CN210691237U - Heat radiator for be used for computer - Google Patents
Heat radiator for be used for computer Download PDFInfo
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- CN210691237U CN210691237U CN201922102649.5U CN201922102649U CN210691237U CN 210691237 U CN210691237 U CN 210691237U CN 201922102649 U CN201922102649 U CN 201922102649U CN 210691237 U CN210691237 U CN 210691237U
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- guide cover
- computer
- heat dissipation
- mounting plate
- air deflector
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Abstract
The utility model discloses a heat dissipation device for a computer, wherein a supporting leg is detachably connected with a placing plate, heat dissipation holes are arranged on each surface of the placing plate, a top panel of the placing plate is detachably connected with a lower main body of the placing plate, an installation part is arranged in an inner cavity and comprises a mounting plate which is supported by a support frame and has a concave-shaped longitudinal section, the bottom of the mounting plate is arranged into a hollow structure, the upper end surface of the side wall of the mounting plate is provided with a groove for bearing a guide cover, and the side wall is also provided with a through hole; the guide cover is of a bowl-shaped structure, and the upper end and the lower end of the guide cover are both provided with openings; the lower end of the guide cover is detachably arranged in the groove, and the upper end of the guide cover is in contact with the panel; the guide cover is internally and transversely provided with an air deflector which is concave upwards, the edge of the air deflector is connected with the inner wall of the guide cover through a connecting rod, and the air deflector is provided with a plurality of air vents. The heat dissipation device for the computer has the advantages of simple and novel structure, lower cost and higher heat dissipation efficiency.
Description
Technical Field
The utility model particularly relates to a heat abstractor for computer.
Background
The more and more notebooks are used in daily life entertainment and work, but some notebooks generate heat seriously, and the heat dissipation device cannot keep up with the notebook, and the notebook often dies because of being too hot, and the work efficiency is influenced, so an external heat dissipation device is often needed. At present, the positions of fans of radiators on the market are all fixed, so that the use efficiency of the radiators is reduced unexpectedly, and the air blown by the radiating fans can only better radiate the parts right above the radiating fans when the air directly blows the positions above the radiating fans, so that the radiating is not complete and complete, and the radiating efficiency is low; meanwhile, after the heat dissipation device is used for a long time, more dust exists, and the problem of inconvenient cleaning exists; and the heat dissipation fan also needs to dissipate heat during operation, so that the heat dissipation of the heat dissipation fan needs to be ensured.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a heat abstractor for computer to solve the problem mentioned in the above-mentioned background art.
In order to solve the above technical problems, the present invention provides a heat dissipation device for a computer, which comprises a placing plate supported by supporting legs and having a hollow structure for placing a computer, wherein a heat dissipation fan is placed in an inner cavity of the placing plate, and the heat dissipation fan is connected with a power supply part through a connecting wire; the supporting legs can be dismantled with placing the board and be connected, all is equipped with the louvre on placing the board each surface, and the top panel of placing the board also is connected for dismantling rather than the lower part main part, and the intracavity is equipped with the installation department that is used for placing radiator fan.
The mounting part comprises a mounting plate which is supported by a support frame and has a concave-shaped longitudinal section, the bottom of the mounting plate is of a hollow structure, the upper end surface of the side wall of the mounting plate is provided with a groove for receiving the guide cover, and the side wall is also provided with a through wire hole; the guide cover is of a bowl-shaped structure, and the upper end and the lower end of the guide cover are both provided with openings; the lower end of the guide cover is detachably arranged in the groove, and the upper end of the guide cover is in contact with the panel; an air deflector is transversely arranged in the guide cover and is positioned right above the mounting plate, the air deflector is upwards concave, the edge of the air deflector is connected with the inner wall of the guide cover through a connecting rod, and a plurality of air vents are distributed on the air deflector.
Furthermore, an air guide groove is arranged on the lower end face of the air guide plate, and the air guide groove is spirally arranged on the lower end face of the air guide plate.
