CN204481019U - A kind of liquid cooling plate with adjustable heat-conducting block - Google Patents
A kind of liquid cooling plate with adjustable heat-conducting block Download PDFInfo
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- CN204481019U CN204481019U CN201520223997.7U CN201520223997U CN204481019U CN 204481019 U CN204481019 U CN 204481019U CN 201520223997 U CN201520223997 U CN 201520223997U CN 204481019 U CN204481019 U CN 204481019U
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- heat
- conducting
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- liquid cooling
- cold drawing
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Abstract
The utility model discloses a kind of liquid cooling plate with adjustable heat-conducting block, relate to communication technical field, this liquid cooling plate comprises cold drawing, lower cold drawing is fixed with bottom it, the upper surface of lower cold drawing has conduit, liquid cooling pipe is provided with in conduit, the bottom of lower cold drawing is provided with some heat-conducting blocks with the corresponding part of conduit, the bottom of every block heat-conducting block is all fixed with the heat-conducting pad for contacting with chip, the top of every block heat-conducting block is all fixed with at least one screw, every block heat-conducting block is all connected by the bottom of screw with lower cold drawing, on all screws, all cover has preloading spring, the thickness of described heat-conducting pad is 0.5 ~ 1.5mm.The utility model is not only convenient to install and is regulated, and effectively can improve the heat dispersion of liquid cooling plate, avoids the contact of heat-conducting pad and chip excessive and causes chip impaired.
Description
Technical field
The utility model relates to communication technical field, is specifically related to a kind of liquid cooling plate with adjustable heat-conducting block.
Background technology
Along with the development of science and technology, the device integration in the fields such as communication and IT is more and more higher, and heat dissipation problem has seriously constrained the performance of chip, and the exchange capacity of equipment is subject to great restriction thereupon.The requirement of current equipment to radiating module is also more and more higher, and liquid-cooling heat radiation mode is also more and more to be applied in family expenses and industrial equipment, and there are the following problems to use liquid-cooling heat radiation mode:
The liquid cooling plate of current use, is provided with heat-conducting block in the bottom of liquid cooling plate, and the bottom of heat-conducting block is fixed with the heat-conducting pad for contacting with chip.To be fixed on conplane multiple chip dispel the heat simultaneously time, because each chip model is different, often reveal chip can not with the problem of corresponding heat-conducting pad reliable contacts, usually the thickness increasing heat-conducting pad is needed, thus cause the thermal resistance of liquid cooling plate to increase, heat dispersion is low, and heat-conducting pad limits by self-strength, contact reliability is lower, and the ability that each chip bears pressure is not identical, if ensure the reliable contacts of chip and corresponding heat-conducting pad, and increase the contact of heat-conducting pad and chip, when contact is excessive, then easily cause chip impaired.
Utility model content
For the defect existed in prior art, the purpose of this utility model is to provide a kind of liquid cooling plate with adjustable heat-conducting block, not only be convenient to install and regulate, and effectively can improve the heat dispersion of liquid cooling plate, avoid the contact of heat-conducting pad and chip excessive and cause chip impaired.
For reaching above object, the utility model provides a kind of liquid cooling plate with adjustable heat-conducting block, comprise cold drawing, lower cold drawing is fixed with bottom it, the upper surface of lower cold drawing has conduit, liquid cooling pipe is provided with in conduit, the bottom of lower cold drawing is provided with some heat-conducting blocks with the corresponding part of conduit, the bottom of every block heat-conducting block is all fixed with the heat-conducting pad for contacting with chip, the top of every block heat-conducting block is all fixed with at least one screw, every block heat-conducting block is all connected by the bottom of screw with lower cold drawing, on all screws, all cover has preloading spring, the thickness of described heat-conducting pad is 0.5 ~ 1.5mm.
On the basis of technique scheme, the top of every block heat-conducting block is all fixed with 4 screws, and the line of centres of 4 screws is square.
