CN210664785U - Sensor paster packaging structure with pin plug-in components structure - Google Patents
Sensor paster packaging structure with pin plug-in components structure Download PDFInfo
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- CN210664785U CN210664785U CN201922017356.7U CN201922017356U CN210664785U CN 210664785 U CN210664785 U CN 210664785U CN 201922017356 U CN201922017356 U CN 201922017356U CN 210664785 U CN210664785 U CN 210664785U
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 230000001681 protective effect Effects 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
- 238000000034 method Methods 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000011161 development Methods 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract description 4
- KMWBBMXGHHLDKL-UHFFFAOYSA-N [AlH3].[Si] Chemical compound [AlH3].[Si] KMWBBMXGHHLDKL-UHFFFAOYSA-N 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000005452 bending Methods 0.000 description 13
- 238000012858 packaging process Methods 0.000 description 10
- 230000000149 penetrating effect Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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- Pressure Sensors (AREA)
Abstract
The utility model discloses a sensor paster packaging structure with pin plug-in components structure, including the pin plug-in conductive base of installing on insulating base, the pin is pegged graft and is glued the sensor chip on the conductive base, the electrically contacted plug-in of pin plug-in conductive base has a plurality of chip pin plug-in components electrodes, the output electrode of sensor chip is connected with each chip pin plug-in components electrode correspondence electricity through aluminium silicon silk respectively, and the chip pin of each chip pin plug-in components electrode is passed through the pin and is pegged graft conductive base and insulating base after being bent perpendicularly and laminate at the insulating base back; the utility model discloses under the pin plug-in components structure that keeps the sensor, and then ensured its sensing characteristic, realized the paster technology development to the sensor that has pin plug-in components structure simultaneously, greatly simplified the installation application process of pin plug-in components structural formula sensor, be fit for mass production, effectively reduced the encapsulation application cost of pin plug-in components structural formula sensor.
Description
Technical Field
The utility model belongs to the encapsulation field of sensor, concretely relates to sensor paster packaging structure with pin plug-in components structure.
Background
The sensor is an essential basic tool for realizing intelligent control, and is widely applied to temperature detection or pressure detection according to different application scenes. With the improvement of the domestic manufacturing level, people hope that the whole structure of the applied sensor is more compact and the manufacturing cost is lower. At present, most sensors adopt pin plug-in structures, are inconvenient to install and apply, are not suitable for large-scale production and application, and are high in manufacturing cost.
The applicant proposes a technical scheme for a patch sensor, but in practical application, it is found that a sensor scheme adopting a pin plug-in structure is superior to a patch sensor in performances such as signal output, sensing sensitivity and the like, which is also a reason why people always insist on adopting the pin plug-in structure.
For this reason, the applicant has eagerly desired to find a technical solution for implementing the development of the mounting process for the sensor having the pin plug structure.
Disclosure of Invention
In view of this, the utility model aims at providing a sensor paster packaging structure with pin plug-in components structure is under the pin plug-in components structure that keeps the sensor, and then has ensured its sensing characteristic, has realized the paster technology development to the sensor that has pin plug-in components structure simultaneously, has greatly simplified the installation application process of pin plug-in components structure sensor, is fit for mass production, has effectively reduced the encapsulation application cost of pin plug-in components structure sensor.
The utility model adopts the technical scheme as follows:
a sensor chip packaging process with a pin plug-in structure comprises the following operation steps:
s10), installing the pin plug-in conductive base on the insulating base;
s20), bonding the sensor chip on the pin plug-in conductive base, simultaneously inserting a plurality of chip pin plug-in electrodes on the pin plug-in conductive base in an electric contact manner, and penetrating the chip pins of the chip pin plug-in electrodes through the pin plug-in conductive base and the insulating base; vertically bending the chip pins penetrating through the pins and inserted into the conductive base and the insulating base, and attaching the vertically bent chip pins to the back of the insulating base;
s30), the output electrode of the sensor chip is electrically connected with the chip pin plug electrode by adopting a conductive wire through a thermal bonding process.
Preferably, the step S30) is followed by a step S40): and fixedly bonding a metal protection cap on the pin inserting conductive base, wherein the metal protection cap is positioned above the sensor chip and the chip pin plug-in electrode.