Furthermore, the connecting rods are at least four and are connected with the edge of the air deflector at equal intervals.
Furthermore, a circle of convex rings are annularly arranged on the inner side of the guide cover and close to the upper end of the guide cover; the convex ring is provided with a filter screen for filtering dust, and the upper end surface of the filter screen is in contact with the lower end surface of the panel.
Furthermore, the bottom of the groove is provided with a magnetic sheet, and the lower end of the guide cover is provided with an iron sheet which is adsorbed with the magnetic sheet.
Furthermore, the inner wall of the groove is at least provided with two L-shaped clamping grooves, and the outer side of the lower end of the guide cover is provided with a clamping block.
Furthermore, the power supply part is a battery box provided with a storage battery or a USB plug connected with a USB interface of the computer.
Furthermore, the support frame is inclined, and an auxiliary frame for auxiliary support is arranged on the inner side of the support frame.
Furthermore, when the lower end of the guide cover is positioned in the groove, the guide cover is provided with a blocking block for positioning the radiating fan, and the blocking block is positioned at the lower end of the guide cover, which is an arc-shaped side wall, and protrudes inwards in the transverse direction.
Further, the side wall of the mounting plate is also provided with a hollow structure.
The utility model has the advantages that: the heat dissipation device for the computer has the advantages of simple and novel structure, lower cost, convenience in cleaning and higher heat dissipation efficiency; it is through the setting to installation department, guide housing and the aviation baffle that is located the guide housing for wind energy can be comprehensive flows from each louvre on the panel, dispels the heat to the different angles and the different positions of computer cooling surface, improves the radiating efficiency. Meanwhile, the convex ring can be used for bearing the dust filtering screen to reduce the phenomenon that dust enters the computer when the heat dissipation device for the computer is used for heat dissipation. And the mounting plate is provided with a hollow structure, and the placing plate is provided with heat dissipation holes on each surface, so that the heat dissipation of the heat dissipation fan is facilitated.
Drawings
Fig. 1 schematically shows a structure of a heat dissipation device for a computer.
Fig. 2 schematically shows a structural view of the inside of the cavity of the heat sink for the computer.
Fig. 3 is a schematic diagram showing the structure of a panel of a heat sink for a computer.
Fig. 4 is a schematic diagram showing the structure of a mounting plate of a heat sink for a computer.
FIG. 5 schematically illustrates a cross-sectional view of a mounting plate for a heat sink of a computer.
Fig. 6 is a schematic sectional view showing a guide cover of a heat dissipating apparatus for a computer according to a fourth embodiment.
Fig. 7 is a schematic sectional view showing a guide cover of a heat sink for a computer according to a fifth embodiment.
Fig. 8 is a schematic diagram of a card slot of a heat sink for a computer.
Fig. 9 is a schematic view showing a connection structure of a heat dissipating fan of the heat dissipating apparatus for a computer.
Fig. 10 is a schematic bottom view of an air deflector of a heat sink for a computer.
Wherein: 1. supporting legs; 101. an opening; 2. placing the plate; 21. an inner cavity; 22. a panel; 23. a main body; 3. a heat radiation fan; 4. connecting a lead; 5. a power supply unit; 6. heat dissipation holes; 7. an installation part; 8. a support frame; 9. mounting a plate; 91. a bottom; 92. a side wall; 921. a through hole; 10. a guide housing; 101. an opening; 102. iron sheets; 103. a clamping block; 104. a barrier block; 11. a groove; 111. a magnetic sheet; 112. a card slot; 12. an air deflector; 121. a wind guide groove; 13. a connecting rod; 14. a ventilation opening; 15. filtering with a screen; 16. a convex ring; 17. an auxiliary frame.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiment is only one embodiment of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail with reference to the accompanying drawings and specific embodiments. And for the sake of simplicity, the following omits the technical common sense known to those skilled in the art.
