

200. a set of fins; 210. a first heat radiation fin; 220. a second heat radiation fin; 221. a first fin portion; 222. a second fin portion;

300. a limiting part; 310. a limiting body; 320. a limiting plane part; 330. reinforcing ribs; 400. a heat transfer portion;

20. a first circuit board; 21. a substrate; 22. a spacing region; 23. an electrical component; 30. a second circuit board; 40. a frame; 50. a shock absorbing ball.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be further understood that the term "and/or" as used in the specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.

Referring to fig. 1 and 2, an embodiment of the present invention provides a shielding heat dissipation device 10 including a shielding can 100, a fin set 200, and a limiting portion 300.

Referring to fig. 1 to 3, the shielding case 100 is used for electromagnetically shielding the first circuit board 20 disposed on the first side 111 of the shielding case 100. Specifically, referring to fig. 3, the first circuit board 20 has a substrate 21, a spacing region 22 disposed on the substrate 21, and an electrical component 23 disposed on the spacing region 22, and the shielding cover 100 has a receiving space 140 for receiving the electrical component 23 of the first circuit board 20. The number and arrangement of the spacing regions 22 may be designed according to actual needs, and the embodiments of the present invention are not limited thereto.

In some embodiments, the shielding case 100 is made of a conductive material, and utilizes absorption action (eddy current loss), reflection action (interface reflection of the electromagnetic signal between the shielding case 100 and air) and cancellation action (electromagnetic induction generates a reverse electromagnetic field on the shielding case 100, which can cancel part of the electromagnetic signal) of the conductive metal material on the electromagnetic signal, so as to reduce or eliminate electromagnetic interference of the electromagnetic signal generated by the electrical component 23 on the first circuit board 20 on the external circuit or electromagnetic interference of the external electromagnetic signal on the electrical component 23 on the first circuit board 20. It is understood that, in other embodiments, a plastic member coated with an electromagnetic signal shielding layer or other materials having an electromagnetic signal shielding effect may also be used for the shielding can 100, and the embodiments of the present invention are not limited thereto.

In some embodiments, the shielding can 100 is a cover made of a heat conductive material, so that heat generated by the electrical components 23 on the first circuit board 20 can be conducted to the fin set 200 or to the second side 112 of the shielding can 100 through the shielding can 100 and dissipated through the fin set 200, thereby more effectively reducing the temperature of the electrical components 23 on the first circuit board 20.

In some embodiments, the heat conduction efficiency of the shielding can 100 is less than that of the fin set 200, so that heat generated by electrical components on the first circuit board 20 can be conducted to the fin set 200 through the shielding can 100 and then dissipated through the fin set 200, thereby further effectively reducing the temperature of the electrical components 23 on the first circuit board 20.

Referring to fig. 1 and 2, the shield case 100 includes a plate body 110, a boundary portion 120, and a spacer portion 130. The plate body 110 has two opposite sides, which are respectively defined as a first side 111 and a second side 112. A surface of the first side 111 of the plate body 110 is defined as a first surface 113, and a surface of the second side 112 of the plate body 110 is defined as a second surface 114.

Referring to fig. 1, the boundary portion 120 is disposed on the first surface 113 of the board body 110, and the boundary portion 120 is disposed along the periphery of the first circuit board 20, such that the boundary portion 120 surrounds the periphery of the spacing region 22. The periphery of the first surface 113 of the board body 110 faces and the boundary portion 120 and the board body 110 enclose to form an accommodating space 140, so that the spacing area 22 on the first circuit board 20 is located in the accommodating space 140. The accommodating space 140 and the first circuit board 20 are located on the same side of the board body 110, that is, both located on the first side 111 of the board body 110.

Referring to fig. 1, the spacing portion 130 is disposed on the first surface 113 of the board body 110 and located in the boundary portion 120 to space the accommodating space 140 to form a plurality of shielding regions 141. The shield region 141 can house the partition regions 22 such that the partition 130 is provided between the partition regions 22 in a blocking manner. Therefore, the shielding case 100 including the plate body 110, the boundary portion 120 and the spacing portion 130 can form a blocking effect around each of the spacing regions 22 of the first circuit board 20, thereby effectively preventing interference of electromagnetic waves.

