CN202759732U - Water cooling plate - Google Patents
Water cooling plate Download PDFInfo
- Publication number
- CN202759732U CN202759732U CN 201220450997 CN201220450997U CN202759732U CN 202759732 U CN202759732 U CN 202759732U CN 201220450997 CN201220450997 CN 201220450997 CN 201220450997 U CN201220450997 U CN 201220450997U CN 202759732 U CN202759732 U CN 202759732U
- Authority
- CN
- China
- Prior art keywords
- drainage
- water
- cooled plate
- cooling water
- cooling plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to an electronic device, and particularly relates to dissipation of heat generated by computer devices such as a server, a network device and a PC. A water cooling plate includes a water cooling plate and a drainage device, wherein the water cooling plate is packaged in the drainage device. The drainage device is a semi-sealed structure, and includes a drainage cover and connectors, wherein cooling water comes from a water inlet and a water outlet and leaked-out cooling water can only pass through the connectors; drainage grooves are disposed inside the drainage cover; the cooling water can flow to the connectors through the drainage grooves; and the connectors is connected with a cooling water recovery device for guiding the leaked-out cooling water to flow to the cooling water recovery device. A surface of the drainage cover in contact with a thermal conductive surface of the water cooling plate is provided with thermal conductive silicon membrane. The water cooling plate enables the leaked-out cooling to get relatively good control, thereby improving waterproof performance.
Description
Technical field
The utility model relates to electronic equipment, and the row who particularly relates to the heat of the computer equipments generations such as server, the network equipment, PC falls apart.
Background technology
The cooled plate of using in the present computer equipment is generally made by good metal materials of heat conductivility such as copper aluminium, the heat conductive silica gel pad is installed between cooled plate and heat-producing device during installation or is smeared heat conductive silica gel.Aspect waterproof, generally pay attention to the sealing of cooled plate itself, and the drainage system behind the cooling water leakage is not installed.The shortcoming of this mode is that the cooling water that leaks out can not be controlled when cooling water leakage occurs, causes damage to computer equipment easily or makes troubles to follow-up maintain and replace work.
The utility model content
Can not be controlled for solving the cooling water that cooled plate leaks out in the prior art, the problem that causes damage to computer equipment easily or make troubles to follow-up maintain and replace work, the utility model provides a kind of cooled plate, outside at the light water cold drawing is equipped with drainage system, the cooling water that leaks out can be drained in the retracting device of cooling water.The advantage of this scheme is that this cooled plate is controlled the cooling water that leaks out preferably, has improved water resistance.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of cooled plate includes cooled plate and drainage system, and cooled plate is encapsulated in the drainage system.Drainage system is Semi-seal structure, comprises drainage hood and joint, and the intake-outlet of cooled plate and the cooling water that leaks out can only pass through from the joint.Drainage trough is arranged in the drainage hood, and cooling water can flow to joint by drainage trough, and joint is connected with cooling water recovery device, and the cooling water that is used for leaking out drains in the cooling water recovery device.The contacted face of the thermal conductive surface of drainage hood and cooled plate is the thermal conductive silicon glued membrane.
The beneficial effects of the utility model are that this cooled plate is controlled the cooling water that leaks out preferably, has improved water resistance.
Description of drawings
Fig. 1 is the planar structure schematic diagram according to cooled plate of the present utility model.
Fig. 2 is the cross-sectional view according to cooled plate of the present utility model.
Among the figure, 1. cooled plate, 2. drainage system, 3. drainage hood, 4. joint, the 5. intake-outlet of cooled plate, 6. drainage trough, the 7. thermal conductive surface of cooled plate, 8. thermal conductive silicon glued membrane.
Embodiment
Below in conjunction with drawings and Examples the utility model is further specified.
Such as Fig. 1, shown in 2: a kind of cooled plate, include (1) cooled plate and (2) drainage system, (1) cooled plate is encapsulated in (2) drainage system.(2) drainage system is Semi-seal structure, comprises (3) drainage hood and (4) joint, and the intake-outlet of (5) cooled plate and the cooling water that leaks out can only pass through from (4) joint.(3) (6) drainage trough is arranged in the drainage hood, cooling water can flow to (4) joint by (6) drainage trough.(3) drainage hood is (8) thermal conductive silicon glued membrane with the contacted face of thermal conductive surface of (7) cooled plate.
Claims (3)
1. cooled plate, it is characterized in that: include cooled plate and drainage system, described cooled plate is encapsulated in the described drainage system.
2. cooled plate according to claim 1, it is characterized in that: described drainage system is Semi-seal structure, includes drainage hood and joint, the intake-outlet of described cooled plate and the cooling water that leaks out can only pass through from the joint; In the described drainage hood drainage trough is arranged.
3. cooled plate according to claim 1 and 2, it is characterized in that: the contacted face of the thermal conductive surface of described drainage hood and described cooled plate is the thermal conductive silicon glued membrane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220450997 CN202759732U (en) | 2012-09-06 | 2012-09-06 | Water cooling plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220450997 CN202759732U (en) | 2012-09-06 | 2012-09-06 | Water cooling plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202759732U true CN202759732U (en) | 2013-02-27 |
Family
ID=47738884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220450997 Expired - Fee Related CN202759732U (en) | 2012-09-06 | 2012-09-06 | Water cooling plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202759732U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103739195A (en) * | 2013-12-25 | 2014-04-23 | 中天科技精密材料有限公司 | Water cooling system for large-size optical fiber preformed rod and water cooling method thereof |
| CN105806134A (en) * | 2014-12-29 | 2016-07-27 | 中国兵器装备研究院 | Water cooling plate |
-
2012
- 2012-09-06 CN CN 201220450997 patent/CN202759732U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103739195A (en) * | 2013-12-25 | 2014-04-23 | 中天科技精密材料有限公司 | Water cooling system for large-size optical fiber preformed rod and water cooling method thereof |
| CN105806134A (en) * | 2014-12-29 | 2016-07-27 | 中国兵器装备研究院 | Water cooling plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130227 Termination date: 20130906 |