Example one
According to an embodiment of the present application, there is provided a heat dissipating device for a computer, as shown in fig. 1 to 6, the heat dissipating device for a computer includes a placing plate 2 supported by supporting legs 1, the placing plate 2 is used for placing a computer and has a hollow structure; the heat dissipation fan 3 is placed in the cavity 21 of the placement board 2, and as shown in fig. 9, the heat dissipation fan 3 is connected to the power supply unit 5 through the connection lead 4. When the notebook computer is used, the computer can be placed on the heat dissipation device to dissipate heat of the computer, so that efficient operation of the computer is ensured.
In the embodiment, the supporting leg 1 of the heat sink for the computer is detachably connected with the placing plate 2, and a user can adjust the supporting leg according to the use condition; when the use height is short, the supporting legs 1 can be arranged at the lower end of the placing plate 2 for heightening; wherein, supporting legs 1 can be bolted connection with the mode of dismantling of placing board 2, and supporting legs 1 also can set up the mode into the telescopic link simultaneously, is convenient for adjust the height that supports.
The heat dissipation holes 6 provided in the upper panel 22 of the placement board 2 are mainly used for discharging the air blown by the heat dissipation fan 3, thereby dissipating heat from the computer placed on the panel 22; the heat dissipation holes 6 disposed on the column are mainly used for dissipating heat of the devices located in the inner cavity 21, such as the heat dissipation fan 3, and ensure efficient operation of the heat dissipation device for the computer.
The inner cavity 21 of the heat sink for the computer is internally provided with a mounting part 7 for placing the heat radiation fan 3; specifically, the mounting portion 7 includes a mounting plate 9 supported by the support frame 8, and the longitudinal section of the mounting plate 9 is "concave", that is, a side wall 92 of the mounting plate 9 protrudes upward. Meanwhile, the bottom 91 of the mounting plate 9 is provided with a hollow structure which can be a spiral hollow structure, the heat dissipation fan 3 is placed on the bottom 91 of the mounting plate 9, and the hollow structure can carry and dissipate heat, so that the operation efficiency and the service life of the heat dissipation fan 3 are improved; of course, the side wall 92 of the mounting plate 9 is also provided with an hollowed-out structure (not shown in the figure).
A groove 11 is arranged on the upper end surface of the side wall 92 of the mounting plate 9 and used for receiving the guide cover 10; a through hole 921 is further formed in the side wall 92 of the mounting plate 9 and used for passing through the connecting wire 4; in a specific embodiment, after the heat dissipation fan 3 is placed on the mounting plate 9, the connection lead 4 connected to the heat dissipation fan 3 is connected to the power supply unit 5 through the through hole 921.
In specific implementation, the power supply part 5 of the heat dissipation device for a computer can be preferably a battery box provided with a storage battery or a USB plug connected with a USB interface for a computer, which belongs to a very mature technical means and is not described herein; of course, the two power supply modes are not limited. Of course, the power supply unit 5 may be placed outside the placement plate 2, and when the power supply unit 5 is a battery case in which a battery is placed, a storage case may be provided outside the placement plate 2, and a hole (not shown) through which the connection wire 4 is inserted may be opened in the side wall 92. When the power supply unit 5 is a USB plug for connecting a USB interface of a computer, a hole for inserting the connecting wire 4 is directly formed in the side wall 92, and the USB plug is placed outside the placing plate 2 and connected to the USB interface of the computer when in use.
The guide cover 10 of the heat sink for computer is bowl-shaped, and the upper and lower ends are both provided with openings 101, the lower opening 101 is aligned with the air outlet of the heat dissipation fan 3 on the mounting plate 9, and the upper opening 101 is aligned with the panel 22; the lower end of the guide cover 10 is detachably mounted in the groove 11, and the upper end of the guide cover 10 is in contact with the panel 22. An air deflector 12 is transversely arranged in the guide cover 10 and is positioned right above the mounting plate 9, the air deflector 12 is inwards concave upwards, the edge of the air deflector 12 is connected with the inner wall of the guide cover 10 through a connecting rod 13, and a plurality of air vents 14 are distributed on the air deflector 12.