Specifically, in some embodiments, the first circuit board 20 is a circuit board of a camera, and the surface of the shield case 100 adjacent to the first circuit board 20, i.e., the first surface 113, is provided with three shielding regions 141, which are respectively defined as a first shielding region 141a, a second shielding region 141b, and a third shielding region 141 c. Of course, in other embodiments, the number of the shielding regions 141 may be designed to be two, four, five, or more.

It will be understood that the number and arrangement of the spacers 130 can be set according to actual requirements. Specifically, the number and arrangement of the spacers 130 correspond to the number and arrangement of the spacer regions 22. Illustratively, the number of the spacing portions 130 and the spacing regions 22 is three, but may be two, four, five or more.

Referring to fig. 2, the fin set 200 is disposed on the surface of the second side 112 of the mask 100. The fin assembly 200 may be integrally formed with the plate body 110 in any suitable manner, for example, the fin assembly 200 is welded to the second surface 114 of the plate body 110.

Referring to fig. 2 and 4, the fin set 200 includes a first heat sink fin 210 and a second heat sink fin 220. The length extending direction of the first heat dissipating fins 210 is different from the length extending direction of the second heat dissipating fins 220, so as to change the airflow direction from the first heat dissipating fins 210, thereby accelerating the airflow velocity, further accelerating the heat dissipating speed, reducing the temperature on the surface of the fin group 200, and finally accelerating the reduction of the temperature of the shielding case 100 and the electrical components around the shielding case 100, and ensuring the working stability of the electrical components. The number and the arrangement of the first heat dissipation fins 210 and the number and the arrangement of the second heat dissipation fins 220 can be designed according to actual requirements, and the embodiment of the present invention is not limited thereto.

In some embodiments, the number of the first heat dissipation fins 210 is greater than the number of the second heat dissipation fins 220, that is, the first heat dissipation fins 210 and the second heat dissipation fins 220 are arranged in a many-to-one manner, and an airflow channel is formed between adjacent first heat dissipation fins 210, so that the heat of the fin group 200 and the shielding case 100 is taken out by using airflow in the airflow channel, the temperature of the surfaces of the fin group 200 and the shielding case 100 is reduced at an accelerated rate, and finally, the temperature of the electrical component on the first circuit board 20 is reduced at an accelerated rate, and the stability of the operation of the electrical component is ensured.

Referring to fig. 5, the second side 112 of the shielding can 100 is further provided with a second circuit board 30. In some embodiments, the airflow flowing out between the first heat dissipating fins 210 can change the flow direction through the second heat dissipating fins 220, and the second heat dissipating fins 220 can guide the airflow to the second circuit board 30, so as to take away the heat of the electrical components on the second circuit board 30 by using the airflow, thereby accelerating the reduction of the temperature on the surface of the second circuit board 30 and ensuring the stability of the operation of the electrical components.

Referring to fig. 2, in other embodiments, the first heat dissipation fins 210 and the second heat dissipation fins 220 are disposed in a one-to-one correspondence manner, that is, the number of the first heat dissipation fins 210 is the same as the number of the second heat dissipation fins 220, so that the airflow flowing out from between two adjacent first heat dissipation fins 210 enters between two corresponding adjacent second heat dissipation fins 220.

In some embodiments, the inclination directions of the first heat dissipation fins 210 and the second heat dissipation fins 220, and the included angle therebetween may be designed according to actual requirements, and the embodiments of the present invention are not limited thereto.

Referring to fig. 4, in some embodiments, the maximum extension of the first heat dissipation fins 210 along the predetermined extension direction is greater than the maximum extension of the second heat dissipation fins 220 along the predetermined extension direction, which is the direction in which the fin set 200 extends away from the shielding can 100. Referring to fig. 2, the X direction is a length extending direction of the shield can 100, the Y direction is a width extending direction of the shield can 100, and the Z direction is a thickness extending direction of the shield can 100. Wherein the preset extending direction is a Z direction.

Illustratively, the height of the first cooling fin 210 is the extension of the first cooling fin 210 along the Z-direction. The first circuit board 20 has more electrical components at a portion corresponding to the maximum height of the first radiator fins 210, and the first circuit board 20 has relatively less electrical components at a portion corresponding to the second radiator fins 220. The maximum height of the first heat dissipation fins 210 is set to be greater than the maximum height of the second heat dissipation fins 220, so that the heat dissipation area can be increased, thereby ensuring effective heat dissipation of electrical components at corresponding positions on the first circuit board 20 and accelerating the reduction of the temperature on the surface of the first circuit board 20.

