CN210694659U - Electrical appliance - Google Patents
Electrical appliance Download PDFInfo
- Publication number
- CN210694659U CN210694659U CN201920968047.5U CN201920968047U CN210694659U CN 210694659 U CN210694659 U CN 210694659U CN 201920968047 U CN201920968047 U CN 201920968047U CN 210694659 U CN210694659 U CN 210694659U
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- back plate
- substrate
- electrical device
- chip module
- circuit board
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Abstract
The utility model discloses an electric device, include: the chip module comprises a shell, wherein the shell is provided with at least one abdicating groove; the circuit board is arranged in the shell; the electric connector is arranged on one side of the circuit board; the backboard is fixed on the other side of the circuit board, the backboard corresponds to the abdicating groove and is provided with at least one reinforcing piece, so that the strength of the backboard is enhanced, the backboard is not easy to bend and deform, and the normal work of the electrical device is ensured.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to an electrical apparatus especially indicates a better electrical apparatus of intensity.
[ background of the invention ]
An electrical device commonly used in the industry, which has an electrical connector, the electrical connector is installed on one side of a circuit board, the other side of the circuit board is fixedly provided with a back plate, the circuit board is arranged in a casing, and the electrical connector is usually used by the personnel in the industry to electrically connect a chip module to the circuit board, because the functions of the chip module which is newly pushed out are increasingly powerful, the transmission sites on the chip module are increased, the scale of the chip module is enlarged, the stress borne by the back plate when the chip module is fixed to the electrical connector is enlarged, the back plate is easy to generate bending deformation, and further the upward warping part of the circuit board is sunken downwards, because the circuit board is provided with other resistors, capacitors, radiators, other card-inserting electrical connectors and the like besides the electrical connector, when the circuit board is warped upwards, the electronic elements on the circuit board inevitably move upwards, and because the space in the casing is limited, when the warping is serious, various electronic elements on the circuit board can abut against the casing to cause a short circuit problem, so that the normal operation of the electric device is influenced.
Therefore, there is a need for a new electrical device to overcome the above problems.
[ Utility model ] content
An object of the creation of the utility model is to provide a groove department of stepping down that corresponds the casing in one side of backplate establishes a reinforcement, makes the better and non-deformable's of intensity electrical apparatus of backplate.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
an electrical device, comprising: the machine shell is provided with at least one abdicating groove; the circuit board is arranged in the shell; the electric connector is arranged on one side of the circuit board; the back plate is fixed on the other side of the circuit board, and at least one reinforcing piece is arranged at the position, corresponding to the abdicating groove, of the back plate.
The cover body presses the chip module to the electric connector, the chip module is electrically connected with the electric connector, and the reinforcing piece is positioned between two adjacent locking pieces.
Further, the height of the two ends of the reinforcing member is lower than the height of the middle of the reinforcing member along the extending direction of the reinforcing member.
Further, the abdicating groove penetrates through the casing, and the reinforcing piece at least partially extends into the abdicating groove.
Further, the reinforcing member is integrally formed or welded or riveted to the back plate.
Further, the reinforcement has a flat board, the flat board with the backplate laminating, certainly the relative both sides of flat board are to two extension boards of casing extension, the extension board at least part extends into the groove of stepping down.
Further, the portable electronic device further comprises a chip module, wherein the chip module comprises a substrate and a metal shell fixed on the substrate, a wafer is arranged on the substrate and positioned between the substrate and the metal shell, and a convex column protrudes from the metal shell to penetrate through the substrate and be fixed with the back plate.
Furthermore, an accommodating space is formed between the metal shell and the substrate, the wafer is located in the accommodating space, a plurality of ribs are arranged in the accommodating space, and the ribs are connected with the convex columns and the side wall of the metal shell.
Furthermore, a containing space is formed between the metal shell and the substrate, the wafer is located in the containing space, a plurality of ribs are arranged in the containing space, two opposite sides of each rib respectively support against the metal shell and the substrate, and the substrate supports against the electric connector.
Furthermore, the back plate is provided with a fixing piece locked with the convex column, the two reinforcing pieces are respectively positioned at two opposite sides of the fixing piece, and the distance between the two reinforcing pieces and the fixing piece is the same.