In specific implementation, the air deflector 12 is located right above the mounting plate 9, the air blown out from the heat dissipation fan 3 placed on the mounting plate 9 firstly blows the air deflector 12, part of the air flows out from the air inlet 14 and continues to flow upward and is discharged from the air outlet, and the rest of the air is dispersed to the periphery under the action of the air deflector 12, flows out from the channels located at the two sides of the air deflector 12 and continues to flow upward and is discharged from the air outlet, so that the wind can flow out from the heat dissipation holes 6 on the panel 22 comprehensively, and heat dissipation is performed on different angles and different positions of the heat dissipation surface of the computer, and the heat dissipation efficiency is improved.
Meanwhile, after long-time use, when the heat dissipation device for the computer needs to dissipate heat, the panel 22 is detached, the guide cover 10 is taken down, the heat dissipation fan 3 placed on the mounting plate 9 is taken down and taken out of the heat dissipation device, and then the inside of the notebook 2 can be directly washed by water flow; after the washing and drying are finished, the heat radiation fan 3 is placed on the mounting plate 9, then the guide cover 10 is mounted on the mounting part 7, and the panel 22 is buckled, so that the washing and drying device is simple and convenient.
Example two
As shown in fig. 10, according to an embodiment of the present application, a heat dissipation device for a computer is provided to further improve the efficiency of splitting the wind flow of the wind deflector 12, so as to improve the heat dissipation efficiency. Specifically, an air guide groove 121 is provided on the lower end surface of the air guide plate 12, and the air guide groove 121 is spirally arranged on the lower end surface of the air guide plate 12.
In specific implementation, the wind blown out from the heat dissipation fan 3 placed on the mounting plate 9 firstly blows to the wind deflector 12, part of the wind flows out from the ventilation opening 14, continues upwards and is discharged from the wind dispersing opening, and the rest is dispersed to the periphery under the action of the wind deflector 12; wherein, when scattering, under the effect that is wind guide groove 121 helically, carry out the vortex to the wind that scatters, the wind after the vortex flows out from the passageway that is located aviation baffle 12 both sides again, continues upwards and discharges from the wind gap that scatters, has accelerateed to flow, improves the radiating efficiency.
It should be noted here that the adjustment of the width of the wind scattering can be achieved by adjusting the concavity of the wind deflector 12 and/or the size of the wind deflector 12, so as to satisfy the function that each heat dissipation hole 6 on the panel 22 with different sizes can blow and dissipate heat, and further, wind can flow out from each heat dissipation hole 6 on the panel 22 comprehensively, and dissipate heat at different angles and different positions of the heat dissipation surface of the computer, thereby improving the heat dissipation efficiency.
In the embodiment, at least four connecting rods 13 are used for connecting the air deflector 12, and are connected with the edge of the air deflector 12 at equal intervals, so that the uniformity and the structural strength of the connection are ensured.
EXAMPLE III
According to one embodiment of the application, a heat dissipation device for a computer is provided to reduce the phenomenon that dust enters the computer when heat is dissipated by using the heat dissipation device for the computer.
Specifically, a circle of convex rings 16 are annularly arranged on the inner side of the guide cover 10 and close to the upper end of the guide cover 10; the convex ring 16 is provided with a filter screen 15 for filtering dust; wherein, the upper end surface of the filter screen 15 contacts with the lower end surface of the panel 22.
In a specific embodiment, when the heat dissipation device for a computer is used to dissipate heat from the computer, the filter screen 15 for filtering dust is placed in the guide housing 10, the edge of the filter screen 15 is received by the protruding ring 16, the filter screen 15 is supported, and the panel 22 is mounted on the main body 23.
When the computer is used, the air blown out by the heat dissipation fan 3 is filtered by the filter screen 15 before passing through the heat dissipation holes 6, so that the phenomenon that dust particles enter the computer is reduced, and the use efficiency of the computer is prevented from being influenced.
