CN210670849U - Anti-corrosion structure of electronic product contact - Google Patents
Anti-corrosion structure of electronic product contact Download PDFInfo
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- CN210670849U CN210670849U CN201920152786.7U CN201920152786U CN210670849U CN 210670849 U CN210670849 U CN 210670849U CN 201920152786 U CN201920152786 U CN 201920152786U CN 210670849 U CN210670849 U CN 210670849U
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The utility model relates to the technical field of electronic products, and discloses an electronic product contact corrosion-resistant structure, which comprises a shell, wherein a surface-roughened contact structure layer formed by surface treatment is arranged on the surface of the shell, and a compact wear-resistant corrosion-resistant metal protective layer covers the surface of the contact structure layer; and a sealing isolation structure at least covering the edge gap position between the metal protective layer and the contact structure layer is arranged on the surface of the shell. A sealing structure layer or a sealing isolation layer is formed on the surface of the shell, so that an edge gap between the metal protection layer and the contact structure layer is isolated from the outside air, electrochemical corrosion caused by the fact that moisture and ions form a primary battery at the edge gap position is avoided, the corrosion resistance of the contact is further improved, and the overall performance of an electronic product is improved.
Description
Technical Field
The utility model relates to an electron product field, in particular to anticorrosive structure of electron product contact.
Background
The antenna arranged on the intelligent terminal product is generally formed by combining a metal shell and a contact, for example, the internal structures of the shell and the middle frame of a mobile phone and a tablet personal computer mainly comprise metal materials such as aluminum alloy and magnesium alloy, and taking the mobile phone as an example, all components in the mobile phone are connected through the contact except for permanent connection. The location of the contacts is typically provided on a metal housing, but many terminal housings or center structures are constructed using metal and plastic in combination with each other, such as by in-molding portions of a plastic frame or the like on a metal substrate, with the location of the contacts being selected and arranged by the location arrangement of the various components of the terminal. In order to overcome the problems that the contact is not wear-resistant and is easy to oxidize to cause poor contact, the applicant proposes that a compact wear-resistant corrosion-resistant metal protective layer is covered on the surface of the contact structure, so that the wear resistance, corrosion resistance and oxidation resistance of the contact can be greatly enhanced, and the overall performance of the mobile phone is greatly improved.
However, in the using process, in some environments with high temperature and humidity, most of electronic products cannot be completely isolated from the outside, moisture and ions in the air easily enter the electronic products, and a primary battery structure is formed at the edge gap position of the contact structure layer and the metal protection layer, so that electrochemical corrosion occurs at the edge gap position of the contact structure layer, the metal protection layer and the electronic product shell, and the service lives of the contact structure layer and the metal protection layer are influenced.
SUMMERY OF THE UTILITY MODEL
The utility model provides an anticorrosive structure of electronic product contact solves current contact structural layer, metal inoxidizing coating and electronic product casing and takes place electrochemical corrosion in edge gap position to the technical problem of contact structural layer and metal inoxidizing coating's life has been influenced.
In order to solve the technical problem, the utility model provides an electronic product contact corrosion-resistant structure, the electronic product has a shell, the surface of the shell is provided with a contact structure layer with roughened surface, which is formed by surface treatment, and the surface of the contact structure layer is covered with a compact wear-resistant corrosion-resistant metal protection layer; and a sealing isolation structure at least covering the edge gap position between the metal protective layer and the contact structure layer is arranged on the surface of the shell.
Furthermore, the sealing isolation structure is a sealing structure layer at the edge gap position between the metal protection layer and the contact structure layer through coating, dispensing, sucking coating, spraying, oxidation treatment and phosphating treatment.
Furthermore, the sealing isolation structure is a film-shaped sealing isolation layer formed on the surface of the shell by coating, sucking and spraying, and the sealing isolation layer at least covers the edge gap position between the metal protection layer and the contact structure layer.
Furthermore, a groove is formed in the surface of the shell corresponding to the position of the contact, the groove is provided with a contact structure layer which is formed through surface treatment and has a roughened surface, and a compact wear-resistant corrosion-resistant metal protection layer covers the surface of the contact structure layer; the metal protection layer and the surface of the shell are positioned on the same plane, and a sealing structure layer is arranged at an edge gap between the surface of the shell and the metal protection layer;
or a sealing isolation layer is arranged on the surface of the shell and at least covers the edge gap between the surface of the shell and the metal protection layer.
Furthermore, a groove is formed in the position, corresponding to the contact, of the surface of the shell, a contact structure layer which is formed through surface treatment and is roughened in the surface is arranged in the groove, a compact wear-resistant corrosion-resistant metal protection layer covers the surface of the contact structure layer, the area of the metal protection layer is smaller than that of the contact structure layer, and a sealing structure layer is arranged in a gap formed between the contact structure layer and the periphery of the metal protection layer.