Preferably, the pin insertion conductive base is provided with an adhesion step serving as an adhesion surface, and the sensor chip and the pin plug-in electrode are located on the inner periphery of the adhesion step.
Preferably, in step S20), the back surface of the pin-inserted conductive base is further provided with 1 or more electrode plug pins, each electrode plug pin is electrically connected to the chip pin plug electrode through the pin-inserted conductive base, each electrode plug pin penetrates through the insulating base and then is bent vertically, and the vertically bent pin is attached to the back surface of the insulating base.
Preferably, the number of the electrode pin inserter is equal to the number of the chip pin inserter electrodes, and the chip pin after vertical bending is parallel to the pin after vertical bending.
Preferably, the conductive wires are silicon-aluminum wires, and the thermal bonding process is an ultrasonic welding process.
Preferably, the output electrode of the sensor chip includes a first output electrode and a second output electrode located at both sides, and the chip pin plug-in electrode includes a first chip pin plug-in electrode electrically connected to the first output electrode, and a second chip pin plug-in electrode electrically connected to the second output electrode.
Preferably, the vertical bending of the chip pins in the step S20) is performed by using a pressing device.
Preferably, the back of the insulating base is provided with a plurality of pin limiting grooves, and the chip pins which are vertically bent are limited in the pin limiting grooves.
The utility model also provides a sensor paster packaging structure with pin plug-in components structure, including installing the pin on insulating base and pegging graft conductive base, it has the sensor chip to bond on the pin grafting conductive base, the electrically contacting plug-in of pin grafting conductive base has a plurality of chip pin plug-in components electrodes, the output electrode of sensor chip corresponds the electricity through aluminium silicon silk and each chip pin plug-in components electrode and is connected, and the chip pin of each chip pin plug-in components electrode is passed through after pin grafting conductive base and insulating base by the perpendicular laminating of bending at the insulating base back; and meanwhile, the chip pin plug-in electrode is electrically connected with an external control system in an installing way and is used for transmitting the signal of the sensor chip to the external control system.
Preferably, the back of the pin-inserted conductive base is further provided with 1 or more electrode plug pins, each electrode plug pin is electrically connected with the chip pin plug electrode through the pin-inserted conductive base, and each electrode plug pin penetrates through the insulating base and is vertically bent and attached to the back of the insulating base.
Preferably, the number of the electrode pin inserter is equal to the number of the chip pin inserter electrodes, and the chip pin after vertical bending is parallel to the pin after vertical bending.
Preferably, the back of the insulating base is provided with a plurality of pin limiting grooves, and the chip pins after vertical bending and the pins after vertical bending are respectively limited in the pin limiting grooves.
Preferably, the sensor chip is an infrared temperature sensor chip, and is electrically connected with an external control system through the chip pin plug-in electrode.
Preferably, the sensor chip is a pressure sensor chip, and the chip pin plug-in electrode is electrically connected with an external control system.
Preferably, a metal protective cap is fixedly bonded and fixed on the pin plugging conductive base, and the metal protective cap is positioned above the sensor chip and the chip pin plug-in electrode.
Preferably, the pin insertion conductive base is provided with an adhesion step serving as an adhesion surface, and the sensor chip and the pin plug-in electrode are located on the inner periphery of the adhesion step.
Preferably, the metal protective cap is made of aluminum or copper.
The utility model creatively adopts the sensor paster packaging process mainly comprising a sensor chip, a chip pin plug-in electrode and a pin plug-in conductive base, and particularly adopts the structure that the chip pin of the chip pin plug-in electrode penetrates through the pin plug-in conductive base and an insulating base; the chip pin penetrating through the pin and inserted into the conductive base and the insulating base is vertically bent and then attached to the back surface of the insulating base, the sensor chip packaging structure with the pin plug-in structure obtained by the chip packaging process of the utility model is maintained under the pin plug-in structure of the sensor, so that the sensing characteristic of the sensor chip packaging structure is ensured, meanwhile, the development of the chip packaging process of the sensor with the pin plug-in structure is realized, the installation and application procedures of the pin plug-in structure type sensor are greatly simplified, the chip packaging structure is suitable for mass production, and the packaging and application cost of the pin plug-in structure type sensor is effectively reduced; and the utility model provides a paster packaging technology only needs to increase the perpendicular technology of bending, and the operation is very simple, easily implements in batches and uses.
Drawings
Fig. 1 is a block diagram of a sensor chip packaging process with a pin plug-in structure according to an embodiment of the present invention.
Fig. 2 is a schematic view of a sensor chip package structure (with a part of the metal protective cap hidden) having a pin plug-in structure according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of the exploded structure of FIG. 2;
FIG. 4 is a schematic structural view of FIG. 2 after being turned 180 degrees;
fig. 5 is a schematic diagram of the exploded structure of fig. 4.
Detailed Description
The embodiment of the utility model discloses a sensor paster packaging structure with pin plug-in components structure, including installing the pin on the insulating base and pegging graft the conductive base, it has sensor chip to bond on the pin grafting conductive base, the electrically contacting plug-in of pin grafting conductive base has a plurality of chip pin plug-in components electrodes, the output electrode of sensor chip corresponds the electricity through aluminium silicon silk and each chip pin plug-in components electrode and is connected, and the chip pin of each chip pin plug-in components electrode is passed through the pin and pegged graft conductive base and insulating base after being bent the laminating perpendicularly at the insulating base back; and meanwhile, the chip pin plug-in electrode is electrically connected with an external control system in an installing way and is used for transmitting the signal of the sensor chip to the external control system.
In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
Referring to fig. 1 in combination with fig. 2 to 5, a sensor chip packaging process with a pin header structure includes the following steps:
s10), installing the pin plug conductive base 20 on the insulating base 10;
s20), bonding the sensor chip 30 to the pin-plugging conductive base 20 (which may be made of copper plate), and simultaneously plugging a plurality of chip pin-plugging electrodes 40 onto the pin-plugging conductive base 20 in an electrically contacting manner, preferably, in this step, the back of the pin-plugging conductive base 20 is further provided with 1 or more electrode plug pins 50; inserting the chip pins 41 of the chip pin plug-in electrodes 40 into the conductive base 20 and the insulating base 10 through the pins; vertically bending the chip pins 41 penetrating through the pins and inserted into the conductive base 20 and the insulating base 10 through pressure equipment, and attaching the vertically bent chip pins 41 to the back of the insulating base 10; each electrode plug pin 50 is electrically connected with the chip pin plug electrode 40 through the pin plug conductive base 20, each electrode plug pin 50 penetrates through the insulating base 10 and then is vertically bent through pressure equipment, and the vertically bent pin 51 is attached to the back of the insulating base 10; particularly preferably, in the present embodiment, the number of the electrode plug pins 50 is equal to the number of the chip pin plug electrodes 40, and the chip pins 41 after being bent vertically are parallel to the pins 51 after being bent vertically, and the pressure device may directly adopt a pressure bending machine on the market;
s30), adopting the conductive wire 60 to realize the electrical connection between the output electrode of the sensor chip 30 and the chip pin plug-in electrode 40 through a thermal bonding process; preferably, in the present implementation step, the conductive wires 60 are silicon aluminum wires, and the thermal bonding process is an ultrasonic welding process;
preferably, step S40) is further included after step S30): fixedly bonding and fixing a metal protective cap 70 on the pin insertion conductive base 20, wherein the metal protective cap 70 is positioned above the sensor chip 30 and the chip pin plug-in electrode 40; the pin insertion conductive base 20 is provided with an adhesion step 21 as an adhesion surface, the sensor chip 30 and the pin inserter electrode 40 are positioned on the inner periphery of the adhesion step 21, when an adhesion process is implemented, sealant is directly coated on the adhesion step 21, and then the metal protective cap 70 is fixed on the adhesion step 21;
preferably, in the present embodiment, the output electrode of the sensor chip 30 includes the first output electrode 31 and the second output electrode 32 on both sides, the chip pin plug-in electrode 40 includes a first chip pin plug-in electrode 40a electrically connected to the first output electrode 31, and a second chip pin plug-in electrode 40b electrically connected to the second output electrode 32, and the electrode plug-in pin 50 includes a first electrode plug-in pin 50a and a second electrode plug-in pin 50 b; in other embodiments, the number of output electrodes of the sensor chip 30 can be selected according to the performance requirement of the sensor chip, and the number of the chip pin plug-in electrodes 40 and the number of the electrode plug-in pins 50 are determined according to the number of output electrodes of the sensor chip 30;
as shown in fig. 2-5, the present invention further provides a sensor chip package structure with a pin plug-in structure obtained by the above-mentioned chip package process, which includes a pin plugging conductive base 20 installed on the insulating base 10, a sensor chip 30 adhered on the pin plugging conductive base 20, a first chip pin plug-in electrode 40a and a second chip pin plug-in electrode 40b inserted on the pin plugging conductive base 20 in an electrically contacting manner, a first output electrode 31 and a second output electrode 32 of the sensor chip 30 are respectively electrically connected with the first chip pin plug-in electrode 40a and the second chip pin plug-in electrode 40b through an aluminum silicon wire 60, and the chip pin 41a of the first chip pin plug-in electrode 40a and the chip pin 41b of the second chip pin plug-in electrode 40b penetrate through the pin plug-in conductive base 20 and the insulation base 10 and then are vertically bent and attached to the back of the insulation base 10; meanwhile, the first chip pin package electrode 40a and the second chip pin package electrode 40b can be electrically connected to an external control system for transmitting the signal of the sensor chip 30 to the external control system;
in this embodiment, the back surface of the pin-plugging conductive base 20 is further provided with a first electrode plug pin 50a and a second electrode plug pin 50b, the first electrode plug pin 50a and the second electrode plug pin 50b are electrically connected with the chip pin plug electrodes 40a and 40b through the pin-plugging conductive base 20, the first electrode plug pin 50a and the second electrode plug pin 50b penetrate through the insulating base 10 and then are vertically bent and attached to the back surface of the insulating base 10, and meanwhile, the vertically bent chip pins 41a and 41b are distributed in parallel at intervals with the vertically bent first pin 51a and second pin 51 b;
in this embodiment, four pin limiting grooves are arranged on the back of the insulating base 10, and specifically include a first pin limiting groove 11a, a second pin limiting groove 11b, a third pin limiting groove 11c and a fourth pin limiting groove 11d, in order, the chip pin 41a of the first chip pin interposer electrode 40a after being bent vertically is limited in the first pin limiting groove 11a, the first electrode interposer pin 50a after being bent vertically is limited in the second pin limiting groove 11b, the second electrode interposer pin 50b after being bent vertically is limited in the third pin limiting groove 11c, and the chip pin 41b of the second chip pin interposer electrode 40b after being bent vertically is limited in the fourth pin limiting groove 11 d;
in the present embodiment, the pin-plugging conductive base 20 is fixedly bonded with a metal protection cap 70, the metal protection cap 70 is located above the sensor chip 20 and the chip pin- plugging electrodes 40a and 40b, the metal protection cap 70 is fixedly bonded to the bonding step 21 of the pin-plugging conductive base, and the sensor chip 30 and the pin- plugging electrodes 40a and 40b are located on the inner periphery of the bonding step 21; in this embodiment, the metal protective cap 70 is preferably made of aluminum or copper.
It should be noted that, in practical implementation of this embodiment, the sensor chip 30 in this embodiment may adopt an infrared temperature sensor chip, and is electrically connected to an external control system through the chip pin plug-in electrodes 40a and 40b, and the infrared temperature sensor chip converts a temperature signal into an electrical signal and transmits the electrical signal to the external control system, so as to implement an infrared temperature sensing detection control function; in practical implementation of this embodiment, the sensor chip 30 in this embodiment may also be a pressure sensor chip, and is electrically connected to an external control system through the chip pin plug-in electrodes 40a and 40b, and the pressure sensor chip converts a pressure signal into an electrical signal and transmits the electrical signal to the external control system, so as to implement a pressure sensing detection function; the present application is not particularly limited thereto.
The embodiment creatively adopts a sensor chip packaging process mainly composed of a sensor chip 30, a chip pin plug-in electrode 20 and a pin plug-in conductive base 10, specifically adopts a method that chip pins 41a and 41b of chip pin plug-in electrodes 40a and 40b penetrate through the pin plug-in conductive base 20 and the insulating base 10; chip pins 41a and 41b penetrating through the pins and inserted into the conductive base 20 and the insulating base 10 are vertically bent and then attached to the back of the insulating base 10, and the sensor chip packaging structure with the pin plug-in structure obtained by the chip packaging process of the embodiment is kept, so that the sensing characteristic of the sensor chip packaging structure is ensured, meanwhile, the chip packaging process development of the sensor with the pin plug-in structure is realized, the installation and application procedures of the pin plug-in structure sensor are greatly simplified, the chip packaging structure is suitable for mass production, and the packaging and application cost of the pin plug-in structure sensor is effectively reduced; in addition, the chip packaging process provided by the embodiment only needs to add a vertical bending process, is very simple to operate, and is easy to implement and apply in batches.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. A sensor patch packaging structure with a pin plug-in structure is characterized by comprising a pin plug-in conductive base installed on an insulating base, wherein a sensor chip is bonded on the pin plug-in conductive base, a plurality of chip pin plug-in electrodes are electrically connected to the pin plug-in conductive base in an electrical contact manner, output electrodes of the sensor chip are correspondingly and electrically connected with the chip pin plug-in electrodes through aluminum silicon wires respectively, and chip pins of the chip pin plug-in electrodes penetrate through the pin plug-in conductive base and the insulating base and then are vertically bent and bonded to the back of the insulating base; and meanwhile, the chip pin plug-in electrode is electrically connected with an external control system in an installing way and is used for transmitting the signal of the sensor chip to the external control system.
2. The sensor chip package structure with the pin plug-in structure according to claim 1, wherein the back surface of the pin plug-in conductive base is further provided with 1 or more electrode plug-in pins, each electrode plug-in pin is electrically connected with the chip pin plug-in electrode through the pin plug-in conductive base, and each electrode plug-in pin penetrates through the insulating base and then is vertically bent and attached to the back surface of the insulating base.
3. The sensor chip package with pin header structure of claim 2, wherein the number of the electrode header pins is equal to the number of the chip pin header electrodes, and the vertically bent chip pins are parallel to the vertically bent pins.
4. The sensor chip package structure with pin inserter structure as claimed in claim 2, wherein the back of the insulating base is provided with a plurality of pin-limiting grooves, and the vertically bent chip pin and the vertically bent pin are respectively limited in the pin-limiting grooves.
5. The sensor chip package with pin plug-in structure of claim 1, wherein the sensor chip is an infrared temperature sensor chip, and the pin plug-in electrodes of the sensor chip are electrically connected with an external control system through the chip.
6. The sensor chip package with pin header structure of claim 1, wherein the sensor chip is a pressure sensor chip, and the pin header electrode is electrically connected to an external control system through the chip.
7. The sensor chip package with pin header structure of claim 1, wherein a metal protective cap is fixedly bonded to the pin-plugging conductive base, and the metal protective cap is located above the sensor chip and the chip pin header electrode.
8. The sensor chip package with pin header structure of claim 7, wherein the pin header conductive base is provided with an adhesive step as an adhesive surface, and the sensor chip and the pin header electrode are located on an inner periphery of the adhesive step.
9. The sensor chip package with pin header structure of claim 7, wherein the metal protective cap is made of aluminum or copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922017356.7U CN210664785U (en) | 2019-11-20 | 2019-11-20 | Sensor paster packaging structure with pin plug-in components structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922017356.7U CN210664785U (en) | 2019-11-20 | 2019-11-20 | Sensor paster packaging structure with pin plug-in components structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210664785U true CN210664785U (en) | 2020-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922017356.7U Active CN210664785U (en) | 2019-11-20 | 2019-11-20 | Sensor paster packaging structure with pin plug-in components structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210664785U (en) |
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2019
- 2019-11-20 CN CN201922017356.7U patent/CN210664785U/en active Active
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