Example four
In the present embodiment, in addition to the above-described embodiments, the mounting manner of the guide cover 10 and the mounting plate 9 is further limited.
Specifically, as shown in fig. 6, a magnetic sheet 111 is disposed at the bottom 91 of the recess 11, and an iron sheet 102 is disposed at the lower end of the guide cover 10 to be attracted to the magnetic sheet 111.
In a specific implementation, when the lower end of the guide cover 10 is placed in the bottom 91 of the groove 11, the iron sheet 102 at the lower end of the guide cover 10 is attached to the magnetic sheet 111 at the bottom 91 of the groove 11, and the guide cover 10 is further connected to the mounting plate 9, so that the phenomenon that the guide cover 10 is blown away when the heat dissipation fan 3 is used for heat dissipation or the phenomenon that the guide cover 10 falls off the mounting plate 9 when the heat dissipation device for a computer is moved is avoided.
EXAMPLE five
In the present embodiment, in addition to the above-described embodiments, the mounting manner of the guide cover 10 and the mounting plate 9 is further limited.
Specifically, as shown in fig. 7 and 8, at least two L-shaped locking slots 112 are formed in the inner wall of the groove 11, and a locking block 103 is disposed on the outer side of the lower end of the guide cover 10.
In a specific implementation, when the guide cover 10 is mounted on the mounting plate 9, the latch 103 outside the lower end of the guide cover 10 enters from the upper end of the L-shaped slot 112, and when the latch 103 is located at the lower end of the slot 112, the guide cover 10 is rotated to move the latch 103 to the lower end seal of the L-shaped slot 112, so as to prevent the guide cover 10 from moving upwards and limit the movement. A plurality of card slots 112 can be arranged at equal intervals; the number of the clamping blocks 103 is the same as that of the clamping grooves 112, and the clamping blocks are matched with the clamping grooves.
EXAMPLE six
In the present embodiment, the heat dissipating device for a computer is further defined on the basis of the above-mentioned embodiments; specifically, when the lower end of the guide cover 10 of the heat sink for a computer is positioned in the groove 11, the guide cover 10 is provided with a blocking block 104 for positioning the heat dissipation fan 3; the blocking piece 104 is located at the lower end of the arc-shaped side wall 92 of the guide housing 10 and projects laterally inward.
In specific implementation, when the lower end of the guide cover 10 is installed and placed in the groove 11, the blocking block 104 provided on the guide cover 10 blocks the heat dissipation fan 3 placed in the mounting plate 9, so as to limit the heat dissipation fan in the mounting plate 9, and prevent the heat dissipation fan from falling from the mounting plate 9.
Meanwhile, in the present embodiment, it is also preferable that the support frame 8 is inclined, and the support frame 8, the placing plate 2 and the mounting plate 9 are integrally formed into a trapezoidal structure; and the inner side of the support frame 8 is also provided with an auxiliary frame 17 for auxiliary support, so that the support strength of the support frame 8 is improved.