Furthermore, the metal protective layer is a metal particle coating or a metal powder coating which is uniformly sprayed on the rough surface of the contact structure layer.
Optionally, the metal protection layer may be a plurality of material layers such as wear-resistant, corrosion-resistant and oxidation-resistant copper alloy, and is preferably a phosphor bronze protection layer.
Further, the contact structure layer is in any shape or a combination of any shapes of circles, rectangles, triangles, ellipses, irregular polygons, line segments, arcs, letters, characters, symbols and numbers.
Optionally, the width, area and thickness of the contact structure layer are respectively a, s and h, wherein a is greater than or equal to 0.2mm, and s is greater than or equal to 0.04mm2，h≥0.01mm。
Optionally, the surface of the shell is provided with an anode treatment layer, and the position of the contact structure layer is not provided with the anode treatment layer.
Optionally, the housing is made of stainless steel or hard alloy, the surface of the housing is plated with a PVD film, and the contact structure layer is not provided with the PVD film.
Optionally, the electronic product includes a smart phone, a tablet computer, a notebook computer, a smart home appliance, and a smart wearable device.
The utility model discloses an anticorrosive structure of electronic product contact, be provided with the sealed isolation structure who covers edge gap position between metal protective layer and the contact structural layer at least through housing face, sealed isolation structure can pass through the coating, the involucra, inhale and cover, spout and cover, technology settings such as oxidation, form sealed structural layer or sealed isolation layer on housing face, make edge gap and outside air between metal protective layer and the contact structural layer keep apart, avoided edge gap position because moisture and ion form the primary cell, electrochemical corrosion takes place, thereby the anticorrosive ability of contact has further been improved, electronic product wholeness can has been promoted.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention, but should not be construed as limiting the invention in any way:
FIG. 1 is a schematic view of the structure of the contact structure on the housing of the present invention,
fig. 2 is a cross-sectional structural view of a first electronic product contact corrosion-resistant structure according to an embodiment of the present invention;
FIG. 3 is a diagram illustrating a first exemplary embodiment of a sealing compound state of a contact corrosion-resistant structure of an electronic product;
fig. 4 is a sectional structural view of a contact corrosion-resistant structure of a second electronic product according to an embodiment of the present invention;
fig. 5 is a cross-sectional structural view of a contact corrosion-resistant structure of a third electronic product according to an embodiment of the present invention;
fig. 6 is a cross-sectional structural view of a fourth anti-corrosion structure of an electronic product contact according to an embodiment of the present invention;
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings. It is to be understood that the description of the embodiments herein is for purposes of illustration and explanation only and is not intended to limit the invention.
As shown in fig. 1-6, for the anti-corrosion structure of the electronic product contact provided by the present invention, the electronic product has a housing 100, the housing has a housing surface 110, a surface-roughened contact structure layer 111 formed by surface treatment is disposed on the housing surface 110, and the surface of the contact structure layer 111 is covered with a dense wear-resistant anti-corrosion metal protection layer 112; a sealing isolation structure is disposed on the housing surface 110 to cover at least the edge gap between the metal protection layer 112 and the contact structure layer 111.
Specifically, as shown in fig. 2, the sealing isolation structure is a sealing structure layer 114 disposed at an edge gap between the metal protection layer 112 and the contact structure layer 111 by coating, dispensing, suction coating, spraying, oxidation treatment, and phosphating treatment. The sealing structure layer 114 is formed by coating, sucking, spraying, dispensing (not limited to the above methods) dense substances such as sealant on the gap to form a strip-shaped or strip-shaped sealing structure, for example, the sealant has good sealing and insulating properties, and can be a commonly used sealant for electronic devices. As shown in fig. 3, the sealing structure layer 114 may be formed in various states at the edge gap position, but is not limited thereto.
The oxidation treatment is to perform oxidation treatment such as high temperature treatment on the gap position, so as to change the metal property of the gap position to form a compact oxidation structure layer, thereby having sealing and isolating performance.
Phosphorization is a common pretreatment technology, belongs to chemical conversion film treatment in principle, and is mainly applied to the phosphorization of steel surfaces, and nonferrous metal (such as aluminum and zinc) parts can also be applied to phosphorization. Phosphorization is a process of forming a phosphate chemical conversion film through chemical and electrochemical reactions, and the formed phosphate chemical conversion film is called a phosphorization film; the purpose of the phosphorization is mainly as follows: the base metal is protected, and the metal is prevented from being corroded to a certain extent; the primer is used for priming before painting, and the adhesive force and the corrosion resistance of a paint film layer are improved; plays a role in friction reduction and lubrication in the metal cold working process.
