CN210670762U

CN210670762U - Concatenation formula circuit board

Info

Publication number: CN210670762U
Application number: CN201921540554.5U
Authority: CN
Inventors: 夏源宏
Original assignee: Shenzhen Yaxin Hongda Electronic Technology Co ltd
Current assignee: Shenzhen Yaxin Hongda Electronic Technology Co ltd
Priority date: 2019-09-16
Filing date: 2019-09-16
Publication date: 2020-06-02
Anticipated expiration: 2029-09-16

Abstract

The utility model relates to a spliced circuit board, which comprises a first circuit board body and a second circuit board body, wherein a first groove is arranged on the first circuit board body, the first groove extends towards the second end surface of the first circuit board body along the first end surface of the first circuit board body, and the first groove penetrates through the first surface of the first circuit board body and the second surface of the first circuit board body; the second circuit board body is inserted into the first groove along the third end face of the second circuit board body and fixed, so that a combined splicing structure of the first circuit board body and the second circuit board body is formed. Set up first recess on first circuit plate body, insert second circuit plate body in the first recess along the third terminal surface position of second circuit plate body to the grafting of second circuit plate body and first circuit plate body is fixed has been realized. The utility model discloses the combination mosaic structure of the first circuit board body that forms and second circuit board body changes single plane circuit board shape into three-dimensional shape, makes the circuit board can have more extensive application scope.

Description

Concatenation formula circuit board

Technical Field

The utility model belongs to the technical field of the circuit board processing, especially, relate to concatenation formula circuit board.

Background

At present, electronic products which require a plurality of identical or different components to form an electronic circuit to perform a certain specific function all require various electronic components to be integrated and assembled on a board body of a circuit board through the circuit board. However, since the shape and size of the current circuit board are limited by the manufacturing process, once the circuit board is manufactured, the shape and size of the circuit board are difficult to change, and the circuit board can only be put into practical use in a plate-type inherent shape and size, thereby hindering the development of electronic circuit design and being difficult to meet the requirements of increasingly diversified electronic products.

SUMMERY OF THE UTILITY MODEL

The utility model provides a concatenation formula circuit board for it is difficult to change its shape and size's technical problem after circuit board makes among the solution prior art.

The utility model provides a concatenation formula circuit board, include:

the first circuit board body is provided with a first groove, the first groove extends towards the second end face of the first circuit board body along the first end face of the first circuit board body, and the first groove penetrates through the first surface of the first circuit board body and the second surface of the first circuit board body;

and the second circuit board body is inserted into the first groove and fixed along the third end face of the second circuit board body so as to form a combined splicing structure of the first circuit board body and the second circuit board body.

Preferably, the first groove includes a first side groove surface, a second side groove surface and a first bottom groove surface, the first side groove surface and the second side groove surface are oppositely disposed and respectively butt-jointed to the first surface of the first circuit board body and the second surface of the first circuit board body, after the first groove is inserted into the second circuit board body, the first side groove surface contacts with the third surface of the second circuit board body, and the second side groove surface contacts with the fourth surface of the second circuit board body.

Preferably, the first side groove surface and the second side groove surface are both provided with first metal welding spots, the third surface and the fourth surface are both provided with first metal pads matched with the first metal welding spots, and after the first groove is inserted into the second circuit board body, the first metal welding spots are in contact with the first metal pads.

Preferably, a second groove is formed in the second circuit board body, the second groove extends from the third end face of the second circuit board body to the fourth end face of the second circuit board body, and the second groove penetrates through the third surface of the second circuit board body and the fourth surface of the second circuit board body.

Preferably, the second groove includes a third groove surface, a fourth groove surface and a second groove bottom surface, the third groove surface and the fourth groove surface are oppositely opened and respectively butt-jointed with the third surface and the fourth surface, after the first groove is inserted into the second groove, the third groove surface contacts with the first surface, the fourth groove surface contacts with the second surface, and the first groove bottom surface contacts with the second groove bottom surface.

Preferably, second metal welding points are arranged on the third side groove surface and the fourth side groove surface, second metal pads matched with the second metal welding points are arranged on the first surface and the second surface, and the second metal welding points are in contact with the second metal pads after the first groove is inserted into the second groove.

Preferably, the first metal welding point and the second metal welding point are both raised circular welding points, and the first metal bonding pad and the second metal bonding pad are both raised elastic sheet structures.

