CN210689921U

CN210689921U - Pressure sensor chip

Info

Publication number: CN210689921U
Application number: CN201921437110.9U
Authority: CN
Inventors: 邢志刚
Original assignee: Shenzhen Speed Electronics Co ltd
Current assignee: Shenzhen Speed Electronics Co ltd
Priority date: 2019-08-30
Filing date: 2019-08-30
Publication date: 2020-06-05
Anticipated expiration: 2029-08-30

Abstract

The utility model discloses a pressure sensor chip, include: casing and circuit board, the casing includes high temperature resistant layer, waterproof layer, corrosion resistant layer, wearing layer and dope layer, the dope layer is heat conduction silicone layer, the wearing layer is the silicon nitride layer, the corrosion resistant layer is the epoxy layer, the waterproof layer is waterproof ventilative rete, high temperature resistant layer is high temperature resistant fibre layer, glue fixedly connected with apron is passed through at the top of casing, the louvre has been seted up on the apron, the top subsides of apron are equipped with the heat conduction pad, the equal fixedly connected with pin in the left and right sides of casing, the pin includes copper sheet and silvered film, pin and circuit board electric connection. From this, mutually support through waterproof layer, dope layer, louvre and heat conduction pad, it is poor to have solved present pressure sensor chip radiating effect, at the in-process of long-time use, leads to the internal circuit to damage easily, influences life's problem.

Description

Pressure sensor chip

Technical Field

The utility model relates to a pressure sensor subassembly technical field specifically is a pressure sensor chip.

Background

The pressure sensor is a device or a device which can sense pressure signals and can convert the pressure signals into usable output electric signals according to a certain rule, the pressure sensor is generally composed of a pressure sensitive element and a signal processing unit, according to different testing pressure types, the pressure sensor can be divided into a gauge pressure sensor, a differential pressure sensor and an absolute pressure sensor, the pressure sensor is the most common sensor in industrial practice, is widely applied to various industrial automatic control environments and relates to various industries such as water conservancy and hydropower, railway traffic, intelligent buildings, production automatic control, aerospace, war industry, petrifaction, oil wells, electric power, ships, machine tools, pipelines and the like, the pressure sensor is composed of a plurality of parts, the chip is one of the industries, but the existing pressure sensor chip has poor heat dissipation effect and is easy to cause damage to an internal circuit in the long-term use process, the service life is influenced, and therefore, a pressure sensor chip is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a pressure sensor chip possesses the good advantage of radiating effect, and it is poor to have solved present pressure sensor chip radiating effect, at the in-process of long-time use, leads to the internal circuit to damage easily, influences life's problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a pressure sensor chip, includes casing and circuit board, the casing includes high temperature resistant layer, waterproof layer, corrosion resistant layer, wearing layer and dope layer, the dope layer is heat conduction silicone layer, the wearing layer is silicon nitride layer, the corrosion resistant layer is the epoxy layer, the waterproof layer is waterproof ventilative rete, high temperature resistant layer is high temperature resistant fibrous layer, glue fixedly connected with apron is passed through at the top of casing, the louvre has been seted up on the apron, the top subsides of apron are equipped with the heat conduction pad, the equal fixedly connected with pin of the left and right sides of casing, the pin includes copper sheet and silvered film layer.

Preferably, the pins are electrically connected with the circuit board, and the silver coating is positioned on the outer surface of the copper sheet.

Preferably, the shell and the cover plate are made of the same material, and the inner cavity of the shell is fixedly connected with the circuit board through screws.

Preferably, the coating layer is positioned on the outer surface of the wear-resistant layer, and the wear-resistant layer is positioned on the outer surface of the corrosion-resistant layer.

Preferably, the corrosion-resistant layer is positioned on the outer surface of the waterproof layer, and the waterproof layer is positioned on the outer surface of the high-temperature-resistant layer.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the utility model can install the chip at the place needing to be installed through the pins, play the role of protecting the circuit board through the shell and the cover plate, utilize the high temperature resistant layer to improve the high temperature resistant effect of the chip, avoid the chip from being in high temperature for a long time to cause the damage of parts and influencing the service life, through the corrosion resistant layer, prevent the chip from being corroded by the substances in the external environment to cause the service life to be shortened, through the wear resistant layer, improve the wear resistant effect of the chip, prevent the chip from being worn by foreign objects in the using process, through the coating layer, utilize the heat conduction silicone grease layer to have high heat conductivity, excellent heat conductivity, good electric insulativity, wider service temperature, good use stability, lower consistency and good construction performance, can play the heat radiation effect to the chip, avoid the damage of parts caused by the over-high temperature of the chip, utilize the waterproof layer to play the waterproof and breathable role, utilize the louvre can improve ventilation effect for inside steam discharge chip, improve the radiating effect, utilize the heat conduction pad to have good heat conductivility and high-grade withstand voltage, further improved the heat conduction radiating effect of chip, it is poor to have solved present pressure sensor chip radiating effect, at the in-process of long-time use, leads to the internal circuit to damage easily, influences life's problem.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the housing structure of the present invention;

fig. 3 is a schematic diagram of the pin structure of the present invention.

In the figure: 1. a housing; 11. a high temperature resistant layer; 12. a waterproof layer; 13. a corrosion-resistant layer; 14. a wear layer; 15. a coating layer; 2. a pin; 21. a copper sheet; 22. a silver coating layer; 3. a cover plate; 4. heat dissipation holes; 5. a thermally conductive pad; 6. a circuit board.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The utility model discloses a casing 1, high temperature resistant layer 11, waterproof layer 12, corrosion-resistant layer 13, wearing layer 14, dope layer 15, pin 2, copper sheet 21, silvered film 22, apron 3, louvre 4, heat conduction pad 5 and circuit board 6 part are the parts that general standard component or field technical personnel know, and its structure and principle all are this technical personnel all can learn through the technical manual or learn through conventional experimental approach.

