CN210670711U - Novel high-efficient heat dissipation copper aluminium base plate structure - Google Patents

Novel high-efficient heat dissipation copper aluminium base plate structure Download PDF

Info

Publication number
CN210670711U
CN210670711U CN201920277784.0U CN201920277784U CN210670711U CN 210670711 U CN210670711 U CN 210670711U CN 201920277784 U CN201920277784 U CN 201920277784U CN 210670711 U CN210670711 U CN 210670711U
Authority
CN
China
Prior art keywords
hole
aluminum plate
seted
rubber
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201920277784.0U
Other languages
Chinese (zh)
Inventor
彭树荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhuhai Langde Wantong Technology Co ltd
Original Assignee
Zhuhai Langde Wantong Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhuhai Langde Wantong Technology Co ltd filed Critical Zhuhai Langde Wantong Technology Co ltd
Priority to CN201920277784.0U priority Critical patent/CN210670711U/en
Application granted granted Critical
Publication of CN210670711U publication Critical patent/CN210670711U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model provides a novel high-efficient heat dissipation copper aluminium base plate structure, including aluminum plate, insulating layer and copper foil, the terminal surface is fixed under aluminum plate to the insulating layer, the terminal surface is fixed under the insulating layer to the copper foil, blind hole one is seted up in aluminum plate up end left side, rubber pole one is inserted in the blind hole, through-hole one is seted up to rubber pole one upper end surface, blind hole two is seted up on aluminum plate up end right side, rubber pole two is inserted in the blind hole two, through-hole two is seted up to two upper end surface of rubber pole, install the stiffener in through-hole two, the stiffener other end is inserted in through-hole one, semicircular groove is seted up to the aluminum plate up end, compares with prior art, the utility model discloses following beneficial effect has: the purpose of preventing scratches in the stacking process is achieved, meanwhile, the contact area of the aluminum plate and the radiating fins is increased, and the radiating effect is improved.