Compared with the prior art, the utility model discloses following beneficial effect has:
the reinforcing piece is arranged on one side of the back plate, the receding groove is formed in the position, corresponding to the reinforcing piece, of the shell, the reinforcing piece with different sizes can be designed according to the size of stress borne by the back plate, when a chip module electrically connected with the electric connector is large, the stress on the back plate is increased, the reinforcing piece with higher strength needs to be arranged in a position where the stress is concentrated in order to enhance the strength of the back plate, and due to the fact that the space in the shell is limited, the receding groove is formed in the position, corresponding to the reinforcing piece, of the shell, a larger space can be provided for the reinforcing piece to design the reinforcing piece according to the stress of the back plate, and therefore the strength of the back plate is enhanced; meanwhile, when the reinforcing member and the back plate are stressed to cause the two ends of the reinforcing member to warp upwards, the middle part of the reinforcing member is inevitably bent downwards, and then the abdicating groove can provide a deformation space for the reinforcing member, namely, the part of the reinforcing member bent downwards can extend into the abdicating groove, so that the reinforcing member can be abutted against the shell and further the circuit board can be damaged by extrusion.
[ description of the drawings ]
FIG. 1 is a schematic exploded perspective view of an electrical apparatus according to the present invention;
FIG. 2 is a schematic perspective view of the chip module and the cover of the electrical apparatus of the present invention being turned over by 90 degrees in the vertical direction;
FIG. 3 is a perspective view of the electrical apparatus of the present invention;
FIG. 4 is a schematic front view of FIG. 3;
FIG. 5 is a schematic perspective exploded view of the electrical apparatus of the present invention turned 180 degrees from bottom to top;
FIG. 6 is a cross-sectional view A-A of FIG. 3;
FIG. 7 is a perspective cross-sectional view of the electrical device of the present invention;
FIG. 8 is a front view of a chip module of the electrical device of the present invention;
fig. 9 is a sectional view of B-B in fig. 6.
Detailed description of the embodiments reference is made to the accompanying drawings in which:
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Circuit board 1 | |
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Through- |
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Convex |
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Back plate 4 | Convex |
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Reinforcing |
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Cover body 6 | |
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| Case 7 | Abdicating |
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[ detailed description ] embodiments
For better understanding of the objects, structures, features, and functions of the present invention, reference should now be made to the drawings and detailed description of the invention.
As shown in fig. 1 to 3, the electric device 100 of the present invention includes: a housing 7; the circuit board 1 is arranged in the shell 7; the electric connector 3 is positioned above the circuit board 1, and the electric connector 3 is electrically connected with a chip module 2 and the circuit board 1; the back plate 4 is arranged below the circuit board 1; and the fixing piece 5 penetrates through the back plate 4, the circuit board 1 and the electric connector 3 to fix the chip module 2 and the back plate 4.
As shown in fig. 6, 8 and 9, the chip module 2 includes a substrate 21, a metal shell 22 fixed on the substrate 21, and a plurality of dies 23, where the dies 23 are cores of the chip module 2 and are used for transmitting data. The substrate 21 is a flat plate and can be a circuit board 1, the substrate 21 is provided with a plurality of transmission sites for the wafers 23 to transmit data outwards, the metal shell 22 includes a top shell 221 and a side wall 222 extending downwards from the periphery of the top shell 221, an accommodating space 24 is enclosed between the top shell 221 and the peripheral side wall 222 and the substrate 21, the plurality of wafers 23 are located in the accommodating space 24, the accommodating space 24 is further provided with a plurality of ribs 25 between the plurality of wafers 23, the ribs 25 vertically support the top shell 221 and the substrate 21, in this embodiment, the ribs 25 and the metal shell 22 are integrally formed, that is, the upper ends of the ribs 25 are connected with the top shell 221, the lower ends of the ribs 25 support the substrate 21, and the ribs 25 are vertically and uniformly arranged in gaps between two adjacent wafers 23, the strength of the chip module 2 is enhanced without increasing the size of the receiving space 24, and the receiving space 24 can be fully utilized, and in other embodiments, the rib 25 may be formed separately from the metal case 22.