Referring to fig. 4, in some embodiments, the at least one second heat fin 220 includes a first fin portion 221 and a second fin portion 222. The first fin portion 221 and the first heat dissipation fin 210 have different length extending directions. The second fin portion 222 is connected to an end of the first fin portion 221 away from the first heat sink fin 210.

The maximum extension of the first fin portion 221 along the preset extension direction is greater than the maximum extension of the second fin portion 222 along the preset extension direction, which is a direction in which the fin group 200 extends away from the shielding can 100. Specifically, the preset extending direction is a Z direction in fig. 2, i.e., a height extending direction of the first fin portion 221.

Specifically, the first circuit board 20 has more electrical components at a portion corresponding to the first fin portion 221, and the first circuit board 20 has relatively less electrical components at a portion corresponding to the second fin portion 222. The maximum height of the first fin portion 221 is set to be greater than the maximum height of the second fin portion 222, so that the heat dissipation area can be increased, thereby ensuring effective heat dissipation of electrical components at corresponding positions on the first circuit board 20 and accelerating reduction of the temperature of the surface of the first circuit board 20.

Referring to fig. 4, in some embodiments, the maximum extension of the first heat dissipation fin 210 along the predetermined extension direction is greater than or equal to the maximum extension of the first fin portion 221 along the predetermined extension direction. Specifically, the first circuit board 20 has more electrical components at the portions corresponding to the first fin portions 221 and the first heat dissipation fins 210, and the first circuit board 20 has relatively less electrical components at the portions corresponding to the second fin portions 222. The maximum height of the first radiator fins 210 is greater than or equal to the maximum height of the first fin portions 221, and the maximum height of the first radiator fins 210 is greater than the maximum height of the second fin portions 222. The shielding heat dissipation device 10 with such a structure can increase the heat dissipation area, thereby ensuring effective heat dissipation of the electrical components at the corresponding positions on the first circuit board 20 and accelerating the reduction of the temperature on the surface of the first circuit board 20.

Referring to fig. 2 and 4, in some embodiments, the first heat dissipation fins 210 are connected to the second heat dissipation fins 220 to prevent the air flow from flowing away at the connection positions of the first heat dissipation fins 210 and the second heat dissipation fins 220, so that the air flow along the guiding direction of the second heat dissipation fins 220 is reduced, thereby improving the heat dissipation effect.

Referring to fig. 2 and 4, the position-limiting portion 300 is disposed on the second surface 114 of the shielding can 100 and is used for limiting the position of the second circuit board 30 mounted on the second side 112 of the shielding can 100. The number of the limiting parts 300 may be set according to actual requirements, for example, one or more, and the number of the limiting parts may be two, three or more.

It can be understood that the arrangement of the limiting portion 300 can be set according to actual requirements as long as the second circuit board 30 can be limited. In some embodiments, the plurality of limiting portions 300 are disposed at intervals in the width direction of the shield case 100. Specifically, the plurality of limiting portions 300 are arranged at intervals along the Y direction, so as to prevent the second circuit board 30 from moving along the X direction to cause the problem that important electrical components on the second circuit board 30 are easily damaged, thereby improving the reliability of the use and transportation of the second circuit board 30.

Referring to fig. 2, in some embodiments, the limiting portion 300 is disposed between two adjacent second heat dissipation fins 220, so that the shielding heat dissipation device 10 can effectively dissipate heat on the surfaces of the second circuit board 30 and the shielding cover 100 and limit the second circuit board 30.

Referring to fig. 2 and 4, in some embodiments, two adjacent second heat dissipation fins 220 are connected to the limiting portion 300 to increase the strength of the limiting portion 300.

Referring to fig. 2 and 4, in some embodiments, the extension of the position-limiting portion 300 along the predetermined extending direction is greater than the extension of the second heat dissipation fin 220 along the predetermined extending direction. The predetermined extending direction is a direction in which the fin set 200 extends away from the shielding can 100. Specifically, the preset extending direction is a Z direction in fig. 2. In the shielding heat sink 10 with the above structure, on one hand, the second heat dissipation fins 220 can dissipate heat on the surface of the second circuit board 30. On the other hand, the limiting portion 300 can limit the second circuit board 30, and prevent the electrical components on the second circuit board 30 from being damaged due to shaking, thereby improving the safety of the second circuit board 30 in use and transportation.