Specifically, as shown in fig. 4, the sealing isolation structure is a sealing isolation layer 115 that is coated, filmed, sucked, sprayed (not limited to the above), and is disposed on the housing surface 110, and the sealing isolation layer 115 at least covers the edge gap position between the metal protection layer 112 and the contact structure layer 111. The sealing isolation layer can be a sealing material film formed by various processes, or can be a sealing material film formed by ink, the surface of the shell can be formed by coating, ink and other process modes during processing, and the sealing isolation layer is removed by a surface treatment process at a corresponding contact metal protection layer or other positions needing to be exposed.
As shown in fig. 5, a groove 101 is formed in a position of the housing surface 110 corresponding to the contact, a contact structure layer 111 formed by surface treatment and having a roughened surface is disposed in the groove 101, and a dense wear-resistant and corrosion-resistant metal protection layer 112 covers the surface of the contact structure layer 111; the metal protection layer 112 and the shell surface 110 are in the same plane, and a sealing structure layer 114 is arranged at an edge gap between the shell surface 110 and the metal protection layer 112;
alternatively, a sealing barrier 115 is provided on the housing surface 110, and the sealing barrier 115 covers at least the edge gap between the housing surface 110 and the metal protective layer 112.
As shown in fig. 6, a groove 101 is formed in a position of the housing surface 110 corresponding to the contact, a contact structure layer 111 formed by surface treatment and having a roughened surface is disposed in the groove 101, a dense wear-resistant and corrosion-resistant metal protection layer 112 covers the surface of the contact structure layer 111, the area of the metal protection layer 112 is smaller than that of the contact structure layer 111, and a seal structure layer 114 is disposed in a gap formed between the contact structure layer 111 and the periphery of the metal protection layer 112.
Through setting up recess 101 for contact structural layer and metal protection layer need not occupy more high space, influence shell surface 110's roughness, especially after setting up sealed isolating structure, shell surface 110 also has better roughness.
The metal protection layer 112 is a metal particle coating or a metal powder coating which is uniformly sprayed on the rough surface of the contact structure layer 111; make the contact reduce wear and tear, corruption and oxidation, adopt this novel contact structure can strengthen the wearability, corrosion resistance, the oxidation resistance of contact greatly to improve the wholeness ability of cell-phone by a wide margin. The metal protection layer 112 may be two or more metal protection layers, and has wear-resistant, corrosion-resistant and electrically conductive functions as a whole.
The utility model discloses in, contact structural layer 111 is the combination of arbitrary one kind shape or arbitrary multiple shape in circle, rectangle, triangle-shaped, ellipse, irregular polygon, line segment, circular arc, letter and the digit, and technical personnel in this field can select above-mentioned shape according to actual needs, matches actual production.
Furthermore, the width, area and thickness of the contact structure layer 111 are respectively set to a, s and h, where a can satisfy a ≥ 0.2mm, s can satisfy s ≥ 0.04mm2, and h can satisfy h ≥ 0.01 mm.
The metal protection layer 112 may be a plurality of material layers such as a wear-resistant, corrosion-resistant, and oxidation-resistant copper alloy, preferably a phosphor bronze protection layer, which has not only good wear-resistant, corrosion-resistant, and oxidation-resistant properties, but also good conductivity, and is a preferred material for the metal protection layer.
In the existing electronic products, the housing 100 containing aluminum alloy is often used as the housing of the electronic product, wherein the housing 100 may include an outer shell, a middle frame and a bottom plate of the electronic product, but is not limited to the above. The contact structure layer 111 may be disposed on the inner and outer surfaces or the inner and outer side surfaces of the housing 100.
As shown in fig. 2, the housing surface 110 of the housing 100 is provided with an anodic treatment layer 113, since the anodic treatment layer 113 is not conductive, the contact position cannot have the anodic treatment layer 113, when making a contact, the contact can be covered by other regions and then the contact position is subjected to surface treatment to form a contact structure layer 111, and then metal particles or metal powder is uniformly sprayed to form a metal protection layer 112; in addition to aluminum-containing alloys, cases 100 containing stainless steel or cemented carbide are also widely used, and when the case 100 is a case 100 containing stainless steel or cemented carbide, the PVD film is plated on the case surface 110, and the contact locations cannot have a PVD film because the PVD film is not conductive.
For those skilled in the art, the electronic products include smart phones, tablet computers, notebook computers, smart appliances and smart wearable devices, and are not limited to these options, and the housing mentioned in the following text may be a housing with a board or a separate middle frame type housing, and the selection may be made according to the specific needs of those skilled in the art, and is not limited to the protection of the present invention.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, and the scope of the invention is to be accorded the full scope of the claims.