Description

Novel high-efficient heat dissipation copper aluminium base plate structure
Technical Field
The utility model relates to a novel high-efficient heat dissipation copper aluminium base plate structure belongs to electronic material technical field.
Background
The aluminum substrate is a metal-based copper-clad plate with good heat dissipation function, and a common single-sided board is composed of three layers, namely a circuit layer (copper foil), an insulating layer and a metal base layer. At present, in the stacking process of a plurality of groups of aluminum substrates, copper foils on the aluminum substrates are easily scratched by friction of other aluminum substrates, so that later-stage use is affected, and meanwhile, metal base layers on the aluminum substrates are mostly planar, so that the contact area between the metal base layers and radiating fins is limited, and the radiating effect is affected.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims at providing a novel high-efficient heat dissipation copper aluminium base plate structure to solve the problem that proposes in the above-mentioned background art, the utility model discloses have wear-resisting structure, have the resistance to compression function, area of contact is big.
In order to achieve the above purpose, the present invention is realized by the following technical solution: the utility model provides a novel high-efficient heat dissipation copper aluminium base plate structure, includes aluminum plate, insulating layer and copper foil, the terminal surface under aluminum plate is fixed to the insulating layer, the terminal surface is fixed under the insulating layer to the copper foil, blind hole one is seted up in aluminum plate up end left side, place rubber pole one in the blind hole, through-hole one is seted up to rubber pole one upper end surface, blind hole two is seted up on aluminum plate up end right side, place rubber pole two in the blind hole two, through-hole two is seted up to two upper end surface of rubber pole, place the stiffener in the through-hole two, the stiffener other end is placed in through-hole one, semicircular groove is seted up to the aluminum plate up end.
Furthermore, at least three groups are arranged on the semicircular grooves, and at least three groups of semicircular grooves are equidistantly arranged on the upper end face of the aluminum plate.
Furthermore, the first rubber rod and the second rubber rod have the same specification, and the diameter of the first through hole and the diameter of the second through hole are the same as the diameter of the reinforcing rod.
Further, two sets of first blind holes are symmetrically formed in the left side of the upper end face of the aluminum plate, two sets of second blind holes are symmetrically formed in the right side of the upper end face of the aluminum plate, two sets of first rubber rods are inserted into the first blind holes, and two sets of second rubber rods are inserted into the second blind holes.
The utility model has the advantages that: the utility model discloses a novel high-efficient heat dissipation copper aluminium base plate structure, because of the utility model discloses added the stiffener, rubber pole one, through-hole one, blind hole one, rubber pole two, through-hole two and blind hole two, this design is through with rubber pole one and rubber pole two respectively the ann insert in blind hole one and blind hole two, realize the purpose of separating the abrasionproof when multiunit copper aluminium base plate stacks, reduce the copper foil by the probability of fish tail when stacking, through with the both ends of stiffener ann respectively in through-hole one and through-hole two, reach the purpose of reinforcing crushing resistance, with rubber pole one, rubber pole two and stiffener recovery recycle, be favorable to reduce cost.
Because of the utility model discloses added the semicircular groove, this design utilizes the semicircular groove on the aluminum plate to mutually support with the sand grip on the fin, reaches the purpose that increases aluminum plate and fin area of contact, improves the radiating effect.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a structural diagram of a novel high-efficiency heat-dissipating copper-aluminum substrate structure of the present invention;
FIG. 2 is an enlarged view of the A position of the novel high-efficiency heat-dissipating copper-aluminum substrate of the present invention;
FIG. 3 is an enlarged view of the B position of the novel high-efficiency heat-dissipating copper-aluminum substrate of the present invention;
in the figure: 1-aluminum plate, 2-insulating layer, 3-copper foil, 4-reinforcing rod, 5-rubber rod I, 6-through hole I, 7-blind hole I, 8-semicircular groove, 9-rubber rod II, 10-through hole II, 11-blind hole II, 12-raised line and 13-radiating fin.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
Referring to fig. 1-3, the present invention provides a technical solution: a novel high-efficiency heat-dissipation copper-aluminum substrate structure comprises an aluminum plate 1, an insulating layer 2 and a copper foil 3, wherein the insulating layer 2 is fixed on the lower end face of the aluminum plate 1, the copper foil 3 is fixed on the lower end face of the insulating layer 2, the left side of the upper end face of the aluminum plate 1 is provided with a first blind hole 7, a first rubber rod 5 is inserted into the first blind hole 7, the first blind hole 7 is designed to facilitate the mutual assembly of the first rubber rod 5 and the aluminum plate 1, the outer surface of the upper end of the first rubber rod 5 is provided with a first through hole 6, the right side of the upper end face of the aluminum plate 1 is provided with a second blind hole 11, a second rubber rod 9 is inserted into the second blind hole 11, the first rubber rod 5 is designed to facilitate the mutual assembly of the first rubber rod 5 and the aluminum plate 1, the outer surface of the upper end of the second rubber rod 9 is provided with a second through hole 10, a reinforcing rod 4 is inserted into the second through hole 6, the other end of the reinforcing rod 4 is inserted into the first through hole, and then rubber pole one 5 and rubber pole two 9 all have a part to be in 1 upside of aluminum plate, and then rubber pole one 5 and rubber pole two 9 play the effect of keeping apart two sets of copper aluminium base plates, thereby reduce the probability that copper foil 3 is by the fish tail, with the both ends of stiffener 4 assign respectively in through-hole one 6 and through-hole two 10, thereby stack in-process stiffener 4 and play the effect of strengthening the 1 resistance to compression of aluminum plate, in the installation, with the semicircle recess 8 on the aluminum plate 1 and the sand grip 12 mutual arrangement on the fin 13, and then increase the area of contact of aluminum plate 1 and fin 13, be favorable to improving the radiating effect.
At least three groups have been seted up to semicircular groove 8, and 8 equidistance of at least three groups of semicircular groove are seted up at aluminum plate 1 up end, and the design of at least three groups of semicircular groove 8 is convenient for sand grip 12 on aluminum plate 1 and the fin 13 to match each other, further increases area of contact, improves the radiating effect.
The specifications of the first rubber rod 5 and the second rubber rod 9 are the same, the diameter of the first through hole 6 and the diameter of the second through hole 10 are the same as the diameter of the reinforcing rod 4, the specifications are the same, the universality is realized, the diameter of the reinforcing rod 4 is the same as the diameter of the first through hole 6 and the diameter of the second through hole 10, and the penetration of the reinforcing rod 4 is facilitated.
Two sets of blind holes 7 are seted up to 1 up end left side symmetry of aluminum plate, and two sets of blind holes 11 are seted up to 1 up end right side symmetry of aluminum plate, all place rubber pole one 5 in two sets of blind holes 7, all place rubber pole two 9 in two sets of blind holes two 11, all place rubber pole one 5 and all place rubber pole two 9 in two sets of blind holes two 11 in two sets of blind holes 7, thereby realize piling the purpose that the in-process four corners supported, improve the stability that multiunit copper aluminium base plate stacked.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (4)