From the foregoing, the embodiment of the utility model provides a can know, the utility model discloses a set up first recess on first circuit board body, insert the second circuit board body in the first recess along the third terminal surface position of second circuit board body to it is fixed with the grafting of first circuit board body to have realized the second circuit board. The utility model discloses the combination mosaic structure of the first circuit board body that forms and second circuit board body changes single plane circuit board shape into three-dimensional shape, makes the circuit board can have more extensive application scope.

Drawings

In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

FIG. 1 is a diagram of the splicing structure of the splicing type circuit board of the present invention;

FIG. 2 is a splicing explosion diagram of the splicing type circuit board of the present invention;

fig. 3 is a front structural view of a first circuit board body of the splicing type circuit board of the utility model;

fig. 4 is a back structure diagram of the first circuit board body of the splicing type circuit board of the present invention;

fig. 5 is a front structural view of a second circuit board body of the splicing type circuit board of the utility model;

fig. 6 is the utility model discloses the back structure chart of the second circuit board body of concatenation formula circuit board.

Description of the main elements:

1. a first circuit board body; 2. a second circuit board; 3. a first metal solder joint; 4. a first metal pad; 5. a second metal solder joint; 6. a second metal pad; 11. a first groove; 12. a first end face; 13. a second end face; 14. a first surface; 15. a second surface; 21. a second groove; 22. a third end face; 23. a fourth end face; 24. a third surface; 25. a fourth surface; 111. a first side groove surface; 112. a second side groove surface; 113. a first bottom groove surface; 211. a third side groove surface; 212. a fourth side groove surface; 213. a second floor tub surface.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the drawings in the embodiments of the present invention are combined to clearly and completely describe the technical solutions in the embodiments of the present invention, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by the skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, the present invention discloses a splicing circuit board, comprising:

a first circuit board body 1, wherein a first groove 11 is arranged on the first circuit board body 1, the first groove 11 extends along a first end surface 12 of the first circuit board body 1 to a second end surface 13 of the first circuit board body 1, and the first groove 11 penetrates through a first surface 14 of the first circuit board body 1 and a second surface 15 of the first circuit board body 1;

and the second circuit board body 2 is inserted into the first groove 11 along the third end surface 22 of the second circuit board body 2 and fixed, so as to form a combined splicing structure of the first circuit board body 1 and the second circuit board body 2.

The "first end face 12" and the "second end face 13" of the first substrate 1, and the "third end face 22" and the "fourth end face 23" of the second substrate 2 are end faces opposing in the substrate thickness direction, that is, two end faces opposing to each other in the substrate length and height, or two end faces opposing to each other in the substrate width and height. The "first surface 14" and the "second surface 15" of the first circuit board body 1, and the "third surface 24" and the "fourth surface 25" of the second circuit board 2 are respectively opposite surfaces in the circuit layout direction of the circuit board, i.e. two opposite surfaces surrounded by the length and the width of the circuit board.

Compared with the prior art, the utility model discloses a set up first recess 11 on first circuit board body 1, insert second circuit board body 2 in first recess 11 along the third terminal surface 22 position of second circuit board body 2 to realized second circuit board 2 and the grafting of first circuit board body 1 fixed. The utility model discloses the combination mosaic structure of the first circuit board body 1 that forms and the second circuit board body 2 changes single plane circuit board shape into three-dimensional shape, makes the circuit board can have more extensive application scope.

Referring to fig. 3-4, the first groove 11 includes a first side groove surface 111, a second side groove surface 112 and a first bottom groove surface 113, the first side groove surface 111 and the second side groove surface 112 are oppositely disposed and are respectively abutted to the first surface 14 of the first circuit board 1 and the second surface 15 of the first circuit board 1, after the first groove 11 is inserted into the second circuit board 2, the first side groove surface 111 contacts with the third surface 24 of the second circuit board 2, and the second side groove surface 112 contacts with the fourth surface 25 of the second circuit board 2. The width of the first undercut surface 113 is matched to the thickness of the second circuit board body 2, so that the contact of the first side undercut surface 111 with the third surface 24 and the contact of the second side undercut surface 112 with the fourth surface 25 can be achieved.

In this embodiment, the first side groove surface 111 and the second side groove surface 112 are both provided with the first metal solder 3, the third surface 24 and the fourth surface 25 are both provided with the first metal pad 4 adapted to the first metal solder 3, and after the first groove 11 is inserted into the second circuit board 2, the first metal solder 3 contacts the first metal pad 4. The first metal welding point 3 is contacted with the first metal welding pad 4, so that the first circuit board body 1 can be electrically connected with the second circuit board body 2, and the first circuit board body 1 and the second circuit board body 2 are really spliced to form an integral body.