As shown in fig. 2, 7 and 9, a convex pillar 26 integrally and downwardly protrudes from the middle position of the top case 221 (in other embodiments, the convex pillar 26 may also be formed separately from the top case 221), both ends of the rib 25 along the extending direction thereof connect the convex pillar 26 and the side wall 222, so as to enhance the strength of the chip module 2, and at the same time, effectively counteract the impact of external force on the wafer 23, so as to be beneficial for preventing the wafer 23 from being damaged by the impact of external force, the inner wall surface of the convex pillar 26 is provided with a thread, a through hole 211 is provided in the center of the substrate 21 for the convex pillar 26 to pass through and be screw-locked with the fixing element 5 (in other embodiments, the top case 221 may also be provided with a threaded hole instead of the convex pillar 26, and the fixing element 5 is directly screw-locked with the threaded hole on the top case 221), the diameter of the through hole 211 is larger than the diameter of the convex pillar 26, a certain gap is formed between the convex column 26 and the base plate 21, so that the convex column 26 is prevented from damaging the base plate 21 in the locking process with the fixing piece 5, and the rib 25 is abutted against the top shell 221 and the base plate 21 up and down, so that the rib 25 can uniformly press the base plate 21 down in the locking process of the convex column 26 and the fixing piece 5.
As shown in fig. 2, 6 and 9, the electrical connector 3 is fixed on the upper surface of the circuit board 1, a plurality of conductive terminals (not shown) are disposed in the electrical connector 3, the upper ends of the conductive terminals are connected to the substrate 21, the lower ends of the conductive terminals are connected to the circuit board 1, so as to electrically connect the die 23 and the circuit board 1, and when the chip module 2 presses the electrical connector 3, the substrate 21 abuts against the electrical connector 3.
As shown in fig. 2, 3 and 7, the electrical apparatus 100 further includes a cover 6, the cover 6 is disposed above the chip module 2, the cover 6 has a top plate 61, the top plate 61 has an opening 62 at the center, the lower surface of the top plate 61 abuts against the upper surface of the sidewall 222 to press the chip module 2 from the periphery of the chip module 2, a frame 63 extends downward and toward the periphery from the top plate 61, and four corners of the frame 63 are respectively provided with a locking member 64 to be locked and fixed with the back plate.
As shown in fig. 1, 5 and 6, the back plate 4 is located on the lower surface of the circuit board 1, the back plate 4 is substantially in a flat plate shape, the middle portion of the back plate 4 is recessed downward to form a convex hull 41, the convex hull 41 is provided with a through hole 42 for the fixing member 5 to pass through, four corners of the back plate 4 are respectively provided with a screw 43, the screws 43 are locked with the locking members 64 to fix the chip module 2, the electrical connector 3, the circuit board 1 and the back plate 4 together, two reinforcing members 44 are fixedly arranged on the lower surface of the back plate 4 on two opposite sides of the fixing member 5 to enhance the strength of the back plate 4, the two reinforcing members 44 are equidistant from the fixing member 5, that is, the reinforcing members are located at symmetrical positions of two ends of the back plate 4 to make the strengths of the back plate 4 identical, so as to avoid the bending deformation of the back plate 4 due to the difference of bearing capacities, the reinforcing member 44 is formed by bending a thin metal plate, and the forming process is simple.
As shown in fig. 2, 5 and 6, the reinforcing member 44 has a flat plate 441, the flat plate 441 is longitudinally and horizontally extending, the flat plate 441 is attached to the backboard 4, and the flat plate 441 can be fixed to the backboard 4 by welding or riveting instead of being assembled to the backboard 4 by screws or other methods (in other embodiments, the flat plate 441 can be integrally formed with the backboard 4, that is, the backboard 4 is recessed downward at the position corresponding to the reinforcing member 44 to form the flat plate 441, or the backboard 4 is protruded at the lower side thereof to form the flat plate 441 during stamping forming), so that the flat plate 441 and the backboard 4 can be completely and tightly attached to form a whole, when the screws 43 and the locking members 64 are locked and fixed to press the chip module 2, the backboard 4 is stressed, however, the flat plate 441 and the backboard 4 do not slide relatively, but the stiffener 44 and the backboard 4 are stressed together, when the flat plate 441 is assembled to the backboard 4 by screws or other methods, a slight gap is generated between the flat plate 441 and the backboard 4, when the backboard 4 is stressed, the flat plate 441 and the backboard 4 slide relatively and cannot be tightly combined with the backboard 4 to bear stress together, and when the flat plate 441 between two adjacent screws is not attached to the backboard 4 by screws, so that the stiffener 44 cannot reinforce the backboard 4 and the backboard 4 is deformed.
