CN210670839U - Inner layer scattering type glue-blocking pattern design circuit board - Google Patents
Inner layer scattering type glue-blocking pattern design circuit board Download PDFInfo
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- CN210670839U CN210670839U CN201921741670.3U CN201921741670U CN210670839U CN 210670839 U CN210670839 U CN 210670839U CN 201921741670 U CN201921741670 U CN 201921741670U CN 210670839 U CN210670839 U CN 210670839U
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Abstract
The utility model provides an inlayer scattering formula hinders gluey graphic design circuit board relates to the circuit board field. The effect of improving the production quality and the disposable yield is realized. This inner layer scattering hinders gluey graphic design circuit board, including circuit board body and sideboard, sideboard fixed mounting has seted up the fixed orifices in the both sides of circuit board body, the surface of sideboard and the position that is located both ends, and the circuit board body includes first copper foil layer, and the below fixed mounting on first copper foil layer has first PP lamella, and the below fixed mounting of first PP lamella has the second PP lamella, and the below fixed mounting of second PP lamella has the core, and the below fixed mounting of core has the third PP lamella. This figure design circuit board is glued to inlayer scattering formula hinders has solved the problem of the incomplete copper of etching after the pressfitting, substitutes the original glue point design that hinders with the gluey groove of flowing of dislocation between the layer, very big improvement production quality and disposable yields, satisfied batch production's processing requirement.
Description
Technical Field
The utility model relates to a circuit board technical field, very much be an inlayer scattering formula hinders gluey graphic design circuit board.
Background
The circuit board is also called as a PCB (printed circuit board), which is greatly developed along with the development of electronic technology, and is widely applied from an original single-layer board to a double-layer board and then to the most common multilayer board at present, particularly, the further miniaturization, standardization and modularization of some high-power products enable the design of copper thickness and the number of processing layers to be higher and higher, and further increase the processing difficulty of the process.
In the prior art, if a thick copper multilayer board adopts a conventional typesetting mode and glue blocking block pressing, white spots are easily generated between circuits and copper-free areas after etching.
SUMMERY OF THE UTILITY MODEL
The utility model provides an invention aim at provides an inlayer scattering formula hinders gluey graphic design circuit board, this inlayer scattering formula hinders gluey graphic design circuit board, has improved production quality and disposable yields.
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides an inlayer scattering formula hinders gluey figure design circuit board, includes circuit board body and sideboard, sideboard fixed mounting is in the both sides of circuit board body, the fixed orifices has been seted up on the surface of sideboard and the position that is located both ends.
The circuit board body comprises a first copper foil layer, a first PP sheet layer is fixedly mounted below the first copper foil layer, a second PP sheet layer is fixedly mounted below the first PP sheet layer, a core plate is fixedly mounted below the second PP sheet layer, a third PP sheet layer is fixedly mounted below the core plate, a fourth PP sheet layer is fixedly mounted below the third PP sheet layer, a second copper foil layer is fixedly mounted below the fourth PP sheet layer, first connecting holes penetrating through the first copper foil layer and the second copper foil layer are formed in the surfaces of the core plate, and glue flowing grooves are formed in the surfaces of the first PP sheet layer, the second PP sheet layer, the core plate, the third PP sheet layer, the fourth PP sheet layer and the second copper foil layer, the surface of the circuit board body is provided with a round hole, the left side of the round hole is provided with a first rectangular hole, a first hole groove is formed above the first rectangular hole, the right side of the first hole groove is provided with a second rectangular hole, the right side of the second rectangular hole is provided with a second hole groove, the right side of the second hole groove is provided with a third rectangular hole, and the right side of the third rectangular hole is provided with a fourth rectangular hole.
Preferably, the thickness of each of the first PP sheet layer and the fourth PP sheet layer is 0.12 mm.
Preferably, the thickness of the second PP sheet layer and the thickness of the third PP sheet layer are both 0.23 mm.
Preferably, the thickness of the core plate is 0.8 mm.
Preferably, the number of the round holes is a plurality, and the aperture of the round holes is 5.5 mm.
Preferably, the number of the second rectangular holes is four, and the length and the width of each second rectangular hole are 4.3mm and 2.0mm respectively.
During the use, carry out the pressfitting with first copper foil layer, first PP lamella, second PP lamella, core, third PP lamella, fourth PP lamella and second copper foil layer, because the gummosis groove has all been seted up on the surface of first PP lamella, second PP lamella, core, third PP lamella, fourth PP lamella and second copper foil layer, solved the problem of the incomplete copper of etching after the pressfitting, the hole groove of seting up on circuit board body surface has made things convenient for the welding to spare part, has improved work efficiency greatly.