The position-limiting portion 300 may be any suitable position-limiting structure as long as it can limit the second circuit board 30, for example, a protruding structure protruding from the board body 110. Referring to fig. 4, in some embodiments, the position-limiting portion 300 includes a position-limiting body 310, a position-limiting plane portion 320, and a rib 330. The limiting body 310 is disposed on the surface of the second side 112 of the shielding shell 100, i.e., on the second surface 114 of the plate 110. The check body 310 extends in the Z direction in fig. 2.

Referring to fig. 4, the limiting plane portion 320 is disposed at one side of the limiting body 310 for preventing the second circuit board 30 from moving along the length direction of the shielding case 100. Specifically, the limiting plane portion 320 is disposed on a side of the limiting body 310 departing from the first heat sink 210 along the Z direction, so as to prevent the second circuit board 30 from moving along the Z direction, and further protect electrical components on the second circuit board 30.

Referring to fig. 4, the stiffener 330 is disposed on a side of the limiting body 310 away from the limiting plane 320. That is, the reinforcing ribs 330 and the limiting plane part 320 are disposed on two opposite sides of the limiting body 310 along the Z direction, and are used for reinforcing the strength of the limiting body 310. Specifically, the structure and arrangement of the reinforcing ribs 330 can be designed according to actual requirements. Illustratively, the reinforcing rib 330 extends along a predetermined extending direction, which is a direction in which the fin set 200 extends away from the shielding can 100, that is, the reinforcing rib 330 extends along the Z direction. It is understood that in other embodiments, the reinforcing rib 330 may be omitted, and the embodiments of the present invention are not limited thereto.

In some embodiments, the shielding can 100, the fin set 200 and the limiting portion 300 are integrally disposed, so as to reduce the assembly process, thereby improving the production efficiency of the shielding heat sink 10. It is understood that, in other embodiments, the shielding can 100, the fin group 200 and the limiting portion 300 may also be independently disposed, and the fixed connection is realized by gluing, fastening, and the like, which is not limited to this embodiment of the present invention.

In the shielding and heat dissipating device 10 provided in the above embodiment, the fin group 200 is disposed on the surface of the side of the shielding case 100 away from the first circuit board 20, the shielding case 100 can electromagnetically shield electrical components on the first circuit board 20, the fin group 200 can conduct heat on the surface and around the shielding case 100, the limiting portion 300 can limit the second circuit board 30 mounted on the side of the shielding case 100 away from the first circuit board 20, so as to achieve electromagnetic shielding and heat dissipation effects and limit the second circuit board 30, thereby preventing the second circuit board 30 from shaking during transportation or flight of the shielding and heat dissipating device to cause easy damage to important electrical components on the second circuit board 30, and improving reliability of use and transportation of the second circuit board 30. In addition, the shielding case 100, the fin group 200 and the limiting portion 300 are integrally arranged, so that the occupied space is effectively reduced, the assembly process can be reduced, and the production efficiency of the shielding and heat-dissipating device 10 is improved.

Example two

Referring to fig. 1, the shielding heat dissipation device 10 of the present embodiment further designs a structure of a heat conduction portion 400 based on the first embodiment.

Referring to fig. 1, the heat conducting portion 400 is disposed on the first surface 113 of the board body 110 and contacts a heat source on the first circuit board 20. In some embodiments, a heat conducting metal sheet is attached or welded to the heat conducting portion 400; and/or, the heat conductive portion 400 is coated with a heat conductive silicone grease for contacting a heat source on the first circuit board 20.

Specifically, the heat-conducting silicone grease is a high-heat-conducting and insulating organic silicon material, takes organic silicone as a main raw material, is added with a material with excellent heat resistance and heat-conducting property, and can keep a grease state in use for a long time at the temperature of minus 50-230 ℃. The heat conductive silicone grease is coated on the contact surface between the heat transfer portion 400 and the heat source on the first circuit board 20, and plays a role of a heat transfer medium and has moisture-proof, dust-proof, corrosion-proof, shock-proof, etc.

Referring to fig. 1, in some embodiments, at least one heat transfer portion 400 is disposed on each shielding region 141, i.e., each shielding region 141 corresponds to at least one heat transfer portion 400. The number and arrangement of the heat transfer portions 400 may be designed according to actual needs, for example, two heat transfer portions 400 are disposed on each shielding region 141, and one, three, four or more heat transfer portions 400 may also be disposed, which is not limited to this embodiment of the present invention. The heat conducting metal sheet can be attached or welded on the digital heat conducting part 400 according to actual conditions, and the forehead heat conducting silicone grease is smeared on the surface of the heat source of the heat conducting part 400 contacting the first circuit board 20, which is not limited by the embodiment of the invention.

Referring to fig. 1, the heat conducting portion 400 may be designed to have any suitable structure with heat conducting function. Illustratively, the heat conduction portion 400 is a boss structure protruding from the first surface 113 of the plate body 110. The shape of the heat transfer portion 400 may be designed to be any suitable shape, such as a cylinder, a rectangular parallelepiped, a prism, and the like, but the embodiment of the present invention is not limited thereto.

In some embodiments, the shielding cover 100, the fin group 200, the limiting portion 300, and the heat conducting portion 400 are integrally disposed, so that the assembly process is reduced, and the production efficiency of the unmanned aerial vehicle is improved. It is understood that, in other embodiments, the heat conducting portion 400 and the shielding case 100 may also be disposed independently, and the fixed connection between the two is realized by gluing, clamping, and the like, which is not limited to this embodiment of the present invention.

In the shielding and heat dissipating device 10 provided in the above embodiment, the fin group 200 is disposed on the surface of the side of the shielding case 100 away from the first circuit board 20, the heat conducting portion 400 is disposed on the surface of the side of the shielding case 100 facing the first circuit board 20, the shielding case 100 can electromagnetically shield electrical components on the first circuit board 20, the fin group 200 can conduct heat on the surface of the shielding case 100 and around the surface, and the limiting portion 300 can limit the second circuit board 30 mounted on the side of the shielding case 100 away from the first circuit board 20, so as to electromagnetically shield, dissipate heat and limit the second circuit board 30, thereby preventing the second circuit board 30 from shaking during transportation or flight of the shielding and damaging important electrical components on the second circuit board 30, and improving reliability of the second circuit board 30 in use and transportation. In addition, the shielding case 100, the fin group 200, the limiting portion 300 and the heat conducting portion 400 are integrally arranged, so that the occupied space is effectively reduced, the assembly process can be reduced, and the production efficiency of the shielding and heat dissipating device 10 is improved.

EXAMPLE III

Referring to fig. 1, fig. 2, fig. 5 and fig. 6, an embodiment of the present invention provides an unmanned aerial vehicle including a shielding heat dissipation device 10, a first circuit board 20, a second circuit board 30 and a frame 40. The first circuit board 20 and the second circuit board 30 are both disposed on the chassis 40. The shielded heat sink 10 can refer to the first and second embodiments of the shielded heat sink of the present invention.

Referring to fig. 5 and 6, a flexible or elastic damping ball 50 is further connected between the second circuit board 30 and the frame 40. The number of the damping balls 50 may be designed according to actual requirements, for example, one, two, three or more. Illustratively, four damping balls 50 are provided at four corners of the second circuit board 30, respectively.

In some embodiments, referring to fig. 5, the first circuit board 20 is a camera circuit board of the drone, the second circuit board 30 is an inertial navigation system of the drone, electrical components on the camera circuit board may interfere with signal transmission of other external circuit components, such as transmission of GPS signals, and signals of the camera circuit board may easily affect the quality of a captured image due to interference of external electromagnetic signals, so the first circuit board 20 is disposed on the first side 111 of the shielding case 100 of the heat sink shielding device 10, and the second circuit board 30 is fixedly disposed on the second side 112 of the shielding case 100. The shielding heat dissipation device 10 can play both a shielding role and a heat dissipation role for the first circuit board 20; the second circuit board 30 can perform both heat dissipation and limiting functions.

As can be appreciated, the shielding heat sink 10 is disposed inside the fuselage of the drone. Specifically, shielding heat abstractor 10 can set up in unmanned aerial vehicle's inside through buckle mode or other suitable fixed modes, the embodiment of the utility model provides a be not limited to this.