On the basis of technique scheme, in described conduit, be filled with heat-conducting medium.
On the basis of technique scheme, the bottom of described lower cold drawing is provided with 2 ~ 10 pieces of heat-conducting blocks with the corresponding part of conduit.
On the basis of technique scheme, the thickness of described heat-conducting pad is 0.8 ~ 1.2mm.
On the basis of technique scheme, the thickness of described heat-conducting pad is 1mm.
On the basis of technique scheme, described heat-conducting pad is rubber sheet gasket.
Compared with prior art, the utility model has the advantage of:
Heat-conducting block in the utility model is fixed with screw, on screw, cover has preloading spring, pass through rotary screw, heat-conducting block is moved relative to lower cold drawing, ensure that all heat-conducting pads all can contact with corresponding chip, compared with ensureing that heat-conducting pad contacts with corresponding chip with the thickness by increasing heat-conducting pad, being not only convenient to install and regulating, and effectively can improve the heat dispersion of liquid cooling plate; Regulate heat-conducting pad and the contact of corresponding chip by preloading spring, the contact of heat-conducting pad and chip can be avoided excessive and cause chip impaired.
Accompanying drawing explanation
Fig. 1 is the structural representation of lower cold drawing in the utility model embodiment.
Fig. 2 is the structural representation that in the utility model embodiment, lower cold drawing is connected with heat-conducting block.
In figure: cold drawing under 1-, 2-liquid cooling pipe, 3-screw, 4-preloading spring, 5-heat-conducting block, 6-heat-conducting pad.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in further detail.
The utility model embodiment provides a kind of liquid cooling plate with adjustable heat-conducting block, comprises cold drawing, is fixed with lower cold drawing 1 bottom it, shown in Figure 1, and the upper surface of lower cold drawing 1 has conduit, is provided with liquid cooling pipe 2, is filled with heat-conducting medium in conduit in conduit.Shown in Figure 2, the bottom of lower cold drawing 1 is provided with some heat-conducting blocks 5 with the corresponding part of conduit, is preferably 2 ~ 10 pieces of heat-conducting blocks 5.The top of every block heat-conducting block 5 is all fixed with at least one screw 3, and the line of centres being preferably 4 screws, 3,4 screws 3 is square, and every block heat-conducting block 5 is all connected by the bottom of screw 3 with lower cold drawing 1, and on all screws 3, all cover has preloading spring 4.The bottom of every block heat-conducting block 5 is all fixed with the heat-conducting pad 6 for contacting with chip, and the thickness of heat-conducting pad 6 is 0.5 ~ 1.5mm, is generally 0.8 ~ 1.2mm, is preferably 1mm.Heat-conducting pad 6 is rubber sheet gasket.
To be fixed on conplane multiple chip dispel the heat simultaneously time, by rotary screw 3, heat-conducting block 5 is moved relative to lower cold drawing 1, ensure that the heat-conducting pad 6 bottom all heat-conducting blocks 5 all can contact with corresponding chip, and apply a pressure at the upper surface of upper cold drawing, thus apply a pretightning force to heat-conducting pad 6 by preloading spring 4, make heat-conducting pad 6 keep the trend of maximal clearance relative to lower cold drawing 1.Be placed on by liquid cooling plate on all chips, preloading spring 4 forced contraction, each heat-conducting pad 6 and corresponding chip realize contacting completely, and the heat distributed by each chip is directly delivered to liquid cooling pipe 2 by heat-conducting block 5.
The utility model is not only confined to above-mentioned preferred forms; anyone can draw other various forms of products under enlightenment of the present utility model; no matter but any change is done in its shape or structure; every have identical with the utility model or akin technical scheme, all within its protection range.