1. The utility model provides a novel high-efficient heat dissipation copper aluminium base plate structure, includes aluminum plate, insulating layer and copper foil, its characterized in that: the insulating layer is fixed at aluminum plate terminal surface down, the terminal surface under the insulating layer is fixed to the copper foil, blind hole one is seted up on aluminum plate up end left side, insert rubber pole one in the blind hole one, through-hole one is seted up to rubber pole one upper end surface, blind hole two is seted up on aluminum plate up end right side, insert rubber pole two in the blind hole two, through-hole two is seted up to two upper end off-plate surfaces of rubber pole, insert the stiffener in the through-hole two, the stiffener other end is inserted in through-hole one, semicircular groove is seted up to the aluminum plate up end.
2. The novel efficient heat dissipation copper-aluminum substrate structure as claimed in claim 1, wherein: at least three groups are arranged on the semicircular grooves, and the semicircular grooves are equidistantly arranged on the upper end surface of the aluminum plate.
3. The novel efficient heat dissipation copper-aluminum substrate structure as claimed in claim 1, wherein: the first rubber rod and the second rubber rod are the same in specification, and the diameter of the first through hole and the diameter of the second through hole are the same as the diameter of the reinforcing rod.
4. The novel efficient heat dissipation copper-aluminum substrate structure as claimed in claim 1, wherein: two sets of blind holes I are symmetrically formed in the left side of the upper end face of the aluminum plate, two sets of blind holes II are symmetrically formed in the right side of the upper end face of the aluminum plate, two sets of rubber rods I are inserted into the blind holes I, and two sets of rubber rods II are inserted into the blind holes II.
CN201920277784.0U 2019-03-03 2019-03-03 Novel high-efficient heat dissipation copper aluminium base plate structure Expired - Fee Related CN210670711U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920277784.0U CN210670711U (en) 2019-03-03 2019-03-03 Novel high-efficient heat dissipation copper aluminium base plate structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920277784.0U CN210670711U (en) 2019-03-03 2019-03-03 Novel high-efficient heat dissipation copper aluminium base plate structure

Publications (1)

Publication Number Publication Date
CN210670711U true CN210670711U (en) 2020-06-02

Family

ID=70819683

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920277784.0U Expired - Fee Related CN210670711U (en) 2019-03-03 2019-03-03 Novel high-efficient heat dissipation copper aluminium base plate structure

Country Status (1)

Country Link
CN (1) CN210670711U (en)

Similar Documents

Publication Publication Date Title
CN204651380U (en) Battery core syndeton
CN106803565A (en) Battery
CN210670711U (en) Novel high-efficient heat dissipation copper aluminium base plate structure
CN104135816A (en) Aluminum-based copper-clad plate and manufacturing method thereof, and electronic circuit board
CN210926233U (en) Battery module and battery pack
CN211047696U (en) Circuit board with multilayer board body
CN206196126U (en) High stability can circuit board
CN212171529U (en) High-efficiency aluminum-based heat-conducting copper-clad plate
CN204560027U (en) There is the printed circuit board imbedding inductance
CN204392757U (en) Electrographite thin slice and graphite substrate
CN206465565U (en) It is a kind of to improve the aluminum-based copper-clad plate for pasting power
CN206217276U (en) A kind of shockproof enhanced aluminum-based copper-clad plate of radiating high
CN212211483U (en) Heat dissipation device for mobile phone motherboard
CN212266903U (en) High-voltage-resistant high-thermal-conductivity aluminum-based copper-clad plate
CN217061711U (en) Anti direct current composite silicon steel iron core
CN221202860U (en) Take heat radiation structure's heavy current PCB board
CN212660368U (en) Thick copper formula fills electric pile base plate
CN216852508U (en) High-efficient radiating PCB circuit board
CN212847989U (en) Iron core column structure
CN216624000U (en) Heat dissipation paster electric capacity
CN201877421U (en) Aluminum section of heat radiator
CN217545530U (en) Air-reinforced double-insulation bus duct
CN210444565U (en) High heat conduction PTFE high frequency copper-clad plate structure
CN207264878U (en) A kind of bimag combines inductance
CN202549749U (en) Copper sheet flexible connecting device

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200602

Termination date: 20210303

CF01 Termination of patent right due to non-payment of annual fee