As shown in fig. 4 to 6, two extending plates 442 extend downward from two opposite sides of the flat plate 441, the two extending plates 442 have the same size, and the height of each extending plate 442 along the longitudinal direction is lower than the height of the middle portion thereof, because the stress applied to the middle portion of the extending plate 442 by the back plate 4 is larger, the increase of the height of the middle portion of the extending plate 442 increases the strength of the stiffener 44, and thus the strength of the back plate 4 at the corresponding position is increased, and the stress applied to the two ends of the back plate 4 corresponding to the extending plates 442 is smaller, the heights of the two ends of the stiffener 44 do not need to be set too high, so that the material can be saved; the two ends of the flat plate 441 are respectively and correspondingly provided with one screw 43, that is, the flat plate 441 is located between two adjacent screws 43, meanwhile, each screw 43 is correspondingly locked with one locking piece 64, the flat plate 441 is also located between two adjacent locking pieces 64, so that when the screws 43 are locked with the locking pieces 64, the top plate 61 tightly abuts against the periphery of the chip module 2, meanwhile, the stress degree of the position on the back plate 4 corresponding to the position between two adjacent screws 43 is greater than that of the rest positions, only one reinforcing piece 44 is respectively arranged between two screws 43, the thickness of the back plate 4 does not need to be integrally increased to increase the strength of the back plate, the back plate 4 is light and easy to assemble, and materials are also saved.
As shown in fig. 2, 5 and 7, in the present embodiment, the housing 7 is illustrated by a plate 441, instead of a complete housing 7, the housing 7 is provided with a yielding groove 71 corresponding to two reinforcing members 44, the yielding groove 71 penetrates the housing 7 up and down, when the extension plate 442 has a large size, the extension plate 442 may extend into the escape groove 71, the back plate 4 with higher strength can be satisfied even if the space inside the cabinet 7 is small, and when the reinforcing member 44 along with the back plate 4 is warped and deformed by the force applied to the both ends thereof upwards, which inevitably bends the middle portion of the reinforcing member 44 downward, the escape groove 71 provides a space for deformation of the reinforcing member 44, that is, the extension plate 442 can extend into the receding groove 71, so that the bottom end of the extension plate 442 is not abutted against the housing 7 and the circuit board 1 is damaged by pressing.
As shown in fig. 2, 6, 8, and 9, during assembly, the electrical connector 3 is fixed to the circuit board 1, the chip module 2 is positioned above the electrical connector 3 by a clamping device, the cover 6 and the back plate 4 are locked and fixed at four corners by four locking pieces 64 and four screws 43 respectively in the vertical direction, finally, the fixing piece 5 passes through the through hole 42, the circuit board 1, the electrical connector 3 and the protruding pillar 26 from the lower side of the back plate 4, the cover 6 is arranged above the chip module 2 to press the periphery of the chip module 2, when the cover 6 presses the chip module 2, the middle of the chip module 2 has a tendency of warping upward due to the upward abutting force of the conductive terminals, the protruding pillar 26 is arranged at the center of the metal shell to lock with the back plate 5 below the back plate 4, the top shell 221 can be pulled down from the middle position of the chip module 2, and the rib 25 is arranged in the accommodating space 24 to vertically abut against the top shell 221 and the substrate 21, so that the top shell 221 is pulled down, the rib 25 can also uniformly press down the substrate 21, a constant distance between the top shell 221 and the substrate 21 is ensured, the wafer 23 in the accommodating space 24 cannot be damaged due to the pulling of the top shell 221, and the middle position of the chip module 2 cannot be warped upwards and deformed due to the downward pulling force of the fixing member 5 in the working process of the chip module 2; finally, the circuit board 1 is assembled into the chassis 7.
In summary, the electrical apparatus 100 of the present invention has the following advantages:
(1) one side of backplate 4 is equipped with stiffener 44, just casing 7 corresponds stiffener 44 department is equipped with the groove 71 of stepping down, can be according to the size design size difference of the stress that backplate 4 receives stiffener 44, when electric connector 3 electric connection's chip module 2 is great, the stress on backplate 4 just becomes, in order to strengthen the intensity of backplate 4 just needs to set up intensity higher in the place of stress concentration stiffener 44, because space in the casing 7 is limited correspond on the casing 7 stiffener 44 department sets up the groove 71 of stepping down can for stiffener 44 provides bigger space and presses the stress design of backplate 4 stiffener 44, thereby the reinforcing the intensity of backplate 4.
(2) The reinforcing member 44 is disposed between two adjacent locking members 64, when the screw 43 is locked with the locking members 64, the top plate 61 tightly abuts against the periphery of the chip module 2, and meanwhile, the stress degree of the position of the back plate 4 corresponding to the position between two adjacent locking members 64 is greater than that of the rest positions, only one reinforcing member 44 is disposed between two locking members 64, so that the thickness of the back plate 4 does not need to be integrally increased to increase the strength of the back plate 4, the back plate 4 is light and easy to assemble, and the material is saved.
(3) The height of the two ends of each reinforcing member 44 in the longitudinal direction is lower than the height of the middle part of each reinforcing member 44, because the stress on the back plate 4 corresponding to the middle part of the reinforcing member 44 is larger, the increase of the height of the middle part of the reinforcing member 44 can increase the strength of the reinforcing member 44, and further increase the strength of the back plate 4 corresponding to the position, the stress on the back plate 4 corresponding to the two ends of the reinforcing member 44 is smaller, and the heights of the two ends of the reinforcing member 44 are not required to be too high, so that the material can be saved.
(4) The receding groove 71 penetrates through the casing 7, when the size of the stiffener 44 is large, the extending plate 442 may extend into the receding groove 71, even if the space in the casing 7 is small, the back plate 4 with high strength may be satisfied, and when the stiffener 44 and the back plate 4 are warped and deformed upwards due to stress, the middle portion of the stiffener 44 may be bent downwards, and then the receding groove 71 may provide a deformation space for the stiffener 44, that is, the extending plate 442 may extend into the receding groove 71, so that the bottom end of the extending plate 442 may be abutted to the casing 7 and the circuit board 1 may be damaged due to extrusion.
(5) The reinforcing member 44 can be fixed to the back plate 44 by integral molding or welding or riveting instead of being assembled to the back plate 4 by screws or other methods, so that the reinforcing member 44 and the back plate 4 can be completely tightly attached to form a whole, when the screws 43 and the locking members 64 are locked and fixed to press the chip module 2, the back plate 4 is stressed by stress, but no relative sliding between the reinforcing member 44 and the back plate 4 occurs, but the reinforcing member 44 and the back plate 4 are stressed together, when the reinforcing member 44 is assembled to the back plate 4 by screws or other methods, a slight gap is generated between the reinforcing member 44 and the back plate 4, when the back plate 4 is stressed, the reinforcing member 44 and the back plate 4 are relatively slid, the reinforcing member 44 between two adjacent screws is not attached to the back plate 4 when the back plate 4 is assembled by the screws, so that the reinforcing member 44 cannot reinforce the back plate 4, and the back plate 4 is deformed.
(6) The two reinforcing members 44 are equidistant from the fixing member 5, that is, the reinforcing members 44 are located at symmetrical positions at two ends of the backboard 4, so that the strength of the two ends of the backboard 4 is the same, and the backboard 4 is prevented from bending and deforming due to the difference of bearing capacity.