Claims (10)
1. An electronic product contact corrosion-resistant structure is characterized in that the electronic product is provided with a shell, a contact structure layer with a roughened surface is formed on the surface of the shell through surface treatment, and a compact wear-resistant corrosion-resistant metal protection layer covers the surface of the contact structure layer; and a sealing isolation structure at least covering the edge gap position between the metal protective layer and the contact structure layer is arranged on the surface of the shell.
2. The contact corrosion-resistant structure of claim 1, wherein the sealing isolation structure is a sealing structure layer at an edge gap position between the metal protection layer and the contact structure layer by coating, dispensing, suction coating, spraying, oxidation treatment, and phosphating treatment.
3. The corrosion-resistant structure for the contact of the electronic product as claimed in claim 1, wherein the sealing and isolating structure is a film-shaped sealing and isolating layer formed by coating, filming, sucking coating or spraying on the surface of the housing, and the sealing and isolating layer at least covers the edge gap position between the metal protective layer and the contact structure layer.
4. The contact corrosion-resistant structure of the electronic product as claimed in claim 1, wherein a groove is formed in the surface of the housing corresponding to the contact, a contact structure layer with a roughened surface is formed in the groove by surface treatment, and a dense wear-resistant corrosion-resistant metal protection layer covers the surface of the contact structure layer; the metal protection layer and the surface of the shell are positioned on the same plane, and a sealing structure layer is arranged at an edge gap between the surface of the shell and the metal protection layer;
or a sealing isolation layer is arranged on the surface of the shell and at least covers the edge gap between the surface of the shell and the metal protection layer.
5. The contact corrosion-resistant structure of the electronic product as claimed in claim 1, wherein a groove is formed in a position of the surface of the housing corresponding to the contact, a contact structure layer with a roughened surface is formed in the groove by surface treatment, a dense wear-resistant corrosion-resistant metal protection layer covers the surface of the contact structure layer, the area of the metal protection layer is smaller than that of the contact structure layer, and a sealing structure layer is arranged in a gap formed between the contact structure layer and the periphery of the metal protection layer.
6. The corrosion-resistant structure of the electronic product contact according to claim 1, wherein the metal protection layer is a metal particle coating or a metal powder coating uniformly sprayed on the rough surface of the contact structure layer.
7. The corrosion-resistant structure for the contact of the electronic product as claimed in claim 1, wherein the contact structure layer is in any one shape or any combination of shapes of a circle, a rectangle, a triangle, an ellipse, an irregular polygon, a line segment, a circular arc, a letter, a character, a symbol and a number.
8. The corrosion resistant structure of the electronic product contact of claim 7, wherein the width, area and thickness of the contact structure layer are a, s and h, respectively, wherein a is greater than or equal to 0.2mm, s is greater than or equal to 0.04mm2, and h is greater than or equal to 0.01 mm.
9. The corrosion-resistant structure for electronic product contacts according to claim 1, wherein the shell surface of the shell is provided with an anodized layer and the contact structure layer is not provided with the anodized layer;
or the shell is made of stainless steel or hard alloy, the surface of the shell is plated with a PVD film, and the position of the contact structure layer is not provided with the PVD film.
10. The contact corrosion-resistant structure of any one of claims 1-9, wherein the electronic product comprises a smart phone, a tablet computer, a notebook computer, a smart appliance, and a smart wearable device.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920152786.7U CN210670849U (en) | 2019-01-27 | 2019-01-27 | Anti-corrosion structure of electronic product contact |
| PCT/CN2019/112962 WO2020151275A1 (en) | 2019-01-27 | 2019-10-24 | Anti-corrosion structure of contacts of electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920152786.7U CN210670849U (en) | 2019-01-27 | 2019-01-27 | Anti-corrosion structure of electronic product contact |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210670849U true CN210670849U (en) | 2020-06-02 |
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| CN201920152786.7U Active CN210670849U (en) | 2019-01-27 | 2019-01-27 | Anti-corrosion structure of electronic product contact |
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| CN (1) | CN210670849U (en) |
| WO (1) | WO2020151275A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10164502B4 (en) * | 2001-12-28 | 2013-07-04 | Epcos Ag | Method for the hermetic encapsulation of a component |
| CN102255612A (en) * | 2011-03-09 | 2011-11-23 | 无锡市固特控制技术有限公司 | Full-electronic solid-state relay |
| CN207733123U (en) * | 2018-01-27 | 2018-08-14 | 千钧万泽(深圳)实业发展有限公司 | A kind of electronic product Wear-resistant corrosion-resistant contact structure |
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- 2019-01-27 CN CN201920152786.7U patent/CN210670849U/en active Active
- 2019-10-24 WO PCT/CN2019/112962 patent/WO2020151275A1/en active Application Filing
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| WO2020151275A1 (en) | 2020-07-30 |
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