The utility model provides an inlayer scattering formula hinders gluey graphic design circuit board. The method has the following beneficial effects:
1. this inner strata scattering formula hinders gluey figure design circuit board, through with first copper foil layer, first PP lamella, the second PP lamella, the core, the third PP lamella, the pressfitting is carried out to fourth PP lamella and second copper foil layer, because first PP lamella, the second PP lamella, the core, the third PP lamella, the gummosis groove has all been seted up on the surface of fourth PP lamella and second copper foil layer, the problem of the incomplete copper of etching after the pressfitting has been solved, and the white spot problem also obtains solving in step, replace original gluey point design of hindering with the gummosis groove of dislocation between the layer, very big improvement production quality and disposable yields, batch production's processing requirement has been satisfied.
2. This inner layer scattering hinders gluey figure design circuit board, the hole groove of seting up through circuit board body surface has made things convenient for the welding to spare part, has improved work efficiency greatly.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a sectional view of the structure of the present invention.
In the figure: 1 connecting plate body, 101 first copper foil layer, 102 first PP lamella, 103 second PP lamella, 104 core, 105 third PP lamella, 106 fourth PP lamella, 107 second copper foil layer, 2 sideboard, 3 fixed orifices, 4 first connecting holes, 5 second connecting holes, 6 gummosis grooves, 7 round holes, 8 first rectangular holes, 9 first hole grooves, 10 second rectangular holes, 11 second hole grooves, 12 third rectangular holes, 13 fourth rectangular holes.
Detailed Description
As shown in fig. 1-2, an inner layer scattering type glue-blocking pattern designed circuit board comprises a circuit board body 1 and side boards 2, wherein the side boards 2 are fixedly installed on two sides of the circuit board body 1, fixing holes 3 are formed in the positions, located at two ends, of the surface of each side board 2, and the fixing holes 3 are used for fixing and limiting the circuit board body 1.
The circuit board body 1 comprises a first copper foil layer 101, the copper foil is an anionic electrolytic material, a thin and continuous metal foil layer is deposited on a circuit board basal layer and is used as a conductor of a PCB, the copper foil layer is easily adhered to an insulating layer and is subjected to printing and protecting layer to form a circuit pattern after corrosion, a first PP sheet layer 102 is fixedly arranged below the first copper foil layer 101, a PP sheet is a prepreg and is a sheet-shaped adhesive material synthesized by resin and a carrier, a second PP sheet layer 103 is fixedly arranged below the first PP sheet layer 102, a core plate 104 is fixedly arranged below the second PP sheet layer 103, a third PP sheet layer 105 is fixedly arranged below the core plate 104, a fourth PP sheet layer 106 is fixedly arranged below the third PP sheet layer 105, a second copper foil layer 107 is fixedly arranged below the fourth PP sheet layer 106, the thicknesses of the first PP sheet layer 102 and the fourth PP sheet layer 106 are both 0.12mm, the thicknesses of the second PP sheet layer 103 and the third PP sheet layer 105 are both 0.23mm, the first connecting hole 4 is formed between the first copper foil layer 101, the first PP sheet layer 102 and the second PP sheet layer 103, the third PP sheet layer 105, the fourth PP sheet layer 106 and the second copper foil layer 107 with the thickness of the core plate 104 being 0.8mm, the second connecting hole 5 penetrating through the first copper foil layer 101 and the second copper foil layer 107 is formed on the surface of the core plate 104, the flow adhesive grooves 6 are formed on the surfaces of the first PP sheet layer 102, the second PP sheet layer 103, the core plate 104, the third PP sheet layer 105, the fourth PP sheet layer 106 and the second copper foil layer 107, and the flow adhesive grooves 6 are formed on the surfaces of the first PP sheet layer 101, the first PP sheet layer 102, the second PP sheet layer 103, the core plate 104, the third PP sheet layer 105, the fourth PP sheet layer 106 and the second copper foil layer 107 through lamination, and the flow adhesive grooves 6 are formed on the surfaces of the first PP sheet layer 102, the second PP sheet layer 103, the core plate 104, the third PP sheet layer 105, the problem of etching residual copper after lamination is solved, the white spot problem is synchronously solved, the original glue blocking point design is replaced by the glue flowing grooves 6 which are staggered between layers, the production quality and the disposable yield are greatly improved, the processing requirement of batch production is met, the surface of the circuit board body 1 is provided with a plurality of round holes 7, the aperture of each round hole 7 is 5.5mm, the left side of each round hole 7 is provided with a first rectangular hole 8, a first hole groove 9 is arranged above each first rectangular hole 8, the right side of each first hole groove 9 is provided with a second rectangular hole 10, the number of the second rectangular holes 10 is four, the length and the width of each second rectangular hole 10 are respectively 4.3mm and 2.0mm, the right side of each second rectangular hole 10 is provided with a second hole groove 11, the right side of each second hole groove 11 is provided with a third rectangular hole 12, the right side of each third rectangular hole 12 is provided with a fourth hole 13, the hole groove formed in the surface of the circuit board body 1 facilitates welding of parts, and work efficiency is greatly improved.