(7) The protruding pillar 26 protrudes from the metal shell 22 to penetrate through the substrate 21 and is fixed to the back plate 4, so that the chip module 2 is not only pressed on the electrical connector 3 around, but also pulled downwards by the protruding pillar 26 and fixed to the electrical connector 3, thereby preventing the chip module 2 from warping and deforming and stably pressing on the electrical connector 3, and ensuring normal electrical connection of the electrical connector 3.
(8) The opposite sides of the rib 25 respectively support against the metal shell 22 and the substrate 21, so that the rib 25 can uniformly press the substrate 21 in the process of locking the convex column 26 and the fixing piece 5, and the substrate 21 is prevented from being deformed due to uneven stress to influence the electrical connection with the conductive terminal.
(9) The rib 25 connects the protruding column 26 and the side wall 222 of the metal shell 22, so that the strength of the chip module 2 can be enhanced, and the impact of external force on the wafer 23 can be effectively counteracted, which is beneficial to preventing the wafer 23 from being damaged under the impact of external force.
The above detailed description is only for the purpose of illustrating the preferred embodiments of the present invention, and not for the purpose of limiting the scope of the present invention, therefore, all the equivalent technical changes using the description and drawings of the present invention are included in the scope of the present invention.
Claims (10)
1. An electrical device, comprising:
the machine shell is provided with at least one abdicating groove;
the circuit board is arranged in the shell;
the electric connector is arranged on one side of the circuit board;
the back plate is fixed on the other side of the circuit board, and at least one reinforcing piece is arranged at the position, corresponding to the abdicating groove, of the back plate.
2. The electrical device of claim 1, wherein: the electric connector further comprises a chip module and a cover body positioned on one side of the electric connector far away from the circuit board, the cover body and the back plate are locked and fixed by four locking pieces, the cover body presses the chip module on the electric connector, the chip module is electrically connected with the electric connector, and the reinforcing piece is positioned between two adjacent locking pieces.
3. The electrical device of claim 1, wherein: the height of the two ends of the reinforcing piece along the extending direction of the reinforcing piece is lower than the height of the middle of the reinforcing piece.
4. The electrical device of claim 1, wherein: the abdicating groove penetrates through the casing, and the reinforcing piece at least partially extends into the abdicating groove.
5. The electrical device of claim 1, wherein: the reinforcing member is integrally formed or welded or riveted to the back plate.
6. The electrical device of claim 1, wherein: the reinforcing piece is provided with a flat plate, the flat plate is attached to the back plate, two opposite sides of the flat plate extend to the shell to form two extending plates, and at least part of the extending plate extends into the abdicating groove.
7. The electrical device of claim 1, wherein: the chip module comprises a substrate and a metal shell fixed on the substrate, a wafer is arranged on the substrate and positioned between the substrate and the metal shell, and a convex column penetrates through the substrate and the back plate to be fixed from the metal shell in a protruding mode.
8. The electrical device of claim 7, wherein: an accommodating space is formed between the metal shell and the substrate, the wafer is located in the accommodating space, a plurality of ribs are arranged in the accommodating space, and the ribs are connected with the convex columns and the side wall of the metal shell.
9. The electrical device of claim 7, wherein: an accommodating space is formed between the metal shell and the substrate, the wafer is located in the accommodating space, a plurality of ribs are arranged in the accommodating space, two opposite sides of each rib respectively support against the metal shell and the substrate, and the substrate supports against the electric connector.
10. The electrical device of claim 7, wherein: the backboard is provided with a fixing piece locked with the convex column, the two reinforcing pieces are respectively positioned at two opposite sides of the fixing piece, and the distance between the two reinforcing pieces and the fixing piece is the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920968047.5U CN210694659U (en) | 2019-06-25 | 2019-06-25 | Electrical appliance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920968047.5U CN210694659U (en) | 2019-06-25 | 2019-06-25 | Electrical appliance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210694659U true CN210694659U (en) | 2020-06-05 |
Family
ID=70901554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920968047.5U Active CN210694659U (en) | 2019-06-25 | 2019-06-25 | Electrical appliance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210694659U (en) |
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2019
- 2019-06-25 CN CN201920968047.5U patent/CN210694659U/en active Active
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