Claims (7)
1. one kind has the liquid cooling plate of adjustable heat-conducting block, comprise cold drawing, lower cold drawing (1) is fixed with bottom it, the upper surface of lower cold drawing (1) has conduit, liquid cooling pipe (2) is provided with in conduit, the lower bottom of cold drawing (1) is provided with some heat-conducting blocks (5) with the corresponding part of conduit, the bottom of every block heat-conducting block (5) is all fixed with the heat-conducting pad (6) for contacting with chip, it is characterized in that: the top of every block heat-conducting block (5) is all fixed with at least one screw (3), every block heat-conducting block (5) is all connected by the bottom of screw (3) with lower cold drawing (1), on all screws (3), all cover has preloading spring (4), the thickness of described heat-conducting pad (6) is 0.5 ~ 1.5mm.
2. there is the liquid cooling plate of adjustable heat-conducting block as claimed in claim 1, it is characterized in that: the top of every block heat-conducting block (5) is all fixed with 4 screws (3), and the line of centres of 4 screws (3) is square.
3. there is the liquid cooling plate of adjustable heat-conducting block as claimed in claim 1, it is characterized in that: in described conduit, be filled with heat-conducting medium.
4. there is the liquid cooling plate of adjustable heat-conducting block as claimed in claim 1, it is characterized in that: the described bottom of lower cold drawing (1) and the corresponding part of conduit are provided with 2 ~ 10 pieces of heat-conducting blocks (5).
5. there is the liquid cooling plate of adjustable heat-conducting block as claimed in claim 1, it is characterized in that: the thickness of described heat-conducting pad (6) is 0.8 ~ 1.2mm.
6. there is the liquid cooling plate of adjustable heat-conducting block as claimed in claim 5, it is characterized in that: the thickness of described heat-conducting pad (6) is 1mm.
7. the liquid cooling plate with adjustable heat-conducting block as described in any one of claim 1 to 6, is characterized in that: described heat-conducting pad (6) is rubber sheet gasket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520223997.7U CN204481019U (en) | 2015-04-14 | 2015-04-14 | A kind of liquid cooling plate with adjustable heat-conducting block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520223997.7U CN204481019U (en) | 2015-04-14 | 2015-04-14 | A kind of liquid cooling plate with adjustable heat-conducting block |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204481019U true CN204481019U (en) | 2015-07-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520223997.7U Active CN204481019U (en) | 2015-04-14 | 2015-04-14 | A kind of liquid cooling plate with adjustable heat-conducting block |
Country Status (1)
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| CN (1) | CN204481019U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109193071A (en) * | 2018-09-07 | 2019-01-11 | 浙江清优材料科技有限公司 | A kind of liquid cooling plate of integrated heat-conducting layer |
| CN110662389A (en) * | 2018-06-28 | 2020-01-07 | 华为技术有限公司 | Heat dissipation device and electronic equipment |
| CN111315192A (en) * | 2020-03-11 | 2020-06-19 | 合肥丰蓝电器有限公司 | Liquid cooling type cold plate heat pipe heat exchange device |
| TWI810844B (en) * | 2022-03-10 | 2023-08-01 | 英業達股份有限公司 | Water-cooling plate assembly |
-
2015
- 2015-04-14 CN CN201520223997.7U patent/CN204481019U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110662389A (en) * | 2018-06-28 | 2020-01-07 | 华为技术有限公司 | Heat dissipation device and electronic equipment |
| CN109193071A (en) * | 2018-09-07 | 2019-01-11 | 浙江清优材料科技有限公司 | A kind of liquid cooling plate of integrated heat-conducting layer |
| CN109193071B (en) * | 2018-09-07 | 2024-02-13 | 浙江清优材料科技有限公司 | Liquid cooling plate integrated with heat conducting layer |
| CN111315192A (en) * | 2020-03-11 | 2020-06-19 | 合肥丰蓝电器有限公司 | Liquid cooling type cold plate heat pipe heat exchange device |
| TWI810844B (en) * | 2022-03-10 | 2023-08-01 | 英業達股份有限公司 | Water-cooling plate assembly |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |