CN210666818U

CN210666818U - Fingerprint module and electronic equipment

Info

Publication number: CN210666818U
Application number: CN201922119327.1U
Authority: CN
Inventors: 娄椿杰; 胡现坤
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2019-11-29
Filing date: 2019-11-29
Publication date: 2020-06-02
Anticipated expiration: 2029-11-29

Abstract

The utility model relates to a fingerprint module and electronic equipment, the fingerprint module includes fingerprint identification module and flexible circuit board, the bottom surface of fingerprint identification module is equipped with a plurality of pads, and is a plurality of the pad is single to be set up and is in arrange according to the preface on the length direction of fingerprint identification module, the fingerprint identification module passes through a plurality of pads connect in flexible circuit board. The utility model discloses an ultra-narrow fingerprint module sets up the single row pad through fingerprint identification module to reduce the width of fingerprint module, thereby can satisfy and assemble in ultra-thin electronic equipment's side.

Description

Fingerprint module and electronic equipment

Technical Field

The utility model relates to a fingerprint identification technical field especially relates to a fingerprint identification module and electronic equipment.

Background

The prior mobile phone enters a full-screen era, the unlocking of the front physical fingerprint is gradually concealed, and the unlocking of the back fingerprint is very troublesome because the integrity of a rear shell of the mobile phone is damaged. Therefore, in order to realize a comprehensive screen effect, the fingerprint identification under the screen and the fingerprint identification at the side edge are carried out at the same time.

As can be seen, the current mobile phone is developed toward being light and thin, and the width of the side fingerprint module is usually more than 2.98mm, which brings great difficulty to the design of the side fingerprint.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present disclosure provides a fingerprint module and an electronic device with a novel structure to solve the above technical problems.

In order to achieve the purpose, the technical scheme adopted by the disclosure is as follows:

according to a first aspect of the embodiment of the present disclosure, a fingerprint module is provided, the fingerprint module includes a fingerprint identification module and a flexible circuit board, the bottom surface of the fingerprint identification module is provided with a plurality of pads, and is a plurality of the pads are arranged in a single row and are arranged in order in the length direction of the fingerprint identification module, and the fingerprint identification module is connected to the flexible circuit board through the pads.

Optionally, in the width direction of fingerprint identification module, the flexible circuit board size is less than the size of fingerprint identification module, the flexible circuit board with both sides on the width direction of fingerprint identification module have the interval, the fingerprint module is still including encapsulating sealed glue at the interval.

Optionally, a dimension of the flexible circuit board in a width direction of the fingerprint identification module is not greater than 1.4 mm.

Optionally, the size of the single pad in the width direction of the fingerprint identification module is D, wherein D is larger than or equal to 0.3 mm.

Optionally, the size of the single pad in the length direction of the fingerprint identification module is L, where L is greater than or equal to 0.3 mm.

Optionally, a dimension D of the single pad in the width direction of the fingerprint identification module is 0.5mm, and a dimension L of the single pad in the length direction of the fingerprint identification module is 0.5 mm.

Optionally, the distance between the adjacent bonding pads is S, wherein S is larger than or equal to 0.3 mm.

Optionally, the area of the pad at the two ends of the fingerprint identification module in the length direction is greater than or equal to the area of the pad at the middle position of the fingerprint identification module.

Optionally, the plurality of pads is 10 pads, including: 1 ground GND pad, 1 connects empty foot NC pad, and 6 connect the peripheral interface SPI pad to and 2 connect the power supply pad.

Optionally, the outer edge of the top surface of the fingerprint identification module is provided with a C-angle.

According to a second aspect of the embodiments of the present disclosure, there is provided an electronic device including a device main body and the fingerprint module as described in any one of the above.

Optionally, the fingerprint module set up in a side frame of equipment main part, the length direction of fingerprint module with electronic equipment's length direction is unanimous, the width direction of fingerprint module with electronic equipment's thickness direction is unanimous.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects: the utility model discloses an ultra-narrow fingerprint module sets up the single row pad through fingerprint identification module to reduce the width of fingerprint module, thereby can satisfy and assemble in ultra-thin electronic equipment's side.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

FIG. 1 is a schematic side view of a fingerprint module according to an exemplary embodiment of the present disclosure;

FIG. 2 is a partial perspective view of a fingerprint module shown in an exemplary embodiment of the present disclosure;

FIG. 3 is a schematic diagram of an electronic device according to an exemplary embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a fingerprint module in an electronic device according to an exemplary embodiment of the disclosure;

3 fig. 3 5 3 is 3 a 3 schematic 3 sectional 3 view 3 in 3 the 3 direction 3 of 3 a 3- 3 a 3 in 3 fig. 3 4 3. 3

Detailed Description

The present disclosure will be described in detail below with reference to specific embodiments shown in the drawings. These embodiments do not limit the disclosure, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the disclosure.

The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

In the following, some embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, and features in the following examples and embodiments may be combined with each other without conflict.

As shown in fig. 1 and fig. 2 in combination with fig. 3, the fingerprint module 10 in an embodiment of the disclosure is disposed at a side of the electronic device 100, so that the electronic device 100 can achieve a full-screen effect. This fingerprint module 10 includes fingerprint identification module 11 and flexible circuit board 12. The fingerprint recognition module 11 is used for collecting fingerprint information when a user touches the finger, so that unlocking or user authentication and recognition can be performed.

Because set up double-row pad in the width direction usually among the current side fingerprint module, lead to the width of current electronic equipment's side fingerprint module all to be more than 2.98 mm. As is known, the larger the width of the side fingerprint module, the thicker the overall thickness of the electronic device, which makes the electronic device unable to be designed in a light and thin manner.

In this disclosure, the bottom surface of this fingerprint identification module 11 is equipped with a plurality of pads 13, and a plurality of pads 13 list is set up and is arranged in proper order on fingerprint identification module 11's length direction, can reduce the size of fingerprint module in the width direction through the setting of list pad 13 to be favorable to fingerprint identification module 11 towards frivolous orientation development. Specifically, the dimension of the fingerprint module 10 in the width direction is not more than 2.4 mm. The fingerprint recognition module 11 is connected to a flexible circuit board 12 through a plurality of pads 13, and the flexible circuit board 12 is connected to the device body 20 of the electronic device 100, thereby implementing signal transmission.

In addition, prior art carries out unilateral point between fingerprint identification module and the flexible circuit board through among the side fingerprint module and glues, so that the width that makes the side fingerprint module can reduce to 2.4 mm. However, the mode that unilateral point was glued leads to the unable red ink that passes through of side fingerprint module to detect to can't satisfy the life waterproof.

In an optional embodiment of the present disclosure, in the width direction of the fingerprint recognition module 11, the size of the flexible circuit board 12 is smaller than the size of the fingerprint recognition module 11, the flexible circuit board 12 has a distance from both sides of the fingerprint recognition module 11 in the width direction, the fingerprint module 10 further includes a sealant 14 encapsulated at the distance, and the sealant 14 is used for sealing both sides of the flexible circuit board 12 with the fingerprint recognition module 11. In this embodiment, the process of packaging the sealant 14 may be generally referred to as dispensing, and the flexible circuit board 12 forms a distance with both sides of the fingerprint identification module 11 to dispense both sides of the flexible circuit board 12, so as to prevent water from permeating into the pad 13, avoid causing risks such as short circuit, and specifically, meet the requirement of being able to pass through a red ink detection test and achieve the IPX 3-level waterproof requirement in life.

In addition, the pulling force between the fingerprint identification module 11 and the flexible circuit board 12 can be increased by dispensing on two sides between the flexible circuit board 12 and the fingerprint identification module 11.

In an alternative embodiment, the flexible circuit board 12 has a dimension in the width direction of the fingerprint recognition module 11 of not more than 1.4 mm. The size of the single pad 13 in the width direction of the fingerprint identification module 11 is D, wherein D is larger than or equal to 0.3 mm. The size of the single pad 13 in the length direction of the fingerprint identification module 11 is L, wherein L is larger than or equal to 0.3 mm. The distance between the adjacent bonding pads 13 is S, wherein S is more than or equal to 0.3 mm. In a preferred embodiment, D is 0.5mm and L is 0.5 mm. Correspondingly, the area of the pad 13 is equal to 0.25mm²。

In this embodiment, the area of the pad 13 determines the pullThe area of the bonding pad 13 increases by 1mm per the original value of the pulling force²The pull force between the fingerprint recognition module 11 and the flexible circuit board 12 rises by about 10N. In order to meet the design requirements of the ultra-narrow fingerprint module 10, the pad 13 is made as large as possible within the size range, so as to increase the pull force between the fingerprint recognition module 11 and the flexible circuit board 12.

In one embodiment, the area of the bonding pads 13 at the two ends of the fingerprint identification module 11 in the length direction is greater than or equal to the area of the bonding pads 13 at the middle position of the fingerprint identification module 11, so as to increase the drawing force at the two ends of the fingerprint identification module 11 in the length direction.

The pads 13 may include power pads 13, SPI (Serial Peripheral Interface) pads 13, ground GND pads 13, and ground pin pads 13. In a preferred embodiment, the plurality of pads 13 is 10 pads 13, including 1 ground GND pad, 1 ground pin NC pad, 6 serial peripheral interface SPI pads, and 2 power pads. It should be noted that the present disclosure includes, but is not limited to, providing the above-mentioned type of pads, and the corresponding type of pads may be eliminated or added according to design requirements.

The fingerprint recognition module 11 of the present disclosure may also be shared with the side keys, i.e. the fingerprint recognition module 11 may also be used for pressing for function control. In this mode of operation, the outer edge of the top surface of the fingerprint recognition module 11 is provided with an angle C. This is disclosed to be equipped with the C angle through the outer fringe at 11 top surfaces of fingerprint identification module, can effectively solve the experience of being scraped the hand by fingerprint module 10 when the user uses. Wherein, this fingerprint identification module 11 can set up 0.1 mm's chamfer, and this 0.1mm is the size of the top surface to the bottom surface direction of fingerprint identification module 11. Preferably, the C angle is a 45 ° chamfer.

The utility model discloses a scheme of super narrow fingerprint module improves the fingerprint identification module of current double pad and sets up single row pad for fingerprint identification module to reduce the width of fingerprint module, thereby can satisfy the side of assembling in ultra-thin electronic equipment. This openly is glued through flexible circuit board and fingerprint identification module's both sides point, compares in prior art because space limitThe system and the mode that adopts unilateral point to glue not only can satisfy the waterproof characteristic of fingerprint module, can increase the drawing force between fingerprint identification module and the flexible circuit board moreover. In addition, the applicant of the present disclosure finds, through a large number of experiments, that the pad area determines the original value of the drawing force, and the area increases by 1mm each time²The tensile force is increased by about 10N; the dispensing range determines the pull-out force increase value, and the pull-out force is increased by about 40N after the double-side dispensing. Furthermore, the proposal of increasing the dispensing range under the condition of reducing the total area of the bonding pad is provided, the conventional double-row bonding pad design idea is broken, the requirement of drawing force can be met, the narrower fingerprint module design in the related technology is realized, and the light and thin design of the electronic equipment is very facilitated.

As shown in fig. 3 to 5, according to another aspect of the embodiment of the present disclosure, an electronic device 100 is provided, where the electronic device 100 includes a device main body 20 and a fingerprint module 10, and optionally, the fingerprint module 10 is disposed on a side frame of the device main body 20, for example, on left and right side frames of the device main body 20, so as to facilitate a user to operate. The fingerprint module 10 is the fingerprint module 10 described in the above embodiments, and is not described herein again.

After fingerprint module 10 assembles in electronic equipment 100, the length direction of fingerprint module 10 is unanimous with electronic equipment 100's length direction, and the width direction of fingerprint module 10 is unanimous with electronic equipment 100's thickness direction. In order to satisfy the trend of the electronic device 100 toward being lighter and thinner, the thickness of the device body 20 is not greater than 2.4 mm.

The fingerprint module 10 of this disclosure can regard as solitary part to use, also can share with the side key of electronic equipment 100, and this fingerprint module 10 can regard as the side key to use promptly. When the fingerprint module 10 is used as a separate component, the top surface of the fingerprint module 10 may be flush with the side frame of the electronic device 100, and may be recessed in the side frame or protrude outside the side frame. When fingerprint module 10 uses as the side frame simultaneously, the protruding side frame that stretches out electronic equipment 100 of this fingerprint module 10, the below of this fingerprint module 10 still is equipped with the steel of 20 assembly with equipment main part and mends piece 15, and the below of steel is mended the piece and is equipped with the conducting base 16 and the bubble celloidin 17 of resilience effect.

The electronic device 100 may be a mobile phone, a tablet computer, a palm computer, a Personal Digital Assistant (PDA), an intelligent wearable device, or the like.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. The utility model provides a fingerprint module, its characterized in that, the fingerprint module includes fingerprint identification module and flexible circuit board, the bottom surface of fingerprint identification module is equipped with a plurality of pads, and is a plurality of the pad is single to be set up and is in arrange according to the preface on fingerprint identification module's the length direction, fingerprint identification module passes through a plurality of pads connect in flexible circuit board.

2. The fingerprint module of claim 1, wherein the flexible circuit board has a size smaller than that of the fingerprint module in a width direction of the fingerprint module, the flexible circuit board has a distance from two sides of the fingerprint module in the width direction, and the fingerprint module further comprises a sealant encapsulated in the distance.

3. The fingerprint module of claim 1 or 2, wherein the flexible circuit board is no larger than 1.4mm in a width direction of the fingerprint identification module.

4. The fingerprint module of claim 1, wherein the dimension of the single pad in the width direction of the fingerprint identification module is D, wherein D is greater than or equal to 0.3 mm.

5. The fingerprint module of claim 1 or 4, wherein the dimension of the single pad in the length direction of the fingerprint identification module is L, wherein L is greater than or equal to 0.3 mm.

6. The fingerprint module of claim 5, wherein a dimension D of the single pad in a width direction of the fingerprint module is 0.5mm, and a dimension L of the single pad in a length direction of the fingerprint module is 0.5 mm.

7. The fingerprint module of claim 1, wherein a distance between adjacent pads is S, wherein S ≧ 0.3 mm.

8. The fingerprint module of claim 1, wherein the area of the bonding pads at the two ends of the fingerprint identification module in the length direction is greater than or equal to the area of the bonding pad at the middle position of the fingerprint identification module.

9. The fingerprint module of claim 1, wherein the plurality of pads is 10 pads, comprising: 1 ground GND pad, 1 connects empty foot NC pad, and 6 connect the peripheral interface SPI pad to and 2 connect the power supply pad.

10. The fingerprint module of claim 1, wherein the top surface of the fingerprint recognition module has an outer edge with a C-angle.

11. An electronic device comprising a device body and the fingerprint module of any one of claims 1 to 10.

12. The electronic device of claim 11, wherein the fingerprint module is disposed on a side frame of the device body, a length direction of the fingerprint module is consistent with a length direction of the electronic device, and a width direction of the fingerprint module is consistent with a thickness direction of the electronic device.