Referring to fig. 5-6, a second groove 21 is formed on the second circuit board body 2, the second groove 21 extends toward a fourth end surface 23 of the second circuit board body 2 along a third end surface 22 of the second circuit board body 2, and the second groove 21 penetrates through a third surface 24 of the second circuit board body 2 and a fourth surface 25 of the second circuit board body 2. The arrangement of the second groove 21 can connect the first circuit board body 1 and the second circuit board body 2 in a cross manner through a groove structure, so that the connection mode is more compact and stable.

In this embodiment, the second groove 21 includes a third side groove surface 211, a fourth side groove surface 212, and a second bottom groove surface 213, the third side groove surface 211 and the fourth side groove surface 212 are opposite to each other and abut against the third surface 24 and the fourth surface 25, respectively, after the first groove 11 is inserted into the second groove 21, the third side groove surface 211 contacts with the first surface 14, the fourth side groove surface 212 contacts with the second surface 15, and the first bottom groove surface 113 contacts with the second bottom groove surface 213. The width of the second bottom groove surface 213 matches the thickness of the first circuit board body 1, so that the contact of the third side groove surface 211 with the first surface 14 and the contact of the fourth side groove surface 212 with the second surface 15 can be realized.

In this embodiment, the third side groove surface 211 and the fourth side groove surface 212 are both provided with the second metal pad 5, the first surface 14 and the second surface 15 are both provided with the second metal pad 6 adapted to the second metal pad 5, and after the first groove 11 is inserted into the second groove 21, the second metal pad 6 is contacted with the second metal pad 5. The second metal pad 5 and the second metal pad 6 assist the first metal pad 3 and the first metal pad 4, so that the electrical connection between the first circuit board body 1 and the second circuit board body 2 is more problematic.

In this embodiment, the first metal pad 3 and the second metal pad 5 are both raised circular pads, and the first metal pad 4 and the second metal pad 6 are both raised spring structures.

Set up the metal solder joint into circular protruding shape, the metal pad sets up to the shell fragment structure, both can make things convenient for first recess 11 and second recess 21 more natural at the grafting in-process, simultaneously because protruding setting has increased the interact power between first recess 11 and the second recess 21 for fixed more firm between first circuit board body 1 and the second circuit board body 2, difficult pine takes off.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

Above is the description to the technical scheme that the utility model provides, to technical personnel in the field, according to the utility model discloses the thought of embodiment all has the change part on concrete implementation and range of application, to sum up, this description content should not be understood as the restriction of the utility model.

Claims

1. A spliced circuit board, comprising:

2. The patch cord board of claim 1, wherein the first groove comprises a first side groove surface, a second side groove surface and a first bottom groove surface, the first side groove surface and the second side groove surface are opposite to each other and are respectively abutted against the first surface of the first circuit board body and the second surface of the first circuit board body, after the first groove is inserted into the second circuit board body, the first side groove surface is in contact with the third surface of the second circuit board body, and the second side groove surface is in contact with the fourth surface of the second circuit board body.

3. The circuit board of claim 2, wherein the first side groove surface and the second side groove surface are each provided with a first metal solder joint, the third surface and the fourth surface are each provided with a first metal pad adapted to the first metal solder joint, and the first metal solder joint is in contact with the first metal pad after the first groove is inserted into the second circuit board body.

4. The patch cord board of claim 3, wherein the second circuit board body has a second groove extending along a third end of the second circuit board body toward a fourth end of the second circuit board body, and the second groove penetrates through a third surface of the second circuit board body and a fourth surface of the second circuit board body.

5. The patch cord board of claim 4, wherein the second groove comprises a third groove surface, a fourth groove surface and a second bottom groove surface, the third groove surface is opposite to the fourth groove surface and is abutted against the third surface and the fourth surface, respectively, after the first groove is inserted into the second groove, the third groove surface is in contact with the first surface, the fourth groove surface is in contact with the second surface, and the first bottom groove surface is in contact with the second bottom groove surface.

6. The patch circuit board of claim 5, wherein a second metal pad is disposed on each of the third and fourth side grooves, and a second metal pad adapted to the second metal pad is disposed on each of the first and second surfaces, and the second metal pad contacts the second metal pad after the first groove is inserted into the second groove.

7. The spliced circuit board of claim 6, wherein the first metal solder joint and the second metal solder joint are raised circular solder joints, and the first metal pad and the second metal pad are raised spring structures.