In the description above, references to "one embodiment," "an embodiment," "one example," "an example," etc., indicate that the embodiment or example so described may include a particular feature, structure, characteristic, property, element, or limitation, but every embodiment or example does not necessarily include the particular feature, structure, characteristic, property, element, or limitation. Moreover, repeated use of the phrase "in accordance with an embodiment of the present application" although it may possibly refer to the same embodiment, does not necessarily refer to the same embodiment.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A heat dissipating double-fuselage for computer, including being used for placing the computer, the board (2) that is hollow structure that is supported by the supporting foot (1), put the cooling fan (3) in the cavity (21) of the board of placing, the cooling fan (3) is connected with power department (5) through the connecting wire (4);
the method is characterized in that: the supporting legs (1) are detachably connected with the placing plate (2), heat dissipation holes (6) are formed in the surfaces of the placing plate (2), an upper panel (22) of the placing plate (2) is detachably connected with a lower main body (23) of the placing plate, and an installation part (7) for placing a heat dissipation fan (3) is arranged in the inner cavity (21);
the mounting part (7) comprises a mounting plate (9) which is supported by a support frame (8) and has a concave-shaped longitudinal section, the bottom (91) of the mounting plate (9) is of a hollow structure, a groove (11) for bearing the guide cover (10) is formed in the upper end face of the side wall (92) of the mounting plate (9), and a through hole (921) is formed in the side wall (92); the guide cover (10) is of a bowl-shaped structure, and the upper end and the lower end of the guide cover are provided with openings (101);
the lower end of the guide cover (10) is detachably arranged in the groove (11), and the upper end of the guide cover (10) is in contact with the panel (22); an air deflector (12) is transversely arranged in the guide cover (10) and is positioned right above the mounting plate (9), the air deflector (12) is upwards concave, the edge of the air deflector (12) is connected with the inner wall of the guide cover (10) through a connecting rod (13), and a plurality of air vents (14) are distributed in the air deflector (12).
2. The heat dissipating device for a computer according to claim 1, wherein: an air guide groove (121) is arranged on the lower end face of the air deflector (12), and the air guide groove (121) is spirally arranged on the lower end face of the air deflector (12).
3. The heat dissipating device for a computer according to claim 1, wherein: the number of the connecting rods (13) is at least four, and the connecting rods are connected with the edge of the air deflector (12) at equal intervals.
4. The heat dissipating device for a computer according to any one of claims 1 to 3, wherein: a circle of convex rings (16) are annularly arranged at the inner side of the guide cover (10) and close to the upper end of the guide cover (10); the convex ring (16) is provided with a filter screen (15) for filtering dust, and the upper end surface of the filter screen (15) is in contact with the lower end surface of the panel (22).
5. The heat dissipating device for a computer according to claim 1, wherein: the bottom of the groove (11) is provided with a magnetic sheet (111), and the lower end of the guide cover (10) is provided with an iron sheet (102) which is adsorbed with the magnetic sheet (111).
6. The heat dissipating device for a computer according to claim 1, wherein: the inner wall of the groove (11) is at least provided with two L-shaped clamping grooves (112), and the outer side of the lower end of the guide cover (10) is provided with a clamping block (103).
7. The heat dissipating device for a computer according to claim 1, wherein: the power supply part (5) is a battery box provided with a storage battery or a USB plug connected with a USB interface of a computer.
8. The heat dissipating device for a computer according to claim 1, wherein: the supporting frame (8) is inclined, and an auxiliary frame (17) for auxiliary supporting is further arranged on the inner side of the supporting frame (8).
9. The heat dissipating device for a computer according to claim 1, wherein: when the lower end of the guide cover (10) is positioned in the groove (11), a blocking block (104) for positioning the radiating fan (3) is arranged on the guide cover (10), and the blocking block (104) is positioned at the lower end of the guide cover (10) which is in an arc-shaped side wall and protrudes inwards in the transverse direction.
10. The heat dissipating device for a computer according to claim 1, wherein: the side wall of the mounting plate (9) is also provided with a hollow structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922102649.5U CN210691237U (en) | 2019-11-29 | 2019-11-29 | Heat radiator for be used for computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922102649.5U CN210691237U (en) | 2019-11-29 | 2019-11-29 | Heat radiator for be used for computer |
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| Publication Number | Publication Date |
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| CN210691237U true CN210691237U (en) | 2020-06-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922102649.5U Active CN210691237U (en) | 2019-11-29 | 2019-11-29 | Heat radiator for be used for computer |
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| CN (1) | CN210691237U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113842028A (en) * | 2021-11-11 | 2021-12-28 | 广东美的厨房电器制造有限公司 | Cooking utensil |
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2019
- 2019-11-29 CN CN201922102649.5U patent/CN210691237U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113842028A (en) * | 2021-11-11 | 2021-12-28 | 广东美的厨房电器制造有限公司 | Cooking utensil |
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