The unmanned aerial vehicle that above-mentioned embodiment provided, set up fin group 200 through shielding heat abstractor 10 on the surface of one side that first circuit board 20 was kept away from to shield cover 100, shield cover 100 can carry out the electromagnetic shield to the electrical components on first circuit board 20, fin group 200 can conduct the heat on shield cover 100 surface and periphery, spacing portion 300 can carry on spacingly to installing in the second circuit board 30 of one side that shield cover 100 kept away from first circuit board 20, thereby compromise the electromagnetic shield, the radiating effect and spacing to second circuit board 30, avoid second circuit board 30 to take place to rock and cause the easy problem of damaging of important electrical components on second circuit board 30 in shielding heat abstractor transportation or flight process, the reliability of second circuit board 30 use and transportation has been improved. In addition, the shielding case 100, the fin group 200 and the limiting portion 300 are integrally arranged, so that the occupied space is effectively reduced, the assembly process can be reduced, and the production efficiency of the shielding and heat-dissipating device 10 is improved.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope of the present invention, and these modifications or replacements should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (15)

1. A shielded heat sink, comprising:

the shielding cover is used for electromagnetically shielding the first circuit board arranged on the first side of the shielding cover and is provided with an accommodating space for accommodating electrical elements of the first circuit board;

the fin group is arranged on the surface of the second side of the shielding case and comprises a first radiating fin and a second radiating fin, and the length extending direction of the first radiating fin is different from that of the second radiating fin so as to change the airflow direction from the first radiating fin, so that the flow velocity of the airflow is accelerated to accelerate the radiating speed;

the surface of the second side of the shielding cover is also provided with a limiting part for limiting a second circuit board arranged on the second side of the shielding cover; the shielding cover, the fin group and the limiting part are integrally arranged.

2. The shielded heat sink of claim 1, wherein the shield comprises:

a plate body;

the boundary part is arranged on the first surface of the plate body and forms the accommodating space with the plate body in an enclosing manner, and the accommodating space and the first circuit board are positioned on the same side of the plate body;

the spacing part is arranged on the first surface of the plate body and is positioned in the boundary part, so that the accommodating space forms a plurality of shielding areas at intervals.

3. The shielded heat sink of claim 2, further comprising:

and the heat transfer part is arranged on the first surface of the plate body and is in contact with a heat source on the first circuit board.

4. The shielded heat sink as claimed in claim 3, wherein at least one of the heat transfer portions is disposed on the shielded region.

5. The shielded heat sink as set forth in claim 3, wherein the heat conducting portion is a convex structure protruding from the first surface of the board body.

6. The shielded heat sink of any one of claims 1-5, wherein a maximum extension of the first heat sink fins along a predetermined extension direction is greater than a maximum extension of the second heat sink fins along the predetermined extension direction, the predetermined extension direction being a direction in which the set of fins extends away from the shielded enclosure.

7. The shielded heat sink of any one of claims 1-5, wherein at least one of the second heat fins comprises:

a first fin portion having a length extending direction different from that of the first heat dissipation fin;

the second fin part is connected with one end of the first fin part, which is far away from the first radiating fin;

the maximum extension size of the first fin portion along a preset extension direction is larger than the maximum extension size of the second fin portion along the preset extension direction, and the preset extension direction is the direction of the fin group facing away from the extension direction of the shielding case.

8. The shielded heat sink of any one of claims 1-5, wherein the first cooling fins are disposed in a one-to-one correspondence with the second cooling fins such that the airflow flowing out from between two adjacent first cooling fins enters between two corresponding adjacent second cooling fins.

9. The shielded heat sink of any one of claims 1-5, wherein the shield is made of a thermally conductive material.

10. The shielded heat sink as claimed in any one of claims 1 to 5, wherein the number of the position-limiting portions is plural.

11. The shielding and heat dissipating device according to any one of claims 1 to 5, wherein the plurality of position-limiting portions are provided at intervals in a width direction of the shield case.

12. The shielding and heat dissipating device of any one of claims 1 to 5, wherein the position-limiting portion is disposed between two adjacent second heat dissipating fins.

13. The shielding and heat dissipating device according to any one of claims 1 to 5, wherein an extension dimension of the limiting portion along a predetermined extension direction is greater than an extension dimension of the second heat dissipating fin along the predetermined extension direction, and the predetermined extension direction is a direction in which the fin group extends away from the shielding case.

14. The shielded heat sink of any one of claims 1-5, wherein the position-limiting portion comprises:

the limiting body is arranged on the surface of the second side of the shielding cover;

the limiting plane part is arranged on one side of the limiting body and used for preventing the second circuit board from moving along the length direction of the shielding cover;

the reinforcing rib is arranged on one side of the limiting body, which deviates from the limiting plane part.

15. An unmanned aerial vehicle, comprising:

a frame;

the first circuit board is arranged on the rack;

the second circuit board is arranged on the rack;

the shielded heat sink of any of claims 1-14, disposed on the chassis between the first circuit board and the second circuit board.

Images