Referring to fig. 1-3, a pressure sensor chip comprises a housing 1 and a circuit board 6, wherein the housing 1 comprises a high temperature resistant layer 11, a waterproof layer 12, an anti-corrosion layer 13, an anti-wear layer 14 and a coating layer 15, the coating layer 15 is located on the outer surface of the anti-wear layer 14, the anti-wear layer 14 is located on the outer surface of the anti-corrosion layer 13, the anti-corrosion layer 13 is located on the outer surface of the waterproof layer 12, the waterproof layer 12 is located on the outer surface of the high temperature resistant layer 11, the coating layer 15 is a heat conductive silicone layer, the anti-wear layer 14 is a silicon nitride layer, the anti-corrosion layer 13 is an epoxy resin layer, the waterproof layer 12 is a waterproof breathable film layer, the high temperature resistant layer 11 is a high temperature resistant fiber layer, the top of the housing 1 is fixedly connected with a cover plate 3 through glue, the housing 1 and the cover plate 3 are made of the same heat dissipation hole material, pins 2 are fixedly connected to the left side and the right side of the shell 1, the pins 2 comprise a copper sheet 21 and a silver-plated layer 22, the chip can be installed in a place needing to be installed through the pins 2, the shell 1 and the cover plate 3 play a role of protecting the circuit board 6, the high-temperature resistant layer 11 is utilized to improve the high-temperature resistant effect of the chip, the problem that the service life of the chip is influenced by the damage of parts due to the long-term high temperature is avoided, the corrosion-resistant layer 13 can prevent the chip from being corroded by substances in the external environment to shorten the service life, the wear-resistant layer 14 can improve the wear-resistant effect of the chip and prevent the chip from being worn by foreign objects in the using process, the heat-conducting silicone grease layer 15 is utilized to have high heat conductivity, excellent heat conductivity, good electric insulation, wide service temperature, good use stability, low consistency and good construction performance, can play radiating effect to the chip, avoid the too high component damage that leads to of chip temperature, utilize waterproof layer 12 to play waterproof ventilative effect, utilize louvre 4 can improve ventilation effect, make inside steam discharge chip, improve the radiating effect, utilize heat conduction pad 5 to have good heat conductivility and high-grade withstand voltage, the heat conduction radiating effect of chip has further been improved, it is poor to have solved present pressure sensor chip radiating effect, at the in-process of long-time use, lead to the internal circuit to damage easily, influence life's problem, pin 2 and circuit board 6 electric connection, silvered film 22 is located copper sheet 21's surface.

When in use, the chip can be installed at a place needing to be installed through the pins 2, the circuit board 6 is protected through the shell 1 and the cover plate 3, the high temperature resistant layer 11 is utilized to improve the high temperature resistant effect of the chip, the influence of the damage of parts to the service life caused by the long-term high temperature of the chip is avoided, the corrosion resistant layer 13 is utilized to prevent the chip from being corroded by substances in the external environment to shorten the service life, the wear resistant layer 14 is utilized to improve the wear resistant effect of the chip and prevent the chip from being worn by foreign objects in the using process, the coating layer 15 is utilized to have high thermal conductivity, excellent thermal conductivity, good electrical insulation, wider service temperature, good use stability, lower consistency and good construction performance, the heat dissipation effect of the chip is achieved, and the damage of parts caused by the overhigh temperature of the chip is avoided, utilize waterproof layer 12 can play waterproof ventilative effect, utilize louvre 4 can improve ventilation effect for inside steam discharge chip, improve the radiating effect, utilize heat conduction pad 5 to have good heat conductivility and high-grade withstand voltage, further improved the heat conduction radiating effect of chip, it is poor to have solved present pressure sensor chip radiating effect, at the in-process of long-time use, lead to internal circuit to damage easily, influence life's problem.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A pressure sensor chip comprising a housing (1) and a circuit board (6), characterized in that: casing (1) is including high temperature resistant layer (11), waterproof layer (12), corrosion resistant layer (13), wearing layer (14) and dope layer (15), dope layer (15) are heat conduction silicone grease layer, wearing layer (14) are silicon nitride layer, corrosion resistant layer (13) are epoxy layer, waterproof layer (12) are waterproof ventilative rete, high temperature resistant layer (11) are high temperature resistant fibre layer, glue fixedly connected with apron (3) is passed through at the top of casing (1), louvre (4) have been seted up on apron (3), the top subsides of apron (3) are equipped with heat conduction pad (5), the equal fixedly connected with pin (2) of the left and right sides of casing (1), pin (2) are including copper sheet (21) and silvered layer (22).

2. A pressure sensor die according to claim 1, wherein: the pins (2) are electrically connected with the circuit board (6), and the silver coating (22) is positioned on the outer surface of the copper sheet (21).

3. A pressure sensor die according to claim 1, wherein: the shell (1) and the cover plate (3) are made of the same material, and the inner cavity of the shell (1) is fixedly connected with the circuit board (6) through screws.

4. A pressure sensor die according to claim 1, wherein: the coating layer (15) is positioned on the outer surface of the wear-resistant layer (14), and the wear-resistant layer (14) is positioned on the outer surface of the corrosion-resistant layer (13).

5. A pressure sensor die according to claim 1, wherein: the corrosion-resistant layer (13) is positioned on the outer surface of the waterproof layer (12), and the waterproof layer (12) is positioned on the outer surface of the high-temperature-resistant layer (11).