Claims (6)
1. The utility model provides an inner layer scattering formula hinders gluey figure design circuit board, includes circuit board body (1) and sideboard (2), its characterized in that: the side plates (2) are fixedly arranged on two sides of the circuit board body (1), and fixing holes (3) are formed in the positions, located at two ends, of the surface of each side plate (2);
the circuit board body (1) comprises a first copper foil layer (101), a first PP sheet layer (102) is fixedly mounted below the first copper foil layer (101), a second PP sheet layer (103) is fixedly mounted below the first PP sheet layer (102), a core board (104) is fixedly mounted below the second PP sheet layer (103), a third PP sheet layer (105) is fixedly mounted below the core board (104), a fourth PP sheet layer (106) is fixedly mounted below the third PP sheet layer (105), a second copper foil layer (107) is fixedly mounted below the fourth PP sheet layer (106), first connecting holes (4) are formed among the first copper foil layer (101), the first PP sheet layer (102), the second PP sheet layer (103), the third PP sheet layer (105), the fourth PP sheet layer (106) and the second copper foil layer (107), and second connecting holes (5) formed through the first copper foil layer (101) and the second copper foil layer (107) are formed in the surface of the core board (104), gummosis groove (6) have all been seted up on the surface of first PP lamella (102), second PP lamella (103), core (104), third PP lamella (105), fourth PP lamella (106) and second copper foil layer (107), round hole (7) have been seted up on the surface of circuit board body (1), first rectangular hole (8) have been seted up in the left side of round hole (7), first hole groove (9) have been seted up to the top of first rectangular hole (8), second rectangular hole (10) have been seted up on the right side of first hole groove (9), second hole groove (11) have been seted up on the right side of second rectangular hole (10), third rectangular hole (12) have been seted up on the right side of second hole groove (11), fourth rectangular hole (13) have been seted up on the right side of third rectangular hole (12).
2. The inner-layer scattering type glue-blocking pattern design circuit board as claimed in claim 1, wherein: the thickness of the first PP sheet layer (102) and the thickness of the fourth PP sheet layer (106) are both 0.12 mm.
3. The inner-layer scattering type glue-blocking pattern design circuit board as claimed in claim 1, wherein: the thickness of the second PP sheet layer (103) and the thickness of the third PP sheet layer (105) are both 0.23 mm.
4. The inner-layer scattering type glue-blocking pattern design circuit board as claimed in claim 1, wherein: the thickness of the core plate (104) is 0.8 mm.
5. The inner-layer scattering type glue-blocking pattern design circuit board as claimed in claim 1, wherein: the number of the round holes (7) is a plurality, and the aperture of the round holes (7) is 5.5 mm.
6. The inner-layer scattering type glue-blocking pattern design circuit board as claimed in claim 1, wherein: the number of the second rectangular holes (10) is four, and the length and the width of each second rectangular hole (10) are respectively 4.3mm and 2.0 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921741670.3U CN210670839U (en) | 2019-10-16 | 2019-10-16 | Inner layer scattering type glue-blocking pattern design circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921741670.3U CN210670839U (en) | 2019-10-16 | 2019-10-16 | Inner layer scattering type glue-blocking pattern design circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210670839U true CN210670839U (en) | 2020-06-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921741670.3U Active CN210670839U (en) | 2019-10-16 | 2019-10-16 | Inner layer scattering type glue-blocking pattern design circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210670839U (en) |
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2019
- 2019-10-16 CN CN201921741670.3U patent/CN210670839U/en active Active
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